CN110488175A - Fingerprint chip testing component, method and computer readable storage medium - Google Patents
Fingerprint chip testing component, method and computer readable storage medium Download PDFInfo
- Publication number
- CN110488175A CN110488175A CN201910703801.7A CN201910703801A CN110488175A CN 110488175 A CN110488175 A CN 110488175A CN 201910703801 A CN201910703801 A CN 201910703801A CN 110488175 A CN110488175 A CN 110488175A
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- fingerprint chip
- capacitive sensing
- copper wire
- guide post
- noise ratio
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- 238000012360 testing method Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 230000006698 induction Effects 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 238000009826 distribution Methods 0.000 claims description 7
- 238000004590 computer program Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The present invention relates to a kind of fingerprint chip testing component, method and computer readable storage mediums.This method comprises: the copper wire array to be measured for interrogating chip capacity sensitive surface can be covered by being arranged out with multi-ribbon electrolytic copper line；With the capacitive sensing face of copper wire array contact fingerprint chip to be measured, capacitive sensing face is read accordingly through capacitive sensing image caused by electric charge induction, there are points of the height of gray value on the capacitive sensing image；Point of height based on the gray value calculates the SNR signal-to-noise ratio between neighbor pixel to the capacitive sensing image using signal noise ratio (snr) of image algorithm, according to the mutual electric induction degree on the SNR Analysis signal-to-noise ratio (SNR) fingerprint chip between adjacent capacitor induction point.The present invention solves the problems, such as that fingerprint chip testing environment and use environment difference are big, judges the mutual electric induction degree between adjacent capacitor induction point by calculating SNR signal-to-noise ratio on capacitive sensing image, the simplification of fingerprint chip testing process is realized with this.
Description
Technical field
The present invention relates to chip testing field more particularly to a kind of fingerprint chip testing components, method and computer-readable
Storage medium.
Background technique
The capacitive sensing face of existing fingerprint chip is formed by multiple capacitive sensing dot matrix column distributions, in test fingerprint chip
When encapsulating the capacitive sensing performance of finished product, human finger need to be simulated using flat rubber head in ATE test machine, by that will put down
Face Rubber end is pressed into the capacitive sensing face of fingerprint chip, produces each capacitive sensing point on capacitive sensing face by electric charge induction
Each unit image is formed capacitive sensing image by respective coordinates position permutation and combination again by raw cell picture, fingerprint chip, then
ATE test machine is sent to through the communication link between fingerprint chip and ATE test machine to perform image display, and is divided for engineer
Analysis.
Since the pixel on image represents the capacitive sensing point on capacitive sensing face, when capacitive sensing point senses charge
When, grey can be presented in corresponding pixel points, and when the damage of capacitive sensing point, black can be presented in corresponding pixel points, take this, work
Cheng Shi can analyze the quality of corresponding capacitive sensing point according to the color of each pixel, and then realize the property in capacitive sensing face
It can detection.
However, existing this test method, in the case where holding sensitive surface without bad point, the capacitor sense of fingerprint chip generation
Answering image only is the pure gray level image of two-dimensional surface, and engineer can only judge the quality of each capacitive sensing point from image, and can not divide
(i.e. electrification capacitive sensing point is to its adjacent not charged capacitor sense for mutual electric induction degree between two capacitive sensing points of phase separation neighbour
The charge that should be put influences), lead to that the mutual electric induction that testing process is specially tested between adjacent capacitor induction point need to additionally be arranged
Degree causes fingerprint chip testing process complexity cumbersome.
Summary of the invention
Present invention aim to address the big problems of fingerprint chip testing environment and use environment difference, and by capacitor
SNR signal-to-noise ratio is calculated in sensed image to judge the mutual electric induction degree between adjacent capacitor induction point, and fingerprint is realized with this
The simplification of chip testing process.
For this purpose, a kind of fingerprint chip testing component is provided, including metal guide post, elastic head and FPC flexible circuit board, institute
It states metal guide post to be fixed on the guide rail of fingerprint chip testing devices, the elastic head is placed at the top of metal guide post, the FPC
Flexible circuit board is equipped with the lines portion for fitting in elastic head top surface, and the shape and fingerprint chip in the lines portion are similar, top surface
It is imprinted with a plurality of exposed copper wire S1, each copper wire S1 is electrically connected with the feeder ear of the fingerprint chip testing devices.
Further, each copper wire S1 is equidistantly arranged in copper wire array, and copper wire array is covered with the top surface in lines portion.
Further, the FPC flexible circuit board is equipped with sideband, and one end of the sideband connects the side in the lines portion
Side, the other end are fixed on the side wall of metal guide post.
Further, the implementation that each copper wire S1 is electrically connected with the feeder ear is specifically: using on the sideband
It is equipped with exposed copper wire S2 in the position connecting with metal guide post side wall, copper wire S2 is contacted and passed through with metal guide post side wall
Cabling in FPC flexible circuit board is electrically connected to the copper wire S1 in the lines portion, the metal guide post and the fingerprint chip
The feeder ear of test equipment is electrically connected.
Further, metal guide post has bolt and nut, and side wall is provided with through hole, offers on the sideband logical
Hole, the copper wire are specifically set on the bottom edge of through-hole, and the bolt is tightened after passing through through-hole and through hole with the nut
It is fixed, to realize that the copper wire S2 is contacted with metal guide post side wall.
It further, further include the copper seat on fingerprint chip testing devices guide rail, copper seat top surface is provided with quantity
Pilot hole that is unlimited and running through copper seat, by array distribution in copper seat top surface, the metal guide post is embedded in wherein each pilot hole
To be fixed on copper seat in one pilot hole, metal guide post bottom connects live wire, and the other end of electric wire is connected to fingerprint core
The feeder ear of built-in testing equipment, so that metal guide post be made to charge.
Further, two side of copper seat is provided with the screw thread for Screw assembly to fingerprint chip testing devices guide rail
Hole.
Further, the top of the elastic head is the square similar with fingerprint chip form.
Further, the square bottom is downwardly extending square cylinder, the top surface side of being provided with of the metal guide post
Shape slot, the form and dimension and square groove of square cylinder are similar, and the square cylinder is embedded into square groove.
Further, the material of the elastic head is fluorocarbon tetramer, aromatic polyamides, SBS, TPU or rubber.
A kind of fingerprint chip detecting method is also provided, comprising:
Lines generation step, the copper wire to be measured for interrogating chip capacity sensitive surface can be covered by being arranged out with multi-ribbon electrolytic copper line
Array；
Image acquisition step reads electricity with the capacitive sensing face of copper wire array contact fingerprint chip to be measured accordingly
Hold sensitive surface through capacitive sensing image caused by electric charge induction, on the capacitive sensing image there are the height of gray value it
Point；
Signal-to-noise ratio calculates step, point of the height based on the gray value, using signal noise ratio (snr) of image algorithm to the electricity
Hold the SNR signal-to-noise ratio between sensed image calculating neighbor pixel, according to adjacent electricity on the SNR Analysis signal-to-noise ratio (SNR) fingerprint chip
Hold the mutual electric induction degree between induction point.
Further, method further include: bad point judgment step is based on the capacitive sensing image, judges fingerprint chip
Capacitive sensing face on bad point distribution situation.
Further, the bad point judgment step further comprises: being analyzed according to the stain on the capacitive sensing image
The bad point distribution situation.
Further, the signal-to-noise ratio measuring and calculating step is only just executed when on determining capacitive sensing face without bad point.
Further, each copper wire equidistantly arranges.
Also provide a kind of electronic equipment, wherein the electronic equipment includes:
Processor；And
It is arranged to the memory of storage computer executable instructions, the executable instruction makes the place when executed
Device is managed to execute according to above-mentioned method.
Also provide a kind of computer readable storage medium, wherein the computer-readable recording medium storage one or more
A program, one or more of programs when being executed by a processor, realize above-mentioned method.
The utility model has the advantages that
The present invention simulates finger lines using the mode of pad pasting, and image measurement is allowed to actually use closer to fingerprint chip
Environment solves the problems, such as that fingerprint chip testing environment and use environment difference are big；The gray value height on image is utilized simultaneously
Point, the SNR signal-to-noise ratio of Sensor is calculated, the mutual electric induction degree between adjacent capacitor induction point is judged with this, from
And realize the simplification to fingerprint chip testing process.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects of the present invention, feature and advantage can
It is clearer and more comprehensible, the followings are specific embodiments of the present invention.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
Fig. 1 shows the structural schematic diagram of the fingerprint chip testing component of the present embodiment；
Fig. 2 shows the amplified front views of FPC flexible circuit board；
Fig. 3 shows the schematic diagram of the capacitive sensing image obtained using the present embodiment method；
Fig. 4 shows the structural schematic diagram of the electronic equipment according to the present embodiment；
Fig. 5 shows the structural schematic diagram of the computer readable storage medium according to the present embodiment.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
5 test component of fingerprint chip as shown in Figure 1 is by copper seat 1, metal guide post 2, elastic head 3 and FPC flexible circuit board 4
Composition, copper seat 1 are used to be fixed on the guide rail of ATE test machine, and two sides are provided with threaded hole 11, are installed to by threaded hole 11
On the guide rail of ATE test machine.In the middle part of copper seat 1 have protrusion, the top surface of the protrusion be provided with quantity it is unlimited and through copper seat 1 circle
Pilot hole 12, each pilot hole 12 is by array distribution in raised top surface.Metal guide post 2 is tested according to fingerprint chip 5 to be measured in ATE
Position in machine selects appropriate pilot hole 12 and is embedded by way of screw connection wherein, to be fixed on copper seat 1.
2 bottom of metal guide post is connected with electric wire not shown in the figure, and the other end of electric wire is connected to the feeder ear of ATE test machine, thus
So that metal guide post 2 charges.
The top of elastic head 3 is the square 31 similar with 5 shape of chip, is referred to so as to fit over by the square comprehensively
The capacitive sensing face of line chip 5,31 bottom of square are downwardly extending square cylinder 32, the top surface side of being provided with of metal guide post 2
Shape slot 21, the form and dimension and square groove 21 of square cylinder 32 are similar, and square cylinder 32 is embedded in by fashion of extrusion
To square groove 21, both realize to inserting, so that elastic head 3 is mounted on 2 top of metal guide post.
FPC flexible circuit board 4 is divided for three parts, is lines portion 41 and two sides for being connected to 41 two sides of lines portion respectively
Band 42, lines portion 41 are integrally formed with sideband 42 and are made of FPC.Wherein, the shape in lines portion 41 and 3 top surface phase of elastic head
It is imitative, 3 top surface of elastic head is fitted in by conducting resinl, sees Fig. 2, the top surface in lines portion 41 is imprinted with a plurality of exposed copper wire S1,
Each copper wire S1 presses 45 degree of angles of inclination and equidistantly arranges, to form the highdensity copper wire battle array for being covered with 41 top surface of lines portion
Column simulate the lines of similar fingerprint with this.To realize that each copper wire S1 of 41 top surface of lines portion is in electrical communication with one another, in lines portion 41
Top surface rectangular copper coil 411 is set, be connected to each copper wire S1 of 41 top surface of lines portion on rectangular copper coil 411.
See Fig. 2, a through-hole 421 is respectively offered on two sidebands 42, wherein the bottom edge of each through-hole 421 studs with
One layer of exposed copper wire S2, copper wire S2 are electrically connected by the cabling 43 on FPC with the rectangular copper wire of 41 top surface of lines portion.
See Fig. 1, the through hole 22 in portion therethrough is provided on the side wall of metal guide post 2, lines portion 41 is fitted in soft
Elastic head 3 on after, by two 42 downward bendings of sideband, the through-hole 421 on two sidebands 42 is made to be respectively aligned to through hole 22
Both ends, then with bolt not shown in the figure pass through each Kong Houyong nut tighten fixation, at this time the copper wire at 421 edge of through-hole and gold
Belong to 2 intimate surface contact of guide post to conductive, electric energy, which is transmitted to lines portion 41, charges copper wire array thereon.
In use process, lines portion 41 is under transverse shifting and the vertical lift effect of ATE test machine guide rail, contact measured
The capacitive sensing face of fingerprint chip 5 in contact process, is charged to simulate finger pressing in capacitive sensing face and lines portion 41
The part of copper wire S1 contact receives electric charge induction and generates image, and grey is presented in corresponding pixel points, such as the region A in Fig. 3；And capacitor sense
The part (i.e. the part in capacitive sensing gap between quasi- copper wire) for answering face not contact with copper wire S1 is not acted on then by electric charge induction,
(i.e. white is presented in corresponding pixel points) can be thus left white in the corresponding position of capacitive sensing image, to generate as shown in Figure 3
Region B.Theoretically, region B should be pure white, but since two adjacent in practice capacitive sensing points can have phase mutual inductance
Answer, the electrification of the point of capacitive sensing corresponding to the A of region can capacitive sensing point to region B generate induced voltage, make corresponding to the B of region
Capacitive sensing point can carry voltage more lower than the point of capacitive sensing corresponding to the A of region, embodiment is exactly region B change on the image
At light gray, there are point of the height of gray value on image, wherein what grayish color intensity reflected is exactly noise journey
Degree, is taken this, the SNR signal-to-noise ratio between neighbor pixel can be analyzed using the color intensity.
When test, engineer's mode of operation according to upper section obtains capacitive sensing image, observes capacitive sensing image
On whether there is or not stain generation, take this to judge that whether there is or not bad points on the capacitive sensing face of fingerprint chip 5, such as nothing, it is meant that capacitive sensing face
Intact, then engineer can be calculated further according to point of the height of gray value on image using traditional signal noise ratio (snr) of image algorithm
SNR signal-to-noise ratio between neighbor pixel judges on fingerprint chip 5 between adjacent capacitor induction point further according to SNR signal-to-noise ratio
Mutual electric induction degree.Specifically, reference, which is worked as, is not limited to following signal noise ratio (snr) of image algorithm calculating SNR signal-to-noise ratio:
S10: intercepting rectangular image I at random in the region B of capacitive sensing image, and rectangular image I includes M × N number of pixel
Point, established standards rectangular image K, rectangular image K size is identical as rectangular image I size, also includes M × N number of pixel, wherein
Pixel color in rectangular image K is white；
S11: calculating the mean square deviation MSE between rectangular image I, K by following formula (1),
In formula, I (i, j) indicates in rectangular image I that encoding value representated by color is (referred to as at the i-th row j column pixel
Color data), K (i, j) indicates the color data in rectangular image K at the i-th row j column pixel；
S12: after obtaining the mean square deviation MSE between rectangular image I, K, calculating SNR signal-to-noise ratio by following formula (2),
In formula, MAXIIndicate the attainable maximum value of color data institute.
What is reflected due to the numerical value of SNR signal-to-noise ratio is exactly mutual electric induction degree between adjacent capacitor induction point,
In this way, engineer is not necessarily to additional 5 testing process of fingerprint chip, mutual electric induction journey can determine whether according only to capacitive sensing image
Degree simplifies to realize to 5 testing process of fingerprint chip.
The present embodiment simulates finger lines using the mode of twill pad pasting, allows image measurement closer to fingerprint chip 5
Practical service environment solves the problems, such as that fingerprint chip 5 tests environment and use environment difference is big；The gray scale on image is utilized simultaneously
It is worth point of height, the SNR signal-to-noise ratio of Sensor is calculated, the mutual electric induction between adjacent capacitor induction point is judged with this
Degree, to realize the simplification to 5 testing process of fingerprint chip.
It should be understood that
In the present embodiment, the effect of elastic head 3 be only make FPC flexible circuit board 4 with fingerprint chip 5 is soft contacts, therefore its material
Matter only needs to consider resiliency characteristics, without regard to conductive characteristic, can select for fluorocarbon tetramer, aromatic polyamides,
SBS, TPU or rubber etc.；
The wiring lines of copper wire in the present embodiment is not limited to tilt, and is also possible to other lines closer to finger print
Road.
Finally it should be noted that: provided herein algorithm and display not with any certain computer, virtual bench or
Other equipment are inherently related.Various fexible units can also be used together with teachings based herein.As described above, structure
It is obvious for making structure required by this kind of device.In addition, the present invention is also not directed to any particular programming language.It should be bright
It is white, it can use various programming languages and realize summary of the invention described herein, and retouched above to what language-specific was done
State is in order to disclose the best mode of carrying out the invention.
In the instructions provided here, numerous specific details are set forth.It is to be appreciated, however, that implementation of the invention
Example can be practiced without these specific details.In some instances, well known method, structure is not been shown in detail
And technology, so as not to obscure the understanding of this specification.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of the various inventive aspects, In
Above in the description of exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the disclosed method should not be interpreted as reflecting the following intention: i.e. required to protect
Shield the present invention claims features more more than feature expressly recited in each claim.More precisely, as following
Claims reflect as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
All as a separate embodiment of the present invention.
Those skilled in the art will understand that can be carried out adaptively to the module in the equipment in embodiment
Change and they are arranged in one or more devices different from this embodiment.It can be the module or list in embodiment
Member or component are combined into a module or unit or component, and furthermore they can be divided into multiple submodule or subelement or
Sub-component.Other than such feature and/or at least some of process or unit exclude each other, it can use any
Combination is to all features disclosed in this specification (including adjoint claim, abstract and attached drawing) and so disclosed
All process or units of what method or apparatus are combined.Unless expressly stated otherwise, this specification is (including adjoint power
Benefit require, abstract and attached drawing) disclosed in each feature can carry out generation with an alternative feature that provides the same, equivalent, or similar purpose
It replaces.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included certain features rather than other feature, but the combination of the feature of different embodiments mean it is of the invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed is appointed
Meaning one of can in any combination mode come using.
Various component embodiments of the invention can be implemented in hardware, or to run on one or more processors
Software module realize, or be implemented in a combination thereof.It will be understood by those of skill in the art that can be used in practice
Microprocessor or digital signal processor (DSP) realize the wearing state of detection electronic equipment according to an embodiment of the present invention
Device in some or all components some or all functions.The present invention is also implemented as executing institute here
Some or all device or device programs of the method for description are (for example, computer program and computer program produce
Product).It is such to realize that program of the invention can store on a computer-readable medium, or can have one or more
The form of signal.Such signal can be downloaded from an internet website to obtain, and perhaps be provided on the carrier signal or to appoint
What other forms provides.
For example, Fig. 4 shows the structural schematic diagram of electronic equipment according to an embodiment of the invention.The electronic equipment passes
It include processor 61 and the memory 62 for being arranged to storage computer executable instructions (program code) on system.Memory 62 can
To be the Electronic saving of such as flash memory, EEPROM (electrically erasable programmable read-only memory), EPROM, hard disk or ROM etc
Device.Memory 62 has the memory space 63 stored for executing the program code 64 of any method and step in embodiment.Example
It such as, may include each journey for being respectively used to realize the various steps in above method for the memory space of program code 63
Sequence code 64.These program codes can read or be written to from one or more computer program product this or
In the multiple computer program products of person.These computer program products include such as hard disk, compact-disc (CD), storage card or soft
The program code carrier of disk etc.Such computer program product is usually computer-readable storage medium described in such as Fig. 5
Matter.The computer readable storage medium can have the memory paragraph of 62 similar arrangement of memory in the electronic equipment with Fig. 4, deposit
Store up space etc..Program code can for example be compressed in a suitable form.In general, storage unit is stored with for executing according to this
The program code 71 of the method and step of invention, it can the program code read by such as 61 etc processor, when these journeys
When sequence code is run by electronic equipment, the electronic equipment is caused to execute each step in method described above.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and ability
Field technique personnel can be designed alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between parentheses should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Element or step listed in the claims.Word "a" or "an" located in front of the element does not exclude the presence of multiple such
Element.The present invention can be by means of including the hardware of several different elements and being come by means of properly programmed computer real
It is existing.In the unit claims listing several devices, several in these devices can be through the same hardware branch
To embody.The use of word first, second, and third does not indicate any sequence.These words can be explained and be run after fame
Claim.
Claims (10)
1. fingerprint chip testing component, it is characterised in that: including metal guide post, elastic head and FPC flexible circuit board, the metal
Guide post is fixed on the guide rail of fingerprint chip testing devices, and the elastic head is placed at the top of metal guide post, the FPC flexible wires
Road plate is equipped with the lines portion for fitting in elastic head top surface, and the shape and fingerprint chip in the lines portion are similar, and top surface is imprinted with
A plurality of exposed copper wire S1, each copper wire S1 are electrically connected with the feeder ear of the fingerprint chip testing devices.
2. fingerprint chip testing component according to claim 1, it is characterized in that: each copper wire S1 is equidistantly arranged in
Copper wire array, copper wire array are covered with the top surface in lines portion.
3. fingerprint chip testing component according to claim 1, it is characterised in that: the FPC flexible circuit board is equipped with side
Band, one end of the sideband connect the side in the lines portion, and the other end is fixed on the side wall of metal guide post.
4. fingerprint chip testing component according to claim 3, which is characterized in that each copper wire S1 with the feeder ear
The implementation of electrical connection is specifically: the position on the sideband for connecting with metal guide post side wall is equipped with exposed copper wire
S2, copper wire S2 are contacted with metal guide post side wall and are passed through the cabling in FPC flexible circuit board and be electrically connected in the lines portion
Copper wire S1, the metal guide post is electrically connected with the feeder ear of the fingerprint chip testing devices.
5. fingerprint chip testing component according to claim 4, it is characterised in that: metal guide post has bolt and nut,
Its side wall is provided with through hole, and through-hole is offered on the sideband, and the copper wire is specifically set on the bottom edge of through-hole, the spiral shell
Bolt tightens fixation with the nut after through-hole and through hole, to realize that the copper wire S2 is contacted with metal guide post side wall.
6. fingerprint chip detecting method characterized by comprising
Lines generation step, the copper wire battle array to be measured for interrogating chip capacity sensitive surface can be covered by being arranged out with multi-ribbon electrolytic copper line
Column；
Image acquisition step reads capacitor sense with the capacitive sensing face of copper wire array contact fingerprint chip to be measured accordingly
Answer face through capacitive sensing image caused by electric charge induction, there are points of the height of gray value on the capacitive sensing image；
Signal-to-noise ratio calculates step, point of the height based on the gray value, using signal noise ratio (snr) of image algorithm to the capacitor sense
Image is answered to calculate the SNR signal-to-noise ratio between neighbor pixel, according to adjacent capacitor sense on the SNR Analysis signal-to-noise ratio (SNR) fingerprint chip
Mutual electric induction degree between should putting.
7. fingerprint chip detecting method according to claim 6, which is characterized in that further include: bad point judgment step, base
In the capacitive sensing image, the bad point distribution situation on the capacitive sensing face of fingerprint chip is judged.
8. fingerprint chip detecting method according to claim 7, which is characterized in that the bad point judgment step is further wrapped
It includes: the bad point distribution situation is analyzed according to the stain on the capacitive sensing image.
9. fingerprint chip detecting method according to claim 7, it is characterised in that: the signal-to-noise ratio measuring and calculating step is only being sentenced
It is just executed when breaking on capacitive sensing face without bad point.
10. a kind of computer readable storage medium, wherein the computer-readable recording medium storage one or more program,
One or more of programs when being executed by a processor, realize method described in any one of claim 6-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910703801.7A CN110488175B (en) | 2019-07-31 | 2019-07-31 | Fingerprint chip test part, method and computer readable storage medium |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910703801.7A CN110488175B (en) | 2019-07-31 | 2019-07-31 | Fingerprint chip test part, method and computer readable storage medium |
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Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11183560A (en) * | 1997-12-24 | 1999-07-09 | Hitachi Ltd | Bare-chip burn-in carrier and manufacture of semicondctor device by using the same |
| KR200392690Y1 (en) * | 2005-05-16 | 2005-08-17 | 주식회사 유니온커뮤니티 | Fingerprint sensor of electronic capacity method for superior fingerprint image |
| KR20080102730A (en) * | 2007-05-22 | 2008-11-26 | 삼성전자주식회사 | Display apparatus |
| CN201903594U (en) * | 2010-10-20 | 2011-07-20 | 天津市中环高科技有限公司 | Capacitive touch screen test device |
| US20160012271A1 (en) * | 2014-07-14 | 2016-01-14 | Fingerprint Cards Ab | Method and electronic device for noise mitigation |
| CN205644573U (en) * | 2016-03-07 | 2016-10-12 | 南昌欧菲生物识别技术有限公司 | Fingerprint sensor's sensing apparatus |
| CN106298569A (en) * | 2016-07-28 | 2017-01-04 | 深圳芯启航科技有限公司 | The volume production method of testing of a kind of image chip and device |
| CN106415294A (en) * | 2016-07-19 | 2017-02-15 | 深圳市汇顶科技股份有限公司 | Test method and test apparatus of sensing module |
| CN106801824A (en) * | 2016-12-29 | 2017-06-06 | 东莞市成卓金属制品有限公司 | A kind of production method of double and wire lamp string |
| US20170169278A1 (en) * | 2015-12-14 | 2017-06-15 | Fingerprint Cards Ab | Method and fingerprint sensing system for forming a fingerprint image |
| CN206311728U (en) * | 2016-12-30 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Automatic blanking fingerprint chip test system |
| CN107025655A (en) * | 2016-01-28 | 2017-08-08 | 南昌欧菲生物识别技术有限公司 | The apparatus and method of test fingerprint sensor image quality |
| WO2017133185A1 (en) * | 2016-02-02 | 2017-08-10 | 深圳市汇顶科技股份有限公司 | Data acquisition chip test system and device and control method therefor |
| EP3316180A1 (en) * | 2016-05-30 | 2018-05-02 | Shenzhen Xinwei Technology Co, Ltd. | Biosensing chip and electronic device |
| CN108051727A (en) * | 2017-11-03 | 2018-05-18 | 杭州长川科技股份有限公司 | Fingerprint chip electric performance testing device |
| CN207690781U (en) * | 2017-12-21 | 2018-08-03 | 苏州迈瑞微电子有限公司 | QFN encapsulating structures, the QFN encapsulating structures of fingerprint recognition and the smart mobile phone with it |
| CN109596958A (en) * | 2017-09-29 | 2019-04-09 | 敦泰电子有限公司 | Sensor unit, fingerprint sensor and electronic equipment |
| CN110031188A (en) * | 2019-03-29 | 2019-07-19 | 上海华岭集成电路技术股份有限公司 | Integrated circuit optical chip aperture test method |
| CN211061640U (en) * | 2019-07-31 | 2020-07-21 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component |
-
2019
- 2019-07-31 CN CN201910703801.7A patent/CN110488175B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11183560A (en) * | 1997-12-24 | 1999-07-09 | Hitachi Ltd | Bare-chip burn-in carrier and manufacture of semicondctor device by using the same |
| KR200392690Y1 (en) * | 2005-05-16 | 2005-08-17 | 주식회사 유니온커뮤니티 | Fingerprint sensor of electronic capacity method for superior fingerprint image |
| KR20080102730A (en) * | 2007-05-22 | 2008-11-26 | 삼성전자주식회사 | Display apparatus |
| CN201903594U (en) * | 2010-10-20 | 2011-07-20 | 天津市中环高科技有限公司 | Capacitive touch screen test device |
| US20160012271A1 (en) * | 2014-07-14 | 2016-01-14 | Fingerprint Cards Ab | Method and electronic device for noise mitigation |
| US20170169278A1 (en) * | 2015-12-14 | 2017-06-15 | Fingerprint Cards Ab | Method and fingerprint sensing system for forming a fingerprint image |
| CN107025655A (en) * | 2016-01-28 | 2017-08-08 | 南昌欧菲生物识别技术有限公司 | The apparatus and method of test fingerprint sensor image quality |
| WO2017133185A1 (en) * | 2016-02-02 | 2017-08-10 | 深圳市汇顶科技股份有限公司 | Data acquisition chip test system and device and control method therefor |
| CN205644573U (en) * | 2016-03-07 | 2016-10-12 | 南昌欧菲生物识别技术有限公司 | Fingerprint sensor's sensing apparatus |
| EP3316180A1 (en) * | 2016-05-30 | 2018-05-02 | Shenzhen Xinwei Technology Co, Ltd. | Biosensing chip and electronic device |
| CN106415294A (en) * | 2016-07-19 | 2017-02-15 | 深圳市汇顶科技股份有限公司 | Test method and test apparatus of sensing module |
| CN106298569A (en) * | 2016-07-28 | 2017-01-04 | 深圳芯启航科技有限公司 | The volume production method of testing of a kind of image chip and device |
| CN106801824A (en) * | 2016-12-29 | 2017-06-06 | 东莞市成卓金属制品有限公司 | A kind of production method of double and wire lamp string |
| CN206311728U (en) * | 2016-12-30 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Automatic blanking fingerprint chip test system |
| CN109596958A (en) * | 2017-09-29 | 2019-04-09 | 敦泰电子有限公司 | Sensor unit, fingerprint sensor and electronic equipment |
| CN108051727A (en) * | 2017-11-03 | 2018-05-18 | 杭州长川科技股份有限公司 | Fingerprint chip electric performance testing device |
| CN207690781U (en) * | 2017-12-21 | 2018-08-03 | 苏州迈瑞微电子有限公司 | QFN encapsulating structures, the QFN encapsulating structures of fingerprint recognition and the smart mobile phone with it |
| CN110031188A (en) * | 2019-03-29 | 2019-07-19 | 上海华岭集成电路技术股份有限公司 | Integrated circuit optical chip aperture test method |
| CN211061640U (en) * | 2019-07-31 | 2020-07-21 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component |
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|---|---|
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