CN110519924A - Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board - Google Patents
Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board Download PDFInfo
- Publication number
- CN110519924A CN110519924A CN201910665561.6A CN201910665561A CN110519924A CN 110519924 A CN110519924 A CN 110519924A CN 201910665561 A CN201910665561 A CN 201910665561A CN 110519924 A CN110519924 A CN 110519924A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- wiring board
- heated
- constant temperature
- copolymer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The present invention relates to a kind of overturning bending mechanisms suitable for polymeric liquid crystal copolymer material flexibility wiring board, the flexible circuit board of polymeric liquid crystal copolymer material is used for bending, overturning bending mechanism include bracket, the pedestal being set on bracket, the locating platform for being set on pedestal and capableing of heated at constant temperature, the connection that rotates with pedestal the flipping block for capableing of heated at constant temperature, connect with bracket can heated at constant temperature and the binder block that can go up and down, be set to binder block lift locating platform top.Locating platform, flipping block, binder block are all made of the structure of the built-in heated at constant temperature part of copper billet package.The present invention can reduce wiring board overturning stress, separates to avoid the occurrence of layer with layer, and easily controllable bending angle, is particularly suitable for the overturning bending of polymeric liquid crystal copolymer material flexibility wiring board, operating efficiency can be improved, ensures product quality.
Description
Technical field
The invention belongs to flexible circuit board production technical fields, and in particular to a kind of bending mechanism is particularly suitable for liquid
The overturning bending mechanism of polycrystalline macromolecule polymer material flexible circuit board.
Background technique
In existing flexible circuit board production technology, for bending wiring board, following manner and jig are generallyd use: by line
Road plate is fixed on jig according to positioning column, carries out bending to it using cylinder push module.It is nothing using which bending
The rebound of method control circuit board bending shape, need to set multiple groups different angle pellet tested after, can just find satisfaction folding
The pellet of the requirement of bending shape is used.And due to the particularity of polymeric liquid crystal copolymer material, there is very high note after bending
Probability will appear segregation phenomenon between layers, cause defective products occur need to scrap, and waste production cost.Therefore, for liquid crystal
Macromolecule polymer material flexible circuit board, existing wrap direction are difficult to reach ideal bending effect, there is higher probability meeting
Interlaminar separation occurs, and bending angle rebound is unable to control, and need to repeatedly be tested.
Summary of the invention
The object of the present invention is to provide one kind can reduce wiring board overturning stress, separates to avoid the occurrence of layer with layer,
And the overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board of easily controllable bending angle.
In order to achieve the above objectives, the technical solution adopted by the present invention is that:
A kind of overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board is high using liquid crystal for bending
The flexible circuit board of Molecularly Imprinted Polymer material, the overturning bending mechanism include bracket, the pedestal that is arranged on the bracket, set
It is placed on the pedestal and is capable of the locating platform of heated at constant temperature, turning over for heated at constant temperature is capable of in the connection that rotates with the pedestal
Switch block, connect with the bracket can heated at constant temperature and the binder block that can go up and down, be set to the binder block lift
Above the locating platform.
The locating platform, the flipping block, the binder block are all made of the knot of the built-in heated at constant temperature part of copper billet package
Structure.
The heated at constant temperature part built in heated at constant temperature part, the flipping block built in the locating platform, in the binder block
The heated at constant temperature part set has been connected respectively temperature controller.
Electric cabinet is provided in the rack, the temperature controller is set on the electric cabinet.
The flipping block is connected with the handle reverse of its overturning of operation.
Mounting rack is provided in the rack, the binder block is mounted on the mounting rack by descending operation mechanism.
The descending operation mechanism includes with the lifting handle of mounting rack rotation connection, with the lifting handle to even
The connecting rod for connecing and vertically moving in lifting handle rotation, the binder block are connected with the connecting rod.
Bolster is provided between the connecting rod and the binder block.
The locating rack with through-hole is provided on the mounting rack, the rod slide is set to the through-hole of the locating rack
In.
Due to the above technical solutions, the present invention has the following advantages over the prior art: the present invention can reduce
Wiring board overturns stress, separates to avoid the occurrence of layer with layer, and easily controllable bending angle, is particularly suitable for liquid crystal polymer
Operating efficiency can be improved in the overturning bending of polymer material flexible circuit board, ensures product quality.
Detailed description of the invention
Attached drawing 1 is the whole schematic front view of overturning bending mechanism of the invention.
Attached drawing 2 is the whole schematic side view of overturning bending mechanism of the invention.
Attached drawing 3 is the local overlooking schematic diagram of overturning bending mechanism of the invention.
In the figures above: 1, bracket；2, pedestal；3, locating platform；4, flipping block；5, binder block；6, handle reverse；7, pacify
It shelves；8, lifting handle；9, connecting rod；10, locating rack；11, electric cabinet.
Specific embodiment
The invention will be further described for embodiment shown in reference to the accompanying drawing.
Embodiment one: as shown in attached drawing 1 to attached drawing 3, one kind being suitable for polymeric liquid crystal copolymer material flexibility wiring board
Overturning bending mechanism, including bracket 1, pedestal 2, locating platform 3, flipping block 4 and binder block 5.
Bracket 1 is horizontally disposed, and the suitable position on bracket 1 is arranged in pedestal 2.Locating platform 3 is arranged on pedestal 2, and
In the slot opened up on insertion pedestal 2.Locating platform 3 can heated at constant temperature, the heated at constant temperature part for using copper billet package built-in
Structure.
Flipping block 4 and pedestal 2 are rotatablely connected, and the side of locating platform 3 are arranged in, and be at least partially embedded on pedestal 2
Slot in.Also using the structure of the built-in heated at constant temperature part of copper billet package, heated at constant temperature may be implemented in flipping block 4.Flipping block 4 connects
It is connected to the handle reverse 6 of its overturning of operation.
Binder block 5 is connected with bracket 1, and its can heated at constant temperature and lifting, and be located at locating platform 3 top.
Specifically, being provided with mounting rack 7 in rack, binder block 5 is mounted on mounting rack 7 by descending operation mechanism.Descending operation machine
Structure include with mounting rack 7 be rotatablely connected lifting handle 8, with lifting handle 8 to connect and lifting handle 8 rotation when longitudinally move
Dynamic connecting rod 9, binder block 5 are connected with connecting rod 9.Bolster can also be set between connecting rod 9 and binder block 5.In mounting rack 7
Upper setting has the locating rack 10 of through-hole, so that connecting rod 9 is slideably positioned in the through-hole of locating rack 10.Binder block 5 also uses copper
The structure of the built-in heated at constant temperature part of block package
In above scheme, the heated at constant temperature part built in heated at constant temperature part, flipping block 4 built in locating platform 3, built in binder block 5
Heated at constant temperature part be connected respectively temperature controller.Electric cabinet 11 is provided in rack, temperature controller is set on electric cabinet 11.
Switch for controlling heated at constant temperature part is also disposed on electric cabinet 11.
Above-mentioned overturning bending mechanism uses the flexible circuit board of polymeric liquid crystal copolymer material for bending, and process is such as
Under: 1, flexible circuit board is located in locating platform 3 on；2, operation binder block 5 pushes and compresses flexible circuit board；3, operation is turned over
Switch block 4 makes its rotation, to form the angle of wanted bending between locating platform 3；4, bending finishes, and each section resets.In
In above-mentioned bending process, locating platform 3, flipping block 4, binder block 5 start heated at constant temperature.
By the overturning bending mechanism, wiring board overturning stress can be reduced, so that it will not occur layer separated with layer it is scarce
It falls into.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board uses liquid crystal for bending
The flexible circuit board of macromolecule polymer material, it is characterised in that: the overturning bending mechanism includes bracket, is set to the branch
Pedestal on frame, the locating platform for being set on the pedestal and capableing of heated at constant temperature, the connection that rotates with the pedestal energy
The flipping block of enough heated at constant temperature, connect with the bracket can heated at constant temperature and the binder block that can go up and down, the binder block
It is set to lift above the locating platform.
2. the overturning bending mechanism according to claim 1 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: the locating platform, the flipping block, the binder block are all made of the built-in heated at constant temperature part of copper billet package
Structure.
3. the overturning bending mechanism according to claim 2 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: heated at constant temperature part, the binder block built in heated at constant temperature part, the flipping block built in the locating platform
Built-in heated at constant temperature part has been connected respectively temperature controller.
4. the overturning bending mechanism according to claim 3 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: being provided with electric cabinet in the rack, the temperature controller is set on the electric cabinet.
5. the overturning bending mechanism according to claim 1 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: the flipping block is connected with the handle reverse of its overturning of operation.
6. the overturning bending mechanism according to claim 1 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: being provided with mounting rack in the rack, the binder block is mounted on the mounting rack by descending operation mechanism
On.
7. the overturning bending mechanism according to claim 6 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: the descending operation mechanism includes the lifting handle and the lifting handle with mounting rack rotation connection
To the connecting rod for connecting and vertically moving when the lifting handle rotates, the binder block is connected with the connecting rod.
8. the overturning bending mechanism according to claim 7 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: being provided with bolster between the connecting rod and the binder block.
9. the overturning bending mechanism according to claim 7 suitable for polymeric liquid crystal copolymer material flexibility wiring board,
It is characterized by: being provided with the locating rack with through-hole on the mounting rack, the rod slide is set to the locating rack
In through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910665561.6A CN110519924A (en) | 2019-07-23 | 2019-07-23 | Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910665561.6A CN110519924A (en) | 2019-07-23 | 2019-07-23 | Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110519924A true CN110519924A (en) | 2019-11-29 |
Family
ID=68623904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910665561.6A Pending CN110519924A (en) | 2019-07-23 | 2019-07-23 | Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110519924A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101727249A (en) * | 2008-10-31 | 2010-06-09 | 宸鸿光电科技股份有限公司 | Manufacturing method and structure of camber-shaped capacitance type touch-control plate |
| CN202374571U (en) * | 2011-11-23 | 2012-08-08 | 南通力德尔机电科技有限公司 | Heating bending mechanism for flexible circuit board |
| CN203352952U (en) * | 2013-03-22 | 2013-12-18 | 博罗县精汇电子科技有限公司 | Jig with heating function |
| CN203764694U (en) * | 2014-01-27 | 2014-08-13 | 欣兴同泰科技（昆山）有限公司 | 180-degree bending and forming fixture |
| CN203886988U (en) * | 2014-01-27 | 2014-10-22 | 欣兴同泰科技（昆山）有限公司 | Buckling jig |
| CN105799143A (en) * | 2015-12-30 | 2016-07-27 | 上海安费诺永亿通讯电子有限公司 | Method for bending and shaping thermoplastic material based on hot-bar device |
| CN206061308U (en) * | 2016-09-23 | 2017-03-29 | 仁宝电脑工业股份有限公司 | The apparatus for bending of soft board |
| CN209037005U (en) * | 2018-10-22 | 2019-06-28 | 深圳市立可自动化设备有限公司 | A kind of FPC heating bending forming mechanism |
-
2019
- 2019-07-23 CN CN201910665561.6A patent/CN110519924A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101727249A (en) * | 2008-10-31 | 2010-06-09 | 宸鸿光电科技股份有限公司 | Manufacturing method and structure of camber-shaped capacitance type touch-control plate |
| CN202374571U (en) * | 2011-11-23 | 2012-08-08 | 南通力德尔机电科技有限公司 | Heating bending mechanism for flexible circuit board |
| CN203352952U (en) * | 2013-03-22 | 2013-12-18 | 博罗县精汇电子科技有限公司 | Jig with heating function |
| CN203764694U (en) * | 2014-01-27 | 2014-08-13 | 欣兴同泰科技（昆山）有限公司 | 180-degree bending and forming fixture |
| CN203886988U (en) * | 2014-01-27 | 2014-10-22 | 欣兴同泰科技（昆山）有限公司 | Buckling jig |
| CN105799143A (en) * | 2015-12-30 | 2016-07-27 | 上海安费诺永亿通讯电子有限公司 | Method for bending and shaping thermoplastic material based on hot-bar device |
| CN206061308U (en) * | 2016-09-23 | 2017-03-29 | 仁宝电脑工业股份有限公司 | The apparatus for bending of soft board |
| CN209037005U (en) * | 2018-10-22 | 2019-06-28 | 深圳市立可自动化设备有限公司 | A kind of FPC heating bending forming mechanism |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113135024B (en) | Yoga mat printing equipment for sports | |
| CN108325871A (en) | A kind of detection device of panel | |
| CN103508187A (en) | Automatic turning-over feeding device | |
| CN209918375U (en) | Circuit board is letter sorting detection line in batches | |
| CN210682314U (en) | Novel turnover mechanism for circuit board production | |
| CN107639139A (en) | A kind of convenient loading and unloading coiling machine bed | |
| CN110519924A (en) | Overturning bending mechanism suitable for polymeric liquid crystal copolymer material flexibility wiring board | |
| CN107403936A (en) | Battery core module tipper | |
| CN109436825B (en) | Automatic sponge dividing machine | |
| CN2585838Y (en) | Turnover device of printed circuit board | |
| CN102166874B (en) | Flexible circuit board pressing device and rapid pressing machine | |
| CN105537204A (en) | Cleaning assembly for production of mobile phone PCB (Printed Circuit Board) | |
| CN114340163A (en) | Variable-pitch pressing machine | |
| CN209315401U (en) | A kind of use for electronic products showing stand | |
| CN108207075A (en) | A kind of turnover device in printed circuit board process | |
| CN205921838U (en) | High density laminated board hot pressing unloader | |
| CN113815963B (en) | Automatic film sealing device and automatic blanking and film sealing equipment and method for flat-plate type products | |
| CN219586336U (en) | Hemming device for towel production | |
| CN205151641U (en) | Vacuum suction board machine lift platform | |
| CN219145747U (en) | Online pressfitting machine | |
| CN214726923U (en) | Automatic flattening device for offset printing paperboard | |
| CN216511499U (en) | Material placing frame for circuit board plate making | |
| CN207083282U (en) | One kind has moisture-proof construction circuit board | |
| CN221010441U (en) | PCB circuit board compression fittings | |
| CN110876860B (en) | Vacuum bubble removing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191129 |