CN110518145B - Thin film packaging structure, preparation method thereof and display panel - Google Patents
Thin film packaging structure, preparation method thereof and display panel Download PDFInfo
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- CN110518145B CN110518145B CN201910801832.6A CN201910801832A CN110518145B CN 110518145 B CN110518145 B CN 110518145B CN 201910801832 A CN201910801832 A CN 201910801832A CN 110518145 B CN110518145 B CN 110518145B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses a thin film packaging structure, a preparation method thereof and a display panel. The thin film encapsulation structure includes: the packaging structure comprises a first packaging layer, a second packaging layer and a bonding layer, wherein the first packaging layer and the second packaging layer are oppositely arranged, and the bonding layer is positioned between the first packaging layer and the second packaging layer and is used for bonding the first packaging layer and the second packaging layer; wherein, the bonding layer is connected with the second packaging layer through a chemical bond formed by the first functional group and the second functional group. According to the film packaging structure disclosed by the invention, the bonding layer and the second packaging layer are bonded by forming a chemical bond through the reaction of the first functional group and the second functional group between the bonding layer and the second packaging layer, so that the adhesiveness of the first packaging layer and the second packaging layer can be improved, and the packaging reliability of the whole film packaging structure can be enhanced.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a thin film packaging structure, a preparation method of the thin film packaging structure and a display panel.
Background
Organic Light Emitting Diode (OLED) display has the advantages of low cost, wide viewing angle, low driving voltage, fast response speed, rich Light Emitting colors, simple preparation process, capability of realizing large-area flexible display and the like, and is considered to be one of the display technologies with the greatest development prospects.
The OLED device is extremely sensitive to water and oxygen, and in order to achieve a good water and oxygen blocking effect, the OLED device is generally packaged in an inorganic film layer and an organic film layer. However, the inorganic film layer and the organic film layer are easily separated due to poor adhesion between the two layers, and the packaging reliability is reduced.
Disclosure of Invention
The embodiment of the invention provides a thin film packaging structure, a preparation method thereof and a display panel, and aims to improve the packaging reliability of the thin film packaging structure.
In a first aspect, the present invention provides a thin film encapsulation structure, including: a first encapsulation layer; the second packaging layer is arranged opposite to the first packaging layer; the bonding layer is positioned between the first packaging layer and the second packaging layer and is used for bonding the first packaging layer and the second packaging layer; wherein, the bonding layer is connected with the second packaging layer through a chemical bond formed by the first functional group and the second functional group.
According to one aspect of the invention, the first functional group comprises an amino group; preferably, the material of the bonding layer comprises a silane containing an amino group; preferably, the amino-containing silane comprises di (isopropylamino) silane.
According to one aspect of the invention, the second functional group comprises a hydroxyl group and/or a vinyl group.
According to an aspect of the present invention, the second encapsulation layer contains particles having a second functional group, the particles including at least one of a silane coupling agent having the second functional group, a hydrolysate of the silane coupling agent, and a hydrolysate of methylsiloxane; preferably, the silane coupling agent comprises at least one of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (. beta. -methoxyethoxy) silane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane; the methyl siloxane includes at least one of dimethyl siloxane and trimethyl siloxane.
According to one aspect of the invention, the first encapsulation layer is an inorganic film layer and the second encapsulation layer is an organic film layer.
In a second aspect, the present invention provides a display panel having a display area and a non-display area located on a peripheral side of the display area, the display panel including: the display device comprises a substrate, a first electrode and a second electrode, wherein the substrate comprises a substrate body, a first dam layer and a second dam layer, the first dam layer and the second dam layer are arranged in a non-display area of the substrate body and surround a display area, and the second dam layer is positioned in the first dam layer; a light emitting device layer which is stacked on the substrate and is positioned in the second bank layer, wherein the light emitting device layer comprises a plurality of light emitting units; and a film encapsulation structure covering the light emitting device layer and connected to the substrate body at the peripheral side of the light emitting unit, wherein the first encapsulation layer is disposed close to the light emitting device layer relative to the second encapsulation layer, the first encapsulation layer extends to the peripheral side of the first dam layer, and the second encapsulation layer is disposed in the second dam layer.
According to an aspect of the present invention, the substrate further includes a plurality of isolation pillars formed in the non-display region of the substrate body and spaced apart at both sides of the second bank layer;
preferably, the isolation columns are uniformly distributed on two sides of the second dam layer; preferably, the heights of the first dam layer, the isolation pillars outside the second dam layer, the second dam layer and the isolation pillars inside the second dam layer are sequentially reduced, and the height of the isolation pillars inside the second dam layer is greater than the thickness of the second encapsulation layer; preferably, the isolation pillars, the first bank layer, and the second bank layer are integrally formed with the substrate body.
In a third aspect, the present invention provides a method for manufacturing a thin film encapsulation structure, including: forming a bonding layer on the surface of the first packaging layer; and forming a second packaging layer on the surface of the bonding layer, which is far away from the first packaging layer, so that the first packaging layer is bonded with the second packaging layer through the bonding layer, wherein the bonding layer is bonded with the second packaging layer through a chemical bond formed by the first functional group and the second functional group.
According to an aspect of the present invention, the step of forming an adhesive layer on a surface of the first encapsulation layer includes: treating the surface of the first encapsulating layer in a pulse manner by using a carrier gas to form an adhesive layer having an amino group on the surface of the first encapsulating layer; preferably, the amino group is diisopropylamino.
According to an aspect of the present invention, the step of forming a second encapsulation layer on a surface of the adhesive layer facing away from the first encapsulation layer so that the first encapsulation layer and the second encapsulation layer are adhered by the adhesive layer includes: doping particles containing at least one functional group of hydroxyl and vinyl in ink-jet printing ink to form printing liquid; ink-jet printing the printing liquid onto the bonding layer; heating and ultraviolet irradiation are carried out on the printing liquid on the bonding layer to form a second packaging layer, and in the process of forming the second packaging layer, amino and hydroxyl and/or vinyl form a covalent bond to bond the second packaging layer and the bonding layer; preferably, the mass ratio of the particles to the ink-jet printing ink is 0.5% to 3%; preferably, the heating temperature is 80 ℃ to 120 ℃.
In the embodiment of the invention, the bonding layer is arranged between the first packaging layer and the second packaging layer, the first packaging layer and the second packaging layer are bonded through the bonding layer, and the bonding layer and the second packaging layer are bonded through the chemical bond formed by the first functional group and the second functional group between the first packaging layer and the second packaging layer, so that the adhesion between the second packaging layer and the bonding layer can be enhanced, and the packaging reliability of the whole thin film packaging structure can be enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a thin film package structure according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a substrate according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for fabricating a thin film encapsulation structure according to an embodiment of the present invention;
FIG. 5 is a flowchart of one embodiment of step 200 shown in FIG. 4.
In the figure:
10-a first encapsulation layer; 20-a second encapsulation layer; 21-particles; 30-a tie layer; 40-a substrate; 41-a first embankment layer; 42-a second embankment layer; 43-an isolation column; 44-a substrate body; 43 a-spacer pillars outside the second bank layer; 43 b-spacer columns inside the second bank layer; 50-a light emitting device layer; AA-display area; NA-non-display area.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The following describes in detail the thin film encapsulation structure, the manufacturing method thereof, and the display panel according to the embodiment of the invention with reference to fig. 1 to 5. Some well-known structures are shown hidden or shown in detail in order to clearly illustrate the structures associated with the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a thin film package structure according to an embodiment of the invention. The thin film packaging structure of the embodiment of the invention at least comprises a first packaging layer 10, a bonding layer 30 and a second packaging layer 20 which are sequentially stacked, and the bonding property between the first packaging layer 10 and the second packaging layer 20 is enhanced through the bonding layer 30 positioned between the first packaging layer 10 and the second packaging layer 20, so that the first packaging layer 10 and the second packaging layer 20 are not easy to separate, and the packaging reliability can be improved.
The adhesive layer 30 is stacked on the first encapsulation layer 10,
the second encapsulating layer 20 is stacked on the side of the bonding layer 30 away from the first encapsulating layer 10, and the second encapsulating layer 20 is connected with the bonding layer 30 through a chemical bond formed by the first functional group and the second functional group.
In this embodiment, the first encapsulation layer 10 and the second encapsulation layer 20 are bonded by the adhesive layer 30, and the adhesive layer 30 and the second encapsulation layer 20 are bonded by a chemical bond formed by a reaction between the first functional group and the second functional group, so that the adhesion between the second encapsulation layer 20 and the adhesive layer 30 can be enhanced, and the encapsulation reliability of the entire thin film encapsulation structure can be enhanced.
It is understood that the thin film encapsulation structure according to the embodiment of the present invention is not limited to the first encapsulation layer 10 and the second encapsulation layer 20, and other encapsulation layers may be stacked on the first encapsulation layer 10, and the present invention is not limited to the specific number of encapsulation layers.
Note that, the present invention does not show the position where the adhesive layer 30 is disposed on the first sealing layer 10, as long as the adhesiveness between the first sealing layer 10 and the second sealing layer 20 can be enhanced. Illustratively, the adhesive layer 30 may completely cover the first encapsulation layer 10, such that the first encapsulation layer 10 and the second encapsulation layer 20 are completely adhered by the adhesive layer 30; since the first encapsulating layer 10 and the second encapsulating layer 20 are easily separated from each other at the edge of the film encapsulating structure, the adhesive layer 30 may be disposed at the edge where the first encapsulating layer 10 and the second encapsulating layer 20 are adhered to each other, and disposed around the edges of the first encapsulating layer 10 and the second encapsulating layer 20, so as to increase the adhesiveness of the edges of the first encapsulating layer 10 and the second encapsulating layer 20 and prevent the edges from being separated from each other; the adhesive layer 30 may further include a plurality of adhesive units, which may be spaced apart between the first and second encapsulation layers 10 and 20, for example, may be disposed in a detachable region thereof to enhance local adhesion of the first and second encapsulation layers 10 and 20.
The specific structures of the first encapsulation layer 10 and the second encapsulation layer 20 are not limited in the present invention, and fig. 1 only shows a schematic diagram that both are flat structures, but it is understood that the first encapsulation layer 10 and the second encapsulation layer 20 may also be partially curved or bent structures.
The first functional group may be a functional group included in the adhesive layer 30 itself, the second functional group may be a functional group included in the second encapsulating layer 20 itself, and further, the particles having the second functional group may be doped in the encapsulating material of the second encapsulating layer 20 so that the second encapsulating layer 20 includes the second functional group. In this way, when the second sealing layer 20 is formed on the adhesive layer 30, the first functional group and the second functional group, which are contained in the second sealing layer, react with each other to form a chemical bond therebetween, thereby bonding the second sealing layer and the adhesive layer, and thus, the bonding reliability of the second sealing layer and the adhesive layer is enhanced. It is understood that a partially unreacted first functional group is contained in the adhesive layer 30 and a partially unreacted second functional group is contained in the second encapsulation layer 20.
In some alternative embodiments, the first encapsulation layer 10 may be an inorganic film layer, and the second encapsulation layer 20 may be an organic film layer. The inorganic film layer has good water and oxygen blocking property, while the organic film has good film forming property, and the surface of the organic film is compact and is not easy to form pinholes. The thin film packaging structure of the inorganic film layer and the organic film layer has good water and oxygen blocking and compact characteristics, and can achieve good packaging effect on a screen body to be packaged.
It is understood that an inorganic film layer and an organic film layer may be stacked on the second encapsulation layer 20, and the bonding layer 30 of the present embodiment may be disposed between the inorganic film layer and the organic film layer to enhance adhesion therebetween. The number of the specific packaging layers of the thin film packaging structure can be designed according to the requirements of actual products.
In this embodiment, the material of the first encapsulation layer 10 may include at least one of an oxide and a silicon nitride, and for example, may be at least one of a silicon oxide, a silicon nitride and an aluminum oxide. The second encapsulation layer 20 may be a polymer film, and the material thereof may include at least one of polymethyl methacrylate, acrylic resin, and epoxy resin.
In some alternative embodiments, the first functional group comprises an amino group. The first functional group is formed at least on the surface of the adhesive layer 30 to which the second encapsulation layer 20 is adhered. The material of the adhesive layer 30 includes silane containing an amino group, and may be, for example, bis (isopropylamino) silane.
Accordingly, the second functional group may include at least one of a hydroxyl group and a vinyl group capable of reacting with an amino group to form a covalent bond. In this embodiment, the first functional group and the second functional group form a covalent bond to enhance the adhesion between the second encapsulation layer 20 and the adhesive layer 30 on the surface of the first encapsulation layer 10, thereby enhancing the encapsulation effect of the thin film encapsulation structure.
The second encapsulation layer 20 contains particles 21 including a second functional group. These particles 21 may specifically include at least one of a silane coupling agent having a second functional group, a hydrolysate of the silane coupling agent, and a hydrolysate of methylsiloxane. If the second encapsulation layer 20 contains a silane coupling agent with a second functional group, the second functional group of the silane coupling agent can directly react with the first functional group in the adhesive layer 30 to form a covalent bond; if the second encapsulation layer 20 contains a hydrolysate of a silane coupling agent, which includes hydroxyl groups, the hydroxyl groups can react with the first functional groups of the amino groups in the adhesive layer 30 to form covalent bonds; if the hydrolysate of the second encapsulant layer 20 containing methylsiloxane contains hydroxyl groups, the hydroxyl groups may react with the first functional amino groups of the adhesive layer 30 to form covalent bonds.
Exemplary silane coupling agents include at least one of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (. beta. -methoxyethoxy) silane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, which inherently contain a vinyl group and/or a hydroxyl group, and which upon hydrolysis may also generate a hydroxyl group, both of which may react with the first functional amino group of the bonding layer 30. The silane coupling agents can be doped into the ink-jet printing ink of the second encapsulation layer 20, and then the second encapsulation layer 20 with vinyl and hydroxyl groups can be formed on the surface of the adhesive layer 30 by means of ink-jet printing.
Illustratively, the methylsiloxane includes at least one of dimethylsiloxane and trimethylsiloxane, which may be hydrolyzed or partially hydrolyzed to generate hydroxyl groups, for example, the methylsiloxane may be doped into an ink-jet printing ink of the second encapsulating layer 20, and the second encapsulating layer 20 having hydroxyl groups may be formed on the surface of the adhesive layer 30 by means of ink-jet printing.
It is understood that, in the above embodiments, only the first functional group is an amino group, and the second functional group is a vinyl group and/or a hydroxyl group, but the first functional group and the second functional group are not limited to the above functional groups, as long as the first functional group and the second functional group can react with each other to enhance the adhesion of the first encapsulating layer 10 and the second encapsulating layer 20, and thus all fall within the protection scope of the present invention.
Fig. 2 shows an embodiment of a display panel, and fig. 2 is a schematic structural diagram of the display panel according to the embodiment of the invention. The display panel of the embodiment of the invention has a display area AA and a non-display area NA positioned on the peripheral side of the display area AA. The display panel at least comprises a substrate 40, a light emitting device layer 50 and the thin film encapsulation structure of any of the embodiments.
The substrate 40 includes a substrate body 44 and a first bank layer 41 and a second bank layer 42 disposed in the non-display area NA of the substrate body 44 and surrounding the non-display area NA, and the second bank layer 42 is located within the first bank layer 41.
The light emitting device layer 50 is stacked on the substrate 40 and positioned within the second bank layer 42, and the light emitting device layer 50 includes a plurality of light emitting cells.
The thin film encapsulation structure covers the light emitting device layer 50 and is connected to the substrate body 44 at the periphery of the light emitting units to seal and protect the light emitting units, so as to prevent water and oxygen from invading and affecting the light emitting effect of the light emitting units. The first encapsulation layer 10 of the thin film encapsulation structure is disposed close to the light emitting device layer 50 with respect to the second encapsulation layer 20, and the first encapsulation layer 10 extends to the outer peripheral side of the first bank layer 41, and the second encapsulation layer 20 is located within the second bank layer 42.
In this embodiment, the film package structure adopts the film package structure of any one of the embodiments, which has the beneficial effects of the film package structure of the embodiments, the adhesive layer 30 of the film package structure is bonded to the second package layer 20 through a chemical bond formed by the reaction of the first functional group and the second functional group between the two, the adhesion between the second package layer 20 and the adhesive layer 30 can be enhanced, the second package layer 20 is bonded to the first package layer 10 through the adhesive layer 30, and thus the package reliability of the whole film package structure can be enhanced. Also, the first and second bank layers 41 and 42 may increase the package length of the thin film package structure and increase the contact area between the first and second package layers 10 and 20, so that the erosion path of water and oxygen may be extended and the reliability of the edge of the thin film package structure may be increased.
Fig. 2 only shows a schematic structural diagram of the thin film encapsulation structure including the first encapsulation layer 10 and the second encapsulation layer 20, and it is understood that other encapsulation layers may be further disposed on the second encapsulation layer 20, and the number of the encapsulation layers is not limited in the present invention. In the embodiment of the present invention, optionally, the first encapsulation layer 10 may be an inorganic film, and the second encapsulation layer 20 may be an organic film. For example, an inorganic film layer may be further formed on the second encapsulation layer 20 to achieve a better effect of preventing water and oxygen from invading.
In some alternative embodiments, please refer to fig. 3, in which fig. 3 is a schematic top view of a substrate according to an embodiment of the present invention. The substrate 40 of the embodiment of the invention further includes a plurality of isolation pillars 43, and the plurality of isolation pillars 43 are formed in the non-display area NA of the substrate body 44 and are spaced apart from each other on both sides of the second bank layer 42.
In this embodiment, the arrangement of the plurality of isolation pillars 43 can increase the contact area between the first encapsulation layer 10 and the second encapsulation layer 20, so as to further enhance the edge reliability of the thin film encapsulation structure. Moreover, the arrangement of the isolation pillars 43 can provide a flow guiding effect for the gas forming the first encapsulation layer 10 during the deposition of the first encapsulation layer 10 on the substrate 40, for example, by chemical vapor deposition or atomic vapor deposition, so as to enhance the uniformity of the flow direction of the edge gas and the uniformity of the edge thickness, thereby reducing the shadow effect at the edge of the first encapsulation layer 10 and improving the display effect of the display panel.
Optionally, a plurality of isolation pillars 43 are uniformly distributed on both sides of the second bank layer 42, so as to further enhance the flow guiding effect of the isolation pillars 43 on the gas, and make the flow direction of the gas more uniform. The plurality of pillars 43 may be arranged in a ring structure on both sides of the second bank layer 42 as shown in fig. 3, and may be distributed in a region spaced apart from the second bank layer by 0.02mm to 0.04mm on both sides of the second bank layer 42.
Optionally, the heights of the first bank layer 41, the isolation pillars 43a and 42 outside the second bank layer, and the isolation pillars 43b inside the second bank layer are sequentially reduced, and the height of the isolation pillar 43b inside the second bank layer is greater than the height of the second encapsulation layer 20, so that the flow guiding effect of the isolation pillar 43 can be maintained when other encapsulation layers are formed on the second encapsulation layer 20. In this embodiment, the height of the isolation pillar 43b inside the second encapsulation layer is less than 3.4 μm, and the height of the isolation pillar 43a outside the second encapsulation layer is 3.4 μm to 4.8 μm.
In the present embodiment, the isolation pillars 43, the first bank layer 41, and the second bank layer 42 are integrally formed with the substrate body 44. It is understood that the substrate 40 may include a pixel defining layer for defining a position of the light emitting unit and a supporting layer for supporting the mask, and the isolation pillars 43, the first bank layers 41, and the second bank layers 42 may be formed together through a patterning process in a structure in which the pixel defining layer and/or the supporting layer are formed. The preparation process can be simplified, and the production efficiency is further improved.
Fig. 4 shows an embodiment of a method for manufacturing a thin film package structure, where fig. 4 is a flowchart of the method for manufacturing the thin film package structure according to the embodiment of the present invention. The preparation method of the film packaging structure comprises the following steps:
step 100, forming an adhesive layer on the surface of the first packaging layer.
In this embodiment, the adhesive layer 30 is disposed between the first encapsulation layer 10 and the second encapsulation layer 20, the adhesion between the encapsulation layer 10 and the second encapsulation layer 20 is realized by the adhesive layer 30, and the adhesive layer 30 and the second encapsulation layer 20 are bonded by a chemical bond formed by a reaction between the first functional group and the second functional group, so that the adhesion between the second encapsulation layer 20 and the adhesive layer 30 can be enhanced, and the encapsulation reliability of the entire thin film encapsulation structure can be enhanced.
In some alternative embodiments, step 100 may comprise: the surface of the first encapsulating layer is treated in a pulse manner with silane having an amino group by a carrier gas to form a bonding layer having an amino group on the surface of the first encapsulating layer.
In this embodiment, the carrier gas may be nitrogen, and the amino group may be diisopropylamino. Specifically, the bonding layer 30 may be formed by treating the surface of the first encapsulation layer 10 in a pulse manner with a precursor of silane having a diisopropylamino group using nitrogen as a carrier gas under a vacuum condition, and adsorbing the precursor of silane having a diisopropylamino group on the surface of the first encapsulation layer 10.
In some alternative embodiments, please refer to fig. 5, in which fig. 5 is a flowchart illustrating an implementation of step 200, step 200 may include the following steps:
in step 201, particles containing at least one functional group of hydroxyl and vinyl are doped in the ink-jet printing ink to form a printing fluid.
In this embodiment, the ink-jet printing ink may be a solution of Methyl Methacrylate (MMA), which may be doped with at least one of a silane coupling agent, a hydrolysate of a silane coupling agent, and a hydrolysate of methylsiloxane, such as at least one of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β -methoxyethoxy) silane, a dimethylsiloxane hydrolysate, and a trimethylsiloxane hydrolysate, which may have a vinyl group or a hydroxyl group by itself, so that the printing liquid has a hydroxyl group and/or a vinyl group.
In the present embodiment, the mass ratio of the particles 21 containing at least one functional group of a hydroxyl group and a vinyl group to the ink-jet printing ink is 0.5% to 3%, and may be, for example, 1%, 1.5%, 2%, or the like, and it is possible to ensure that the ink-jet printing ink has many functional groups and also to ensure the film forming property of the ink-jet printing ink.
In the present embodiment, the printing liquid formed in step 201 is formed on the adhesive layer 30 by inkjet printing.
And 203, heating and irradiating the printing liquid on the bonding layer with ultraviolet light to form a second packaging layer, wherein in the process of forming the second packaging layer, the amino group and the hydroxyl group and/or the vinyl group form a covalent bond to bond the second packaging layer and the bonding layer.
In this embodiment, the printing liquid spreads the flatting process on tie coat 30, heats it and ultraviolet irradiation, can make the printing liquid solidify fast, and in the course of solidifying, hydroxyl and/or vinyl in the printing liquid can generate the chemical bond with amino reaction, can increase the adhesion of second encapsulating layer 20 and tie coat 30.
In this embodiment, the heating temperature may be 80 ℃ to 120 ℃, for example, 85 ℃, 90 ℃, 100 ℃, and the like, and the performance of the first encapsulation layer 10 may not be affected while the curing efficiency is ensured.
In summary, the preparation method of the film packaging structure of the embodiment of the present invention has a simple preparation process, and the film packaging structure prepared by the preparation method of the film packaging structure of the embodiment of the present invention bonds the first packaging layer 10 and the second packaging layer 20 through the bonding layer 30, and two surfaces of the bonding layer 30 opposite to each other have good adhesion with the first packaging layer 10 and the second packaging layer 20, respectively, so that the first packaging layer 10 and the second packaging layer 20 are not easily separated, and the reliability of the whole film packaging structure can be enhanced.
In accordance with the above-described embodiments of the present invention, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.
Claims (18)
1. A thin film encapsulation structure, comprising:
a first encapsulation layer;
the second packaging layer is arranged opposite to the first packaging layer;
the bonding layer is positioned between the first packaging layer and the second packaging layer and used for bonding the first packaging layer and the second packaging layer;
wherein the adhesive layer comprises a first functional group, the second encapsulation layer contains particles having a second functional group, and the adhesive layer and the second encapsulation layer are connected by a chemical bond formed by the first functional group and the second functional group;
the first packaging layer is an inorganic film layer, and the second packaging layer is an organic film layer.
2. The film encapsulation structure of claim 1, wherein the first functional group comprises an amino group.
3. The film encapsulation structure of claim 1, wherein the material of the bonding layer comprises a silane containing an amino group.
4. The film encapsulation structure of claim 3, wherein the amino-containing silane comprises bis (isopropylamino) silane.
5. The film encapsulation structure according to any one of claims 2 to 4, wherein the second functional group comprises a hydroxyl group and/or a vinyl group.
6. The film encapsulation structure of claim 5, wherein the particles comprise at least one of a silane coupling agent having a second functional group, a hydrolysate of a silane coupling agent, and a hydrolysate of methyl siloxane.
7. The film encapsulation structure of claim 6, wherein the silane coupling agent comprises at least one of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β -methoxyethoxy) silane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane; the methyl siloxane includes at least one of dimethyl siloxane and trimethyl siloxane.
8. A display panel having a display region and a non-display region on a peripheral side of the display region, comprising:
the display device comprises a substrate, a first display area and a second display area, wherein the substrate comprises a substrate body, and a first dam layer and a second dam layer which are arranged in the non-display area of the substrate body and surround the display area, and the second dam layer is positioned in the first dam layer;
a light emitting device layer stacked on the substrate and located in the second bank layer, the light emitting device layer including a plurality of light emitting cells;
a thin film encapsulation structure covering the light emitting device layer and connected to the substrate body at a peripheral side of the light emitting unit, the thin film encapsulation structure according to any one of claims 1 to 7, wherein the first encapsulation layer is disposed close to the light emitting device layer with respect to the second encapsulation layer, the first encapsulation layer extends to a peripheral side of the first bank layer, and the second encapsulation layer is disposed in the second bank layer.
9. The display panel according to claim 8, wherein the substrate further comprises a plurality of spacers formed on the non-display region of the substrate body and spaced apart from each other on both sides of the second bank layer.
10. The display panel according to claim 9, wherein a plurality of the barrier pillars are uniformly distributed on both sides of the second bank layer.
11. The display panel according to claim 9, wherein heights of the first bank layer, the spacer columns outside the second bank layer, and the spacer columns inside the second bank layer are sequentially decreased, and the height of the spacer columns inside the second bank layer is greater than the thickness of the second encapsulation layer.
12. The display panel according to claim 9, wherein the barrier pillars, the first bank layer, and the second bank layer are each integrally formed with the substrate body.
13. A method for preparing a thin film packaging structure is characterized by comprising the following steps:
forming a bonding layer on the surface of the first packaging layer;
and forming a second packaging layer on the surface of the bonding layer, which is far away from the first packaging layer, so that the first packaging layer and the second packaging layer are bonded through the bonding layer, wherein the bonding layer comprises a first functional group, the second packaging layer contains particles with a second functional group, and the bonding layer and the second packaging layer are bonded through a chemical bond formed by the first functional group and the second functional group.
14. The method for manufacturing a thin film encapsulation structure according to claim 13, wherein the step of forming a bonding layer on the surface of the first encapsulation layer comprises:
the surface of the first encapsulating layer is treated by a carrier gas in a pulse manner with silane having an amino group to form an adhesive layer having an amino group on the surface of the first encapsulating layer.
15. The method for manufacturing a thin film encapsulation structure according to claim 14, wherein the amino group is a diisopropylamino group.
16. The method for manufacturing a thin film encapsulation structure according to claim 14 or 15,
the step of forming a second encapsulation layer on the surface of the bonding layer, which is away from the first encapsulation layer, so that the first encapsulation layer and the second encapsulation layer are bonded through the bonding layer includes:
doping particles containing at least one functional group of hydroxyl and vinyl in ink-jet printing ink to form printing liquid;
ink-jet printing the printing fluid onto the bonding layer;
and heating the printing liquid on the bonding layer and irradiating the printing liquid with ultraviolet light to form a second packaging layer, wherein in the process of forming the second packaging layer, the amino and the hydroxyl and/or the vinyl form a covalent bond to bond the second packaging layer and the bonding layer.
17. The method for preparing a film packaging structure according to claim 16, wherein the mass ratio of the particles to the inkjet printing ink is 0.5% to 3%.
18. The method for manufacturing a film encapsulation structure according to claim 16, wherein the heating temperature is 80 ℃ to 120 ℃.
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| CN114843421B (en) * | 2022-04-21 | 2023-10-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
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