CN110456570A - 一种led背光模块及显示装置 - Google Patents
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Abstract
本发明公开了一种LED背光模块及显示装置,该LED背光模块的基板上分布若干发光单元,且基板的表面设有若干供发光单元贴靠的阻焊开窗区,联接两相邻发光单元的导电线路分为主线路和辅线路;基板上除阻焊开窗区外的其余部分都涂覆绝缘物质,涂覆过程存在对位误差,可能导致预留的阻焊开窗区被覆盖,实际的阻焊开窗区发生偏移,由于辅线路贯穿阻焊开窗区且走线方向与发光单元的两电极连线方向相交,辅线路设置足够长,可避免被大面积覆盖,从而验光时可监测到其中未被绝缘物质覆盖的部分充当焊盘进行固晶,有效避免了固晶失败的发生,大大提高LED封装的良品率,此发明用于LCD与LED显示领域。
Description
技术领域
本发明涉及LCD与LED显示领域,特别是涉及一种LED背光模块及显示装置。
背景技术
随着人们对显示体验的要求越来越高,高级显示器一般都使用曲面甚至是可弯曲屏。传统的液晶显示屏背光为窄长的背光条,其可弯曲程度相对较高。但是随着微型蓝光LED芯片以及直下式局部背光调节技术的成熟,以微型LED作为背光源的技术开始逐渐普及,背光条逐渐发展成为Mini LED背光板。目前的曲面LCD屏主要采用的是弧形的侧发光背光条提供光源,通过导光板将线光源转为面光源,因此很难做到精细的区域调光,且持续点亮下,功耗较高,LCD的灯条侧边温度较高。
如果采用可弯曲的直下式Mini LED面光源,一方面可以实现曲面弯曲的显示要求;另外一方面可以做很精细的区域调光,实现超高对比度。目前Mini LED背光板普遍采用倒装COB结构,常用锡膏进行焊接,焊锡普遍偏脆,且存在焊接不牢固、不易受力的问题。
如图1、图2分别显示的是现有技术的导电线路正常开窗与不良开窗的示意图,现有的导电线路走线方向与发光单元的两电极连线方向相互平行,在基板制作工艺中,基板的非焊盘部分(即非阻焊开窗区的部分)需要涂覆绝缘白油,当白油涂覆过程出现对位偏差时,原预设的阻焊开窗区发生偏移,导致在验光过程中检测不到焊盘,使得固晶失败。
发明内容
本发明的目的在于提供一种确保验光过程中顺利固晶的LED背光模块及显示装置。
本发明所采取的技术方案是:
一种LED背光模块,包括基板、若干设置在所述基板上的发光单元,所述基板的表面设有若干供发光单元贴靠的阻焊开窗区,各所述阻焊开窗区内分别设有与各发光单元的两电极相接的焊盘,所述基板上布设若干联接两相邻发光单元的导电线路,各所述导电线路均分为主线路、两接连于所述主线路的辅线路,各所述辅线路均贯穿阻焊开窗区且走线方向与发光单元的两电极连线方向相交。
进一步作为本发明技术方案的改进,各所述辅线路的走线方向与发光单元的两电极连线方向垂直。
进一步作为本发明技术方案的改进,各所述辅线路的长度和宽度至少是各发光单元的电极长度和宽度的1.2倍。
进一步作为本发明技术方案的改进,所述基板沿一固定方向弯曲,以所述基板弯曲后弧度发生变化所在的水平方向为基板的弯曲方向,各所述发光单元的两电极连线方向与基板的弯曲方向相互垂直并位于基板所在曲面上。
进一步作为本发明技术方案的改进,各所述发光单元分别采用封装胶进行覆盖封装。
进一步作为本发明技术方案的改进,各所述发光单元在基板上呈矩形或等腰三角形阵列排布,沿所述发光单元的两电极连线方向排列的各发光单元上所覆盖的封装胶的胶路首尾相接。
进一步作为本发明技术方案的改进,所述封装胶的材料为有机硅或者环氧树脂。
进一步作为本发明技术方案的改进,各所述阻焊开窗区的面积均大于发光单元的横截面积。
进一步作为本发明技术方案的改进,所述阻焊开窗区的长、宽分别比所述发光单元的长、宽大20μm~100μm。
进一步作为本发明技术方案的改进,所述基板采用覆铜板;所述覆铜板的基体材料为热固型环氧树脂或聚酰亚胺,增强材料为玻璃纤维或者碳纤维。
进一步作为本发明技术方案的改进,所述覆铜板的厚度不大于1.2mm。
进一步作为本发明技术方案的改进,各所述发光单元均采用双电极芯片。
一种显示装置,包括如上所述的LED背光模块。
本发明的有益效果:此LED背光模块及显示装置,LED背光模块的基板上分布若干发光单元,且基板的表面设有若干供发光单元贴靠的阻焊开窗区,联接两相邻发光单元的导电线路分为主线路和辅线路;基板上阻焊开窗区外的其余部分都涂覆绝缘物质,涂覆过程存在对位误差,可能导致预留的阻焊开窗区被覆盖,实际的阻焊开窗区发生偏移,由于辅线路贯穿阻焊开窗区且走线方向与发光单元的两电极连线方向相交,辅线路设置足够长,可避免被大面积覆盖,从而验光时可监测到其中未被绝缘物质覆盖的部分充当焊盘进行固晶,有效避免了固晶失败的发生,更好地提高该LED背光模块的质量及性能。
附图说明
下面结合附图对本发明作进一步说明:
图1是现有技术的导电线路的正常开窗示意图;
图2是现有技术的导电线路的不良开窗示意图;
图3是本发明实施例基板上的导电线路走线图一;
图4是本发明实施例基板上的导电线路走线图二;
图5是本发明实施例LED背光模块的整体结构俯视图;
图6是本发明实施例LED背光模块的整体结构侧视图。
具体实施方式
下面详细描述本发明的实施方式,实施方式的示例在附图中示出,其中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。
如图1、图2所示,现有技术中,导电线路12的走线方向与发光单元的两电极连线方向相互平行;又在基板1制作工艺中,基板1的非焊盘部分需要涂覆绝缘白油,当白油涂覆过程出现对位偏差时,原预设的阻焊开窗区11发生偏移,导致在验光过程中难以检测到焊盘3的存在,使得固晶失败。
参照图3至图6,为本发明的其中一种实施例,提供了一种LED背光模块,包括有基板1、若干设置在基板1上的发光单元2,基板1的表面设有若干供发光单元2贴靠的阻焊开窗区11,各所述阻焊开窗区11内分别设有与各发光单元2的两电极相接的焊盘3,基板1上布设若干联接两相邻发光单元2的导电线路12,各导电线路12均分为主线路、两连接主线路的辅线路,各辅线路均贯穿阻焊开窗区11且走线方向与发光单元2的两电极连线方向相交,各焊盘均位于辅线路上。
此LED背光模块,基板1上分布若干发光单元2,其基板1的表面设有若干供发光单元2贴靠的阻焊开窗区11,联接两相邻发光单元2的导电线路分为主线路和辅线路,主线路的两端分别连接有辅线路,且两辅线路位于主线路的同一侧;基板1上阻焊开窗区11外的其余部分都涂覆绝缘物质,涂覆过程存在对位误差,可能导致预留的阻焊开窗区11被覆盖,实际的阻焊开窗区11发生偏移,由于辅线路贯穿阻焊开窗区11且走线方向与发光单元2的两电极连线方向相交,辅线路设置足够长,可避免被大面积覆盖,从而验光时可监测到其中未被绝缘物质覆盖的部分充当焊盘进行固晶,有效避免了固晶失败的发生,更好地提高该LED背光模块的质量及性能。在本实施例中,绝缘物质为白油。
进一步地,基板1沿一固定方向弯曲,以基板1弯曲后弧度发生变化所在的水平方向为基板1的弯曲方向,各发光单元2的两电极连线方向与基板1的弯曲方向相互垂直并位于基板1所在曲面上,使得在基板1折弯的过程中,发光单元2的焊接处所受应力减小,从而有效避免焊盘3处的焊锡与发光单元2的电极发生脱离,减少虚焊情况的产生,减少不良率,提高背光模块的整体有效性能。
目前的封装工艺一般采用整面注塑,当基板1有一定弯折度之后,一方面应力就会导致焊锡与发光单元2的电极脱离,从而导致虚焊进而导致背光模块失效;另一方面,整面相连的封装胶在弯曲后,相互拉伸,易导致胶裂。
如图6所示,针对该问题,本实施例中,各发光单元2分别采用封装胶4进行覆盖封装,覆盖于各发光单元2上的封装胶4的胶路轨迹均从发光单元2的一端延伸至另一端,使得封装胶4的胶路轨迹与基板1的弯曲方向相互垂直。减小了在基板1弯曲后,发光单元2与封装胶4之间所受应力的大小,从而有效避免发光单元2的两电极与其焊盘3处焊锡的分离问题。
由于传统封装模式中,封装胶4为整面覆盖相连的形式,在基板1弯曲后,封装胶4受到拉伸,容易导致胶体断裂的情况发生,封装效果大打折扣,并容易导致发光单元2的固定不稳的问题。进一步作为优选地,参照图5,各发光单元2在基板1上呈矩形阵列排布,沿发光单元2的两极连线方向排列的各发光单元2上所覆盖的封装胶的胶路首尾相接,形成线型封装模式,封装胶4的胶路轨迹与基板1的弯曲方向相垂直,从而在基板1的折弯过程,相邻两列的封装胶4不再沿基板1的折弯方向受到拉伸作用,防止了封装胶4的胶体断裂问题的产生。可选的,在某些实施例中,各发光单元2在基板1上呈等腰三角形排布。
本实施例中,封装胶4的材料为有机硅或者环氧树脂;作为优选地,采用硅胶或者硅树脂作为封装胶4的材料。由于硅胶具备耐高温的特性,且极具柔韧性,不轻易变形,对拉伸变形等的承受能力强,更好地避免发生断裂或者撕裂情况。本实施例中,采用划胶的封装工艺进行封装胶4的涂布;在某些实施例中,封装工艺可采用点胶或者一体模压等。
根据图3所示,本实施例中,基板1的部分上表面覆盖绝缘物质,基板1上未被绝缘物质覆盖的部分形成若干供发光单元2贴靠的阻焊开窗区11,各阻焊开窗区11的形状与发光单元2的横截面形状相同,且各阻焊开窗区11的面积大于发光单元2的横截面面积;更具体地,当发光单元2采用发光芯片时,阻焊开窗区的长、宽分别比发光单元2的长、宽大20μm~100μm;各焊盘3均位于阻焊开窗区11内。基板1上布设有若干条联接相邻发光单元2的导电线路12,各导电线路12的主线路的走线方向与发光单元2的两电极连线方向相同,沿发光单元2的两电极连线方向设置的各导电线路的主线路错开分布,即,沿发光单元2的两电极连线方向设置的相邻的导电线路的主线路分别位于发光单元的两侧;在其他实施例中,沿发光单元2的两电极连线方向设置的各导电线路的主线路位于发光单元的同一侧。作为优选地,各辅线路的长度和宽度至少设置为各发光单元2的电极长度和宽度的1.2倍,以此保证了辅线路的长度足够长,进而确保验光时可顺利检测到辅线路未被绝缘白油覆盖的金属部分充当焊盘进行固晶。更具体作为说明地,如图4,各阻焊开窗区11之间的上下、左右偏差,并不影响发光单元2及其他器件在基板1上的贴片,且发光单元2在验光对位过程中不易发生偏移。
作为本发明优选的实施方式,基板1采用覆铜板,该覆铜板的基体材料为热固型环氧树脂或聚酰亚胺,增强材料为玻璃纤维或者碳纤维,该覆铜板的厚度不大于1.2mm,在更为优选的情况下,覆铜板的厚度不大于0.6mm,可使制作出的背光模块的成品能更加轻薄,且更易弯曲,避免弯曲时断裂情况的发生。
本实施例中,各发光单元2均采用双电极芯片。进一步地,在某些实施例当中,发光单元2可采用多电极芯片,或者可利用双电极灯珠、多电极灯珠替代发光单元2作为发光器件。
本发明还提供了一种显示装置,其包括如上所述的LED背光模块。此LED背光模块,对发光单元2在基板1上的排布方式,以及封装结构进行了优化,有效解决了基板1弯曲过程中所导致的发光单元2虚焊和封装胶4胶体断裂的问题,以及由于白油涂覆过程存在对位误差,所导致发光单元2在验光过程中检测不到焊盘,使得固晶失败的问题,很好地提高了整体的有效性能。
当然,本发明的设计创造并不局限于上述实施方式,熟悉本领域的技术人员在不违背本发明精神的前提下还可作出等同变形或替换,这些等同的变型或替换均包含在本申请权利要求所限定的范围内。
Claims (13)
1.一种LED背光模块,其特征在于:包括基板、若干设置在所述基板上的发光单元,所述基板的表面设有若干供发光单元贴靠的阻焊开窗区,各所述阻焊开窗区内分别设有与各发光单元的两电极相接的焊盘,所述基板上布设若干联接两相邻发光单元的导电线路,各所述导电线路均分为主线路、两接连于所述主线路的辅线路,各所述辅线路均贯穿阻焊开窗区且走线方向与发光单元的两电极连线方向相交,各所述焊盘均位于辅线路上。
2.根据权利要求1所述的LED背光模块,其特征在于:各所述辅线路的走线方向与发光单元的两电极连线方向垂直。
3.根据权利要求1所述的LED背光模块,其特征在于:各所述辅线路的长度和宽度至少是各发光单元电极的长度和宽度的1.2倍。
4.根据权利要求1所述的LED背光模块,其特征在于:所述基板沿一固定方向弯曲,以所述基板弯曲后弧度发生变化所在的水平方向为基板的弯曲方向,各所述发光单元的两电极连线方向与基板的弯曲方向相互垂直并位于基板所在曲面上。
5.根据权利要求4所述的LED背光模块,其特征在于:各所述发光单元分别采用封装胶进行覆盖封装。
6.根据权利要求5所述的LED背光模块,其特征在于:各所述发光单元在基板上呈矩形或等腰三角形阵列排布,沿所述发光单元的两电极连线方向排列的各发光单元上所覆盖的封装胶的胶路首尾相接。
7.根据权利要求6所述的LED背光模块,其特征在于:所述封装胶的材料为有机硅或者环氧树脂。
8.根据权利要求1所述的LED背光模块,其特征在于:各所述阻焊开窗区的面积均大于发光单元的横截面积。
9.根据权利要求8所述的LED背光模块,其特征在于:各所述阻焊开窗区的长、宽分别比发光单元的长、宽大20μm~100μm。
10.根据权利要求1所述的LED背光模块,其特征在于:所述基板采用覆铜板;所述覆铜板的基体材料为热固型环氧树脂或聚酰亚胺,增强材料为玻璃纤维或者碳纤维。
11.根据权利要求10所述的LED背光模块,其特征在于:所述覆铜板的厚度不大于1.2mm。
12.根据权利要求1所述的LED背光模块,其特征在于:各所述发光单元均采用双电极芯片。
13.一种显示装置,其特征在于:包括如权利要求1至12任一项所述的LED背光模块。
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