CN110484169B - High-temperature-resistant anti-rebound double-sided adhesive tape and adhesive composition - Google Patents
High-temperature-resistant anti-rebound double-sided adhesive tape and adhesive composition Download PDFInfo
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- CN110484169B CN110484169B CN201910828435.8A CN201910828435A CN110484169B CN 110484169 B CN110484169 B CN 110484169B CN 201910828435 A CN201910828435 A CN 201910828435A CN 110484169 B CN110484169 B CN 110484169B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention relates to an adhesive composition and a high-temperature-resistant anti-rebound double-sided adhesive tape, wherein the adhesive composition comprises the following components in percentage by mass based on the total weight of the adhesive composition: 19-30% of polyacrylate, 5-10% of high-softening-point tackifying resin, 5-10% of low-softening-point tackifying resin, 0.5-1.5% of curing agent and 50-70% of solvent; the weight average molecular weight of the polyacrylate is 70-110 ten thousand, and the molecular weight distribution is 10-25; the high-softening-point tackifying resin is rosin resin or terpene phenol resin, the softening point of the high-softening-point tackifying resin is 120-160 ℃, the acid value is 15-60 mgKOH/g or the hydroxyl value is 60-150 mgKOH/g; the low-softening-point tackifying resin is polymerized terpene resin, terpene phenol resin or petroleum resin, the softening point of the low-softening-point tackifying resin is 80-110 ℃, the acid value is 0-10 mgKOH/g or the hydroxyl value is 0-80 mgKOH/g; the curing agent is isocyanate curing agent or epoxy curing agent.
Description
Technical Field
The invention relates to the field of adhesive tapes, in particular to a high-temperature-resistant anti-rebound double-sided adhesive tape and an adhesive composition.
Background
Electronic products are provided with a plurality of curved surface components, such as FPC (flexible printed circuit), 5G (5G) antenna and the like, and the edges of some components need to be bonded with a coating material, such as a screen backlight module and the like, all of which have bonding application of heating and rebound stress, if a common double-sided adhesive tape or a common rebound-resistant adhesive tape is used, cohesive failure or bonding failure can be caused to generate a warping phenomenon under the action of long-term high-temperature creep and rebound stress.
The anti-rebound double-sided adhesive tape disclosed in the Chinese patent CN108384483A has the advantages that the softening point of the tackifying resin in the adhesive is lower than 85 ℃, the high temperature resistance is improved only by the first curing agent with the content of 0.3-0.8 part, and the anti-rebound property can not be ensured to be kept under the condition of long-term high temperature.
Disclosure of Invention
In order to solve the above technical problems, the present invention aims to provide a high temperature resistant anti-rebound double-sided adhesive tape and an adhesive composition.
The invention aims to provide an adhesive composition, which comprises the following components in percentage by mass based on the total weight of the adhesive composition:
19-30% of polyacrylate, 5-10% of high-softening-point tackifying resin, 5-10% of low-softening-point tackifying resin, 0.5-1.5% of curing agent and 50-70% of solvent;
the weight average molecular weight of the polyacrylate is 70-110 ten thousand, and the molecular weight distribution is 10-25;
the high-softening-point tackifying resin is rosin resin or terpene phenol resin, the softening point of the high-softening-point tackifying resin is 120-160 ℃, the acid value is 15-45 mgKOH/g or the hydroxyl value is 60-150 mgKOH/g;
the low-softening-point tackifying resin is polymerized terpene resin, terpene phenol resin or petroleum resin, the softening point of the low-softening-point tackifying resin is 80-110 ℃, the acid value is 0-10 mgKOH/g, or the hydroxyl value is 0-80 mgKOH/g;
the curing agent is isocyanate curing agent or epoxy curing agent.
Further, the solvent is an ester, aromatic or ketone solvent, including but not limited to a mixture of one or more of ethyl acetate, butyl acetate, isobutyl acetate, sec-butyl acetate, toluene and butanone.
Further, the glass transition temperature T of the polyacrylategIs-40 to-50 ℃ and has an acid value of 10 to 20 mgKOH/g.
Further, the isocyanate curing agent is polymer or addition product of TDI, HDI or IPDI.
Furthermore, the epoxy curing agent is a polyfunctional epoxy resin, and the epoxy equivalent is 90-110 g/Eq.
The adhesive composition has excellent comprehensive properties: the high molecular weight part and the crosslinking part of the widely distributed polyacrylate and the tackifying resin with high softening point form a structure with high rigidity, thereby providing good stress shear resistance and high temperature resistance; the low molecular weight part which is not crosslinked and the tackifying resin with low softening point in the polyacrylate ensure that the adhesive has high enough strain capacity, and the stress is absorbed in the strain process, thereby achieving the rebound resistance effect. Both types of tackifying resins comprise high and low polarity resins (the higher the acid and hydroxyl values, the higher the polarity; the lower the acid and hydroxyl values, the lower the polarity) such that the adhesive has a high peel force to the surface of materials of different polarity.
The second purpose of the invention is to provide a high-temperature-resistant anti-rebound double-sided adhesive tape (shown in figure 1), which comprises a heavy release film, a first adhesive layer, a substrate layer, a second adhesive layer and a light release film layer which are sequentially arranged, wherein the first adhesive layer and the second adhesive layer are prepared from the adhesive composition.
Further, the ratio of the release force of the heavy release film to the release force of the light release film is 2-4: 1.
Further, the thickness of the first adhesive layer or the second adhesive layer is 15-30 μm.
Further, the thickness of the substrate layer is 6-25 μm.
Further, the material of the base material layer is PET.
By the scheme, the invention at least has the following advantages:
the adhesive composition disclosed by the invention has high stripping force on the surfaces of materials with different polarities, and is good in high-temperature resistance, excellent in shear resistance at high temperature and good in rebound resistance.
The adhesive composition is used for preparing an adhesive layer, and a double-sided adhesive tape is further prepared, and the advantages of the adhesive composition are retained.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following description is made with reference to the preferred embodiments of the present invention and the accompanying detailed drawings.
Drawings
FIG. 1 is a schematic cross-sectional structure of a high-temperature-resistant anti-rebound double-sided adhesive tape;
FIG. 2 is a schematic illustration of an anti-bounce test;
description of reference numerals:
1-heavy release film; 2-a first adhesive layer; 3-a substrate layer; 4-a second adhesive layer; 5-light release film layer; 6-aluminum plate; 7-PC board.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1, the high temperature resistant and anti-rebound double-sided tape of the present invention comprises a heavy release film 1, a first adhesive layer 2, a substrate layer 3, a second adhesive layer 4 and a light release film layer 5, which are sequentially disposed, wherein the first adhesive layer and the second adhesive layer are made of an adhesive composition. The ratio of the release force of the heavy release film to the release force of the light release film is 2:1, the thickness of the first adhesive layer or the second adhesive layer is 15 micrometers, the thickness of the base material layer is 6 micrometers, and the base material layer is made of PET.
The adhesive composition comprises the following components in percentage by mass:
19% of polyacrylate, 5% of high-softening-point tackifying resin, 5.5% of low-softening-point tackifying resin, 0.5% of curing agent and 70% of solvent. Wherein the weight average molecular weight of the polyacrylate is 70 ten thousand, the molecular weight distribution is 10, and the glass transition temperature TgAt-50 ℃ and an acid value of 10 mgKOH/g. The high-softening-point tackifying resin is rosin resin, the softening point of the rosin resin is 120 ℃, and the acid value of the rosin resin is 30 mgKOH/g. The low-softening-point tackifying resin is a polymerized terpene resin, the softening point of which is 80 ℃, and the acid value of which is 1 mgKOH/g. The curing agent is HDI tripolymer. The solvent is formed by mixing sec-butyl acetate and butanone 3/1.
The preparation method of the high-temperature-resistant anti-rebound double-sided adhesive tape comprises the following steps:
1. preparing the adhesive according to the formula of the adhesive composition, stirring uniformly, filtering, and coating the adhesive on the surface of the base material within 4 hours.
2. And coating the prepared adhesive on one surface of the base material, and baking at 90 ℃ for 5 minutes after coating, so that a first adhesive layer is formed on one surface of the base material. And then attaching a heavy release film on the surface of the first adhesive layer.
3. And (3) coating the other side of the base material with the prepared adhesive according to the method of the step 2, namely forming a second adhesive layer on the other side of the base material. And then attaching a light release film on the surface of the second adhesive layer.
4. And (4) rolling the product prepared in the step (3), and curing at 50 ℃ for 3 days to obtain the high-temperature-resistant anti-rebound double-sided adhesive tape.
Example 2
The utility model provides a high temperature resistant anti-bounce double sided tape, is including the heavy membrane of leaving type, first adhesive layer, substrate layer, second adhesive layer and the light membrane layer of leaving type that sets gradually, and first adhesive layer and second adhesive layer are made by the adhesive composition. The ratio of the release force of the heavy release film to the release force of the light release film is 3:1, the thickness of the first adhesive layer or the second adhesive layer is 20 micrometers, the thickness of the base material layer is 12 micrometers, and the base material layer is made of PET.
The adhesive composition comprises the following components in percentage by mass:
27% of polyacrylate, 7% of high-softening-point tackifying resin, 10% of low-softening-point tackifying resin, 1.0% of curing agent and 55% of solvent. Wherein the weight average molecular weight of the polyacrylate is 90 ten thousand, the molecular weight distribution is 15, and the glass transition temperature TgAt-45 ℃ and an acid value of 15 mgKOH/g. The high-softening-point tackifying resin is rosin resin, the softening point of the rosin resin is 140 ℃, and the acid value of the rosin resin is 45 mgKOH/g. The low-softening-point tackifying resin is a polymerized terpene resin, the softening point of which is 100 ℃, and the acid value of which is 7 mgKOH/g. The curing agent is TDI trimer. The solvent was ethyl acetate.
The preparation method of the high temperature resistant and anti-bouncing double-sided tape of this example is the same as that of example 1.
Example 3
The utility model provides a high temperature resistant anti-bounce double sided tape, is including the heavy membrane of leaving type, first adhesive layer, substrate layer, second adhesive layer and the light membrane layer of leaving type that sets gradually, and first adhesive layer and second adhesive layer are made by the adhesive composition. The ratio of the release force of the heavy release film to the release force of the light release film is 4:1, the thickness of the first adhesive layer or the second adhesive layer is 30 micrometers, the thickness of the base material layer is 25 micrometers, and the base material layer is made of PET.
The adhesive composition comprises the following components in percentage by mass:
30% of polyacrylate, 10% of high-softening-point tackifying resin, 8.5% of low-softening-point tackifying resin, 1.5% of curing agent and 50% of solvent. Wherein the weight average molecular weight of the polyacrylate is 110 ten thousand, the molecular weight distribution is 25, and the glass transition temperature TgAt-50 ℃ and an acid value of 20 mgKOH/g. The high-softening-point tackifying resin is rosin resin, the softening point of the rosin resin is 160 ℃, and the acid value of the rosin resin is 45 mgKOH/g. The low-softening-point tackifying resin is terpene phenol resin, the softening point of which is 95 ℃, and the hydroxyl value of which is 50 mgKOH/g. The curing agent is TDI addition product. The solvent is formed by mixing ethyl acetate and toluene 3/1.
The preparation method of the high temperature resistant and anti-bouncing double-sided tape of this example is the same as that of example 1.
The double-sided adhesive tapes of examples 1 to 3 were tested for peel force, holding force and anti-rebound property according to the method disclosed in CN 108384483A.
Among them, in the test of the peel force, SUS 304 (high polarity material) and PP (polypropylene plastic plate, low polarity material) were selected as the test plate materials.
As shown in fig. 2, in testing the anti-rebound performance, a double-sided tape was sandwiched between an aluminum plate 6(180mm × 25mm) having a thickness of 0.5mm and a PC plate 7(200mm × 30mm) having a thickness of 2mm, from which a heavy release film and a light release film layer were removed, and the PC plate was curved in an arc shape, and the pop-up distance of the aluminum plate to which the tape was attached was tested after 24 hours.
The peel force, retention force and rebound resistance test results are shown in table 1. The results show that the double-sided tapes of examples 1 to 3 all have high peel strength against material surfaces of different polarities, and are excellent in high-temperature resistance and shear (holding power) resistance at high temperatures.
TABLE 1 results of various Performance tests
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (6)
1. The adhesive composition is characterized by comprising the following components in percentage by mass based on the total weight of the adhesive composition: 30% of polyacrylate, 10% of high-softening-point tackifying resin, 8.5% of low-softening-point tackifying resin, 1.5% of curing agent and 50% of solvent; wherein the weight average molecular weight of the polyacrylate is 110 ten thousand, the molecular weight distribution is 25, the glass transition temperature Tg is-50 ℃, and the acid value is 20 mgKOH/g; the high-softening-point tackifying resin is rosin resin, the softening point of the high-softening-point tackifying resin is 160 ℃, and the acid value of the high-softening-point tackifying resin is 45 mgKOH/g; the low-softening-point tackifying resin is terpene phenol resin, the softening point of the low-softening-point tackifying resin is 95 ℃, and the hydroxyl value of the low-softening-point tackifying resin is 50 mgKOH/g; the curing agent is TDI addition product; the solvent is formed by mixing ethyl acetate and toluene 3/1.
2. The utility model provides a high temperature resistant anti-bounce double sided tape, heavily from type membrane, first adhesive layer, substrate layer, second adhesive layer and light from type membrane layer, its characterized in that including setting gradually: the first adhesive layer and the second adhesive layer are made from the adhesive composition of claim 1.
3. The high temperature resistant anti-bounce double-sided adhesive tape according to claim 2, characterized in that: the ratio of the release force of the heavy release film to the release force of the light release film is 2-4: 1.
4. The high temperature resistant anti-bounce double-sided adhesive tape according to claim 2, characterized in that: the thickness of the first adhesive layer or the second adhesive layer is 15-30 mu m.
5. The high temperature resistant anti-bounce double-sided adhesive tape according to claim 2, characterized in that: the thickness of the substrate layer is 6-25 mu m.
6. The high temperature resistant anti-bounce double-sided adhesive tape according to claim 2, characterized in that: the material of substrate layer is PET.
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| CN201910828435.8A CN110484169B (en) | 2019-09-03 | 2019-09-03 | High-temperature-resistant anti-rebound double-sided adhesive tape and adhesive composition |
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| CN201910828435.8A CN110484169B (en) | 2019-09-03 | 2019-09-03 | High-temperature-resistant anti-rebound double-sided adhesive tape and adhesive composition |
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| CN110484169B true CN110484169B (en) | 2021-08-13 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111073558A (en) * | 2019-12-30 | 2020-04-28 | 苏州赛伍应用技术股份有限公司 | High-shear-resistance acrylate pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof |
| CN111378394A (en) * | 2020-03-24 | 2020-07-07 | 太仓斯迪克新材料科技有限公司 | Ultrathin single-side grid PET double-sided tape and preparation method thereof |
| CN113444460B (en) * | 2020-03-26 | 2023-05-23 | 宁波激智科技股份有限公司 | Double-sided adhesive tape production process and production equipment thereof |
| CN111871561A (en) * | 2020-08-04 | 2020-11-03 | 苏州兴业材料科技南通有限公司 | Method for preventing low-softening-point phenolic resin from caking |
| CN112126362B (en) * | 2020-09-25 | 2022-03-25 | 广东东立新材料科技股份有限公司 | Shading material functional film and preparation method and application thereof |
| CN112210315B (en) * | 2020-09-30 | 2022-03-22 | 广东东立新材料科技股份有限公司 | Polyester film functional material and preparation method and application thereof |
| CN114933868A (en) * | 2022-06-30 | 2022-08-23 | 安徽晶华新材料科技有限公司 | Double-sided adhesive tape for adhering melamine foam and preparation method thereof |
| CN117327230B (en) * | 2023-11-29 | 2024-03-05 | 江苏皇冠新材料科技有限公司 | Polyisobutylene grafted acrylate copolymer, adhesive and pressure-sensitive adhesive tape |
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| CN104877605A (en) * | 2014-02-28 | 2015-09-02 | 日东电工（上海松江）有限公司 | Adhesive composition and adhesive sheet |
| CN108384483A (en) * | 2018-01-30 | 2018-08-10 | 苏州德佑胶带技术有限公司 | Anti-reflective bullet double faced adhesive tape and preparation method thereof |
| JP2018199827A (en) * | 2018-08-27 | 2018-12-20 | 積水化学工業株式会社 | Acryl adhesive and adhesive sheet for electronic apparatus |
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2019
- 2019-09-03 CN CN201910828435.8A patent/CN110484169B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877605A (en) * | 2014-02-28 | 2015-09-02 | 日东电工（上海松江）有限公司 | Adhesive composition and adhesive sheet |
| CN108384483A (en) * | 2018-01-30 | 2018-08-10 | 苏州德佑胶带技术有限公司 | Anti-reflective bullet double faced adhesive tape and preparation method thereof |
| JP2018199827A (en) * | 2018-08-27 | 2018-12-20 | 積水化学工業株式会社 | Acryl adhesive and adhesive sheet for electronic apparatus |
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