CN112864337A - Flexible display panel and preparation method thereof - Google Patents
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- CN112864337A CN112864337A CN202110033580.4A CN202110033580A CN112864337A CN 112864337 A CN112864337 A CN 112864337A CN 202110033580 A CN202110033580 A CN 202110033580A CN 112864337 A CN112864337 A CN 112864337A
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a flexible display panel and a preparation method thereof, wherein the flexible display panel comprises a TFT (thin film transistor) substrate, an OLED (organic light emitting diode) device layer, a thin film packaging layer and a packaging substrate, the packaging substrate comprises a water absorption layer which is positioned on the TFT substrate and covers the thin film packaging layer and a flexible cover plate which is positioned on the water absorption layer, and the flexible cover plate is made of ultrathin tempered glass. The packaging substrate is combined with the flexible cover plate through the water absorption layer, the water absorption layer adopts pressure-sensitive adhesive, the flexible cover plate adopts ultrathin tempered glass, the packaging substrate is attached to the TFT substrate, and the water absorption layer can prevent water vapor from entering from the side due to the fact that the ultrathin tempered glass has strong water resistance, so that the packaging substrate has an excellent packaging effect; in addition, the ultra-thin tempered glass has high transmittance, can meet the requirements of a top-emitting OLED display panel, and can ensure the foldable and bendable characteristics of the flexible display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display panel and a preparation method thereof.
Background
Currently, large-sized flexible Organic light-emitting diode (OLED) display panels in top emission are under development, wherein flexible packaging above an OLED device layer is a difficult point, and a packaging material adopted for flexible packaging not only needs to ensure transmittance, but also needs to ensure a packaging effect. The existing packaging substrate is mainly of a laminated structure formed by pressure sensitive adhesive and a barrier layer, wherein the barrier layer is mainly formed by depositing inorganic materials on a flexible base material, and the pressure sensitive adhesive adheres the barrier layer to a Thin Film Transistor (TFT) substrate.
The Water Vapor Transmission Rate (WVTR) of the existing barrier layer is in the level of 10-3g/m2/d, and the packaging requirement of an OLED device layer cannot be met. The conventional pressure-sensitive adhesive is not added with a drying agent for ensuring the transmittance, so that the water absorption capacity is insufficient, and the packaging requirement of an OLED device layer cannot be met.
In view of the foregoing, it is desirable to provide a new flexible display panel and a method for manufacturing the same to solve the above-mentioned problems.
Disclosure of Invention
The embodiment of the invention provides a flexible display panel and a preparation method thereof, and aims to solve the technical problem that when a packaging substrate adopts a laminated structure formed by a pressure sensitive adhesive and a barrier layer, the packaging requirements of an OLED device layer cannot be met in the conventional flexible display panel and the preparation method thereof.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
an embodiment of the present invention provides a flexible display panel, including:
a TFT substrate;
the OLED device layer is positioned on the TFT substrate;
the thin film packaging layer is positioned on the TFT substrate and covers the OLED device layer; and
a package substrate on the thin film encapsulation layer, the package substrate including:
the water absorption layer is positioned on the TFT substrate and covers the thin film packaging layer; and
and the flexible cover plate is positioned on the water absorption layer and is made of ultrathin tempered glass.
According to the flexible display panel provided by the embodiment of the invention, the water absorption layer is made of a pressure-sensitive or heat-sensitive adhesive material.
According to the flexible display panel provided by the embodiment of the invention, the water absorption layer is dispersed with desiccant particles, and the desiccant particles adopt any one of liquid desiccant particles, nano-scale particles and transparent resin particles.
According to the flexible display panel provided by the embodiment of the invention, the thickness of the water absorption layer is less than or equal to 50 um.
According to the flexible display panel provided by the embodiment of the invention, the thickness of the flexible cover plate is less than or equal to 50 um.
According to the flexible display panel provided by the embodiment of the invention, the film packaging layer comprises:
the first water-resistant layer is positioned on the TFT substrate and covers the OLED device layer;
the buffer layer is positioned on the first waterproof layer; and
a second water resistant layer on the first water resistant layer and covering the buffer layer.
According to the flexible display panel provided by the embodiment of the invention, the TFT substrate comprises:
a flexible substrate;
the TFT array layer is arranged on one side, close to the OLED device layer, of the flexible substrate; and
and the support film is arranged on one side of the substrate base plate, which is far away from the OLED device layer.
The embodiment of the invention provides a preparation method of a flexible display panel, which comprises the following steps:
s10: providing a TFT substrate;
s20: forming an OLED device layer on the TFT substrate;
s30: forming a thin film packaging layer covering the OLED device layer on the TFT substrate;
s40: providing a packaging substrate, wherein the packaging substrate comprises a water absorption layer and a flexible cover plate formed on the water absorption layer, the water absorption layer is formed on the TFT substrate and covers the thin film packaging layer, and the flexible cover plate is made of ultrathin tempered glass;
s50: attaching the packaging substrate to the TFT substrate; and
s60: and thermally curing the water-absorbing layer.
According to the preparation method of the flexible display panel provided by the embodiment of the invention, the water absorption layer is made of a pressure-sensitive or heat-sensitive adhesive material.
According to the preparation method of the flexible display panel provided by the embodiment of the invention, the water absorption layer is dispersed with desiccant particles, and the desiccant particles are any one of liquid desiccant particles, nano-scale particles and transparent resin particles.
The invention has the beneficial effects that: according to the flexible display panel and the preparation method thereof, the packaging substrate is combined with the flexible cover plate through the water absorption layer, the water absorption layer adopts the pressure-sensitive adhesive, the flexible cover plate adopts the ultrathin tempered glass, and the packaging substrate is attached to the TFT substrate; in addition, the ultra-thin tempered glass has high transmittance, can meet the requirements of a top-emitting OLED display panel, and can ensure the foldable and bendable characteristics of the flexible display panel.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible display panel according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present invention;
fig. 3A to fig. 3I are schematic flow structure diagrams of a method for manufacturing a flexible display panel according to an embodiment of the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
Aiming at the flexible display panel and the preparation method thereof in the prior art, the packaging requirements of the OLED device layer cannot be met when the packaging substrate adopts a laminated structure formed by the pressure sensitive adhesive and the barrier layer, and the defect can be solved by the embodiment.
As shown in fig. 1, the flexible display panel provided in the embodiment of the present invention may be a middle-large size top emission flexible OLED display panel, and the flexible display panel includes a TFT substrate 10, and an OLED device layer 20, a thin film encapsulation layer 30, and an encapsulation substrate 40 sequentially disposed on the TFT substrate 10.
The TFT substrate 10 is a flexible TFT substrate, the TFT substrate 10 includes a flexible substrate 101 and is disposed on one side of the flexible substrate 101 close to the OLED device layer 20, and the flexible substrate 101 may be Polyimide (PI). The TFT substrate 10 further includes a support film 103, and the support film 103 is disposed on a side of the flexible substrate 101 away from the OLED device layer 20, and is used for supporting the flexible substrate 101.
The OLED device layer 20 is located on the TFT substrate 10, and the OLED device layer 20 includes an organic light emitting layer.
The thin film encapsulation layer 30 includes a first water-blocking layer 301, a buffer layer 302 and a second water-blocking layer 303, the first water-blocking layer 301 is located on the TFT substrate 10 and covers the OLED device layer 20, and the OLED device layer 20 is covered by the first water-blocking layer 301. The buffer layer 302 is located on the first water blocking layer 301, the buffer layer 302 is any one of polymer silicon-based organic polymer or organic resin, and the size of the buffer layer 302 is smaller than that of the first water blocking layer 301 and larger than that of the OLED device layer 20. The second water-blocking layer 303 is located on the first water-blocking layer 301 and covers the buffer layer 302, the buffer layer 302 is covered by the second water-blocking layer 303, the size of the first water-blocking layer 301 is equal to that of the second water-blocking layer 303, and the first water-blocking layer 301 and the second water-blocking layer 303 are made of inorganic materials, including single layers or stacked layers of SiO2 (silicon dioxide), SiOx (silicon oxide), SiON (silicon oxynitride), SiNx (silicon nitride), Al2O3 (aluminum oxide), and the like. The buffer layer 302 is used for reducing stress between the first water-resistant layer 301 and the second water-resistant layer 303, and the first water-resistant layer 301 and the second water-resistant layer 303 are used for preventing external moisture from invading into the OLED device layer 20.
It should be noted that, in the embodiment of the present invention, the film encapsulation layer 30 includes a three-layer encapsulation structure composed of the first water-blocking layer 301, the buffer layer 302 and the second water-blocking layer 303, but it should be understood that the film encapsulation layer 30 is not limited to a three-layer structure, and may also be composed of more layers, for example, a five-layer structure (the first water-blocking layer 301, the first buffer layer, the second water-blocking layer 303, the second buffer layer and the third water-blocking layer) may be adopted, and the number of the water-blocking layers in the film encapsulation layer 30 and the thickness of each layer may be adjusted according to actual needs, which is not limited in this invention.
The packaging substrate 40 is located on the thin film packaging layer 30, the packaging substrate 40 includes a water absorption layer 401 and a flexible cover plate 402, the water absorption layer 401 is located on the TFT substrate 10 and covers the thin film packaging layer 30, the water absorption layer 401 covers the OLED device layer 20 and the thin film packaging layer 30, and the flexible cover plate 402 is located on the water absorption layer 401. The flexible cover plate 402 is Ultra-thin strengthened glass (UTG).
The water absorbing layer 401 may be made of a pressure-sensitive or heat-sensitive adhesive material, such as a pressure-sensitive adhesive (PSA). In order to improve the water absorption capacity of the water absorption layer 401, desiccant particles are dispersed in the water absorption layer 401, and the pressure-sensitive adhesive added with the desiccant particles can prevent moisture from entering the OLED device layer 20 from the side face, so that an excellent packaging effect can be obtained. Wherein, the desiccant particles adopt any one of liquid desiccant particles, nano-grade particles and transparent resin particles.
Specifically, the water-absorbing layer 401 has a thickness of 50um or less.
Because the ultrathin tempered glass has strong water resistance, the ultrathin tempered glass has high light transmittance while ensuring flexibility and foldability, and the transmittance is greater than 98%, so that the requirement of the top-emitting OLED display panel on the light transmittance can be fully met. In addition, because the ultra-thin strengthened glass has the density similar to that of common glass and has excellent water resistance, the packaging substrate 40 in the embodiment of the invention adopts the pressure-sensitive adhesive added with the drying agent to be combined with the ultra-thin strengthened glass, so that the packaging substrate has an excellent packaging effect and higher transmittance, and can meet the requirements of a top-emitting OLED display panel.
Specifically, the thickness of the flexible cover plate 402 is less than or equal to 50 um.
As shown in fig. 2, an embodiment of the present invention further provides a method for manufacturing a flexible display panel, including the following steps:
s10: a TFT substrate 10 is provided.
Specifically, the step S10 further includes:
first, as shown in fig. 3A, a glass substrate 50 is provided, the glass substrate 50 is washed with a washing liquid such as pure water or hot sulfuric acid, a PI liquid is applied on the glass substrate 50, and the PI liquid is cured by baking or the like to form the flexible substrate 101. Then, a TFT array layer 102 is formed on the flexible substrate 101 by a method such as plating, coating a photoresist solution, exposing, developing, and etching, thereby forming the TFT substrate 10.
S20: an OLED device layer 20 is formed on the TFT substrate 10.
Specifically, as shown in fig. 3B, the OLED device layer 20 is fabricated on the TFT substrate 10 by evaporation or inkjet printing, and the OLED device layer 20 includes an organic light emitting layer.
S30: a thin film encapsulation layer 30 covering the OLED device layer 20 is formed on the TFT substrate 10.
Specifically, the step S30 includes the steps of:
first, as shown in fig. 3C, a first water blocking layer 301 is formed on the TFT substrate 10 on the upper surface of the OLED device layer 20 by using an atomic layer deposition method or a chemical vapor deposition method, and the first water blocking layer 301 completely covers the OLED device layer 20. Then, as shown in fig. 3D, a buffer layer 302 is formed on the TFT substrate 10 on the upper surface of the first water blocking layer 301 by using an inkjet printing thermosetting polymer material, and the encapsulation material is cured by ultraviolet irradiation or other heating methods. Next, as shown in fig. 3E, a second water-blocking layer 303 is formed on the TFT substrate 10 by using an atomic layer deposition method or a chemical vapor deposition method on the upper surface of the buffer layer 302, and the second water-blocking layer 303 completely covers the buffer layer 302. The first water-resistant layer 301, the buffer layer 302, and the second water-resistant layer 303 constitute the thin film encapsulation layer 30.
S40: providing an encapsulation substrate 40, wherein the encapsulation substrate 40 comprises a water absorption layer 401 and a flexible cover plate 402 formed on the water absorption layer, the water absorption layer 401 is formed on the TFT substrate 10 and covers the thin film encapsulation layer 30, and the flexible cover plate 402 is ultra-thin tempered glass.
Specifically, the step S40 includes the steps of:
as shown in fig. 3F, the water absorbing layer 401 and the flexible cover plate 402 are provided, a first release film 403 is disposed on a side of the water absorbing layer away from the flexible cover plate 402, and a second release film 404 is disposed on a side of the flexible cover plate 402 away from the water absorbing layer 401.
The water absorbing layer 401 and the flexible cover plate 402 are attached together by means of a roller or vacuum pressing. The water absorbing layer 401 may be made of a pressure-sensitive or heat-sensitive adhesive material, such as PSA. Desiccant particles are dispersed in the water-absorbing layer 401, so that the water-absorbing capacity of the pressure-sensitive adhesive can be improved, and moisture can be prevented from entering the OLED device layer 20 from the side surface to obtain an excellent packaging effect. Wherein, the desiccant particles adopt any one of liquid desiccant particles, nano-grade particles and transparent resin particles. Because the ultrathin tempered glass has strong water resistance, the ultrathin tempered glass has high light transmittance while ensuring flexibility and foldability, and can fully meet the requirement of a top-emitting OLED display panel on the light transmittance. The packaging substrate 40 in the embodiment of the invention is combined by the water absorbing layer 401 and the flexible cover plate 402, that is, the packaging substrate 40 is combined with the ultrathin strengthened glass by the pressure sensitive adhesive added with the drying agent, so that the packaging substrate has an excellent packaging effect and higher transmittance, and can meet the requirements of a top-emitting OLED display panel.
S50: the package substrate 40 is attached to the TFT substrate 10.
Specifically, the step S50 further includes the following steps:
first, as shown in fig. 3G, the first release film 403 is removed, and the package substrate 40 is attached to the upper surface of the second water-resistant layer 303 in a vacuum environment. Thereafter, as shown in fig. 3H, the glass substrate 50 is cut, and the flexible substrate 101 is separated from the glass substrate 50. The second release film 404 may or may not be torn off, and under the condition that the second release film 404 is not torn off, the second release film 404 may be used to protect the flexible cover 402.
Next, as shown in fig. 3I, a support film 103 is provided, the release film on one side of the support film 103 is removed, and the support film 103 is attached to one side of the flexible substrate 101 away from the OLED device layer 20 in a vacuum environment.
S60: the water-absorbing layer 401 is thermally cured.
Specifically, the water-absorbing layer 401 may be cured by a mechanical or deaeration thermal press, thereby completing the package.
In summary, in the preparation method of the flexible display panel according to the embodiment of the present invention, the flexible substrate 101 and the TFT array layer 102 are firstly fabricated on one side of the glass substrate 50, then the OLED device layer 20 is fabricated, then the OLED device layer 20 is encapsulated by the multiple layers of the thin film encapsulation layers 30, then the encapsulation substrate 40 composed of the ultra-thin strengthened glass UTG and the pressure-sensitive adhesive with the desiccant is attached to the TFT substrate 10, then the flexible substrate 101 is peeled off from the surface of the glass substrate 50, the support film 103 is attached to one side of the glass substrate 50, and finally the pressure-sensitive adhesive is cured by mechanical hot pressing or defoaming hot pressing to complete encapsulation.
The beneficial effects are that: according to the flexible display panel and the preparation method thereof provided by the embodiment of the invention, the packaging substrate is combined with the flexible cover plate by adopting the water absorption layer, the water absorption layer adopts the pressure-sensitive adhesive, the flexible cover plate adopts the ultrathin tempered glass, and the packaging substrate is attached to the TFT substrate; in addition, the ultra-thin tempered glass has high transmittance, can meet the requirements of a top-emitting OLED display panel, and can ensure the foldable and bendable characteristics of the flexible display panel.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A flexible display panel, comprising:
a TFT substrate;
the OLED device layer is positioned on the TFT substrate;
the thin film packaging layer is positioned on the TFT substrate and covers the OLED device layer; and
a package substrate on the thin film encapsulation layer, the package substrate including:
the water absorption layer is positioned on the TFT substrate and covers the thin film packaging layer; and
and the flexible cover plate is positioned on the water absorption layer and is made of ultrathin tempered glass.
2. The flexible display panel of claim 1, wherein the water-absorbing layer is made of a pressure-sensitive or heat-sensitive adhesive.
3. The flexible display panel of claim 1, wherein the water-absorbing layer has desiccant particles dispersed therein, and the desiccant particles are any one of liquid desiccant particles, nano-scale particles, and transparent resin-based particles.
4. The flexible display panel of claim 1, wherein the water-absorbing layer has a thickness of less than or equal to 50 um.
5. The flexible display panel of claim 1, wherein the flexible cover plate has a thickness less than or equal to 50 um.
6. The flexible display panel of claim 1, wherein the thin film encapsulation layer comprises:
the first water-resistant layer is positioned on the TFT substrate and covers the OLED device layer;
the buffer layer is positioned on the first waterproof layer; and
a second water resistant layer on the first water resistant layer and covering the buffer layer.
7. The flexible display panel of claim 1, wherein the TFT substrate comprises:
a flexible substrate;
the TFT array layer is arranged on one side, close to the OLED device layer, of the flexible substrate; and
and the support film is arranged on one side of the substrate base plate, which is far away from the OLED device layer.
8. A preparation method of a flexible display panel is characterized by comprising the following steps:
s10: providing a TFT substrate;
s20: forming an OLED device layer on the TFT substrate;
s30: forming a thin film packaging layer covering the OLED device layer on the TFT substrate;
s40: providing a packaging substrate, wherein the packaging substrate comprises a water absorption layer and a flexible cover plate formed on the water absorption layer, the water absorption layer is formed on the TFT substrate and covers the thin film packaging layer, and the flexible cover plate is made of ultrathin tempered glass;
s50: attaching the packaging substrate to the TFT substrate; and
s60: and thermally curing the water-absorbing layer.
9. The method for manufacturing a flexible display panel according to claim 8, wherein the water-absorbing layer is made of a pressure-sensitive or heat-sensitive adhesive material.
10. The method of claim 8, wherein desiccant particles are dispersed in the water-absorbing layer, and the desiccant particles are any one of liquid desiccant particles, nano-scale particles, and transparent resin particles.
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| CN202110033580.4A CN112864337A (en) | 2021-01-12 | 2021-01-12 | Flexible display panel and preparation method thereof |
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| CN202110033580.4A CN112864337A (en) | 2021-01-12 | 2021-01-12 | Flexible display panel and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113534320A (en) * | 2021-07-08 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Circular polarizer and organic light emitting diode display panel |
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