CN110470071B - Contact type hot-charging cutter handle cooling system and method based on semiconductor refrigeration - Google Patents
Contact type hot-charging cutter handle cooling system and method based on semiconductor refrigeration Download PDFInfo
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- CN110470071B CN110470071B CN201910744940.4A CN201910744940A CN110470071B CN 110470071 B CN110470071 B CN 110470071B CN 201910744940 A CN201910744940 A CN 201910744940A CN 110470071 B CN110470071 B CN 110470071B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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Abstract
The invention discloses a contact type hot-charging cutter handle cooling system and method based on semiconductor refrigeration, and belongs to the field of water circulation cooling. The technical scheme of the invention is as follows: the system comprises a to-be-cooled cutter handle, a main control module, a small water storage tank, a first adjustable speed water pump corresponding to the small water storage tank, a large water storage tank, a second adjustable speed water pump corresponding to the large water storage tank, a semiconductor refrigerator, a first temperature detection device, a second temperature detection device, a cooling cover, a water-cooling radiator and a direct-current fan; the method comprises the following steps: controlling the rotating speed and the opening and closing of the direct current fan according to the temperature data, controlling the opening and closing of the first speed-adjustable water pump and the second speed-adjustable water pump, controlling the opening and closing of the semiconductor cooler, and judging whether the cooling of the tool shank to be cooled is completed or not. According to the invention, the semiconductor refrigeration and the circulating water cooling radiator are combined to cool the tool shank, so that the tool shank is cooled more quickly, the tool shank temperature and environment temperature detection function is added, whether the tool shank is cooled or not can be accurately judged, and the tool shank is prevented from being polluted by condensed water.
Description
Technical Field
The invention relates to a water circulation cooling technology, in particular to a contact type hot charging cutter handle cooling system and method based on semiconductor refrigeration.
Background
The hot-mounted knife handle can be naturally cooled after being heated for a long time, and active cooling means mainly adopted at present comprise cooling liquid soaking, air cooling and contact type circulating water cooling. The contact type circulating water cooling is the safest cooling method with the least damage to the hot charging cutter handle, and the common contact type refrigeration is as follows: the compressor and the refrigerant are used for cooling the cooling liquid in the water tank, and then the heat on the hot charging cutter handle is taken away through the circulation of the cooling liquid in the cooling cover, so that the cutter handle is cooled. However, the compressor has the problems of high price, large volume, inconvenient movement and the like.
That is, in the prior art, the contact type device for cooling the hot-mounted tool holder has the problems of high cost, heaviness and the like, cannot sense the ambient temperature and the temperature of the tool holder, causes the situation that the tool holder is always in a working state, wastes energy, and easily forms condensed water in the cooling cover to pollute the tool holder under the condition of high air humidity.
Disclosure of Invention
The invention aims to provide a contact type hot-charging cutter handle cooling system and method based on semiconductor refrigeration, which can realize that the cutter handle is cooled more quickly, can accurately judge whether the cutter handle is cooled or not, and avoids the pollution of condensed water on the cutter handle.
The invention solves the technical problem, and adopts the technical scheme that: the contact type hot-charging cutter handle cooling system based on semiconductor refrigeration comprises a cutter handle to be cooled, a main control module, a small water storage tank, a first adjustable-speed water pump corresponding to the small water storage tank, a large water storage tank, a second adjustable-speed water pump corresponding to the large water storage tank, a semiconductor refrigerator, a first temperature detection device, a second temperature detection device, a cooling cover, a water-cooling radiator and a direct-current fan;
the outlet of the small water storage tank is connected with the inlet of the semiconductor refrigerator through a first speed-adjustable water pump, the outlet of the large water storage tank is connected with the inlet of the semiconductor refrigerator through a second speed-adjustable water pump, the outlet of the semiconductor refrigerator is connected with the inlet of the cooling cover through a first temperature detection device, the outlet of the cooling cover is connected with the inlet of the water-cooling radiator through a second temperature detection device, the outlet of the water-cooling radiator is respectively connected with the inlet of the small water storage tank and the inlet of the large water storage tank, and the direct current fan, the first speed-adjustable water pump, the second speed-adjustable water pump, the semiconductor cooler, the first temperature detection device and the second temperature detection device;
the cooling cover is used for covering the cooling cover on the tool shank to be cooled when the tool shank to be cooled needs to be cooled;
the direct current fan is used for radiating the cooling liquid in the water-cooling radiator;
the first adjustable-speed water pump is used for adjusting the water outlet flow of the small water storage tank;
the second adjustable-speed water pump is used for adjusting the water outlet flow of the large water storage tank;
the small water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet;
the large water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet;
the semiconductor refrigerator is used for applying voltage with corresponding magnitude on a semiconductor refrigerating sheet of the semiconductor refrigerator when the cooling liquid needs to be cooled, so that the temperature of the cooling liquid flowing through the semiconductor refrigerator is reduced;
the temperature detection device is used for detecting the temperature at the inlet of the cooling cover and the ambient temperature at the inlet and transmitting the temperature to the main control module;
the temperature detection device is used for detecting the temperature at the outlet of the cooling cover and the ambient temperature at the outlet and transmitting the temperature to the main control module;
the main control module is used for controlling the rotating speed and the opening and closing of the direct current fan according to data transmitted by the first temperature detection device and the second temperature detection device, controlling the opening and closing of the first speed-adjustable water pump and the second speed-adjustable water pump, controlling the opening and closing of the semiconductor cooler, judging whether the cooling of the to-be-cooled tool shank is finished, and judging that the cooling of the to-be-cooled tool shank is finished when the difference between the detected temperature at the inlet and the detected temperature at the outlet of the cooling cover is within a specified range.
Furthermore, the first temperature detection device and the second temperature detection device are both temperature sensors.
Specifically, the semiconductor refrigerator comprises a direct current power supply, an insulating ceramic plate, a metal conduit, a plurality of N-type semiconductor refrigerating plates and a plurality of P-type semiconductor refrigerating plates, wherein the N-type semiconductor refrigerating plates and the P-type semiconductor refrigerating plates are sequentially arranged, the models of the two adjacent semiconductor refrigerating plates are different, the N-type semiconductor refrigerating plates and the P-type semiconductor refrigerating plates are arranged in the inner space of the metal conduit, one end of each semiconductor refrigerating plate is contacted with one end inside the metal conduit, the other opposite end is contacted with the other end inside the corresponding metal conduit, the positive electrode of the direct current power supply is connected with the leftmost end of one end, contacted with the semiconductor refrigerating plates, inside the metal conduit, the negative electrode of the direct current power supply is connected with the rightmost end of one end, contacted with the semiconductor refrigerating plates, and the insulating ceramic plate is wrapped outside the metal conduit, for insulating the exterior of the metal conduit.
Further, still include the pilot lamp, the pilot lamp sets up on cooling cover to be connected with main control module, be used for showing the cooling condition of waiting to cool off the handle of a knife.
Specifically, when the indicator light shows green, it indicates that the to-be-cooled tool shank is cooled, and when the indicator light shows red, it indicates that the to-be-cooled tool shank is not cooled.
The cooling method of the contact type hot charging cutter handle based on the semiconductor refrigeration is applied to the cooling system of the contact type hot charging cutter handle based on the semiconductor refrigeration, and comprises the following steps:
step 1, in a standby state, reducing the temperature of cooling water in a large water storage tank to a first temperature for later use through a semiconductor refrigeration sheet in a semiconductor device;
step 2, after the cooling cover covers the to-be-cooled tool shank, starting a speed-adjustable water pump I to enable cooling water to flow through the semiconductor refrigeration sheet and the water-cooling radiator to cool the to-be-cooled tool shank;
step 3, adjusting the rotating speed of the first speed-adjustable water pump, controlling the temperature of the water outlet of the cooling cover to be a second temperature, and opening the direct-current fan to radiate the circulating cooling liquid in the water-cooled radiator;
step 4, after the to-be-cooled tool shank is cooled to the second temperature, the first speed-adjustable water pump is turned off, the second speed-adjustable water pump is started, and the to-be-cooled tool shank is cooled through cooling liquid stored in the large water storage tank;
step 5, the temperature of the water outlet of the cover to be cooled is reduced to room temperature, and an indicator lamp is controlled to indicate that cooling is finished;
step 6, after the cooling knife handle is removed, continuously cooling the cooling liquid in the large water storage tank to reduce the temperature of the cooling liquid to the first temperature for later use;
step 7, turning off the second speed-adjustable water pump, and starting the first speed-adjustable water pump to enable hot water in the small water storage tank to flow through the cooling cover, so that condensation on the inner wall of the cooling cover is avoided;
and 8, when the temperature of the water in the small water storage tank is reduced to the room temperature, closing the semiconductor refrigeration sheet, the direct current fan and the speed-adjustable water pump I in the semiconductor refrigerator, and entering a standby mode.
Specifically, in steps 1 and 6, the first temperature is 10 ℃.
Further, in steps 3 and 4, the second temperature is 85 ℃.
The semiconductor refrigeration-based contact type hot-charging cutter handle cooling system and method have the advantages that the semiconductor refrigeration-based contact type hot-charging cutter handle cooling system and method are used for cooling the cutter handle through the logic combination of two cooling modes of semiconductor refrigeration and a circulating water cooling radiator, the advantages of the two cooling modes are utilized, the respective weaknesses are avoided, and the cutter handle is cooled more quickly. And moreover, the cooling temperature and time are intelligently controlled, the functions of monitoring the temperature of the cutter handle and monitoring the ambient temperature are added, whether the cutter handle is cooled or not can be accurately judged, and meanwhile, the cutter handle is prevented from being polluted by condensate water.
Drawings
FIG. 1 is a flow chart of a cooling method of a contact type hot charging cutter handle based on semiconductor refrigeration according to the invention;
FIG. 2 is a schematic view of a part of the structure of the cooling system of embodiments 1 and 3;
fig. 3 is a schematic circuit diagram of the refrigerator after the metal conduit is cut away in embodiment 2 of the present invention.
The device comprises a base, a handle, a water tank, a speed-adjustable water pump I, a speed-adjustable water pump II, a semiconductor refrigerator 107, a semiconductor refrigerator 108, a temperature detection device I, a temperature detection device II, a cooling cover 110, a water-cooling radiator 111, a direct current fan 112, a handle to be cooled 113 and an indicator lamp 114, wherein the base is made of a ceramic insulating material 101, the metal conduit 102, the small water tank 103, the speed-adjustable water pump I, the large water tank 105, the speed-adjustable water pump II, the semiconductor refrigerator 107, the.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the embodiments and the accompanying drawings.
The contact type hot charging cutter handle cooling system based on semiconductor refrigeration comprises a cutter handle to be cooled, a main control module, a small water storage tank, a first adjustable speed water pump corresponding to the small water storage tank, a large water storage tank, a second adjustable speed water pump corresponding to the large water storage tank, a semiconductor refrigerator, a first temperature detection device, a second temperature detection device, a cooling cover, a water-cooling radiator and a direct current fan, wherein the semiconductor refrigerator is arranged in the large water storage tank;
the outlet of the small water storage tank is connected with the inlet of the semiconductor refrigerator through a first speed-adjustable water pump, the outlet of the large water storage tank is connected with the inlet of the semiconductor refrigerator through a second speed-adjustable water pump, the outlet of the semiconductor refrigerator is connected with the inlet of a cooling cover through a first temperature detection device, the outlet of the cooling cover is connected with the inlet of a water-cooling radiator through a second temperature detection device, the outlet of the water-cooling radiator is respectively connected with the inlet of the small water storage tank and the inlet of the large water storage tank, and the direct current fan, the first speed-adjustable water pump, the second speed-adjustable water pump, the semiconductor cooler, the first temperature detection device and the second temperature detection device;
the cooling cover is used for covering the cooling cover on the to-be-cooled tool shank when the to-be-cooled tool shank needs to be cooled; the direct current fan is used for radiating the cooling liquid in the water-cooling radiator; the first adjustable-speed water pump is used for adjusting the water outlet flow of the small water storage tank; the second adjustable-speed water pump is used for adjusting the water outlet flow of the large water storage tank; the small water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet; the large water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet;
the semiconductor refrigerator is used for applying voltage with corresponding magnitude on a semiconductor refrigerating sheet of the semiconductor refrigerator when the cooling liquid needs to be cooled, so that the temperature of the cooling liquid flowing through the semiconductor refrigerator is reduced;
the temperature detection device is used for detecting the temperature at the inlet of the cooling cover and the ambient temperature at the inlet and transmitting the temperature to the main control module; the temperature detection device is used for detecting the temperature at the outlet of the cooling cover and the ambient temperature at the outlet and transmitting the temperature to the main control module;
and the main control module is used for controlling the rotating speed and the opening and closing of the direct current fan according to data transmitted by the first temperature detection device and the second temperature detection device, controlling the opening and closing of the first speed-adjustable water pump and the second speed-adjustable water pump, controlling the opening and closing of the semiconductor cooler, judging whether the cooling of the to-be-cooled tool shank is finished, and judging that the cooling of the to-be-cooled tool shank is finished when the difference between the detected temperature at the inlet and the detected temperature at the outlet of the cooling cover is within a specified range.
A cooling method of a contact type shrink fit tool shank based on semiconductor refrigeration is applied to a cooling system of the contact type shrink fit tool shank based on semiconductor refrigeration, and a flow chart of the cooling system is shown in figure 1, wherein the method comprises the following steps:
step 1, in a standby state, reducing the temperature of cooling water in a large water storage tank to a first temperature for later use through a semiconductor refrigeration sheet in a semiconductor device;
step 2, after the cooling cover covers the to-be-cooled tool shank, starting a speed-adjustable water pump I to enable cooling water to flow through the semiconductor refrigeration sheet and the water-cooling radiator to cool the to-be-cooled tool shank;
step 3, adjusting the rotating speed of the first speed-adjustable water pump, controlling the temperature of the water outlet of the cooling cover to be a second temperature, and opening the direct-current fan to radiate the circulating cooling liquid in the water-cooled radiator;
step 4, after the to-be-cooled tool shank is cooled to the second temperature, the first speed-adjustable water pump is turned off, the second speed-adjustable water pump is started, and the to-be-cooled tool shank is cooled through cooling liquid stored in the large water storage tank;
step 5, the temperature of the water outlet of the cover to be cooled is reduced to room temperature, and an indicator lamp is controlled to indicate that cooling is finished;
step 6, after the cooling knife handle is removed, continuously cooling the cooling liquid in the large water storage tank to reduce the temperature of the cooling liquid to the first temperature for later use;
step 7, turning off the second speed-adjustable water pump, and starting the first speed-adjustable water pump to enable hot water in the small water storage tank to flow through the cooling cover, so that condensation on the inner wall of the cooling cover is avoided;
and 8, when the temperature of the water in the small water storage tank is reduced to the room temperature, closing the semiconductor refrigeration sheet, the direct current fan and the speed-adjustable water pump I in the semiconductor refrigerator, and entering a standby mode.
Example 1
The embodiment of the invention discloses a semiconductor refrigeration-based contact type hot-charging handle cooling system, which comprises a handle to be cooled 113, a main control module, a small water storage tank 103, a first speed-adjustable water pump 104 corresponding to the small water storage tank 103, a large water storage tank 105, a second speed-adjustable water pump 106 corresponding to the large water storage tank 105, a semiconductor refrigerator 107, a first temperature detection device 108, a second temperature detection device 109, a cooling cover 110, a water-cooling radiator 111 and a direct-current fan 112, wherein the structural schematic diagram of part of the whole cooling system is shown in figure 2.
In practical application, the number of the cooling covers 110 can be configured according to the number of the tool shanks 113 to be cooled, in this embodiment, one cooling cover 110 is provided, wherein an outlet of the small water storage tank 103 is connected with an inlet of the semiconductor refrigerator 107 through the first speed-adjustable water pump 104, an outlet of the large water storage tank 105 is connected with an inlet of the semiconductor refrigerator 107 through the second speed-adjustable water pump 106, an outlet of the semiconductor refrigerator 107 is connected with an inlet of each cooling cover 110 through the first temperature detection device 108, an outlet of each cooling cover 110 is connected with an inlet of the water-cooled radiator 111 through the second temperature detection device 109, an outlet of the water-cooled radiator 111 is respectively connected with the inlet of the small water storage tank 103 and the inlet of the large water storage tank 105, and the direct current fan 112, the first speed-adjustable water pump 104, the second speed-adjustable water pump 106, the semiconductor cooler, the first temperature detection.
Each cooling cover 110 is used for covering the cooling cover 110 on the tool shank 113 to be cooled when the tool shank 113 to be cooled needs to be cooled; the direct current fan 112 is used for radiating the cooling liquid in the water-cooled radiator 111; the first speed-adjustable water pump 104 is used for adjusting the water outlet flow of the small water storage tank 103; the second adjustable-speed water pump 106 is used for adjusting the water outlet flow of the large water storage tank 105; the small water storage tank 103 is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet; the large water storage tank 105 is used to store the coolant, and to deliver the coolant to the outside through the water outlet when necessary, and to receive the circulated coolant through the water inlet.
The semiconductor cooler 107 is used for applying a voltage with a corresponding magnitude on the semiconductor cooler chip of the semiconductor cooler 107 when the cooling liquid needs to be cooled, so that the temperature of the cooling liquid flowing through the semiconductor cooler 107 is reduced.
The first temperature detection device 108 is used for detecting the temperature at the inlet of the cooling cover 110 and the ambient temperature at the inlet, and transmitting the temperature to the main control module; the second temperature detecting device 109 is used for detecting the temperature at the outlet of the cooling cover 110 and the ambient temperature therein, and transmitting the temperature to the main control module.
The main control module is used for controlling the rotating speed and the opening and closing of the direct current fan 112, controlling the opening and closing of the first adjustable speed water pump 104 and the second adjustable speed water pump 106, controlling the opening and closing of the semiconductor cooler, and judging whether the cooling of the tool shank 113 to be cooled is finished or not according to data transmitted by the first temperature detection device 108 and the second temperature detection device 109, and when the detected difference between the temperature at the inlet and the temperature at the outlet of the cooling cover 110 is within a specified range, judging that the cooling of the tool shank 113 to be cooled is finished.
In this embodiment, the first temperature detection device 108 and the second temperature detection device 109 are preferably temperature sensors according to the temperature detection requirement and the cost reduction.
Example 2
In this embodiment, in order to consider material selection and better complete refrigeration, compared to embodiment 1, the semiconductor refrigerator 107 in this embodiment specifically includes a dc power supply, an insulating ceramic sheet 101, a metal conduit 102, a plurality of N-type semiconductor chilling plates and a plurality of P-type semiconductor chilling plates, and a circuit composition schematic diagram of the refrigerator after the metal conduit 102 is cut open is shown in fig. 3, wherein the number of the N-type semiconductor chilling plates and the P-type semiconductor chilling plates is four, four N-type semiconductor chilling plates and four P-type semiconductor chilling plates are sequentially arranged, and two adjacent semiconductor chilling plates are different in type, the four N-type semiconductor chilling plates and four P-type semiconductor chilling plates are disposed in an inner space of the metal conduit 102, one end of each semiconductor chilling plate contacts with one end inside the metal conduit 102, and the opposite other end contacts with the other end inside the corresponding metal conduit 102, the anode of the direct current power supply is connected with the leftmost end of one end, in contact with the semiconductor refrigeration piece, of the metal guide tube 102, the cathode of the direct current power supply is connected with the rightmost end of one end, in contact with the semiconductor refrigeration piece, of the metal guide tube 102, and the insulating ceramic sheet 101 is wrapped outside the metal guide tube 102 and used for insulating the metal guide tube 102.
The semiconductor refrigeration is a new refrigeration technology based on five thermoelectric effects, namely a Seebeck effect, a Peltier effect, a Thomson effect, a Joule effect and a Fourier effect. When a loop is formed of two different semiconductor materials, one end of the loop absorbs heat and the other end emits heat. In the embodiment, voltage is applied to the semiconductor refrigerating sheet, so that heat is transported from one end of the refrigerating sheet to the other end of the refrigerating sheet; the circulating water becomes the cold end, and the cooling fan end becomes the hot end, can realize the effect to the circulating water cooling. Further, by changing the direction of the applied voltage, the cooling and heating can be switched.
Example 3
In this embodiment, with respect to embodiment 1 and embodiment 2, referring to fig. 2, a partial structural schematic diagram of the entire cooling system, wherein the system further includes an indicator lamp 114, and the indicator lamp 114 is disposed on the cooling cover 110, and is connected to the main control module, and is used for displaying a cooling condition of the tool shank 113 to be cooled. In order to facilitate the identification of whether cooling is completed or not by field workers, when the indicator lamp 114 displays green, it indicates that the cooling of the tool shank 113 to be cooled is completed, and when the indicator lamp 114 displays red, it indicates that the cooling of the tool shank 113 to be cooled is not completed.
Example 4
Embodiment 4 of the present invention is a method for cooling a contact type shrink fit tool holder based on semiconductor refrigeration, which is applied to the contact type shrink fit tool holder cooling system based on semiconductor refrigeration proposed in embodiments 1 to 3, and includes the following steps:
step 1, in a standby state, the temperature of cooling water in a large water storage tank is reduced to a first temperature for standby through a semiconductor refrigeration sheet in a semiconductor device, wherein the first temperature is preferably 10 ℃ generally.
And 2, after the cooling cover covers the to-be-cooled tool shank, starting a speed-adjustable water pump I to enable cooling water to flow through the semiconductor refrigeration sheet and the water-cooling radiator to cool the to-be-cooled tool shank.
And 3, adjusting the rotating speed of the first speed-adjustable water pump, controlling the temperature of the water outlet of the cooling cover to be a second temperature, turning on the direct-current fan, and radiating the circulating cooling liquid in the water-cooled radiator, wherein the second temperature is preferably 85 ℃ according to the working condition.
And 4, after the to-be-cooled cutter handle is cooled to the second temperature, turning off the first speed-adjustable water pump, starting the second speed-adjustable water pump, and cooling the to-be-cooled cutter handle through the cooling liquid stored in the large water storage tank, wherein the second temperature is preferably 85 ℃ according to the working condition.
And 5, cooling the water outlet of the cooling cover to room temperature, and controlling an indicator light to indicate that cooling is finished.
And 6, after the cooling cutter handle is removed, continuously cooling the cooling liquid in the large water storage tank to reduce the temperature of the cooling liquid to a first temperature for standby, wherein the first temperature is preferably 10 ℃ generally.
And 7, turning off the second speed-adjustable water pump, and starting the first speed-adjustable water pump to enable hot water in the small water storage tank to flow through the cooling cover, so that condensation on the inner wall of the cooling cover is avoided.
And 8, when the temperature of the water in the small water storage tank is reduced to the room temperature, closing the semiconductor refrigeration sheet, the direct current fan and the speed-adjustable water pump I in the semiconductor refrigerator, and entering a standby mode.
By combining the embodiments 1 to 4, the invention cools the tool shank by logically combining the semiconductor refrigeration and the circulating water cooling radiator, and avoids respective weaknesses by utilizing the advantages of the two refrigeration modes, thereby realizing faster tool shank cooling. And moreover, the cooling temperature and time are intelligently controlled, the functions of monitoring the temperature of the cutter handle and monitoring the ambient temperature are added, whether the cutter handle is cooled or not can be accurately judged, and meanwhile, the cutter handle is prevented from being polluted by condensate water.
Claims (8)
1. The contact type hot-charging cutter handle cooling system based on semiconductor refrigeration comprises a cutter handle to be cooled and is characterized by further comprising a main control module, a small water storage tank, a first speed-adjustable water pump corresponding to the small water storage tank, a large water storage tank, a second speed-adjustable water pump corresponding to the large water storage tank, a semiconductor refrigerator, a first temperature detection device, a second temperature detection device, a cooling cover, a water-cooling radiator and a direct-current fan;
the outlet of the small water storage tank is connected with the inlet of the semiconductor refrigerator through a first speed-adjustable water pump, the outlet of the large water storage tank is connected with the inlet of the semiconductor refrigerator through a second speed-adjustable water pump, the outlet of the semiconductor refrigerator is connected with the inlet of the cooling cover through a first temperature detection device, the outlet of the cooling cover is connected with the inlet of the water-cooling radiator through a second temperature detection device, the outlet of the water-cooling radiator is respectively connected with the inlet of the small water storage tank and the inlet of the large water storage tank, and the direct current fan, the first speed-adjustable water pump, the second speed-adjustable water pump, the semiconductor cooler, the first temperature detection device and the second temperature detection device;
the cooling cover is used for covering the cooling cover on the tool shank to be cooled when the tool shank to be cooled needs to be cooled;
the direct current fan is used for radiating the cooling liquid in the water-cooling radiator;
the first adjustable-speed water pump is used for adjusting the water outlet flow of the small water storage tank;
the second adjustable-speed water pump is used for adjusting the water outlet flow of the large water storage tank;
the small water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet;
the large water storage tank is used for storing cooling liquid, conveying the cooling liquid outwards through the water outlet when needed, and receiving the circulated cooling liquid through the water inlet;
the semiconductor refrigerator is used for applying voltage with corresponding magnitude on a semiconductor refrigerating sheet of the semiconductor refrigerator when the cooling liquid needs to be cooled, so that the temperature of the cooling liquid flowing through the semiconductor refrigerator is reduced;
the temperature detection device is used for detecting the temperature at the inlet of the cooling cover and the ambient temperature at the inlet and transmitting the temperature to the main control module;
the temperature detection device is used for detecting the temperature at the outlet of the cooling cover and the ambient temperature at the outlet and transmitting the temperature to the main control module;
the main control module is used for controlling the rotating speed and the opening and closing of the direct current fan according to data transmitted by the first temperature detection device and the second temperature detection device, controlling the opening and closing of the first speed-adjustable water pump and the second speed-adjustable water pump, controlling the opening and closing of the semiconductor cooler, judging whether the cooling of the to-be-cooled tool shank is finished, and judging that the cooling of the to-be-cooled tool shank is finished when the difference between the detected temperature at the inlet and the detected temperature at the outlet of the cooling cover is within a specified range.
2. The semiconductor refrigeration-based contact type hot-charging cutter handle cooling system is characterized in that the first temperature detection device and the second temperature detection device are both temperature sensors.
3. The contact type hot-charging handle cooling system based on semiconductor refrigeration of claim 1, wherein the semiconductor refrigerator comprises a direct current power supply, an insulating ceramic sheet, a metal conduit, a plurality of N-type semiconductor refrigeration sheets and a plurality of P-type semiconductor refrigeration sheets, the plurality of N-type semiconductor refrigeration sheets and the plurality of P-type semiconductor refrigeration sheets are sequentially arranged, the types of two adjacent semiconductor refrigeration sheets are different, the plurality of N-type semiconductor refrigeration sheets and the plurality of P-type semiconductor refrigeration sheets are arranged in the inner space of the metal conduit, one end of each semiconductor refrigeration sheet is in contact with one end in the metal conduit, the opposite end is in contact with the other end in the metal conduit, the positive electrode of the direct current power supply is connected with the leftmost end in one end of the metal conduit in contact with the semiconductor refrigeration sheets, the negative electrode of the direct current power supply is connected with the rightmost end in one end of the metal conduit in contact with the semiconductor refrigeration sheets, the insulating ceramic plate is wrapped outside the metal conduit and used for insulating the outside of the metal conduit.
4. The semiconductor refrigeration-based contact type hot charging handle cooling system is characterized by further comprising an indicator light, wherein the indicator light is arranged on the cooling cover and connected with the main control module, and is used for displaying the cooling condition of the handle to be cooled.
5. The semiconductor refrigeration-based contact type hot charging cutter handle cooling system is characterized in that when the indicator light shows green, the cooling of the cutter handle to be cooled is finished, and when the indicator light shows red, the cooling of the cutter handle to be cooled is not finished.
6. A cooling method of a contact type shrink fit cutter handle based on semiconductor refrigeration is applied to the cooling system of the contact type shrink fit cutter handle based on semiconductor refrigeration, which is characterized by comprising the following steps:
step 1, in a standby state, reducing the temperature of cooling water in a large water storage tank to a first temperature for later use through a semiconductor refrigeration sheet in a semiconductor device;
step 2, after the cooling cover covers the to-be-cooled tool shank, starting a speed-adjustable water pump I to enable cooling water to flow through the semiconductor refrigeration sheet and the water-cooling radiator to cool the to-be-cooled tool shank;
step 3, adjusting the rotating speed of the first speed-adjustable water pump, controlling the temperature of the water outlet of the cooling cover to be a second temperature, and opening the direct-current fan to radiate the circulating cooling liquid in the water-cooled radiator;
step 4, after the to-be-cooled tool shank is cooled to the second temperature, the first speed-adjustable water pump is turned off, the second speed-adjustable water pump is started, and the to-be-cooled tool shank is cooled through cooling liquid stored in the large water storage tank;
step 5, the temperature of the water outlet of the cover to be cooled is reduced to room temperature, and an indicator lamp is controlled to indicate that cooling is finished;
step 6, after the cooling knife handle is removed, continuously cooling the cooling liquid in the large water storage tank to reduce the temperature of the cooling liquid to the first temperature for later use;
step 7, turning off the second speed-adjustable water pump, and starting the first speed-adjustable water pump to enable hot water in the small water storage tank to flow through the cooling cover, so that condensation on the inner wall of the cooling cover is avoided;
and 8, when the temperature of the water in the small water storage tank is reduced to the room temperature, closing the semiconductor refrigeration sheet, the direct current fan and the speed-adjustable water pump I in the semiconductor refrigerator, and entering a standby mode.
7. The method for cooling the contact type shrink fit tool shank based on semiconductor refrigeration according to claim 6, wherein the first temperature is 10 ℃ in steps 1 and 6.
8. The method for cooling the contact type shrink fit tool shank based on semiconductor refrigeration as claimed in claim 6, wherein the second temperature is 85 ℃ in steps 3 and 4.
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