CN110449743A - A kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing and method - Google Patents
A kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing and method Download PDFInfo
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- CN110449743A CN110449743A CN201910673003.4A CN201910673003A CN110449743A CN 110449743 A CN110449743 A CN 110449743A CN 201910673003 A CN201910673003 A CN 201910673003A CN 110449743 A CN110449743 A CN 110449743A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
Abstract
The present invention relates to Fabrication Techniques of Nano-Structure fields, it is proposed a kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing, including the laser, optical splitter, pendulum mirror, macro/micromotion platform set gradually, and it analyzes to obtain corresponding machining area path respectively to the controller of each component transmission control signal for the processing model according to importing, wherein laser adjusts the focus and height of optical path according to control signal, it puts mirror and beat is carried out according to control signal, macro/micromotion platform carries out macro micro- compound motion according to control signal.The present invention also proposes a kind of multiphoton polymerization face shaped three dimensional nanometer direct write processing method.Single laser beam is divided into several laser beams by optical splitter and carries out multiple spot simultaneous processing by the present invention, three micro-nano direct write processing are realized in conjunction with the beat movement of pendulum mirror and macro micro- compound motion of macro/micromotion platform, processing efficiency can be effectively improved, realizes the write-in resolving power and diffraction efficiency for combining direct write processing technology.
Description
Technical field
The present invention relates to Fabrication Techniques of Nano-Structure fields, more particularly, to a kind of multiphoton polymerization face shaped three dimensional
Nanometer direct write system of processing and method.
Background technique
Multiphoton polymerization laser direct-writing processing technology is a kind of three-dimensional photoetching technology without exposure mask, basic functional principle
It is that high-precision laser beam or Sample Scan are controlled by computer, inscribes out mask pattern on a photoresist or on light-sensitive material.Cause
This, multiphoton polymerization laser direct-writing processing technology is widely used in IC manufacturing, micro optical element processing, MEMS, optics
In multiple industries such as optical element needed for detection, optical anti-counterfeiting and astronomy, space flight, aviation, printing, and in nanoscale electricity
In terms of the production of son, photon and microfluidic device, which can compete with prior art.
However, traditional laser direct-writing device is limited due to being inscribed by single laser, there are low efficiencys, at high cost, only
The problems such as can apply to the production and preparation of microsize device.Since traditional laser writing technology exposes mould using single-point
Formula, cannot achieve higher write efficiency, and the multiple spot exposure parallel laser direct writing technology risen in recent years, be widely regarded as most
The potential laser writing technology for being able to solve the above problem.But the current technology still has write-in resolving power and diffraction efficiency
It cannot take into account, the problem in science and key technical problem of the urgent need to resolve such as baseline drift, restrict and affect multiple spot exposure and is parallel
The development of laser writing technology.
Summary of the invention
The present invention is to overcome multiple spot exposure parallel laser direct writing technology described in the above-mentioned prior art that cannot take into account write-in point
It distinguishes power and diffraction efficiency, haves the defects that baseline drift, a kind of multiphoton polymerization face shaped three dimensional nanometer direct write processing system is provided
System, by optical splitter by single laser beam be divided into several laser beams carry out multiple spot simultaneous processing, in conjunction with pendulum mirror beat movement and
Macro micro- compound motion of macro/micromotion platform realizes three micro-nano direct write processing, can effectively improve processing efficiency, realize simultaneously
Take into account the write-in resolving power and diffraction efficiency of direct write processing technology.
In order to solve the above technical problems, technical scheme is as follows:
A kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing, including set gradually laser, optical splitter,
Put mirror, macro/micromotion platform, and for the processing model according to importing analyze to obtain corresponding machining area path it is right respectively
Laser, pendulum mirror, macro/micromotion platform send the controller of control signal, and wherein laser is according to control signal adjustment optical path
Focus and height, pendulum mirror carry out beat according to control signal, and macro/micromotion platform carries out macro micro- compound motion according to control signal；
The incident laser that laser issues obtains multi beam parallel laser after optical splitter, and multi beam parallel laser projects after overswing mirror
It is placed with the macro/micromotion platform of light-sensitive material, macro/micromotion platform carries out macro micro- compound motion according to the control signal, and
The location information of macro/micromotion platform is fed back to controller.
In the technical program, incident single laser beam is divided by multiple laser beams using spectroscope, to realize that multiple spot is same
Shi Jiagong realizes multiple identical three-dimensional micro-nano structure processing with array arrangement in synchronization；Put mirror root
Make beat movement according to the control signal that controller exports, the macro micro- compound fortune carried out in conjunction with macro/micromotion platform according to control signal
It is dynamic, so that laser spot is realized the minute movement for meeting machining path on the photosensitive material.
Preferably, optical splitter is cylindrical micro-lens array.
Preferably, macro/micromotion platform is the macro micro- composite motion platform of X-Y-Z, including what is set gradually from bottom to up
Macro micro- compound motion equipment support platform, macro micro- composite motion platform Y-axis, macro micro- composite motion platform X-axis, macro micro- compound motion
The upper surface of macro micro- composite motion platform Z axis inching gear is arranged in platform Z axis inching gear, light-sensitive material.
Preferably, macro/micromotion platform uses model reference self-adapting control algorithm by the incidence of most parallel lasers
Location information feedback realizes across the scale Collaborative Control of multidimensional to controller.
The present invention also proposes a kind of multiphoton polymerization face shaped three dimensional nanometer direct write processing method, poly- using above-mentioned multi-photon
Conjunction face shaped three dimensional nanometer direct write system of processing, comprising the following steps:
S1: initialization system parameter imports processing model to controller, and controller is obtained accordingly by analyzing processing model
Machining path and control signal；
S2: controller sends control signal to laser, and laser adjusts the focus and height of optical path according to control signal；
Controller sends control signal to pendulum mirror, and pendulum mirror adjusts initial deflection angle according to control signal；
S3: light-sensitive material to be processed is placed on macro/micromotion platform；
S4: the laser of starting laser, laser emitting obtains multi beam parallel laser by spectroscope, is changed by pendulum mirror
The launching position of multi beam parallel laser, multi beam parallel laser project on light-sensitive material；In process, the continuous basis of mirror is put
It controls signal and adjusts deflection angle, macro/micromotion platform constantly makees macro/micromotion according to control signal, while macro/micromotion being put down
The location information of platform is fed back into controller, and controller is according to the location information fed back and the machining path analyzed
Control signal is adjusted；
S5: after completing processing, controller issues stop signal, laser, pendulum to laser, pendulum mirror, macro/micromotion platform
Mirror, macro/micromotion platform stop operating, and then observe image quality to the light-sensitive material for completing processing by electron microscope.
Compared with prior art, the beneficial effect of technical solution of the present invention is: if being divided into single laser beam by optical splitter
Dry laser beam carries out multiple spot simultaneous processing, in conjunction with macro micro- compound motion of macro/micromotion platform, can effectively improve processing effect
Rate, it is ensured that machining accuracy realizes the write-in resolving power and diffraction efficiency for combining direct write processing technology；By using pendulum mirror pair
The launching position of laser beam is adjusted, mismachining tolerance problem caused by can effectively solve the problem that because of baseline drift.
Detailed description of the invention
Fig. 1 is the multiphoton polymerization face shaped three dimensional nanometer direct write system of processing structural schematic diagram of embodiment 1.
Fig. 2 is the multiphoton polymerization face shaped three dimensional nanometer direct write processing method flow chart of embodiment 2.
Wherein, 1- laser, 2- optical splitter, 3- pendulum mirror, 4- macro/micromotion platform, the macro micro- composite motion platform Z axis of 41- are micro-
Dynamic device, the macro micro- composite motion platform X-axis inching gear of 42-, the macro micro- composite motion platform Y-axis inching gear of 43-, 44- are macro micro-
Compound motion equipment support platform.
Specific embodiment
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；
In order to better illustrate this embodiment, the certain components of attached drawing have omission, zoom in or out, and do not represent actual product
Size；
To those skilled in the art, it is to be understood that certain known features and its explanation, which may be omitted, in attached drawing
's.
The following further describes the technical solution of the present invention with reference to the accompanying drawings and examples.
Embodiment 1
The present embodiment proposes a kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing, as shown in Figure 1, being this reality
Apply the multiphoton polymerization face shaped three dimensional nanometer direct write system of processing schematic diagram of example.
The multiphoton polymerization face shaped three dimensional nanometer direct write system of processing of the present embodiment include the laser 1 set gradually,
Optical splitter 2, pendulum mirror 3, macro/micromotion platform 4, and analyze to obtain corresponding machining area for the processing model according to importing
Path sends the controller of control signal to laser 1, pendulum mirror 3, macro/micromotion platform 4 respectively.
In the present embodiment, the optical path for single laser beam that the control signal adjustment that laser 1 is sent according to controller exports is burnt
Point and height；Optical splitter 2 is used to incident single laser beam being divided into multi beam parallel laser, realizes multiple spot simultaneous processing；Pendulum 3, mirror
Beat movement is done according to the control signal that controller is sent, controls multi beam by changing the angle of pendulum mirror 3 in direct write process
The launching position of parallel laser, to reach the machining path for changing multi beam parallel laser；Macro/micromotion platform 4 is according to controller
The control signal of transmission carries out macro micro- compound motion, moves the further throwing to multi beam parallel laser in conjunction with the beat of pendulum mirror 3
It penetrates position to be adjusted, realizes the 3D completed by the movement of laser spot and the linkage of macro/micromotion platform 4 to light-sensitive material
Processing.
In the present embodiment, optical splitter 2 is cylindrical micro-lens array, having a size of 10 × 10mm, effective focal length 1.6mm,
Radius is 0.711mm, and with a thickness of 1.2mm, spacing is 250 μm.
In the present embodiment, macro/micromotion platform 4 is the macro micro- composite motion platform of X-Y-Z, including from bottom to up successively
Macro micro- compound motion equipment support platform 44 for being arranged, macro micro- composite motion platform Y-axis inching gear 43, macro micro- compound motion are flat
Platform X-axis inching gear 42, macro micro- composite motion platform Z axis inching gear 41, light-sensitive material are arranged in macro micro- composite motion platform Z
The upper surface of axis inching gear 41.
In the present embodiment, macro/micromotion platform 4 uses model reference self-adapting control algorithm by the macro/micromotion platform 4
Location information feedback to controller, be able to solve the multiaxis collaboration dynamic response problem difficult with precise positioning control slowly, realize
Across the scale Collaborative Control of multidimensional.
In the specific implementation process, initialization controller, controller is respectively to laser 1, pendulum mirror 3, macro/micromotion platform 4
Reset signal is sent, detects whether each component operates normally；The processing model that complete design is imported to controller obtains corresponding
Machining area path and control command；Controller sends control signal, laser to laser 1 according to the machining area path of generation
Device 1 starts to work after receiving control signal and adjusts its optical path focal spot height and position, the laser of the multiphoton polymerization generated
Optical path injects optical splitter 2, and single beam laser generates the outgoing of 8 road parallel lasers after optical splitter 2；Controller sends control to pendulum mirror 3
Signal processed makees beat movement according to the received control signal of institute after the pendulum completion reset work of mirror 3, makes 8 road parallel lasers of outgoing
It projects and is arranged on the light-sensitive material of 4 upper surface of macro/micromotion platform, macro/micromotion platform 4 is according to the received control signal of institute
Do macro micro- compound motion in X-Y-Z axis direction, at the same 4 binding model Model Reference Adaptive Control algorithm of macro/micromotion platform by its
Macro micro- composite motion platform Y-axis inching gear 43, macro micro- composite motion platform X-axis inching gear 42, macro micro- composite motion platform Z
The location information of axis inching gear 41 returns in controller in real time to be fed back, until completing processing, controller is respectively to laser
Device 1, pendulum mirror 3, macro/micromotion platform 4 send stop signal, and laser 1, pendulum mirror 3, macro/micromotion platform 4 stop operating.
In the present embodiment, single laser beam is divided by several laser beams by optical splitter 3 and carries out multiple spot simultaneous processing, in conjunction with
Macro micro- compound motion of macro/micromotion platform 4, can effectively improve processing efficiency, it is ensured that machining accuracy, realization combine straight
Write the write-in resolving power and diffraction efficiency of processing technology；In conjunction with the macro micro- compound of the beat movement and macro/micromotion platform 4 for putting mirror 3
Movement, which is realized, processes the three-dimensional manometer direct write of light-sensitive material, at the same by the beat of pendulum mirror 3 to the launching position of laser beam into
Row adjustment, mismachining tolerance problem caused by can effectively solve the problem that because of baseline drift.
Embodiment 2
The present embodiment proposes a kind of multiphoton polymerization face shaped three dimensional nanometer direct write processing method, mentions in Application Example 1
Multiphoton polymerization face shaped three dimensional nanometer direct write system of processing out.
As shown in Fig. 2, the flow chart of the multiphoton polymerization face shaped three dimensional nanometer direct write processing method for the present embodiment.
Multiphoton polymerization face shaped three dimensional nanometer direct write processing method that the present embodiment is proposed the following steps are included:
S1: initialization system parameter imports processing model to controller, and controller is obtained accordingly by analyzing processing model
Machining path and control signal；
S2: controller sends control signal to laser 1, and laser 1 adjusts the focus and height of optical path according to control signal
Degree；Controller sends control signal to pendulum mirror 3, and pendulum mirror 3 adjusts initial deflection angle according to control signal；
S3: light-sensitive material to be processed is placed on macro/micromotion platform 4；
S4: starting laser 1, the laser that laser 1 is emitted obtain multi beam parallel laser by spectroscope 2, by putting mirror 3
Change the launching position of multi beam parallel laser, multi beam parallel laser projects on light-sensitive material；In process, mirror 3 is put not
It is completely cured according to control signal adjustment deflection angle, macro/micromotion platform 4 constantly makees macro/micromotion according to control signal, while will be macro micro-
4 binding model Model Reference Adaptive Control algorithm of motion platform feeds back its location information into controller, controller according to it is anti-
The location information of feedback and the machining path analyzed are adjusted control signal；
S5: after completing processing, controller issues stop signal, laser to laser 1, pendulum mirror 3, macro/micromotion platform 4
1, mirror 3 is put, macro/micromotion platform 4 stops operating, the then light-sensitive material observation imaging by electron microscope to processing is completed
Quality, i.e. the three-dimensional manometer direct write processing of completion light-sensitive material.
The same or similar label correspond to the same or similar components；
The terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent；
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (5)
1. a kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing, it is characterised in that: including the laser set gradually
Device (1), optical splitter (2), pendulum mirror (3), macro/micromotion platform (4), and analyze to obtain phase for the processing model according to importing
The machining area path answered sends the controller of control signal to laser, pendulum mirror, macro/micromotion platform respectively, wherein described swash
For light device (1) according to the focus and height of control signal adjustment optical path, the pendulum mirror (3) carries out beat according to control signal, described
Macro/micromotion platform (4) carries out macro micro- compound motion according to control signal；The incident laser that the laser (1) issues passes through institute
Multi beam parallel laser is obtained after stating optical splitter (2), the multi beam parallel laser projects after overswing mirror (3) and is placed with photosensitive material
The macro/micromotion platform (4) of material, the macro/micromotion platform (4) carry out macro micro- compound motion according to the control signal, and will
The location information of the macro/micromotion platform (4) is fed back to controller.
2. shaped three dimensional nanometer direct write system of processing in multiphoton polymerization face according to claim 1, it is characterised in that: described
Optical splitter (2) is cylindrical micro-lens array.
3. shaped three dimensional nanometer direct write system of processing in multiphoton polymerization face according to claim 1, it is characterised in that: described
Macro/micromotion platform (4) is the macro micro- composite motion platform of X-Y-Z, and the macro/micromotion platform (4) includes successively setting from bottom to up
Macro micro- compound motion equipment support platform (44), the macro micro- composite motion platform Y-axis inching gear (43), macro micro- compound motion set
Platform X-axis inching gear (42), macro micro- composite motion platform Z axis inching gear (41).
4. shaped three dimensional nanometer direct write system of processing in multiphoton polymerization face according to claim 1, it is characterised in that: described
Macro/micromotion platform (4) is fed back the location information of the macro/micromotion platform (4) using model reference self-adapting control algorithm
To controller.
5. a kind of multiphoton polymerization face shaped three dimensional nanometer direct write processing method, described in any item more using Claims 1 to 4
Photon polymerize face shaped three dimensional nanometer direct write system of processing, which comprises the following steps:
S1: initialization system parameter imports processing model to controller, and controller obtains adding accordingly by analyzing processing model
Work path and control signal；
S2: controller sends control signal to laser (1), and laser (1) adjusts the focus and height of optical path according to control signal
Degree；Controller sends control signal to pendulum mirror (3), and pendulum mirror (3) adjusts initial deflection angle according to control signal；
S3: light-sensitive material to be processed is placed on macro/micromotion platform (4)；
S4: the laser of starting laser (1), laser (1) outgoing obtains multi beam parallel laser by spectroscope (2), passes through pendulum
Mirror (3) changes the launching position of multi beam parallel laser, and multi beam parallel laser projects on light-sensitive material；In process, it puts
Mirror (3) constantly adjusts deflection angle according to control signal, and macro/micromotion platform (4) constantly makees macro/micromotion according to control signal,
The location information of macro/micromotion platform (4) is fed back into controller simultaneously, controller according to the location information fed back and
The machining path analyzed is adjusted control signal；
S5: after completing processing, controller issues stop signal, laser to laser (1), pendulum mirror (3), macro/micromotion platform (4)
Device (1), pendulum mirror (3), macro/micromotion platform (4) stop operating, then by electron microscope to the light-sensitive material for completing processing
Observe image quality.
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| CN201910673003.4A CN110449743A (en) | 2019-07-24 | 2019-07-24 | A kind of multiphoton polymerization face shaped three dimensional nanometer direct write system of processing and method |
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| CN106583930A (en) * | 2016-12-07 | 2017-04-26 | 合肥工业大学 | Method for achieving reversible wettability of titanium sheet based on femtosecond laser direct writing |
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| CN102621823A (en) * | 2012-04-17 | 2012-08-01 | 中国科学院上海光学精密机械研究所 | Multi-beam parallel laser direct writing device and method |
| CN103706946A (en) * | 2013-12-03 | 2014-04-09 | 张立国 | Laser splitting galvanometer scanning and processing device |
| CN103995394A (en) * | 2014-03-19 | 2014-08-20 | 南开大学 | Micro-nano region liquid crystal alignment method and system based on laser direct-writing |
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| CN106583930A (en) * | 2016-12-07 | 2017-04-26 | 合肥工业大学 | Method for achieving reversible wettability of titanium sheet based on femtosecond laser direct writing |
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Application publication date: 20191115 |
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| RJ01 | Rejection of invention patent application after publication |