CN110472706A - A kind of smart card personalization system and method based on wafer scale - Google Patents
A kind of smart card personalization system and method based on wafer scale Download PDFInfo
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- CN110472706A CN110472706A CN201810448605.5A CN201810448605A CN110472706A CN 110472706 A CN110472706 A CN 110472706A CN 201810448605 A CN201810448605 A CN 201810448605A CN 110472706 A CN110472706 A CN 110472706A
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- wafer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
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Abstract
The smart card personalization system and method based on wafer scale that the present invention provides a kind of, the smart card personalization system includes computer, probe, wafer, probe system and automatic test equipment ATE, wherein, probe connects wafer, wafer is connect with probe system, probe system is communicated with automatic test equipment ATE foundation, and probe system control wafer is completed to connect with probe automatic order.Smart card personalization system and method for the invention, without the concern for the packing forms of subsequent smart card, greatly improve the flexibility that smart card puts goods on the market, and, individualized formula need to only be added in existing wafer test formula, newly-increased individualized production system is not needed, the production cost before smart card puts goods on the market is saved, testing efficiency is improved, saves testing cost, simultaneously, it does not need to be individualized again after wafer level packaging is complete, there is no the connection twice of clip making machine and packaging body, do not have scratch, will not influence the appearance of packaging body in future.
Description
Technical field
The present invention relates to integrated circuit smart card production technical field more particularly to a kind of smart cards based on wafer scale
Peopleization system and method.
Background technique
Smart card after packaging is accomplished, is needed for operating system and individuation data to be respectively written into card and is stored accordingly
In unit, that is, it is pre- individualized and individualized, it is referred to as personalization process.After the completion of individualized, smart card can actually make
With.The present invention, which is provided, carries out personalized method in wafer scale, can effectively increase flexibility, improve efficiency, reduce cost.
Traditional smart card personalization system, as shown in Figure 1, the system uses unique individualization equipment, i.e., individualized visitor
Family end and personalized service device, are completed with clip making machine cooperation.Main flow include it is pre- individualized and individualized, it is pre- individualized to be
After Intelligent card package is module, module is connected with clip making machine, and it is general to use 4 same surveys or 16 with surveying, smart card is completed parallel
It is pre- individualized, it is individualized be after being encapsulated as card, card and clip making machine connect again, the serial individual for completing smart card
Change.
Conventional smart card personalization method, as shown in Fig. 2, wherein personal data includes pre- personal data and individualizes
The specific implementation step of data, the personalization method is as follows:
Step 1: personal data saves；Personal data is stored in the file directory of personalized service device first；
Step 2: personal data receives；I.e. individualized client issues request of data to personalized service device, receives sending
Data；
Step 3: personal data file process；Personal data file is handled, the application protocol number of clip making machine identification is generated
According to unit AP DU；
Step 4: personal data write storage unit；I.e. clip making machine is instructed by Application Protocol Data Unit APDU, will be personal
In the storage unit for changing data write-in intelligent card chip.
Such method flexibility is poor, and surveys number and lack low efficiency, and testing cost is high.Traditional smart card personalization system requirements
The packing forms of smart card are necessary for card encapsulation, and the packing forms of smart card are increasingly diversified at present, certain special encapsulation
Form, such as BGA, the packing forms such as WLCSP almost cannot achieve in existing smart card personalization system.If packing forms
It is the achievable form other than card, such as SOP8, VQFN etc., the equipment of personalization system just need to customize again, in this way
It just will increase production cost, and flexibility is poor.Personalization process will be scrapped, be caused if there is failure, packaging body card
Higher encapsulation loss.Personalization device carries out smart card personalization at present, is mostly card form, due to encapsulating card volume
Greatly, general same number of surveying can only be more than ten even several, and testing efficiency is low.Personalization process operation is APDU(application association
Discuss data cell) test script, the script of normal user instruction needs several hundred clock cycle that could transmit a data, testing time
Tediously long, testing cost is high.The individualized test process of tradition, pre- individualized and individualized, smart card and chip have to be connected twice, such as
When connection exception occurs for fruit, it is possible to scratch can be caused to Modular surface.If packaging body surface leaves severe marking, shadow
Appearance is rung, chip just needs to scrap, and equally will increase cost.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a kind of smart cards based on wafer scale
Personalization system and its method, using the smart card personalization system carry out smart card it is individualized can effectively solve the problem that it is traditional
The flexibility of smart card personalization is poor and surveys number and lacks low efficiency, the high problem of testing cost.
In order to reach above-mentioned technical purpose, the technical scheme adopted by the invention is that:
A kind of smart card personalization system based on wafer scale, the smart card personalization system include computer, probe, crystalline substance
Circle, probe system and automatic test equipment ATE, wherein computer converts pre- individualized HEX file format, compiler, probe
Wafer is connected, wafer is connect with probe system, and probe system is communicated with automatic test equipment ATE foundation, and probe system control is brilliant
Circle is completed to connect with probe automatic order, and controls automatic test equipment ATE according to individualized journey on rule operation computer
The executable file that formula compiling generates, completes the personalization process of smart card, probe system and automatic test equipment ATE have cooperated
After full wafer wafer test, test result is saved on computers.
A kind of smart card personalization based on wafer scale, the smart card personalization based on wafer scale use
Smart card personalization system, smart card personalization system include computer, probe, wafer, probe system and automatic test equipment
ATE, the smart card personalization are specifically divided into three parts, including personal data is handled, personal data is downloaded and a
Peopleization result treatment, wherein
First part: specific step is as follows for personal data processing:
Step 1: smart card personalization data are provided；Wherein, personal data includes pre- personalized HEX file and individualizes
Every a line of file, individualized file represents the personal data of a smart card；
Step 2: pre- individualized HEX file process；I.e. in a simulated environment, pre- individualized HEX file is converted into automatic test
The identifiable graphic file of equipment ATE；
Step 3: individualized file declustering；That is automatic test equipment ATE is configured to 8 independent systems, will using script file
Individualized file declustering is 8 independent subfiles；
Second part: specific step is as follows for personal data downloading:
Step 4: individualized formula is write；The graphic file that above-mentioned steps two are obtained, is added in test formula, with batch
8 independent subfiles in above-mentioned steps three are loaded into automatic test equipment before program brings into operation by processing routine automatically
In the associated computer of ATE, reading and processing module that formula realizes file are write, completes smart card and individualized file one
One is corresponding, using test instruction execution down operation, so that graphic file and treated individualized text that step 2 obtains
Part can be written into the respective memory unit of smart card, and the test formula finished writing is compiled with computer, generate executable text
Part；
Step 5: starting probe system；Wafer is placed in probe system, probe system controls wafer movement, so that brilliant
The intelligent card chip of fixed quantity and the contact of respective counts target probe on circle；
Step 6: pre- individualized and individualized processing；That is the executable text generated of automatic test equipment ATE operating procedure four
Part, first carries out the smart card of fixed quantity pre- individualized parallel, and pre- personal data is written in parallel to accordingly depositing for smart card
Storage unit, automatic test equipment ATE are configured as 8 independent subsystems, each subsystem independent operating step 4 is given birth to
At executable file, each subsystem is according to following process flow operation: running each time, formula is according to the number of smart card non-defective unit
Amount reads the individualized file of fixed line number, and is stored in computer, and each style of writing part, which is converted to test interface instruction, to be known
Other hexadecimal data, and it is serially written the storage unit of each smart card；
Step 7: full wafer wafer test；That is, step 6 and step 7, circulation is carried out, until completing the test to full wafer wafer；
Part III: specific step is as follows for personal data processing:
Step 8: personal data processing is completed；I.e. after the completion of seven full wafer wafer test of above-mentioned steps, probe system and automatic
Test equipment ATE complete jointly whole wafer it is individualized after, the test result ultimately generated saves in a computer, and passes through
Tool handles test data, is supplied to the Map of client's wafer, the mark of non-defective unit and defective products is provided on the Map of wafer, for client
Encapsulation uses.
Smart card personalization system of the invention is due to using above-mentioned computer, probe, wafer, probe system and automatic
The structure of test equipment ATE, wherein probe connects wafer, and wafer is connect with probe system, probe system and automatic test equipment
ATE establishes communication, and probe system control wafer is completed to connect with probe automatic order, and beneficial effect obtained is, firstly,
Wafer scale is individualized, without the concern for the packing forms of subsequent smart card, substantially increases the flexibility that smart card puts goods on the market,
Moreover, individualized formula need to only be added in existing wafer test formula, newly-increased individualized production system is not needed, is saved
Smart card put goods on the market before production cost；Meanwhile wafer scale personalization process, smart card do not have packaging body, it can be existing
On wafer test system, while several hundred or even thousands of smart cards are tested, testing efficiency improves about 10 times, same number of intelligence
Energy card chip, wafer scale, which is individualized, individualizes the time for having saved about 70% than tradition, and testing cost is greatly saved；Moreover, this
In invention, the test instruction of personalization process operation is the instruction of test interface, it is only necessary to which tens clock cycle can pass
A data are sent, the time of downloading smart card personalization data substantially shortens；It is tested together in wafer-level test, after having encapsulated
It does not need to be individualized again, without the connection twice of clip making machine and packaging body, does not have scratch, will not influence packaging body in future
Appearance.
Moreover, the smart card personalization based on wafer scale that the present invention is embodied, can effectively adjust individualized
Production procedure, individualized after traditional Intelligent card package and test, be adjusted to Intelligent card package and test the one before
Peopleization greatly simplifies personalized production procedure；Moreover, also effectively reduce personalized production link, from original
Three production links are reduced to twice production link, can shorten the period that client takes product；And provide a kind of new
The smart card form of peopleization is adjusted to wafer from traditional card, the application for more and more diversified packaging bodies, envelope
The limitation of dress form will no longer be present；A kind of individualized production system of new downloading is additionally provided, from traditional personalization device
And clip making machine, be adjusted to automatic test equipment ATE and probe system, new downloading individualize production system can and Chip
Probe wafer test is that system communicates, and exempts cost caused by individualized production system；Additionally provide a kind of new downloading
Peopleization test platform is adjusted to that automatic test equipment ATE that is extensive and surveying can be achieved from traditional clip making machine, solves system very well
The problem of card machine is tested and to survey number few, low efficiency；A kind of new individualized test method is provided, is assisted from traditional test application
The method that the method for view data cell APDU test script is adjusted to test instruction, effectively solves traditional test application protocol data
Unit AP DU test script runs testing time longer problem.
The present invention will be further described with reference to the accompanying drawings and detailed description.
Detailed description of the invention
Fig. 1 is traditional smart card personalization system construction drawing.
Fig. 2 is conventional smart card personalization method sequence of steps figure.
Fig. 3 is a kind of smart card personalization system construction drawing based on wafer scale that the present invention is embodied.
Fig. 4 is a kind of smart card personalization sequence of steps figure based on wafer scale that the present invention is embodied.
Specific embodiment
Referring to Fig. 3, a kind of smart card personalization system construction drawing based on wafer scale being embodied for the present invention.The base
In the smart card personalization system of wafer scale include computer 4, probe 2, wafer 1, probe system 3 and automatic test equipment ATE
5, wherein computer 4 converts pre- individualized HEX file format, compiler, and probe 2 connects wafer 1, wafer 1 and probe system
3 connections, probe system 3 are communicated with the foundation of automatic test equipment ATE 5, and probe system 3 controls wafer 1 and 2 automatic order of probe
Ground complete connection, and control automatic test equipment ATE 5 according to rule operation computer 4 on individualize formula compiling generate can
File is executed, the personalization process of smart card is completed, full wafer wafer 1 is completed in probe system 3 and the cooperation of automatic test equipment ATE 5
After test, test result is saved on the computer 4.
The fixation of probe 2 used by smart card personalization system of the invention and detecting number are 256, this quantity can be with
It is adjusted according to the product of client is corresponding, can be bigger, such as 512 and detecting number, it can also be smaller, such as 128 and detecting number.
It is a kind of smart card personalization sequence of steps figure based on wafer scale that the present invention is embodied referring to Fig. 4.
The smart card personalization based on wafer scale uses smart card personalization system, and smart card personalization system includes calculating
Machine 4, probe 2, wafer 1, probe system 3 and automatic test equipment ATE 5, the smart card personalization are specifically divided into three
Point, including personal data processing, personal data downloading and individualized result treatment, wherein
First part: specific step is as follows for personal data processing:
Step 1: smart card personalization data are provided；Wherein, personal data includes pre- personalized HEX file and individualizes
Every a line of file, individualized file represents the personal data of a smart card；
Step 2: pre- individualized HEX file process；I.e. in a simulated environment, pre- individualized HEX file is converted into automatic test
The identifiable graphic file of equipment ATE 5；
Step 3: individualized file declustering；That is automatic test equipment ATE 5 is configured to 8 independent systems, uses script file
It is 8 independent subfiles by individualized file declustering；
Second part: specific step is as follows for personal data downloading:
Step 4: individualized formula is write；The graphic file that above-mentioned steps two are obtained, is added in test formula, with batch
8 independent subfiles in above-mentioned steps three are loaded into automatic test equipment before program brings into operation by processing routine automatically
In the associated computer 4 of ATE 5, reading and processing module that formula realizes file are write, completes smart card and individualized text
Part corresponds, using test instruction execution down operation, so that the graphic file of step 2 acquisition and treated individual
Changing file can be written into the respective memory unit of smart card, the test formula computer 4 finished writing is compiled, generation can be held
Style of writing part；
Step 5: starting probe system；Wafer is placed in probe system 3, probe system 3 controls the movement of wafer 1, makes
The intelligent card chip of fixed quantity and respective counts target probe 2 on wafer 1 is obtained to contact；
Step 6: pre- individualized and individualized processing；That is the executable text generated of 5 operating procedure of automatic test equipment ATE four
Part, first carries out the smart card of fixed quantity pre- individualized parallel, and pre- personal data is written in parallel to accordingly depositing for smart card
Storage unit, automatic test equipment ATE 5 are configured as 8 independent subsystems, each subsystem independent operating step 4 institute
The executable file of generation, each subsystem is according to following process flow operation: running each time, formula is according to smart card non-defective unit
Quantity reads the individualized file of fixed line number, and is stored in computer 4, and each style of writing part is converted to test interface instruction can
The hexadecimal data of identification, and it is serially written the storage unit of each smart card
Step 7: full wafer wafer test；That is, step 6 and step 7, circulation is carried out, until completing the test to full wafer wafer 1；
Part III: specific step is as follows for personal data processing:
Step 8: personal data processing is completed；I.e. seven full wafer wafer 1 of above-mentioned steps test after the completion of, probe system 3 and from
Dynamic test equipment ATE 5 complete jointly whole wafer it is individualized after, the test result ultimately generated is stored in computer 4,
And test data is handled by tool, it is supplied to the Map of client's wafer 1, provides the mark of non-defective unit and defective products on the Map of wafer 1
Note is encapsulated for client and is used.
During specific smart card personalization, client can select suitable packaging body according to oneself demand, different
Surely it is card form necessary to traditional personalization system, there is considerable flexibility.The used wafer-level test system of the present invention
The automatic test equipment ATE of system is the MagnumII of Teradyne Inc., and probe system is the UF3000EX of TSK company, both
Equipment can be can be used for the equipment replacement of wafer test by other.
The present invention is not limited to embodiment discussed above, the above description to specific embodiment is intended to retouch
State and illustrate technical solution of the present invention.The obvious transformation or substitution enlightened based on the present invention should also be as being considered
Fall into protection scope of the present invention；Above specific embodiment is used to disclose best implementation method of the invention, so that this
The those of ordinary skill in field can reach of the invention using numerous embodiments of the invention and a variety of alternatives
Purpose.
Claims (2)
1. a kind of smart card personalization system based on wafer scale, which is characterized in that the smart card personalization system includes meter
Calculation machine, probe, wafer, probe system and automatic test equipment ATE, wherein computer converts pre- individualized HEX file format,
Compiler, probe connect wafer, and wafer is connect with probe system, and probe system is communicated with automatic test equipment ATE foundation, visit
Needle system control wafer is completed to connect with probe automatic order, and controls automatic test equipment ATE and calculate according to rule operation
The executable file that formula compiling generates is individualized on machine, completes the personalization process of smart card, probe system and automatic test
After full wafer wafer test is completed in equipment ATE cooperation, test result is saved on computers.
2. a kind of smart card personalization based on wafer scale, which is characterized in that the smart card based on wafer scale is personal
Change method use smart card personalization system, smart card personalization system include computer, probe, wafer, probe system and from
Dynamic test equipment ATE, the smart card personalization are specifically divided into three parts, including personal data processing, individualized number
According to downloading and individualized result treatment, wherein
First part: specific step is as follows for personal data processing:
Step 1: smart card personalization data are provided；Wherein, personal data includes pre- personalized HEX file and individualizes
Every a line of file, individualized file represents the personal data of a smart card；
Step 2: pre- individualized HEX file process；I.e. in a simulated environment, pre- individualized HEX file is converted into automatic test
The identifiable graphic file of equipment ATE；
Step 3: individualized file declustering；That is automatic test equipment ATE is configured to 8 independent systems, will using script file
Individualized file declustering is 8 independent subfiles；
Second part: specific step is as follows for personal data downloading:
Step 4: individualized formula is write；The graphic file that above-mentioned steps two are obtained, is added in test formula, with batch
8 independent subfiles in above-mentioned steps three are loaded into automatic test equipment before program brings into operation by processing routine automatically
In the associated computer of ATE, reading and processing module that formula realizes file are write, completes smart card and individualized file one
One is corresponding, using test instruction execution down operation, so that graphic file and treated individualized text that step 2 obtains
Part can be written into the respective memory unit of smart card, and the test formula finished writing is compiled with computer, generate executable text
Part；
Step 5: starting probe system；Wafer is placed in probe system, probe system controls wafer movement, so that brilliant
The intelligent card chip of fixed quantity and the contact of respective counts target probe on circle；
Step 6: pre- individualized and individualized processing；That is the executable text generated of automatic test equipment ATE operating procedure four
Part, first carries out the smart card of fixed quantity pre- individualized parallel, and pre- personal data is written in parallel to accordingly depositing for smart card
Storage unit, automatic test equipment ATE are configured as 8 independent subsystems, each subsystem independent operating step 4 is given birth to
At executable file, each subsystem is according to following process flow operation: running each time, formula is according to the number of smart card non-defective unit
Amount reads the individualized file of fixed line number, and is stored in computer, and each style of writing part, which is converted to test interface instruction, to be known
Other hexadecimal data, and it is serially written the storage unit of each smart card,
Step 7: full wafer wafer test；That is step 6 and step 7, circulation carry out, until completing the test to full wafer wafer；
Part III: specific step is as follows for personal data processing:
Step 8: personal data processing is completed；I.e. after the completion of seven full wafer wafer test of above-mentioned steps, probe system and automatic
Test equipment ATE complete jointly whole wafer it is individualized after, the test result ultimately generated saves in a computer, and passes through
Tool handles test data, is supplied to the Map of client's wafer, the mark of non-defective unit and defective products is provided on the Map of wafer, for client
Encapsulation uses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810448605.5A CN110472706A (en) | 2018-05-11 | 2018-05-11 | A kind of smart card personalization system and method based on wafer scale |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810448605.5A CN110472706A (en) | 2018-05-11 | 2018-05-11 | A kind of smart card personalization system and method based on wafer scale |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810448605.5A Pending CN110472706A (en) | 2018-05-11 | 2018-05-11 | A kind of smart card personalization system and method based on wafer scale |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111143211A (en) * | 2019-12-24 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | Method for quickly detecting test setting accuracy in offline manner |
| CN113010404A (en) * | 2019-12-20 | 2021-06-22 | 北京紫光青藤微系统有限公司 | Finished product testing method of high-capacity smart card |
| CN115630353A (en) * | 2022-12-19 | 2023-01-20 | 紫光同芯微电子有限公司 | Chip personalization method and device based on SAS standard |
-
2018
- 2018-05-11 CN CN201810448605.5A patent/CN110472706A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113010404A (en) * | 2019-12-20 | 2021-06-22 | 北京紫光青藤微系统有限公司 | Finished product testing method of high-capacity smart card |
| CN111143211A (en) * | 2019-12-24 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | Method for quickly detecting test setting accuracy in offline manner |
| CN111143211B (en) * | 2019-12-24 | 2023-04-28 | 上海华岭集成电路技术股份有限公司 | Method for off-line rapid detection of test setting accuracy |
| CN115630353A (en) * | 2022-12-19 | 2023-01-20 | 紫光同芯微电子有限公司 | Chip personalization method and device based on SAS standard |
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