CN106415294A - Test method and test apparatus of sensing module - Google Patents
Test method and test apparatus of sensing module Download PDFInfo
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- CN106415294A CN106415294A CN201680000900.3A CN201680000900A CN106415294A CN 106415294 A CN106415294 A CN 106415294A CN 201680000900 A CN201680000900 A CN 201680000900A CN 106415294 A CN106415294 A CN 106415294A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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Abstract
The invention relates to the field of testing technology of electronic products, and discloses a test method and test apparatus of a sensing module. The testing method comprises the following steps: controlling a sensing module to send a test signal to a conductive solution, soaking the sensing module in the conductive solution; receiving a feedback signal, which is received through the conductive solution and sent by the sensing module; and generating a test result according to the feedback signal. The invention also provides a test apparatus. According to the test method, a conductive solution is used to replace the test hardware in the conventional technology, due to the mobility of the liquid, the conductive solution and the surface of a sensing module are completely attached, moreover, the error of test hardware is eliminated, the interference is further reduced, and the precision of test data is improved.
Description
Technical field
Present patent application is related to the measuring technology of electronic product, particularly to a kind of method of testing of inductive module and test
Device.
Background technology
With the arrival of fingerprint recognition and mobile payment tide, capacitance type fingerprint chip has welcome explosive growth, and right
During capacitance type fingerprint chip application, in order to obtain good picture quality, fingerprint chip has to pass through calibration and tests.
Common calibration and method of testing be using press on the induction zone of fingerprint chip an opposed flattened each to
The same sex can conductive plane (common are Rubber end, ferrule), then gathered data, by processing to data, carry out core
Piece self calibration, also can be examined to the thickness of epoxy molding material (Epoxy Molding Compound, EMC) layer and density
Survey.
However, it is conventional Rubber end (or ferrule) itself out-of-flatness, different Rubber end (or ferrule) density, smooth
Degree is inconsistent, and can wear and tear (leading to more out-of-flatness) after use repeatedly.On the other hand, using Rubber end (or metal
Head) physical depression damages chip, and the size of physical depression intensity can affect test result thereby increases and it is possible to induction zone to fingerprint chip
Cause to damage.
Content of the invention
The purpose of section Example of the present invention is to provide a kind of method of testing of inductive module and test device, using leading
Electric solution replaces test hardware of the prior art, makes conducting solution complete with the surface of inductive module using the mobility of liquid
Full laminating；Thus eliminating the deviation of test hardware of the prior art itself, can obtain disturbing less, the higher survey of precision
Examination data.
For solving above-mentioned technical problem, An embodiment provides a kind of method of testing of inductive module, bag
Include：Inductive module is controlled to send test signal to conducting solution, inductive module is immersed in conducting solution；Receive inductive module to lead to
Cross the feedback signal of conducting solution reception；According to feedback signal generation test result.
An alternative embodiment of the invention additionally provides a kind of test device, is applied to the survey of above-described inductive module
Method for testing；Described test device includes：Bracing frame, testing flume, test fixture, electric connector and microprocessor；Described survey
Examination tank is arranged at support frame as described above；Described testing flume is built with described conducting solution；Described test fixture movably sets
It is placed in support frame as described above, described test fixture is used for clamping described inductive module；Described electric connector is connected to described microprocessor
Device, for mutually passing signal for described microprocessor and described inductive module；Wherein, when the described survey being clamped with described inductive module
When examination fixture movement is to test position, described inductive module is immersed in described conducting solution；Described microprocessor is used for controlling
Described inductive module sends described test signal to described conducting solution, and passes through described conducting solution according to described inductive module
The feedback signal receiving produces test result.
The present embodiment in terms of existing technologies, using conducting solution as the conducting medium in test, test is believed
Number feed back to inductive module.That is, test hardware (such as Rubber end or ferrule) of the prior art is replaced using conducting solution,
Using the mobility of liquid, conducting solution is fitted completely with the surface of inductive module；Thus eliminating test hardware itself
Deviation, can obtain disturbing less, the higher test data of precision.
In addition, described inductive module is fingerprint inductive module；Described fingerprint inductive module includes fingerprint chip, surface protection
Layer and metal header；Described test signal sent by described metal header by described fingerprint chip molten to described conduction, and
Pass sequentially through described conducting solution and feed back to described fingerprint chip with described sealer, form described feedback signal.I.e., originally
The method of testing of example can be used in testing a kind of correlated performance of fingerprint inductive module.
In addition, described inductive module is fingerprint inductive module；Described fingerprint inductive module is included fingerprint chip and is protected with surface
Sheath；Described test signal is sent to described conducting solution by described sealer by described fingerprint chip；And lead to successively
Cross described conducting solution and feed back to described fingerprint chip with described sealer, form described feedback signal.That is, this example
Method of testing can be used in testing the correlated performance of another kind of fingerprint inductive module.
In addition, the solvent of described conducting solution includes distilled water.Using distilled water as solvent, can avoid introducing miscellaneous
Matter, thus be conducive to obtaining the higher test data of precision.
In addition, the method for testing of described inductive module also includes：Described test result is uploaded to main control device.To test
Result uploads main control device, realizes the unified record to bulk article and manages, in order to follow-up tracking inquiry.
In addition, in test device, described test fixture includes holder and drive mechanism；Described drive mechanism machinery is even
It is connected to described holder, and be electrically connected at described microprocessor；Wherein, described motor is used for driving described holder,
So that the mobile extremely described test position of described holder.I.e. so that inductive module to be immersed in the conducting solution being pre-configured with
Middle the step for, achieves automation；It is achieved thereby that the full-automatic operation of test process；Time saving and energy saving.
In addition, described test device also includes adjusting tank；Described regulation tank be arranged at support frame as described above and with described
Testing flume is connected；Wherein, the described tank that adjusts is used for adjusting the height of the described conducting solution in described testing flume.Increase
If regulation tank, the principle using linker in real time and automatically regulates the height of the conducting solution in testing flume, without people
Work real-time monitoring is simultaneously adjusted；Time saving and energy saving.
Brief description
Fig. 1 (a) is the flow chart according to the method for testing of the inductive module of first example in section Example of the present invention；
Fig. 1 (b) is flatness according to the sealer in first example in section Example of the present invention before compensation
With the schematic diagram after compensation；
Fig. 1 (c) is the thickness measuring principle according to the sealer in first example in section Example of the present invention
Schematic diagram；
Fig. 1 (d) is the impurity and cavity test according to the sealer in first example in section Example of the present invention
The schematic diagram of principle；
Fig. 2 is the flow chart according to the method for testing of the inductive module of second example in section Example of the present invention；
Fig. 3 is the structural representation according to the test device of third example in section Example of the present invention；
Fig. 4 is the block diagram according to the test device of third example in section Example of the present invention；
Fig. 5 is the block diagram according to the test device of fourth example in section Example of the present invention.
Specific embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with the part to the present invention for the accompanying drawing
Embodiment is explained in detail using way of example.However, it will be understood by those skilled in the art that in each example
In, in order that reader more fully understands that the application proposes many ins and outs.But, even if do not have these ins and outs and
Many variations based on following embodiment and modification are it is also possible to realize the application technical scheme required for protection.
First example is related to a kind of method of testing of inductive module.Wherein, inductive module can be with touch sensible work(
Any electronics module of energy, taking fingerprint inductive module is as a example specifically described in this example, right not limited to this.
As shown in Fig. 1 (a), for the flow chart of the method for testing of the inductive module of this example, concrete steps are described as follows.
Step 101：Inductive module is controlled to send test signal to conducting solution, inductive module is immersed in conducting solution.
In this example, need to be pre-configured with normal temperatures conducting solution；Conducting solution can be for example sodium bicarbonate solution
Or sodium carbonate liquor.Wherein, the solvent of conducting solution is distilled water, such that it is able to avoid introducing impurity, is conducive to obtaining essence
Spend higher test data.In general, conducting solution is when close to saturation, electric conductivity is best；But conducting solution is not
Saturation can separate out crystal., when concentration range is [1.8,2.5] gram/every liter, conductance is preferable for such as sodium bicarbonate solution
And it is relatively stable.This example is not intended to be limited in any to the selection of solute in conducting solution；As long as distilled water and tool can be dissolved in
Electric conductivity；This example is also not intended to be limited in any to the concentration range of conducting solution, and different conducting solutions may select not
Same concentration range (being determined by the property of this conducting solution).
It should be noted that the concentration of conducting solution should remain constant (or in the error range allowing),
To ensure the uniformity to the test of each inductive module.
Fingerprint inductive module in this example can have different structure, said below taking two kinds of concrete structures as a example
Bright.
The fingerprint inductive module of the first structure includes circuit board, fingerprint chip, sealer and metal header.Refer to
Line chip is installed on circuit boards, and sealer is arranged on fingerprint chip；Metal header is installed on circuit boards and cincture
Fingerprint chip；Sealer and metal header are electrically connected with fingerprint chip.Wherein, fingerprint chip is, for example, condenser type
Fingerprint chip, right not limited to this；Metal header is, for example, endless metal decoration or earthing member, right not limited to this.
Specifically, the fingerprint chip of described inductive module is connected to a microprocessor.When a test is begun, microprocessor
Device controls fingerprint chip to send test signal to conducting solution.That is, microprocessor sends a startup order to fingerprint chip；Refer to
After line chip receives startup order, obtain the test signal prestoring inside it, and sent to conducting solution by metal header；
So not limited to this, test signal can also be sent to fingerprint chip by microprocessor.Because fingerprint inductive module is immersed in conduction
In solution, i.e. the outer surface of metal header and conducting solution full contact, therefore test signal can all be conducted molten to conduction
In liquid.Wherein, this test signal can be pulse signal.
The fingerprint inductive module of second structure only includes fingerprint chip and sealer.The method of testing of this example should
For the first structure and second structure fingerprint inductive module when, test mode is roughly the same；It is in place of difference：First
Plant in the fingerprint inductive module of structure, test signal is sent to conducting solution by metal header by described fingerprint chip；And the
In the fingerprint inductive module of two kinds of structures, test signal is sent to conducting solution by sealer by fingerprint chip.
Step 102：Receive the feedback signal that inductive module is received by conducting solution.
In this example, inductive module receives feedback signal by conducting solution.That is, for the fingerprint sense of above two structure
For answering module, test signal is and passes sequentially through conducting solution and sealer and feed back to fingerprint chip, forms feedback letter
Number.
Step 103：According to feedback signal generation test result.
Microprocessor receives feedback signal from fingerprint chip, and according to feedback signal generation test result.Test result bag
Include testing flatness result, thickness measuring result and the impurity of sealer and empty test result at least within it
One.Wherein：
Refer to Fig. 1 (b), show the flatness of the sealer schematic diagram before compensation and after compensating, wherein, figure
Before in 1 (b), the figure in left side represents compensation, after the figure on right side represents compensation.Specifically, the flatness of sealer refers to table
The flatness of the outer surface (being used for the surface of sensing signal) of face protective layer；By to the computing of feedback data and process, can
To obtain the flatness of chip.Specifically, the size of feedback signal has actually reacted the outer surface of sealer
Concavo-convex degree；For example, it is possible to calculate the flatness to assess the outer surface of sealer for the mean square deviation feeding back signal, all just
Difference is less, and flatness is higher；So it is not limited to secondary, other relevant parameters that can also calculate feedback signal are smooth to assess
Degree.
In follow-up use, fingerprint chip can carry out self calibration according to this flatness, by compensating, eliminates fingerprint chip
The inconsistency of itself and the inconsistency of sealer.That is, due to due to manufacturing process, the surface of sealer is simultaneously
Non-fully smooth；And fingerprint chip surface is not substantially flat, this also further causes the table being arranged on fingerprint chip surface
The out-of-flatness on the surface of face protective layer.Therefore, by compensating inconsistency and the surface that can eliminate fingerprint chip itself simultaneously
The inconsistency of protective layer.
Refer to Fig. 1 (c), show the schematic diagram of the thickness measuring principle of sealer.Specifically, surface protection
The thickness of layer can be calculated according to formula C (inductance capacitance)=ε S/4 π kd.Wherein, the fingerprint chip in present embodiment
It is capacitance type fingerprint chip, in formula, C refers to the capacitance that capacitance type fingerprint chip detection obtains；D is the thickness of sealer
Degree；In addition, ε, S, π, k are all constants, specifically, ε is dielectric constant, and S is two capacitor boards in capacitance type fingerprint chip
Facing area；D is the spacing of two capacitor boards.
Actual, the size of C determines the size of feedback signal, i.e. C is bigger, and feedback signal is bigger；Table thus can be obtained
The size of face protective layer thickness d and feedback signal is inversely proportional to, around this principle can be by the attenuation degree matching of feedback signal
Go out the thickness of sealer.
Refer to Fig. 1 (d), show the impurity of sealer and the schematic diagram of empty test philosophy.Specifically, table
The impurity of face protective layer can be by drawing to the analysis feeding back signal with cavity.That is, feedback signal is actually surface protection
The data of layer collection；Sealer comprises multiple pixels, according to the number of the poor pixel of data and position in feedback signal
Put, to judge that sealer whether there is impurity or cavity.For example, when there are multiple numbers in certain region of sealer
During according to pixel less than normal, then judge to exist impurity or cavity in this region.
It should be noted that above is taking the fingerprint inductive module of above two structure as a example, to step 102 and step
103 specific implementation illustrates；So this example is not limited to this, and the components and parts being comprised when fingerprint inductive module are not
When same or inductive module is others electronics module, the specific implementation of step 102 and step 103 can be different.
In this example, using conducting solution as the conducting medium in test, test signal is fed back to inductive module.
That is, test hardware (such as Rubber end or ferrule) of the prior art is replaced using conducting solution, using the mobility of liquid
Conducting solution is fitted completely with the surface of inductive module；Thus eliminating the deviation of test hardware itself, can be done
Disturb less, the higher test data of precision；It is also possible to avoid the existing test hardware can to the sensitive surface of inductive module
The hard damage that can cause.
Second example is related to a kind of method of testing of inductive module.Second example is the improvement on the basis of first example,
Mainly the improvement is that：In second example, test result also can be uploaded to main control device.
As shown in Fig. 2 the flow chart of the method for testing of inductive module for second example.Wherein, step 201 is to step
203 is roughly the same to step 103 with the step 101 in first example, and here is omitted；Difference is, this example is new
Increase step 204, be described as follows.
Step 204：Test result is uploaded to main control device.
That is, microprocessor reports main control device by analyzing the test result drawing.
In this example, main control device can record the test result of each fingerprint inductive module, realizes the unification to bulk article
Record and management, in order to follow-up tracking inquiry.
The step of various methods divides above, is intended merely to describe clear, can merge into when realizing a step or
Some steps are split, is decomposed into multiple steps, as long as including identical logical relation, all in the protection domain of this patent
Interior；To adding inessential modification in algorithm or in flow process or introducing inessential design, but do not change its algorithm
With the core design of flow process all in the protection domain of this patent.
Third example is related to a kind of test device, please also refer to Fig. 3 and Fig. 4.Test device in this example includes：?
Support 10, testing flume 11, test fixture 12, electric connector 13, microprocessor 14 and operating parts 15.This test device is used for
Test inductive module 17.
In this example, bracing frame 10 at least includes base 101.Base 101 can be hollow structure, that is, inside base 101
There is an accommodation space, to place microprocessor 14.But this example is not intended to be limited in any to the practical structures of base 101,
And the placement location of microprocessor 14 is also not intended to be limited in any.
In this example, testing flume 11 is arranged at base 101, i.e. testing flume 11 is placed on the upper surface of base 101
On.Testing flume 11 is built with the conducting solution of test.Conducting solution can be for example sodium bicarbonate solution or sodium carbonate
Solution.Wherein, the solvent of conducting solution is distilled water, can avoid introducing impurity, be conducive to obtaining the higher test number of precision
According to.In general, at room temperature conducting solution when close to saturation, electric conductivity is best；But conducting solution is unable to saturation
Separate out crystal.For example at room temperature, when [1.8,2.5] gram/every liter, conductance is relatively for the concentration range of sodium bicarbonate solution
Good and relatively stable.This example is not intended to be limited in any to the selection of solute in conducting solution；As long as can be dissolved in distilled water and
Tool electric conductivity；This example is also not intended to be limited in any to the concentration range of conducting solution, the concentration model of different conducting solution
Enclose and determined by the property of this conducting solution.In addition, the concentration of conducting solution should remain constant (or allow error
In the range of), to ensure the uniformity to the test of each inductive module 17.
Preferably, test device can also include a regulation tank 16, this regulation tank 16 is arranged at base 101, that is,
Adjust tank 16 to be placed on the upper surface of base 101 and be located at the side of testing flume 11；Adjust tank 16 and testing flume
11 are connected.Adjust tank 16 to be used for adjusting the height of the conducting solution in testing flume 11.Specifically, adjust tank 16 to fill
Have and identical conducting solution in testing flume 11.Using law of connected vessels, adjusting tank 16 can adjust in real time and automatically
The height of the conducting solution in section testing flume；Thus need not artificial real-time monitoring adjusting, time saving and energy saving.
In this example, test fixture 12 is movably arranged at bracing frame 10.Specifically, test fixture 12 includes clamping
Part 121 and at least one elastic component 122, the two ends of elastic component 122 are connected to base 101 and the holder 121 of bracing frame 10.
Elastic component 122 is, for example, spring, and the number of spring for example, two.Preferably, bracing frame 10 also includes being individually fixed in bottom
Two leads 102 of seat 101, two springs are sheathed on two leads 102 respectively.The tool to elastic component 122 for this example
The number of body structure and elastic component is not intended to be limited in any；Can arrange according to actual needs.
In this example, holder 121 can clamp the edge of the circuit board of inductive module 17.This example is to holder
121 concrete structure is not intended to be limited in any, and every any clamp structure that can clamp inductive module 17 is all in this example
Within protection domain；Holder shown in Fig. 3 is only used as exemplary illustration.
In this example, electric connector 13 is connected to microprocessor 14, and electric connector 13 is used for microprocessor and inductive module
17 mutual biography signals.Preferably, electric connector 13 is fixed on holder 121, and when inductive module 17 is clamped on holder 121
When, electric connector 13 is connected with corresponding connector in inductive module 17.But this example specifically setting to electric connector 13
Seated position is not intended to be limited in any, as long as microprocessor 14 and inductive module 17 can be made to realize being electrically connected with.
In this example, operating parts 15 is connected to holder 121, operating parts 15 be used for for operator manually operated so that folder
Gripping member 121 moves to test position.Specifically, the operating parts 15 of this example includes spanner 151, the first trace 152, second
Trace 153, it is fixed on the head rod 154 of holder 121 and is fixed on the second connecting rod 155 of base 101.Spanner
151 connection end is pivotably coupled to the first end of the first trace 152, and the second end of the first trace 152 is rotatably
It is connected to head rod 154；The connection end of spanner 151 is also pivotably coupled to the first end of the second trace 153, and second
Second end of trace 153 is pivotably coupled to the second connecting rod 155.In this example, the second connecting rod 155 passes through holder
121 perforate；That is, one end of the second connecting rod 155 and the second end of the second trace 153 are rotatably connected, and the other end is fixed
In base 101.
The course of work of the test device in this example is described as follows：
First, inductive module 17 is clamped on holder 121, and inductive module 17 is electrically connected with electric connector 13
Connect.Wherein, inductive module 17 for example, includes the fingerprint sensing of circuit board, fingerprint chip, sealer and metal header
Module；Now, holder 121 can clamp on circuit boards；As long as not affecting test signal and the conduction of feedback signal.
Secondly, operator forces in spanner 151, that is, be pulled upwardly spanner 151, in the first trace 152, head rod
In the presence of 154, holder 121 is moved downward to test position, and now, inductive module 17 is just immersed in conducting solution.
That is, holder 121 can be moved up and down with respect to base 101 by elastic component 122；When holder 121 is moved downward to
During test position, elastic component 122 is in compressive state.Corresponding, when operator's revocation acts on the external force on spanner 151,
In the presence of elastic component 122, when holder 121 moves back up to initial position, now elastic component 122 recovers to nature
Elongation state；So this example is not intended to be limited in any to this.Wherein, the holder 121 shown in Fig. 3 is located at initial position.
Then, microprocessor 14 sends enabling signal to inductive module 17, to control inductive module 17 to send test signal
To conducting solution.Inductive module 17 receives feedback signal by conducting solution, and microprocessor 14 receives feedback signal, and according to anti-
Feedback signal produces test result.
Preferably, test result can be uploaded to main control device by microprocessor 14；Main control device is able to record that each sensing mould
The test result of group, realizes the unified record to bulk article and manages, in order to follow-up tracking inquiry.
It is seen that, this example is the system corresponding with first or second example, and this example can be with first or second case
Son is worked in coordination enforcement.First or second example in the relevant technical details mentioned still effective in the present example, in order to reduce
Repeat, repeat no more here.Correspondingly, the relevant technical details mentioned in this example are also applicable in first or second example
In.
Fourth example is related to a kind of test device, refer to Fig. 5.Fourth example is roughly the same with third example, main region
Part is not：In third example, test fixture includes holder and elastic component (preferably also including operating parts), operator
Member's Non-follow control holder movement is to test position.And in fourth example, test fixture includes holder and drive mechanism 18；
Drive mechanism 18 is mechanically connected to holder, and is electrically connected at microprocessor 14.Motor 18 is used for driving holder, with
Make holder movement to test position.Wherein, Fig. 5 is the block diagram of the test device of fourth example；Microprocessor 14
It is also attached to electric connector 13；Electric connector 13 is connected to inductive module 17.
Specifically, drive mechanism 18 can include motor, rotating shaft and gear assembly (not shown), and motor is electrically connected with
In microprocessor 14 and drive shaft, gear assembly is mechanically connected to drive shaft and holder.When inductive module 17 is held on clamping
After part, microprocessor 14 controls motor operations and drive shaft rotates towards first direction, and drives drive clamping by gear assembly
Part movement is to test position.At the end of this test, microprocessor 14 controls motor operations and drive shaft is towards second direction
Rotate, and drive holder movement is driven to initial position by gear assembly.This example is not made to the concrete structure of drive mechanism
Any restriction, everything is capable of any version driving holder to move back and forth between test position and initial position
Belong to the protection domain of this example.
In this example, holder movement is automatically driven to join in advance so that being immersed in inductive module using drive mechanism
The step in the conducting solution put, achieves automation；It is achieved thereby that the full-automatic operation of test process；Time saving and energy saving.
It is seen that, this example is the system corresponding with first or second example, and this example can be with first or second case
Son is worked in coordination enforcement.First or second example in the relevant technical details mentioned still effective in the present example, in order to reduce
Repeat, repeat no more here.Correspondingly, the relevant technical details mentioned in this example are also applicable in first or second example
In.
It will be appreciated by those skilled in the art that all or part of step realized in above-mentioned example can be by program
Completing, this program storage, in a storage medium, includes some instructions use so that an equipment to the related hardware of instruction
(can be single-chip microcomputer, chip etc.) or processor (processor) execute each embodiment methods described of the application whole or
Part steps.And aforesaid storage medium includes：USB flash disk, portable hard drive, read-only storage (ROM, Read-Only Memory),
Random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can be with store program codes
Medium.
It will be understood by those skilled in the art that foregoing description only realizes the example of the section Example of the present invention
Son, and in actual applications, can to it, various changes can be made in the form and details, the spirit without departing from the present invention and model
Enclose.
Claims (13)
1. a kind of method of testing of inductive module is it is characterised in that include：
Inductive module is controlled to send test signal to conducting solution, described inductive module is immersed in described conducting solution；
Receive the feedback signal that described inductive module is received by described conducting solution；
According to described feedback signal generation test result.
2. the method for testing of inductive module according to claim 1 is it is characterised in that described inductive module senses for fingerprint
Module, described fingerprint inductive module includes fingerprint chip, sealer and metal header；
Described test signal is sent to described conducting solution by described metal header by described fingerprint chip, and passes sequentially through institute
State conducting solution and feed back to described fingerprint chip with described sealer, form described feedback signal.
3. the method for testing of inductive module according to claim 1 is it is characterised in that described inductive module senses for fingerprint
Module, described fingerprint inductive module includes fingerprint chip and sealer；
Described test signal is sent to described conducting solution by described sealer by described fingerprint chip, and passes sequentially through
Described conducting solution and described sealer feed back to described fingerprint chip, form described feedback signal.
4. the method for testing of the inductive module according to Claims 2 or 3 is it is characterised in that described test result includes：Institute
State testing flatness result, thickness measuring result and the impurity of sealer and empty test result at least within it
One.
5. the method for testing of inductive module according to any one of claim 1 to 4 is it is characterised in that described conduction is molten
The solvent of liquid includes distilled water.
6. the method for testing of inductive module according to claim 5 is it is characterised in that the solute of described conducting solution includes
Sodium acid carbonate.
7. the method for testing of inductive module according to any one of claim 1 to 6 is it is characterised in that described sensing mould
The method of testing of group also includes：
Described test result is uploaded to main control device.
8. a kind of test device is it is characterised in that be applied to the survey of the inductive module described in any one in claim 1 to 7
Method for testing, described test device includes：Bracing frame, testing flume, test fixture, electric connector and microprocessor；
Described testing flume is arranged at support frame as described above, and described testing flume is built with described conducting solution；
Described test fixture is movably arranged at support frame as described above, and described test fixture is used for clamping described inductive module；
Described electric connector is connected to described microprocessor, and described electric connector is used for for described microprocessor and described sensing mould
Group mutually passes signal；
Wherein, when being clamped with the described test fixture movement of described inductive module to test position, described inductive module submergence
In described conducting solution；
Described microprocessor is used for controlling described inductive module to send described test signal to described conducting solution, and according to described
The feedback signal that inductive module is received by described conducting solution produces test result.
9. test device according to claim 8 is it is characterised in that described test fixture includes holder and at least one bullet
Property part；
The two ends of described elastic component are connected to support frame as described above and described holder；
Wherein, during the mobile extremely described test position of described test fixture, described elastic component is in compressive state.
10. test device according to claim 9 it is characterised in that described elastic component be spring, described spring housing located at
The lead of support frame as described above.
11. test devices according to claim 9 or 10 are it is characterised in that described test fixture also includes operating parts, institute
State operating parts and be connected to described holder；
Wherein, described operating parts is used for operating described holder, so that the mobile extremely described test position of described holder.
12. test devices any one of according to Claim 8 to 11 are it is characterised in that described test fixture includes pressing from both sides
Gripping member and drive mechanism；
Described drive mechanism is mechanically connected to described holder, and is electrically connected at described microprocessor；
Wherein, described drive mechanism is used for driving described holder, so that the mobile extremely described test position of described holder.
13. test devices any one of according to Claim 8 to 12 are it is characterised in that described test device also includes
Adjust tank, described regulation tank is arranged at support frame as described above and is connected with described testing flume；
Wherein, the described tank that adjusts is used for adjusting the height of the described conducting solution in described testing flume.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/090476 WO2018014193A1 (en) | 2016-07-19 | 2016-07-19 | Test method and test device for sensing module |
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| CN106415294A true CN106415294A (en) | 2017-02-15 |
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| WO (1) | WO2018014193A1 (en) |
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| CN107454963A (en) * | 2017-06-16 | 2017-12-08 | 深圳市汇顶科技股份有限公司 | Fingerprint image processing method, optical fingerprint identification system and electronic installation |
| CN109558289A (en) * | 2017-09-26 | 2019-04-02 | 南昌欧菲生物识别技术有限公司 | A kind of test device and test method of fingerprint mould group |
| CN110488175A (en) * | 2019-07-31 | 2019-11-22 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component, method and computer readable storage medium |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115825702B (en) * | 2023-02-06 | 2023-04-28 | 镇江矽佳测试技术有限公司 | Fingerprint chip anti-interference testing device |
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| US6607929B1 (en) * | 1997-12-24 | 2003-08-19 | Commissariat A L' Energie Atomique | Device and method for testing sensitive elements on an electronic chip |
| CN101581700A (en) * | 2009-03-31 | 2009-11-18 | 林俊明 | Method for testing curing degree of lacquer coat of metal plate |
| CN102439467A (en) * | 2009-04-30 | 2012-05-02 | 卢森堡大学 | Electrical and opto-electrical characterisation of large-area semiconductor devices |
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- 2016-07-19 WO PCT/CN2016/090476 patent/WO2018014193A1/en active Application Filing
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| US6607929B1 (en) * | 1997-12-24 | 2003-08-19 | Commissariat A L' Energie Atomique | Device and method for testing sensitive elements on an electronic chip |
| CN101581700A (en) * | 2009-03-31 | 2009-11-18 | 林俊明 | Method for testing curing degree of lacquer coat of metal plate |
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| CN107454963A (en) * | 2017-06-16 | 2017-12-08 | 深圳市汇顶科技股份有限公司 | Fingerprint image processing method, optical fingerprint identification system and electronic installation |
| US11068691B2 (en) | 2017-06-16 | 2021-07-20 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint image processing method, optical fingerprint identification system and electronic device |
| CN109558289A (en) * | 2017-09-26 | 2019-04-02 | 南昌欧菲生物识别技术有限公司 | A kind of test device and test method of fingerprint mould group |
| CN110488175A (en) * | 2019-07-31 | 2019-11-22 | 广东利扬芯片测试股份有限公司 | Fingerprint chip testing component, method and computer readable storage medium |
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| WO2018014193A1 (en) | 2018-01-25 |
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