JPH10335566A - Resin-sealed semiconductor device and circuit member used therein, and manufacture of resin-sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase a chip area in a semiconductor-device package size, to reduce the device size, and to reduce packaging area on a circuit substrate, by mounting the semiconductor device on a die pad electrically isolated from terminal parts. SOLUTION: A semiconductor device 110 is mounted on a die pad 120, with a surface opposite to a terminal 111 side surface faced down, via a die attach member 115, and attached to the die pad 120. The terminal 111 of the semiconductor device 110 and an inner terminal 132 of a terminal part 130 are electrically connected via a wire 140. Further, a part of an external terminal 134 of the terminal part 130 is exposed, and the entire device is sealed with resin 150. The internal terminal 132 for electrical connection with the terminal 111 of the semiconductor device 110 and the external terminal 134 for connection to an external circuit are integrally provided in correspondence with each other, on both surfaces of the terminal part 130. A plurality of terminal parts 130 are two-dimensionally provided within approximately one plane, electrically isolated from each other. By this arrangement, the chip area can be increased, and the size of the semiconductor device can be reduced, further, the packaging area on the circuit substrate can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-encapsulated semiconductor device (plastic package) on which a semiconductor element is mounted, and more particularly to a semiconductor device capable of responding to a reduction in package size and improving its mountability. The present invention relates to an apparatus and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, due to the progress of high integration and miniaturization technologies and the tendency of electronic devices to have higher performance and lighter, thinner and smaller size (current trend), semiconductor devices have been represented by LSI ASICs.
It is becoming more and more highly integrated and highly functional. Accordingly, the development trend of the encapsulated semiconductor device using the lead frame is also based on SOJ (Small).
Outline J-Leaded Package)
Through a surface mount type package such as QFP (Quad Flat Package) or TSOP (Thick Flat Package).
n Small Outline Package) to reduce the size of the package, with the main axis being thinner, and to improve chip storage efficiency by making the package three-dimensional, LOC (Lead On Chip)
Structure. However, the resin-encapsulated semiconductor device package is required to have higher integration, higher functionality, more pins, thinner, and smaller size. This has led to a limitation in miniaturization of packages. Further, in a small package such as TSOP, there is a limit to the number of pins due to lead routing and pin pitch.

[0003]

As described above, further high integration and high functionality of the resin-encapsulated semiconductor device are required, and the number of pins of the resin-encapsulated semiconductor device package is increased. Thinning and miniaturization are required. Under such circumstances, the present invention can increase the occupancy of the chip in the package size of the semiconductor device, reduce the size of the semiconductor device, and reduce the mounting area on the circuit board. It is an object of the present invention to provide a resin-sealed semiconductor device capable of improving the density. At the same time, it is intended to further increase the number of pins, which has been difficult for a small package such as a conventional TSOP.

[0004]

According to the present invention, there is provided a resin-encapsulated semiconductor device having an internal terminal portion, which is externally processed by etching and electrically connected to a terminal of a semiconductor element, and a connection terminal to an external circuit. A plurality of externally provided terminal portions are integrally provided so as to face each other on the front and back sides, and a plurality of terminal portions are two-dimensionally arranged substantially in a plane, each of which is electrically independent of each other, and A resin-sealed semiconductor device in which an internal terminal and a terminal of a semiconductor element are electrically connected by a wire, and a part of the external terminal of the terminal portion is exposed to the outside and resin-sealed; A resin-encapsulated semiconductor device in which an external electrode made of solder for mounting on a circuit board or the like is provided on a surface of an external terminal portion exposed to the outside of a terminal portion of the device, wherein the semiconductor element has a terminal portion. And mounted on an electrically independent die pad Is characterized in that the at it. In the above, a part of the die pad is exposed to the outside. Also,
In the resin-encapsulated semiconductor device of the present invention, the inner and outer terminals for electrical connection to the terminals of the semiconductor element and the outer terminals for connection to an external circuit are processed by etching. A plurality of terminal portions integrally provided so as to be opposed to each other are arranged two-dimensionally in a substantially one plane, each of which is electrically independent from each other, and the internal terminal of the terminal portion and the terminal of the semiconductor element are connected to each other. A resin-sealed semiconductor device that is electrically connected by a wire and partially sealed to the outside by exposing a part of the external terminal of the terminal portion to the outside, or the terminal portion of the resin-sealed semiconductor device is exposed to the outside. A resin-encapsulated semiconductor device provided with external electrodes made of solder for mounting on a circuit board or the like on the surface of the external terminal portion, wherein each terminal extends along a plane on which the terminal portion is two-dimensionally arranged. The parts are electrically independent,
A lead integrally connected to the terminal portion is provided, and the semiconductor element is mounted on the lead. In the above-mentioned semiconductor device, the terminals of the semiconductor element are arranged along a substantially central line of a pair of sides of the terminal surface of the semiconductor element, and the terminal portion is provided on each of the pair of sides facing each other so as to sandwich the center line. , And are provided respectively.

In the circuit member of the present invention, the inner and outer terminals for electrical connection to the terminals of the semiconductor element and the outer terminals for connection to the external circuit are processed by etching. A plurality of terminal portions provided integrally so as to be opposed to each other are arranged in a substantially one plane independently of each other, and each terminal portion is connected to an outer frame portion holding the whole via a connection lead. It is characterized by being integrally connected. In the above, there is provided a die pad, wherein the die pad is integrally connected to an outer frame portion which holds the whole through a connection lead, and one surface of the die pad is connected to an external terminal. The surface of the portion is provided on the same one plane.
The circuit member does not have a die pad, and is provided with a lead for mounting a semiconductor element different from the connection lead, which is integrally connected to each terminal.

According to the method of manufacturing a resin-encapsulated semiconductor device of the present invention, an external terminal for electrically connecting to a terminal of a semiconductor element and an external terminal for connection to an external circuit are formed by etching. A plurality of terminal portions are provided two-dimensionally and substantially electrically independent of each other in a substantially one plane so that the terminal portions and the front and rear surfaces thereof are integrally provided. A method of manufacturing a resin-sealed semiconductor device in which the terminals of the element are electrically connected by wires, and a part of the external terminals of the terminal portion is exposed to the outside, and the whole is resin-sealed.
Alternatively, a method of manufacturing a resin-encapsulated semiconductor device in which external terminals made of solder for mounting on a circuit board or the like are provided on the surface of the external terminal portion exposed to the outside of the terminal portion of the resin-encapsulated semiconductor device At least (A) In the etching process, the internal terminal for electrically connecting to the terminal of the semiconductor element and the external terminal for connection to the external circuit are opposed to each other. A plurality of terminal parts provided integrally with each other are arranged two-dimensionally in a substantially one plane, independently of each other, and each terminal part is integrally connected to an outer frame part which holds the whole through connection leads. (B) a semiconductor element mounting step of mounting a semiconductor element, and (C) electrically connecting terminals of the semiconductor element and internal terminal portions of the circuit member by wires. A wire bonding step for connecting; (D A resin sealing step of exposing a part of the external terminal of the terminal part to the outside and sealing with a resin, and (E) an outer frame part separating and removing step of cutting each connection lead of the circuit member and removing the outer frame part. It is characterized by having. The circuit member described above has a die pad, and the die pad is integrally connected to an outer frame portion that holds the whole via connection leads, and the semiconductor element is die-attached in the semiconductor element mounting step. The die pad portion is mounted on a surface other than the terminal surface side by the agent, and the die pad of the circuit member is
One of the surfaces and the surface of the external terminal portion are provided on the same plane. Further, in the resin sealing step, resin sealing is performed so that a part of the die pad is exposed to the outside. Also, the circuit member does not have a die pad, and a lead for mounting a semiconductor element different from the connection lead is provided integrally connected to each terminal portion,
In addition, the semiconductor element is mounted on the lead by a die attach agent on a surface other than the terminal surface side.

[0007]

The resin-encapsulated semiconductor device of the present invention has the above-described structure, so that the occupancy of the chip in the semiconductor device package size is increased, and the semiconductor device can be made smaller. That is, the mounting area of the semiconductor device on the circuit board is reduced, and the mounting density on the circuit board can be improved. Also, the terminal section is two-dimensionally arranged in a plurality of rows,
By providing a plurality of rows, it is possible to further increase the number of pins, which has been difficult for a small package such as a conventional TSOP. By forming an external electrode portion integrally connected to an external terminal portion with a solder ball, a BGA (Ball) is formed.
(Grid Array) type. Specifically, an internal terminal portion that is externally processed by etching and electrically connected to a terminal of the semiconductor element,
External terminal portion and is two-dimensionally a plurality substantially in one plane a terminal part provided integrally so as to face its front and back for connection to an external circuit, electrically independently of each other, respectively A resin-sealed semiconductor device in which an internal terminal of the terminal portion and a terminal of the semiconductor element are electrically connected by a wire, and a part of the external terminal of the terminal portion is exposed to the outside and resin-sealed; or A resin-encapsulated semiconductor device in which terminal portions of the resin-encapsulated semiconductor device are provided with external electrodes made of solder for mounting on a circuit board or the like on a surface of the external terminal portion exposed to the outside, This is achieved because the semiconductor element is mounted on a die pad that is electrically independent of the terminal section. Also, the outer shape processed by etching,
The internal terminal portions for terminal and electrically connecting the semiconductor element, in substantially one plane a terminal part provided integrally as an external terminal portion for connection to an external circuit is relative to the front and back A plurality of two-dimensionally arranged, electrically independent of each other, and electrically connecting the internal terminal of the terminal portion and the terminal of the semiconductor element with a wire, and partially connecting the external terminal of the terminal portion. A resin-sealed semiconductor device that is exposed to the outside and sealed with a resin, or a solder for mounting on a circuit board or the like, on a surface of an external terminal portion exposed to the outside of a terminal portion of the resin-sealed semiconductor device. A resin-encapsulated semiconductor device provided with external electrodes consisting of:
This is achieved by providing a lead integrally connected to the terminal portion with each terminal portion being electrically independent, and the semiconductor element being mounted on the lead. When a semiconductor element is mounted on a die pad, good heat dissipation can be achieved by exposing a part of the die pad to the outside. Further, in the above, the terminals of the semiconductor element are arranged along a substantially central line of a pair of sides of the terminal surface of the semiconductor element, and the terminal portions extend along each of the pair of sides facing each other so as to sandwich the center line. , Each having a simple structure and a structure suitable for mass production.

The circuit member of the present invention, which has the above-described structure, enables the production of the above-mentioned resin-encapsulated semiconductor device. However, the circuit member is manufactured by the same etching process as that of a normal lead frame. be able to. In particular, when the circuit member has a die pad, and one surface of the die pad and the surface of the external terminal portion are provided on the same plane, the external terminal Is exposed to the outside, but at the same time, a part of the die pad is easily exposed to the outside.

In a method of manufacturing a resin-encapsulated semiconductor device according to the present invention, a semiconductor element is mounted on a circuit portion using the circuit member, and terminals of the semiconductor element and internal terminal portions of the circuit member are electrically connected by wires. It is a thing which removes the outer frame part by connecting, electrically exposing a part of the external terminal of the terminal part of the circuit member to the outside, sealing with resin, and further cutting each connection lead of the circuit member. The semiconductor device of the present invention can be downsized and a resin-encapsulated semiconductor device with good mountability can be manufactured.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin-sealed semiconductor device according to the present invention will be described with reference to the drawings. First, a first example of the resin-sealed semiconductor device of the present invention will be described. FIG. 1A is a schematic cross-sectional view of a first example of a resin-sealed semiconductor device of the present invention,
FIG. 1B is a perspective view in which the internal configuration is seen through,
FIG. 1C is a schematic cross-sectional view of the second example. FIG.
Among them, 100 and 100A are resin-sealed semiconductor devices, 110
Is a semiconductor element, 111 is a terminal (pad), 115 is a die attach material, 120 is a die pad, 130 is a terminal portion,
32 is an internal terminal portion, 134 is an external terminal portion, 134A is an exposed portion, 140 is a wire, 150 is a sealing resin, 160 is silver plating, and 170 is an external electrode made of solder. FIG.
The resin-encapsulated semiconductor device 100 of the first example shown in FIG. 1 is manufactured using a circuit member whose outer shape has been processed by etching described later.
On the side other than the first side, the semiconductor element 110 is bonded and mounted on the die pad 120 via the die attach material 115.
Terminal (pad) 111 and internal terminal 1 of terminal 130
32 are electrically connected to each other by a wire 140, a part of the external terminal 134 of the terminal portion 130 is exposed to the outside, and the whole is resin-sealed with a sealing resin 150. The terminal section 130 is a terminal (pad) 111 of the semiconductor element 110.
An internal terminal portion 132 for electrically connecting the external terminal portion and an external terminal portion 134 for connection to an external circuit are integrally provided so as to face each other, and a plurality of two-dimensionally arranged in substantially one plane are provided. And are individually electrically independent of each other. The resin-sealed semiconductor device 100 of the first example shown in FIG.
, The terminal (pad) 111 of the semiconductor element 110
Are arranged along a pair of sides of the terminal surface of the semiconductor element 110, and the terminal portions 130 are also provided outside the semiconductor element 110 along the pair of sides. And
The semiconductor device 100 shown in FIG.
0 is thinner than the thickness of the terminal portion 130, and one surface is formed along the surface 132A of the internal terminal 132, and the external terminal 134 side is recessed toward the internal terminal from the surface 134A of the external terminal 134. You are.

The semiconductor device 1 of the second example shown in FIG.
00A is the semiconductor device 10 of the first example shown in FIG.
The external electrode 170 made of solder is provided on the surface 134A of the external terminal portion exposed to the outside of the external terminal portion 1, and when mounted on a circuit board, the solder is melted and solidified to form the external terminal portion 1
34 is electrically connected to an external circuit.

The semiconductor device shown in FIGS. 2A and 2B is a modification of the semiconductor device 100 of the first example shown in FIG. 1A, and is a modification of the semiconductor device 100 shown in FIGS. The semiconductor device shown in d) is a modification of the semiconductor device 100A of the second example shown in FIG. The semiconductor device 100a shown in FIG.
In the semiconductor device 100 shown in FIG. 1A, the die pad 120 is formed to the thickness of the terminal portion 130. Then, the semiconductor device 100b shown in FIG.
In the semiconductor device 100 shown in FIG. 1A, the die pad 120 is made thinner than the thickness of the terminal portion 130, and one surface is formed along the surface 134A of the external terminal 134. It has a structure recessed from the surface of the terminal 132 toward the external terminal. The semiconductor device 100c shown in FIG. 2C is the same as the semiconductor device 1 shown in FIG.
At 00A, the die pad 120 is formed to have the thickness of the terminal portion 130, and the external electrode 170 made of solder is provided on the surface 134A of the external terminal 134. FIG.
A semiconductor device 100d shown in FIG. 1D has the same structure as that of the semiconductor device 100A shown in FIG.
The inner terminal 1 is formed along the surface 134A of
The side 32 has a structure recessed from the surface of the internal terminal 132 toward the external terminal.

Next, a third example of the resin-sealed semiconductor device of the present invention will be described. FIG. 3A is a schematic sectional view of a third example of the resin-encapsulated semiconductor device of the present invention, and FIG. 3B is a perspective view showing the internal configuration of the semiconductor device, and FIG. FIG. 9 is a schematic sectional view of a fourth example. 3, 200, 200
A is a resin-sealed semiconductor device, 210 is a semiconductor element, 21
1 is a terminal (pad), 215 is a die attach material, 225
Is a lead, 230 is a terminal, 232 is an internal terminal, 23
4 is an external terminal portion, 234A is an exposed portion, 240 is a wire,
Reference numeral 250 denotes a sealing resin, 260 denotes silver plating, and 270 denotes an external electrode made of solder. The semiconductor device 200 shown in FIG. 3A has the lead 22 integrally connected to the terminal 230.
5 is provided, and the semiconductor element 210 is mounted on the lead 225 via the die attach material 215, but is different from the semiconductor device 100 shown in FIG.

The semiconductor device 2 of the fourth example shown in FIG.
00A is the semiconductor device 20 of the third example shown in FIG.
An external electrode 270 made of solder is provided on the surface 234A of the external terminal portion exposed to the outside of the external terminal portion 270. When the external electrode portion 270 is mounted on a circuit board, the solder is melted and solidified to form the external terminal portion 2
34 is electrically connected to an external circuit.

The resin-encapsulated semiconductor device of the present invention is, as shown in FIGS. 1, 2 and 3, a package having a reduced area in which the package area does not largely differ from the area of the semiconductor element. However, about 1.0m in the thickness direction
m or less, and the thickness can be reduced at the same time. Also, in the examples shown in FIGS. 1, 2 and 3, the external terminals are arranged in two rows along the terminals (pads) of the semiconductor element, but the positions of the terminals of the semiconductor element are arranged along the four sides thereof. By arranging the terminals two-dimensionally and two-dimensionally arranging the terminal portions outside the semiconductor element along the four sides of the semiconductor element, it is possible to sufficiently cope with a further increase in the number of pins of the semiconductor element.

Next, a circuit member of the present invention will be described with reference to the drawings. The circuit member of the present invention, which is used for manufacturing the above-described semiconductor device of the present invention, is subjected to external processing by etching, and as shown in FIGS. 4 (a) and 4 (b), a semiconductor element. A plurality of terminal parts provided integrally with an internal terminal part for electrically connecting the terminal and an external terminal part for connection to an external circuit so as to face each other in a substantially plane. Are arranged independently of each other, and outside the respective terminal portions, the respective terminal portions or die pads are integrally connected via connection leads, and an outer frame portion for holding the whole is provided. The circuit member 300 shown in FIG. 4A is used for manufacturing the semiconductor devices of the first example shown in FIG. 1A and the second example shown in FIG. (A) shows a plan view thereof. Further, the circuit member 305 in FIG.
FIGS. 4A and 4B are used for manufacturing the semiconductor device of the third example shown in FIG. 4A and the fourth example shown in FIG.
Shows a plan view thereof. 4 (a) (b), FIG.
(B) and (b) are FIGS. 4 (a) and (b), respectively.
4B is a schematic cross-section taken along lines C1-C2 and C3-C4 of FIG. 4A, but in actuality, FIGS. 4A and 4C and FIGS. It becomes such a shape. The planar shape of the circuit member used in the semiconductor device shown in FIG. 2 is basically the same as the shape shown in FIGS. ) C1
The cross-sectional shape of the die pad portion at the position corresponding to -C2 is different. 4, 300 and 305 are circuit members, and 320
Is a die pad, 325 is a lead, 330 is a terminal, 33
2 is an internal terminal, 334 is an external terminal, 350 is an outer frame, and 352 is a connection lead. Note that a dotted line region in FIG. 4 indicates a region used for manufacturing a semiconductor device of a circuit member. The material of the circuit member 300 (305) is 42
Alloy (Ni 42% Fe alloy), copper alloy, etc. are used,
As with a normal lead frame, the outer shape can be processed by etching.

Next, an example of a method of manufacturing a circuit member of the present invention shown in FIG. 4 and an example of a method of manufacturing a circuit member used in the semiconductor device shown in FIG. 2 will be described with reference to the drawings. First, a circuit member used in the semiconductor device of the first example and the second example shown in FIGS. 1A and 1C, and a third example shown in FIG. A method of manufacturing a circuit member used in the semiconductor device of the fourth example shown in FIG. FIG. 5 shows only the periphery of the terminal portion for easy understanding of the description. First, a 42 alloy (Ni 42% F
e) and a thickness of 0.2 which is a material of the circuit member.
A plate material 410 of about mm is prepared, and both sides of the plate material 410 are degreased or the like and are thoroughly cleaned (FIG. 5A).
A photosensitive resist 420 is applied to both sides of the substrate 10 and dried. (FIG. 5B) Next, after exposing only a predetermined portion of the resist from both surfaces of the plate material 410 using a predetermined pattern plate, development processing is performed to form a resist pattern. (FIG. 5C) In the case of manufacturing the circuit member 300 shown in FIG.
(C) As shown in (a), the resist patterns 421, 42
2 are formed, and in the case of manufacturing the circuit member 305 shown in FIG. 4B, resist patterns 423 and 424 are formed as shown in FIGS. The resist is not particularly limited, but a casein-based resist using potassium dichromate as a photosensitive material, a negative-type liquid resist (PMER resist) manufactured by Tokyo Ohka Co., Ltd., or the like can be used. Next, the resist pattern is used as a corrosion-resistant film, and etching is performed with a corrosion liquid to produce a circuit member. (FIGS. 5D and 5E) In the case of manufacturing the circuit member 300 shown in FIG.
(D) As shown in (a), the etching proceeds, and FIG.
(E) As shown in (a), the etching is completed. In the case of manufacturing the circuit member 305 shown in FIG.
As shown in FIG. 5D and FIG.
(E) As shown in (b), the etching is completed. still,
In the case of manufacturing the circuit members shown in FIGS. 4A and 4B,
The thickness of the thin portion 430 can be adjusted by adjusting the amount of etching on the front and back of the plate member 410. The etching is usually performed by spray etching from both sides of the plate using an aqueous solution of ferric chloride as a corrosion liquid. Thereafter, the resist is stripped off to obtain the circuit member of the present invention.
(FIG. 5F) The method shown in FIG. 5 is one of the methods for manufacturing the circuit member shown in FIG.
By way of example, and not limitation.

FIG. 2 shows a modification of the semiconductor device 100 of the first example shown in FIG.
(A), a circuit member used for the semiconductor device shown in FIG. 2 (c) and a method for manufacturing the circuit member used for the semiconductor device shown in FIGS. 2 (b) and 2 (d) will be described with reference to FIG. explain. FIG. 6 also shows only the periphery of the terminal portion for easy understanding. Similar to the manufacturing method shown in FIG. 5, a plate material 410 made of a 42 alloy (Ni 42% Fe alloy) or the like and having a thickness of about 0.2 mm, which is a material of a circuit member, is prepared, and both surfaces of the plate material 410 are degreased. Washing was performed well (Fig. 6
(A)) Then, the photosensitive resist 42 is applied to both sides of the plate material 410.
Apply 0 and dry. (FIG. 6B) Next, the plate material 4
After exposing only a predetermined portion of the resist using a predetermined pattern plate from both sides of 10, development processing is performed to form a resist pattern. (FIG. 6C) In the case of manufacturing a circuit member used for the semiconductor device shown in FIGS. 2A and 2C, as shown in FIGS.
The resist patterns 421A and 422A are formed.
(B) In the case of manufacturing a circuit member used for the semiconductor device shown in FIG. 2D, resist patterns 423A and 424A are formed as shown in FIGS. Next, the resist pattern is used as a corrosion-resistant film, and etching is performed with a corrosion liquid to produce a circuit member. (FIG. 6 (d),
6 (e)) In the case of manufacturing a circuit member used for the semiconductor device shown in FIGS. 2 (a) and 2 (c), as shown in FIGS.
The etching proceeds, and the etching is completed as shown in FIGS. In the case of manufacturing a circuit member used for the semiconductor device illustrated in FIGS. 2B and 2D,
As shown in FIG. 6D and FIG.
(E) As shown in (b), the etching is completed. Thereafter, the resist is stripped off to obtain the circuit member of the present invention.
(FIG. 6 (f))

The above-described method for manufacturing a circuit member is a method for manufacturing one circuit member necessary for manufacturing one semiconductor device. However, usually, from the viewpoint of productivity, etching of the circuit member is performed. Then, the circuit member shown in FIG. In this case, a frame portion (not shown) connected to a part of the outer frame portion 350 shown in FIG. 4 is provided outside the lead frame to be imposed.

Next, a method of manufacturing a semiconductor device according to the present invention will be briefly described with reference to FIG. The case where the circuit member 300 shown in FIG. 4A is used will be described. First, FIG.
A circuit member 300 shown in FIG. (FIG. 7A) Next, after performing a cleaning process or the like, a silver plating process is performed on the surface of the internal terminal portion 332 to provide a silver plated portion 510.
(FIG. 7B) Note that gold plating or palladium plating may be used instead of silver plating. Next, the semiconductor element 520 is connected to the die attach
5, the terminal 522 of the semiconductor element 520 and the silver plating part 510 of the internal terminal part 332 are electrically connected to each other by a wire 540. (FIG. 7 (c)) Thereafter, a part of the external terminal portion 334 of the terminal portion 330 is exposed to the outside, and the whole is sealed with a sealing resin. (FIG. 7
(D) Further, if necessary, an external electrode 560 made of solder is provided on one surface 334A of the exposed external terminal portion 334 of the terminal portion 330.
To form (FIG. 7E) Next, each connection lead 352 of the circuit member 300 is cut by a press, and the outer frame portion 350 is removed. (FIG. 7 (f
1), FIG. 7 (f2)) In the production of the external electrode 560 made of solder, an amount of solder necessary for connection between the circuit board and the semiconductor device can be obtained even by solder paste application by screen printing or reflow. Good. The method of manufacturing a semiconductor device according to the present invention has been described above, but the circuit member is not limited to the one shown in FIG.

[0021]

EXAMPLES Further, examples of the circuit member of the present invention will be described.
A description will be given based on FIG. Circuit member 3 shown in FIG.
00, consisting of 42 alloy (Ni 42% Fe alloy),
After obtaining a circuit member having a terminal portion having a thickness of 0.2 mm by the etching method shown in FIG. 5, the semiconductor device shown in FIG. 1 was manufactured by the semiconductor device manufacturing method shown in FIG. However, there was no particular problem in quality. Similarly, FIG.
A circuit member made of a copper alloy and having a terminal part thickness of 0.2 mm and a lead part thickness of 0.05 mm is manufactured by the etching method shown in FIG. After that, the semiconductor device shown in FIG. 3 was manufactured by the method for manufacturing a semiconductor device shown in FIG. 7, but there was no particular problem.

[0022]

According to the present invention, as described above, under the situation where higher integration and higher functionality of a resin-encapsulated semiconductor device are required, the occupation rate of a chip in a semiconductor device package size is increased. According to the present invention, it is possible to provide a conductor device capable of reducing the mounting area on a circuit board in correspondence with miniaturization of a semiconductor device, that is, improving the mounting density on a circuit board. The present invention makes it possible to provide a resin-encapsulated semiconductor device realizing a further increase in the number of pins, which has been difficult for conventional small packages such as TSOP.

[Brief description of the drawings]

FIG. 1 shows a first example and a second example of a resin-sealed semiconductor device of the present invention.

FIG. 2 is a diagram showing a modified example of the first and second examples of the resin-sealed semiconductor device of the present invention.

FIG. 3 is a view showing a third example and a fourth example of the resin-encapsulated semiconductor device according to the present invention;

FIG. 4 is a view showing a circuit member of the present invention.

FIG. 5 is a manufacturing process diagram of the circuit member of the present invention.

FIG. 6 is a manufacturing process diagram of the circuit member of the present invention.

FIG. 7 is a manufacturing process diagram of the resin-encapsulated semiconductor device of the present invention.

[Explanation of symbols]

Reference Signs List 100, 100A Resin-sealed semiconductor device 110 Semiconductor element 111 Terminal (pad) 115 Die attach material 120 Die pad 130 Terminal 132 Internal terminal 134 External terminal 134A Exposed surface 140 Wire 150 Sealing resin 160 Silver plating 170 From solder External electrode 200, 200A Resin-sealed semiconductor device 210 Semiconductor element 211 Terminal (pad) 215 Die attach material 225 Lead 230 Terminal section 232 Internal terminal section 234 External terminal section 234A Exposed surface 240 Wire 250 Sealing resin 260 Silver plating 270 External electrodes made of solder 300, 305 Circuit member 320 Die pad 325 Lead 330 Terminal section 332 Internal terminal section 334 External terminal section 350 Outer frame section 352 Connection lead 410 Plate material 420 Resist 421, 22, 423, 424 Resist pattern 421A, 422A, 423A, 424A Resist pattern 430 Thin portion 500, 500A Semiconductor device 510 Silver plating 520 Semiconductor element 522 Terminal (pad) 525 Die attach 540 Wire 550 Sealing resin 560 External made of solder electrode

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masato Sasaki 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd.

Claims (13)

[Claims] 1. An internal terminal portion, which is externally processed by etching and electrically connected to a terminal of a semiconductor element,
External terminals for connection to an external circuit and terminals integrally provided so as to face the front and back are two-dimensionally arranged on a substantially single plane, and are electrically independent of each other. A resin-sealed semiconductor device in which an internal terminal of the terminal portion and a terminal of the semiconductor element are electrically connected by a wire, and a part of the external terminal of the terminal portion is exposed to the outside and resin-sealed; or A resin-encapsulated semiconductor device in which terminal portions of the resin-encapsulated semiconductor device are provided with external electrodes made of solder for mounting on a circuit board or the like on a surface of the external terminal portion exposed to the outside, A resin-encapsulated semiconductor device, wherein a semiconductor element is mounted on a die pad electrically independent of a terminal portion. 2. The resin-sealed semiconductor device according to claim 1, wherein a part of the die pad is exposed to the outside. 3. An internal terminal portion which is externally processed by etching and electrically connected to a terminal of a semiconductor element.
External terminals for connection to an external circuit and terminals integrally provided so as to face the front and back are two-dimensionally arranged on a substantially single plane, and are electrically independent of each other. A resin-sealed semiconductor device in which an internal terminal of the terminal portion and a terminal of the semiconductor element are electrically connected by a wire, and a part of the external terminal of the terminal portion is exposed to the outside and resin-sealed; or A resin-encapsulated semiconductor device in which terminal portions of the resin-encapsulated semiconductor device are provided with external electrodes made of solder for mounting on a circuit board or the like on a surface of the external terminal portion exposed to the outside, Along the plane in which the terminal portions are two-dimensionally arranged, each terminal portion is electrically independent, a lead integrally connected to the terminal portion is provided, and the semiconductor element is mounted on the lead. A resin-encapsulated semiconductor device. 4. The semiconductor device according to claim 1, wherein the terminals of the semiconductor element are arranged along a substantially central line of a pair of sides of the terminal surface of the semiconductor element, and the terminal portions oppose each other so as to sandwich the center line. A resin-sealed semiconductor device is provided along each of the pair of sides. 5. An internal terminal portion which is externally processed by etching and electrically connected to a terminal of a semiconductor element,
An external terminal portion for connection to an external circuit and a plurality of terminal portions provided integrally so as to face each other are arranged independently in substantially one plane, and each terminal portion is provided independently. A circuit member, wherein the portion is integrally connected to an outer frame portion that holds the entire portion via a connection lead. 6. The method according to claim 5, further comprising a die pad,
A circuit member, wherein the die pad is integrally connected to an outer frame portion that holds the whole via a connection lead. 7. The circuit member according to claim 6, wherein one surface of the die pad and a surface of the external terminal portion are provided on the same plane. 8. The circuit member according to claim 5, wherein a lead for mounting a semiconductor element, which does not have a die pad, is provided separately from the connection lead to each terminal portion. 9. An internal terminal portion which is externally processed by etching and electrically connected to a terminal of a semiconductor element,
External terminal portion and is two-dimensionally a plurality substantially in one plane a terminal part provided integrally so as to face its front and back for connection to an external circuit, electrically independently of each other, respectively Then, the internal terminal of the terminal portion and the terminal of the semiconductor element are electrically connected by a wire, and a part of the external terminal of the terminal portion is exposed to the outside, and the whole is resin-sealed. The manufacturing method, or a resin-sealed semiconductor device in which external terminals made of solder for mounting on a circuit board or the like are provided on the surface of the external terminal portion exposed to the outside of the terminal portion of the resin-sealed semiconductor device Wherein at least (A) an internal terminal portion for electrically connecting to a terminal of a semiconductor element and an external terminal portion for connection to an external circuit are formed on the front and back sides by etching. Terminals integrally provided to face each other A circuit member creation step of creating a circuit member in which a plurality of two-dimensionally arranged two-dimensionally independently from each other, and each terminal portion is integrally connected to an outer frame portion holding the whole via connection leads; B) a semiconductor element mounting step of mounting a semiconductor element; (C) a wire bonding step of electrically connecting terminals of the semiconductor element to internal terminals of the circuit member by wires; and (D) external parts of the terminal. A resin sealing step of exposing a part of the terminal to the outside and resin sealing;
(E) an outer frame portion separating and removing step of cutting each connection lead of the circuit member and removing the outer frame portion. 10. The circuit member according to claim 9, further comprising a die pad, wherein the die pad is connected via a connection lead.
In the semiconductor element mounting step, the semiconductor element is mounted on the die pad portion by a die attach agent on a surface other than the terminal surface side in the semiconductor element mounting step. Of manufacturing a resin-sealed semiconductor device. 11. The resin-sealed semiconductor device according to claim 10, wherein one surface of the die pad of the circuit member and the surface of the external terminal portion are provided on the same plane. Manufacturing method. 12. The method of manufacturing a resin-encapsulated semiconductor device according to claim 10, wherein in the resin encapsulation step, the die pad is resin-encapsulated so that a part of the die pad is exposed to the outside. 13. The circuit member according to claim 9, wherein the circuit member does not have a die pad, and a lead for mounting a semiconductor element different from the connection lead is provided integrally with each terminal portion, and A method of manufacturing a resin-encapsulated semiconductor device, comprising mounting a semiconductor element on a lead on a surface other than a terminal surface thereof by a die attach agent.