CN110446368A - Bonding structure, bonding method and the Package boxes comprising the bonding structure - Google Patents
Bonding structure, bonding method and the Package boxes comprising the bonding structure Download PDFInfo
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- CN110446368A CN110446368A CN201910669800.5A CN201910669800A CN110446368A CN 110446368 A CN110446368 A CN 110446368A CN 201910669800 A CN201910669800 A CN 201910669800A CN 110446368 A CN110446368 A CN 110446368A
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- pcb board
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- aperture
- quantum chip
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- 238000000034 method Methods 0.000 title claims abstract description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000009434 installation Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims description 20
- 230000035515 penetration Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
Abstract
A kind of bonding structure, bonding method and the Package boxes comprising the bonding structure, bonding structure, comprising: quantum chip；Pcb board is provided with aperture on the pcb board, the length and width size or diameter dimension of the aperture are less than the correspondingly-sized of quantum chip for being bonded with the quantum chip；Wherein, the quantum chip is located at below the aperture of the pcb board and contacts with the pcb board, and by aperture exposure, second part upper surface is blocked by the pcb board of verge of opening for the first part upper surface of the quantum chip.The size of aperture is less than the size of quantum chip, quantum chip is allowed to carry out additional contact with pcb board from the pcb board back side, the region of the two contact can be used for being grounded or signal connection, effectively save the positive layout area of pcb board, whole bond strength is improved simultaneously, and avoid it is existing be put into chip from pcb board front, it is insecure in conjunction with sample box base and thermally contact bad phenomenon with pedestal that when installation, is easy to appear chip.
Description
Technical field
The disclosure belongs to quantum chip encapsulation technology field, is related to a kind of bonding structure, bonding method and comprising the bonding
The Package boxes of structure, especially one kind can be used for bonding structure and its bonding side under pole low temperature environment (being, for example, less than 10mK)
Method, and the Package boxes comprising the bonding structure.
Background technique
In the implementation that Superconducting Quantum calculates, it is indispensable that quantum processor is attached with peripheral circuit
One step.Superconducting Quantum Processor Package boxes are the first stage arrangements being attached with quantum processor.How by superconduction
All kinds of performance pins of quantum processor are attached, are fanned out to, and guarantee that signal performance on route is done in reduction small as far as possible
Disturb the design challenges for just becoming industry.
In order to realize control signal and read the input and output of signal, usually by quantum chip by way of wire bonding
It is connected on pcb board, and transfers to be connected with peripheral circuit by pcb board.
Problem is that quantum chip is put into packaged sample box by existing installation method from top to bottom, is placed in pcb board
On, and by being glued on pcb board, it is easy to appear bonding out-of-flatness, unstable phenomenon may cause quantum chip and water occurs
Prosposition is moved, vibrates and is thermally contacted with pedestal bad.
Also, during quantum chip low temperature near from room temperature, it may occur that expand with heat and contract with cold, may cause contact not
It is good, thus optimize connection type be very it is necessary to.
Summary of the invention
(1) technical problems to be solved
Present disclose provides a kind of bonding structure, bonding method and comprising the Package boxes of the bonding structure, at least portion
Decompose technical problem certainly set forth above.
(2) technical solution
According to one aspect of the disclosure, a kind of bonding structure is provided, comprising: quantum chip；Pcb board is used for and this
Quantum chip is bonded, and is provided with aperture on the pcb board, and the length and width size or radial dimension of the aperture are less than quantum core
The correspondingly-sized of piece；Wherein, the quantum chip is located at below the aperture of the pcb board and contacts with the pcb board, the amount
By aperture exposure, second part upper surface is blocked by the pcb board of verge of opening for the first part upper surface of sub- chip.
In some embodiments of the present disclosure, the second chip is provided on the second part upper surface of the quantum chip and is connect
Contact or contact surface, the corresponding position in pcb board lower surface is also equipped with second circuit board contact point or contact surface, so that quantum
Chip second chip contact or contact surface and the second circuit board contact point or contact surface electrical property after being contacted with pcb board
Connection.
In some embodiments of the present disclosure, the first chip is provided on the first part upper surface of the quantum chip and is connect
Contact or contact surface are provided with first circuit board contact point or contact surface, the first chip contact on the pcb board upper surface
Point or contact surface and the first circuit board contact point or contact surface are electrically connected.
In some embodiments of the present disclosure, second chip contact or contact surface and the second circuit board are contacted
Point or contact surface are for ground connection and/or signal wire connection, first chip contact or contact surface and the first circuit board
Contact point or contact surface are for ground connection and/or signal wire connection, so that signal interconnects between quantum chip and pcb board.
A kind of bonding method another aspect of the present disclosure provides, comprising: prepare a quantum chip；Prepare PCB
Plate is provided with aperture on the pcb board, and the length and width size or radial dimension of the aperture are less than the correspondingly-sized of quantum chip；It will
The quantum chip is installed from the back side of the pcb board, installation to be located at the pcb board aperture below and with it is described
Pcb board contact；So that the first part upper surface of the quantum chip is by aperture exposure, second part upper surface is by aperture
The pcb board at edge blocks.
In some embodiments of the present disclosure, the step of the quantum chip is installed from the back side of the pcb board
In further include: alignment function is carried out, by the second chip contact of the quantum chip or contact surface and the second of the pcb board
Circuit board contact pad or contact surface alignment, then according to the position of alignment by quantum chip from the back side of the pcb board install to
It is contacted below the aperture of the pcb board and with the pcb board.
In some embodiments of the present disclosure, the quantum chip is installed from the back side of the pcb board, installation is extremely
After the step of contacting below the aperture of the pcb board and with the pcb board further include: the first of the quantum chip
Lead is carried out between chip contact or contact surface and the first circuit board contact point or contact surface of the pcb board, so that quantum
Signal interconnects between chip and pcb board.
According to the another aspect of the disclosure, a kind of Package boxes are provided, any bonding referred to comprising the disclosure
Structure.
In some embodiments of the present disclosure, Package boxes, further includes: pedestal is provided with the second aperture, and described
The size setting of two apertures can accommodate the quantum chip and pass through；Top cover is oppositely arranged with the pedestal；And sealing cover, with
The sealing of the second aperture is realized in the second aperture cooperation.
In some embodiments of the present disclosure, boss is provided on the pedestal, second aperture runs through the boss,
It is arranged fluted on the top cover, the depth of the groove is greater than the height of projection of the boss, the pedestal and the top cover shape
At an accommodating space, the accommodating space is for placing the bonding structure.
In some embodiments of the present disclosure, the depth of penetration of second aperture is equal to height and the institute of the sealing cover
State the sum of quantum chip thickness, the carrying support that the sealing cover is installed as quantum chip.
(3) beneficial effect
It can be seen from the above technical proposal that the disclosure provide bonding structure, bonding method and include the bonding structure
Package boxes, have the advantages that
1, by the way that aperture is arranged on pcb board, the length and width size or radial dimension of the aperture are less than pair of quantum chip
Answer size that quantum chip is allowed to carry out additional contact with pcb board from the pcb board back side, the region of the two contact can be used for
Ground connection or signal connection, effectively save the positive layout area of pcb board, while improving whole bond strength, and keep away
Exempted from it is existing be put into chip from pcb board front, when installation be easy to appear chip it is insecure in conjunction with sample box base and and
Pedestal thermally contacts bad phenomenon.
2, in one embodiment, pass through the pcb board lower surface in the second part upper surface of quantum chip and corresponding position
Corresponding contact point or contact surface are set, the contact point being oppositely arranged or contact surface are connected for carrying out ground connection or signal wire,
The area being effectively utilized below pcb board also effectively realizes part while realizing pcb board and the contact of quantum chip and fastening
Route is electrically connected, while also eliminating the area that above-mentioned part route is arranged above pcb board, improves space utilization
Rate.
3, it can be installed the cap on pedestal as chip in the way of the mounting bonding of the back side in Package boxes
Carrying support quantum chip and base are made by the power that fit sealing lid generates by quantum chip support to after pcb board rear-face contact
Seat and pcb board fit closely, and are able to maintain good contact always during being down to low temperature from room temperature, make chip installation more
Securely, and the heat dissipation performance of chip is improved.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the bonding structure according to shown in one embodiment of the disclosure.
Fig. 2 is the front plan view of the bonding structure according to shown in one embodiment of the disclosure.
Fig. 3 is the back side top view of the bonding structure according to shown in one embodiment of the disclosure.
Fig. 4 is point during the quantum chip according to shown in one embodiment of the disclosure is installed on pcb board from bottom to top
Solution structure schematic diagram.
Fig. 5 is the decomposition texture signal of the Package boxes according to shown in one embodiment of the disclosure comprising the bonding structure
Figure.
[symbol description]
1-PCB plate；
11- aperture；
2- quantum chip；
21- first part upper surface；22- second part upper surface；
23- chip frame；
The behind 3- contact area；
The first chip contact of 41- or contact surface；The second chip contact of 42- or contact surface；
51- first circuit board contact point or contact surface；
52- second circuit board contact point or contact surface；
6- pedestal；
The second aperture of 61-；62- second boss；
7- top cover；
71- observation window.
Specific embodiment
The mode that existing quantum chip is bonded with pcb board is usually the front installation quantum chip from pcb board,
Pcb board is one piece of complete plank, and quantum chip is placed on pcb board and is fixed, and fixed mode is, for example, gluing, and is led to
It crosses gluing and is fixed on pcb board and be easy to appear bonding out-of-flatness, unstable phenomenon may cause quantum chip and horizontal position occurs
Move, vibration and it is bad with pedestal thermo-contact the problems such as, especially at low temperature, being originally bonded firm quantum chip may be due to
Expanding with heat and contract with cold leads to the poor contact between pcb board, to influence signal output quality.
The disclosure proposes a kind of bonding structure, bonding method and the Package boxes comprising the bonding structure, by pcb board
Upper setting aperture, the correspondingly-sized that the length and width size or radial dimension of the aperture are less than quantum chip make quantum chip can
To carry out additional contact with pcb board from the pcb board back side, the region of the two contact can be used for being grounded or signal connection, has
Effect saves the positive layout area of pcb board, while improving whole bond strength, avoids and existing puts from pcb board front
Enter chip, it is insecure in conjunction with sample box base and thermally contact bad phenomenon with pedestal that when installation is easy to appear chip.In
The carrying support that can be installed the cap on pedestal as chip in the way of the mounting bonding of the back side in Package boxes, will measure
Sub- chip support keeps quantum chip and pedestal and pcb board close to after pcb board rear-face contact by the power that fit sealing lid generates
Fitting, is able to maintain good contact always during being down to low temperature from room temperature, is more firmly mounted chip, and improve
The heat dissipation performance of chip.
For the purposes, technical schemes and advantages of the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
First embodiment
In first exemplary embodiment of the disclosure, a kind of bonding structure is provided.
Fig. 1 is the schematic diagram of the section structure of the bonding structure according to shown in one embodiment of the disclosure.Fig. 2 is according to the disclosure
The front plan view of bonding structure shown in one embodiment.Fig. 3 is the back of the bonding structure according to shown in one embodiment of the disclosure
Face top view.With the behind contact area 3 between thicker black lines signal quantum chip 2 and pcb board in Fig. 3.
Referring to Fig.1 shown in-Fig. 3, the bonding structure of the disclosure, comprising: quantum chip 2；Pcb board 1 is used for and the quantum core
Piece 2 is bonded, and is provided with aperture 11 on the pcb board 1, and the length and width size or radial dimension of the aperture 11 are less than quantum core
The correspondingly-sized of piece 2；Wherein, the quantum chip 2 is located at 11 lower section of aperture of the pcb board 1 and contacts with the pcb board 1,
The first part upper surface 21 of the quantum chip 2 is by the aperture 11 exposure, and second part upper surface 22 is by verge of opening
Pcb board 1 blocks.
In exemplary size range, for example, the length of the aperture, width or radial dimension are that quantum chip corresponds to ruler
Very little 60%-98%, for example, 70%, preferably, ratio is 75%-95%；Further preferably, ratio 85%-90%.
In the present embodiment, be square with quantum chip 2, the aperture 11 of pcb board 1 is also square carry out example, then
The size of the aperture 11 is less than the meaning of the size of quantum chip 2 are as follows: the side length of aperture 11 is less than the side length of quantum chip 2；In
In other embodiments, the shape of quantum chip 2 can be rectangle, polygon, circle, ellipse or other shapes, aperture 11
Shape can be identical as the shape of quantum chip, then the size of corresponding aperture is less than the meaning of the size of quantum chip are as follows:
Length, width or the radial dimension (including long axis, short axle, the diameter of a circle in ellipse) of aperture are less than the length of quantum chip
Degree, width or radial dimension；Certainly, the shape of aperture can also be different from the shape of quantum chip, for example, the shape of aperture 11
Shape is circle, and the shape of quantum chip 2 is rectangle, then the size of corresponding aperture is less than the meaning of the size of quantum chip are as follows:
The radial dimension of aperture is less than the length or width of quantum chip.In other words, the length of aperture, width or radial dimension are small
It is as follows in the meaning of the correspondingly-sized of quantum chip: the position of the quantum chip 2 aligned apertures 11 from below is placed in patch
Nearly 1 back side of pcb board, the size of the aperture 11 make the quantum chip 2 be stuck in the edge of aperture 11 and be able to close to pcb board 1
The back side and be unlikely to pass through from the aperture 11.
The chip frame 23 (being blocked, do not see, therefore illustrate with dotted line) of quantum chip 2 is illustrated with dotted line in Fig. 2,
And the bonding plane of first part upper surface 21 and corresponding pcb board that quantum chip 2 is exposed is illustrated, the bonding is flat
Face corresponds to the region being located in the middle between two solid box in Fig. 2, and solid line is corresponding in Fig. 2 overlooks visible parts for front,
Dotted line illustrates the component being blocked.The contact point or contact surface, use that signal connects are used for oval signal respectively with rectangle in Fig. 2
Contact point or contact surface in ground connection.Corresponding second chip contact positioned at second part upper surface and pcb board lower surface
Or contact surface 42 and second circuit board contact point or contact surface 52 be due to being blocked and the two is in contact condition, in Fig. 2
In carry out while illustrating with the dashed component of the same position.The signal of dotted line and solid line acts on identical, back side top view in Fig. 3
In, since the size of quantum chip 2 is greater than the size of aperture 11, it can be observed that the chip frame 23 of quantum chip 2, corresponding
Two frames that pcb board is bonded plane become dotted line；In Fig. 3, with the second part upper surface 22 of double-head arrow signal quantum chip 2
Area size.
Fig. 4 is point during the quantum chip according to shown in one embodiment of the disclosure is installed on pcb board from bottom to top
Solution structure schematic diagram.In Fig. 4, in order to protrude the second chip contact of the second part upper surface 22 for illustrating quantum chip or connect
The setting of contacting surface 42 illustrates the corresponding region of aperture in the form of projection, to define table in the first part of quantum chip
Face 21 and second part upper surface 22, simplify the structure of pcb board 1, the bonding plane of stepped form in non-schematic diagram 1
Outer wire.Certainly, corresponding to also has the setting of corresponding circuit board contact pad or contact surface, this field in pcb board lower surface
Technical staff is apparent that with Fig. 4 according to fig. 2, in order to achieve the purpose that drawing is clean and tidy, does not make to illustrate here.
In conjunction with shown in Fig. 2-Fig. 4, in the present embodiment, it is provided on the second part upper surface 22 of the quantum chip 2
Second chip contact or contact surface 42, the corresponding position in 1 lower surface of pcb board are also equipped with second circuit board contact point or connect
Contacting surface 52, so that quantum chip 2 second chip contact or contact surface 42 and second circuit after being contacted with pcb board 1
Plate contact point or contact surface 52 are electrically connected.
It is connect by the way that the second part upper surface 22 in quantum chip 2 is corresponding with 1 lower surface of the pcb board setting of corresponding position
Contact or contact surface, the contact point being oppositely arranged or contact surface are effectively utilized PCB for carrying out ground connection or signal wire connection
The area of 1 lower section of plate has carried out sharing for part route for the conventional layout type for carrying out wire bonding using front, has saved
Front wiring area and to efficiently solve the problems, such as that route concentrates on wiring caused by pcb board and quantum chip front side complicated,
The connection of part signal route is also effectively realized while realizing pcb board 1 and the contact of quantum chip 2 and fastening, while also being saved
The area of above-mentioned part signal route is but set above pcb board again, improves space utilization rate.
In conjunction with shown in Fig. 2-Fig. 4, in the present embodiment, it is provided on the first part upper surface 21 of the quantum chip 2
First chip contact or contact surface 41 are provided with first circuit board contact point or contact surface 51 on 1 upper surface of pcb board,
First chip contact or contact surface 41 and the first circuit board contact point or contact surface 51 are electrically connected.
Wherein, second chip contact or contact surface 42 and the second circuit board contact point or contact surface 52 are used for
Ground connection and/or signal wire connection, first chip contact or contact surface 41 and the first circuit board contact point or contact
Face 51 is for ground connection and/or signal wire connection, so that signal interconnects between quantum chip 2 and pcb board 1.
In the disclosure, electrical contact or the form of connection are not especially limited, can be set according to actual needs
It sets, the wiring for second part upper surface 22 and corresponding pcb board lower surface, can be the contact point only laid for ground connection
Or contact surface, or the contact point for signal wire connection or contact surface are only laid, it can also lay and connect for signal wire simultaneously
The signal contact point connect or contact surface.Wiring configuration for first part upper surface 21 and pcb board upper surface is also similarly, only
Want the overall routing of first part upper surface 21, second part upper surface 22 and pcb board upper and lower surface make quantum chip 2 with
Signal interconnection is realized between pcb board 1.
In one example, the second part upper surface 22 of quantum chip 2 is provided with die ground contact, it is corresponding in PCB
1 lower surface of plate is provided with circuit board ground contact, and the first part upper surface 21 of quantum chip 2 is provided with chip signal wire bonding
Point and earthing contact, are provided with circuit board signal wire bonding point and earthing contact in the bonding plane corresponding position of pcb board.It is preferred that
, in order to enable the distance of lead is shorter, the preferably chip contact or contact surface of quantum chip front side and the positive electricity of pcb board
Road plate contact point or contact surface alignment, the two is linear distance.
In the example, quantum chip and pcb board are realized by the connection of chip signal wire bonding point and circuit board signal solder joint
Between signal interconnection, in combination with quantum chip upper surface die ground contact and pcb board lower surface circuit board ground
The connection of contact, the bonding structure integrally have being bonded for good signal transmission performance and physics.
The bonding structure of the present embodiment on pcb board by being arranged aperture, the length and width size or radial dimension of the aperture
Correspondingly-sized less than quantum chip allows quantum chip to carry out additional contact with pcb board from the pcb board back side, is improving
Front wiring area is also saved while bond strength by way of being overleaf routed and reduces answering for front wiring
Miscellaneous degree, avoid it is existing be put into chip from pcb board front, it is insecure in conjunction with sample box base that when installation, is easy to appear chip
And bad phenomenon is thermally contacted with pedestal.In some be preferably provided with, pass through setting for corresponding signal wire solder joint and earthing contact
It sets, so that the bonding structure integrally has being bonded for good signal transmission performance and physics.
Second embodiment
In second exemplary embodiment of the disclosure, a kind of bonding method is provided.
In the present embodiment, which includes:
Step S21: prepare a quantum chip；
In the present embodiment, the shape of the quantum chip is square (top view), and size is meant that size dimension.In
In other embodiments, quantum chip is also possible to other shapes, for example, round, polygon or ellipse etc..
Step S22: prepare pcb board, be provided with aperture on the pcb board, the length and width size or radial dimension of the aperture are small
In the correspondingly-sized of quantum chip；
In the present embodiment, the aperture of pcb board corresponds to rectangle, it is of course also possible to be round, polygon or other shapes
Aperture, as long as meet the aperture length and width size or radial dimension be less than quantum chip correspondingly-sized, in other words,
The position of quantum chip aligned apertures from below is placed in close to the pcb board back side, the size of the aperture makes the amount
Sub- chip card is able to be unlikely to pass through from the aperture close to the pcb board back side at the edge of aperture.
Step S23: the quantum chip is installed from the back side of the pcb board, and installation is to positioned at the pcb board
It is contacted below aperture and with the pcb board；So that the first part upper surface of the quantum chip is exposed by the aperture, second
Portion of upper surface is blocked by the pcb board of verge of opening；
In the present embodiment, in the step of quantum chip is installed from the back side of the pcb board further include: carry out
Alignment function, by the second circuit board contact point of the second chip contact of the quantum chip or contact surface and the pcb board
Or contact surface alignment, then quantum chip is installed from the back side of the pcb board to positioned at the pcb board according to the position of alignment
Aperture below and contact with the pcb board.
In some embodiments of the present disclosure, the quantum chip is installed from the back side of the pcb board, installation is extremely
After the step of contacting below the aperture of the pcb board and with the pcb board further include:
Step S24: in the first chip contact of the quantum chip or the first circuit board of contact surface and the pcb board
Lead is carried out between contact point or contact surface, so that signal interconnects between quantum chip and pcb board；
Bonding method in the present embodiment, by back mounted form, so that the aperture on quantum chip alignment pcb board
It is bonded to the back side of pcb board, realizes the two contact point or contact surface (for being grounded in the place that quantum chip is contacted with pcb board
Or signal wire connection) connection, by front in quantum chip and the pcb board front corresponding contact point of progress lead realization or
The connection of contact surface (for be grounded or signal wire connects), integrally realizes the steady of good signal transmission performance and physics
It is solidly connected.
3rd embodiment
In the third exemplary embodiment of the disclosure, a kind of Package boxes are provided, are appointed comprising what the disclosure referred to
A kind of bonding structure.
Fig. 5 is the decomposition texture signal of the Package boxes according to shown in one embodiment of the disclosure comprising the bonding structure
Figure.
In the present embodiment, the Package boxes, further includes: pedestal 6 is provided with the second aperture 61, second aperture
61 size setting can accommodate the quantum chip 2 and pass through；Top cover 7 is oppositely arranged with the pedestal 6；And sealing cover is (in figure
Do not illustrate), the sealing for realizing the second aperture 61 is cooperated with second aperture 61.
In the present embodiment, pedestal 6 is complementary with the one side shape that top cover 7 is opposite, and seal cap sealing is in second aperture 61
In, pedestal 6, top cover 7 and sealing cover form external sealing and the internal Package boxes with accommodating space.
In an example of the disclosure, boss 62 is provided on the pedestal 6, second aperture 61 runs through the boss
62, it is arranged fluted (visual angle is blocked in Fig. 5) on the top cover 7, the depth of the groove is greater than the height of projection of the boss,
The pedestal and the top cover form an accommodating space, and the accommodating space is for placing the bonding structure.
In the present embodiment, the shape of the second aperture 61 is in step-like, for example, " convex " shape.The side of step can be vertically
, it is also possible to inclined, the case where side of corresponding step is inclination, preferably step is tilted towards direction in the inner part, is kept away
Exempt from light leakage, helps to realize better seal effect and signal transmission.
In a preferred embodiment, height of the depth of penetration of second aperture equal to the sealing cover and the quantum
The sum of chip thickness, the carrying support that the sealing cover is installed as quantum chip, bore size (length and width or the diameter of pcb board
Or the corresponding size of other shapes) it is slightly less than the correspondingly-sized of quantum chip, Package boxes are packed into pcb board and complete connector
Welding after, can be described to being located at along the second aperture support from the back side of pcb board by quantum chip based on the sealing cover
It the lower section of pcb board and is contacted with the pcb board, so that the first part upper surface of the quantum chip is by aperture exposure,
Second part upper surface is blocked by the pcb board of verge of opening, then carries out subsequent wire bonding step.
In the present embodiment, as shown in figure 5, observation window 71 is additionally provided on the top cover 7 of Package boxes, convenient for observation quantum
The state of chip.It should be noted that in other embodiments, the top cover of the Package boxes can also be free of observation window or tool
There are other settings.
In the present embodiment, can be by the cap on pedestal in the way of the mounting bonding of the back side in Package boxes
Made by quantum chip support to after pcb board rear-face contact by the power that fit sealing lid generates as the carrying support of chip installation
Quantum chip is fitted closely with pedestal and pcb board, in the process for being down to low temperature (or even extremely low temperature, close to absolute zero) from room temperature
In be able to maintain good contact always, be more firmly mounted chip, and improve the heat dissipation performance of chip.
In conclusion present disclose provides a kind of bonding structure, bonding method and comprising the Package boxes of the bonding structure,
By the way that aperture is arranged on pcb board, the length and width size or radial dimension of the aperture are less than the correspondingly-sized of quantum chip, make
Additional contact can be carried out from the pcb board back side with pcb board by obtaining quantum chip, also by carrying on the back while improving bond strength
Face wiring form save front wiring area and reduce front wiring complexity, avoid it is existing from pcb board just
Face is put into chip, and it is insecure in conjunction with sample box base and thermally contact with pedestal undesirable existing that when installation is easy to appear chip
As.By the second part upper surface contact point corresponding with the setting of the pcb board lower surface of corresponding position in quantum chip or connect
Contacting surface, the contact point being oppositely arranged or contact surface are effectively utilized below pcb board for carrying out ground connection or signal wire connection
Area also effectively realizes being electrically connected for part route while realizing pcb board and the contact of quantum chip and fastening, simultaneously also
The area that above-mentioned part route is set above pcb board is eliminated, space utilization rate is improved.The back side is utilized in Package boxes
The carrying support that the mode of mounting bonding can install the cap on pedestal as chip, by quantum chip support to and pcb board
After rear-face contact, quantum chip is fitted closely with pedestal and pcb board by the power that fit sealing lid generates, is down to from room temperature
Always it is able to maintain good contact during low temperature, is more firmly mounted chip, and improves the heat dissipation performance of chip.
It should be noted that the direction term mentioned in embodiment, such as "upper", "lower", "front", "rear", "left", "right"
Deng being only the direction with reference to attached drawing, not be used to limit the protection scope of the disclosure.Through attached drawing, identical element is by identical
Or similar appended drawing reference indicates.When may cause understanding of this disclosure and cause to obscure, conventional structure or structure will be omitted
It makes.
And the shape and size of each component do not reflect actual size and ratio in figure, and only illustrate the embodiment of the present disclosure
Content.In addition, in the claims, any reference symbol between parentheses should not be configured to the limit to claim
System.
The word of ordinal number such as " first ", " second ", " third " etc. used in specification and claim, with modification
Corresponding element, itself is not meant to that the element has any ordinal number, does not also represent the suitable of a certain element and another element
Sequence in sequence or manufacturing method, the use of those ordinal numbers are only used to enable an element and another tool with certain name
Clear differentiation can be made by having the element of identical name.
Furthermore word "comprising" or " comprising " do not exclude the presence of element or step not listed in the claims.Positioned at member
Word "a" or "an" before part does not exclude the presence of multiple such elements.Unless there are technology barrier or contradiction, this public affairs
The above-mentioned various embodiments opened can be freely combined to form other embodiment, these other embodiments are in the disclosure
Protection scope in.
Particular embodiments described above has carried out further in detail the purpose of the disclosure, technical scheme and beneficial effects
Describe in detail it is bright, it is all it should be understood that be not limited to the disclosure the foregoing is merely the specific embodiment of the disclosure
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. a kind of bonding structure characterized by comprising
Quantum chip；
Pcb board is provided with aperture on the pcb board for being bonded with the quantum chip, the length and width size of the aperture or
Radial dimension is less than the correspondingly-sized of quantum chip；
Wherein, the quantum chip is located at below the aperture of the pcb board and contacts with the pcb board, the quantum chip
By aperture exposure, second part upper surface is blocked by the pcb board of verge of opening for first part upper surface.
2. bonding structure according to claim 1, which is characterized in that set on the second part upper surface of the quantum chip
Be equipped with the second chip contact or contact surface, the corresponding position in pcb board lower surface be also equipped with second circuit board contact point or
Contact surface so that quantum chip after being contacted with pcb board second chip contact or contact surface connect with the second circuit board
Contact or contact surface are electrically connected.
3. bonding structure according to claim 1, which is characterized in that set on the first part upper surface of the quantum chip
It is equipped with the first chip contact or contact surface, first circuit board contact point or contact surface, institute are provided on the pcb board upper surface
It states the first chip contact or contact surface and the first circuit board contact point or contact surface is electrically connected.
4. bonding structure according to claim 2 or 3, which is characterized in that second chip contact or contact surface and
The second circuit board contact point or contact surface are for ground connection and/or signal wire connection, first chip contact or contact
Face is connected with the first circuit board contact point or contact surface for ground connection and/or signal wire, so that quantum chip and pcb board
Between signal interconnection.
5. a kind of bonding method characterized by comprising
Prepare a quantum chip；
Prepare pcb board, be provided with aperture on the pcb board, the length and width size or radial dimension of the aperture are less than quantum chip
Correspondingly-sized；
The quantum chip is installed from the back side of the pcb board, installation to be located at the pcb board aperture below and with
The pcb board contact；So that the first part upper surface of the quantum chip passes through aperture exposure, second part upper surface quilt
The pcb board of verge of opening blocks.
6. bonding method according to claim 5, which is characterized in that by the quantum chip from the back side of the pcb board
In the step of being installed further include:
Alignment function is carried out, by the second chip contact of the quantum chip or the second circuit of contact surface and the pcb board
Then plate contact point or contact surface alignment install quantum chip to being located at from the back side of the pcb board according to the position of alignment
It is contacted below the aperture of the pcb board and with the pcb board.
7. bonding method according to claim 6, which is characterized in that by the quantum chip from the back side of the pcb board
After the step of being installed, being contacted below installation to the aperture for being located at the pcb board and with the pcb board further include:
In the first chip contact of the quantum chip or contact surface and the first circuit board contact point of the pcb board or contact
Lead is carried out between face, so that signal interconnects between quantum chip and pcb board.
8. a kind of Package boxes, which is characterized in that include bonding structure described in any one of Claims 1-4.
9. Package boxes according to claim 8, which is characterized in that further include:
Pedestal, is provided with the second aperture, and the size setting of second aperture can accommodate the quantum chip and pass through；
Top cover is oppositely arranged with the pedestal；And
Sealing cover cooperates the sealing for realizing the second aperture with second aperture；
Optionally, boss is provided on the pedestal, second aperture runs through the boss, is provided on the top cover recessed
Slot, the depth of the groove are greater than the height of projection of the boss, and the pedestal and the top cover form an accommodating space, the accommodating
Space is for placing the bonding structure.
10. Package boxes according to claim 8 or claim 9, which is characterized in that the depth of penetration of second aperture is equal to institute
State the height and the sum of the quantum chip thickness of sealing cover, the carrying support that the sealing cover is installed as quantum chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669800.5A CN110446368A (en) | 2019-07-23 | 2019-07-23 | Bonding structure, bonding method and the Package boxes comprising the bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669800.5A CN110446368A (en) | 2019-07-23 | 2019-07-23 | Bonding structure, bonding method and the Package boxes comprising the bonding structure |
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| CN110446368A true CN110446368A (en) | 2019-11-12 |
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| CN201910669800.5A Pending CN110446368A (en) | 2019-07-23 | 2019-07-23 | Bonding structure, bonding method and the Package boxes comprising the bonding structure |
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