CN110446352B - PCB circuit board drilling needle and drilling process effect detection method - Google Patents

PCB circuit board drilling needle and drilling process effect detection method Download PDF

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Publication number
CN110446352B
CN110446352B CN201910730447.7A CN201910730447A CN110446352B CN 110446352 B CN110446352 B CN 110446352B CN 201910730447 A CN201910730447 A CN 201910730447A CN 110446352 B CN110446352 B CN 110446352B
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Prior art keywords
pcb
drilling
drill
hole
circuit board
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CN110446352A (en
Inventor
宋改丽
蔡少华
李小冬
周俊杰
朴炫昌
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Simmtech Electronics Xi'an Co ltd
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Simmtech Electronics Xi'an Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Abstract

The invention relates to the technical field of drill pins, in particular to a PCB circuit board drill pin and a method for detecting the effect of a drilling process. The film layer made of one or more of titanium nitride, titanium carbide, aluminum oxide, titanium carbonitride, titanium aluminum nitride and titanium aluminum carbonitride is plated on the micro drill point with the diameter of 0.2mm, so that the rigidity of the drill point is enhanced, the service life of the drill point is prolonged to 2 times of that of the traditional micro drill point, and the manufacturing cost of the multilayer circuit board is reduced.

Description

PCB circuit board drilling needle and drilling process effect detection method
Technical Field
The invention relates to the technical field of drill points, in particular to a PCB circuit board drill point and a drilling process effect detection method.
Background
Pcb (printed circuit board), also called printed circuit board, is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
When a PCB is produced, a drill point is needed, the diameter of which is 0.6mm and is hereinafter referred to as a small drill point, and the diameter of which is 0.3mm and is hereinafter referred to as a micro drill point, and when a multi-layer circuit board is drilled, the micro drill point is usually selected for drilling because the machining size requirement is precise.
The traditional small drill point with the diameter of more than 0.3mm is generally coated with a film layer, while the micro drill point with the diameter of less than 0.3mm is generally formed by taking tungsten carbide powder as a substrate and taking cobalt powder as a binder through pressurization and sintering, and the surface of the micro drill point is not provided with the film layer, so the service life of the micro drill point is generally 2200 times of drilling, when the micro drill point performs drilling operation for a certain number, passivation can be generated to influence the cutting precision, or the phenomena of abrasion and deformation can be generated, the service life of the micro drill point can directly cause the consumable cost of the micro drill point to be increased, and the consumable cost of the micro drill point can cause the manufacturing cost of the multilayer circuit board to be increased.
Disclosure of Invention
A first object of the present invention is to provide a CB circuit board drilling pin, which is a micro-drilling pin for performing a drilling operation of a conductive through hole in a multilayer circuit board, and which can prolong a service life by 2 times as long as a conventional micro-drilling pin and reduce a manufacturing cost of the multilayer circuit board.
The invention provides a drilling needle for a PCB (printed circuit board), which comprises a handle part and a tungsten carbide blade part connected with the handle part, wherein the tungsten carbide blade part contains cobalt metal, and the drilling needle is characterized in that the diameter of the tungsten carbide blade part is 0.2mm, a plurality of layers of films are arranged on the outer layer of the tungsten carbide blade part, and the films are made of titanium nitride, titanium carbide, a mixture of aluminum oxide and titanium carbonitride, or a mixture of titanium carbide and titanium aluminum nitride, or titanium aluminum carbonitride.
By adopting the technical scheme, the film layer containing the mixture of titanium nitride, titanium carbide, aluminum oxide and titanium carbonitride, or the film layer containing the mixture of titanium carbide and titanium aluminum nitride, or the film layer of titanium aluminum carbonitride is plated on the micro drill point with the diameter of 0.2mm, so that the rigidity of the drill point is enhanced, the service life of the drill point is prolonged to 2 times of that of the traditional micro drill point, and the manufacturing cost of a multilayer circuit board is reduced.
The second purpose of the invention is to provide a method for detecting the drilling process effect of the drilling needle of the PCB, which comprises hole site precision detection and hole wall quality detection, wherein the hole site precision detection is obtained by a hole site deviation amount, and the hole wall quality detection is used for checking the hole wall quality by slicing.
By adopting the technical scheme, the drilling times are preset during detection, and the hole site precision and the hole wall quality are detected after the drilling reaches the preset times, so that the process effect of the drilling needle is detected, whether the service life of the drilling needle reaches the standard or not is obtained, the process is simple, and the service life of the drilling needle can be visually detected.
In some embodiments, a specified position and a specified number of drill holes are processed on the PCB by a drilling machine, and then hole position precision detection is performed on the hole position on the PCB by an image detection device.
By adopting the technical scheme, the hole site precision is detected by adopting the image detection device, the operation is convenient, and the time cost and the labor cost are saved.
In some embodiments, the target surface is arranged by taking the target position of the drilling hole as a target center, the distance between adjacent target rings of the target surface is 1mil, a target surface graph of the drilling hole on the PCB is output in a graph mode, and then hole position deviation is analyzed through the graph.
By adopting the technical scheme, the positions of the drill holes are visually displayed through the target surface map, so that the accuracy of preliminarily knowing the hole positions can be conveniently observed.
In some embodiments, the number of drill holes in each target ring is counted, and the percentage of drill holes falling into each target ring is calculated.
By adopting the technical scheme, the number of the drill holes in each circular target ring and the percentage of the drill holes falling into each circular target ring are intermediate values for obtaining the hole site accuracy.
In some embodiments, a plurality of drilling needles of the same specification are used to repeat the drilling operation at the same designated position and the same designated number on different PCB, count the number of accumulated drilling points in each circular target ring, and calculate the percentage of accumulated drilling holes falling into each circular target ring.
By adopting the technical scheme, the contingency of the test result is eliminated, and the detection accuracy is improved.
In some embodiments, a plane coordinate system is established with the target as an origin, an X-axis standard upper limit, an X-axis standard lower limit, a Y-axis standard upper limit and a Y-axis standard lower limit are set, an X-axis average value and a Y-axis average value are respectively counted, an X-axis standard deviation and a Y-axis standard deviation are calculated, and finally, an offset average value, an offset standard deviation, an offset specification upper limit and an offset specification lower limit are obtained.
By adopting the technical scheme, the hole site offset is finally and visually displayed through the chart, so that the worker can conveniently and quickly obtain the detection result.
In some embodiments, the method for detecting the quality of the pore wall comprises the following steps:
s1: performing Drill operation;
s2: copper plating operation;
s3: sampling;
s4: and (3) hot oil, which is used for detecting whether the PCB has white spots and bubbles under thermal shock and whether the PCB has layering phenomenon on the surface or in the hole.
In some embodiments, the specific step of S4 is:
s41: sampling the PCB and placing the PCB in an oven at the temperature of 120-150 ℃ for baking for 40-80 min;
s42: adjusting the temperature of the hot oil furnace to 257 and 266 ℃, and sampling and immersing the PCB in the hot oil furnace for 20-21s when the temperature is reached;
s43: the pore wall quality was measured by microscopy.
In summary, compared with the prior art, the PCB drilling needle and the method for detecting the effect of the drilling process provided by the invention have the beneficial technical effects that:
the film layer is plated on the micro drill point with the diameter of 0.2mm, so that the rigidity of the drill point is enhanced, the service life is prolonged to 2 times of that of the traditional micro drill point, and the manufacturing cost of the multilayer circuit board is reduced.
Detailed Description
The invention discloses a drilling needle for a PCB (printed circuit board), which comprises a handle part and a tungsten carbide blade part connected with the handle part, wherein the tungsten carbide blade part adopts tungsten carbide powder as a matrix, cobalt powder is used as a binder, and the tungsten carbide blade part is formed by pressurizing and sintering the tungsten carbide powder, the drilling needle for the PCB disclosed by the invention is a drilling needle with the tungsten carbide blade part diameter of 0.2mm, the outer layer of the tungsten carbide blade part is coated with a film layer, the film layer is made of a mixture of titanium nitride, titanium carbide, aluminum oxide and titanium carbonitride or a mixture of titanium carbide and titanium aluminum nitride or titanium aluminum carbonitride, and the thickness of the film layer is 0.1-2 mu m. According to the PCB circuit board drilling needle provided by the invention, the film layer is plated on the micro-drilling needle with the diameter of 0.2mm, so that the rigidity of the drilling needle is enhanced, the service life is prolonged to 2 times of that of the traditional micro-drilling needle, namely the service life can reach 4400 times of drilling.
The invention also discloses a method for detecting the effect of the drilling process by adopting the micro drill needle plated with the three film layers and having the diameter of 0.2mm, wherein the drilling times are preset during detection, the hole site precision and the hole wall quality are detected after the drilling reaches the preset times, the hole site precision detection is obtained by detecting the hole site deviation amount, and the hole wall quality detection is obtained by detecting the roughness in the hole by slicing.
Specifically, in this embodiment of the present invention, the specific method for detecting the hole position accuracy is as follows:
processing a specified number of drill holes at specified positions on the PCB by a drilling machine, (wherein the specified number is the maximum drill hole number of expected drill pins in the service life limit, such as 4400 times), setting a target surface by taking a drill hole target position as a target center, wherein the distance between adjacent target rings of the target surface is 1mil, (in the embodiment of the invention, the inner diameter of the maximum target ring of the target surface is 6.000mil, and the minimum is 1.000mil), outputting a target surface diagram of the drill pins plated with the titanium aluminum carbonitride film layer after drilling holes on the PCB by a graph mode, counting the number of the drill holes in each ring target ring by the graph, and respectively calculating the percentage of the drill holes falling into each ring target ring.
In order to improve the detection accuracy, multiple operations are adopted for detection, namely, the drilling needles with the same specification are adopted to repeat the drilling operations of the same designated position and the same designated number on different PCB circuit boards respectively, then the accumulated drilling points in each circular target ring are counted, and the accumulated drilling percentage falling into each circular target ring is calculated respectively.
Establishing a plane coordinate system by taking a target center as an origin, setting an X-axis standard upper limit to be 2.000mil, an X-axis standard lower limit to be-2.000 mil, a Y-axis standard upper limit to be 2.000mil and a Y-axis standard lower limit to be-2.000 mil, respectively counting an X-axis average value and a Y-axis average value of positions drilled on the coordinate system according to the positions of the holes drilled on the target surface, calculating an X-axis standard deviation, a Y-axis standard deviation, an X-axis Ca, an X-axis Cp, an X-axis CPK, an X-axis 1Sigma, an X-axis Avg +1Sigma, a Y-axis Ca, a Y-axis Cp, a Y-axis CPK, a Y-axis Sigma, a Y-axis 1Sigma and a Y-axis Avg +1Sigma, and finally obtaining an offset average value, an offset standard deviation, an offset specification upper limit, an offset specification lower limit, a process standard degree Ca, a process capability Cp, a process capability.
In this embodiment of the present invention, the method for detecting the quality of the hole wall comprises:
example 1:
s1: drilling a PCB circuit board by using a Drill hole coated with a micro Drill pin with the diameter of 0.2mm of the film layer containing the mixture of titanium nitride, titanium carbide, aluminum oxide and titanium carbonitride for a specified number of Drill operations, (wherein the specified number is the maximum Drill number of the expected Drill pin in the service life, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 120 ℃ for 40 min;
s42: adjusting the temperature of the hot oil furnace to 257 ℃, and sampling and immersing the PCB in the hot oil furnace for 20s when the temperature is reached;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Example 2:
s1: drilling a PCB by using a micro-Drill pin with the diameter of 0.2mm of the film layer coated with the mixture of the titanium carbide and the titanium aluminum nitride for specified times of Drill operation (the specified number is the maximum number of Drill holes of the expected Drill pin in the service life, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 150 ℃ for 80 min;
s42: adjusting the temperature of the hot oil furnace to 266 ℃, and sampling and immersing the PCB in the hot oil furnace for 21s when the temperature reaches the temperature;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Example 3:
s1: drilling the PCB by the micro-Drill pins with the diameter of 0.2mm plated with the titanium aluminum carbonitride film layer for a specified number of Drill operations (the specified number is the maximum Drill number of the expected Drill pins in the service life, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 135 ℃ for 60 min;
s42: adjusting the temperature of the hot oil furnace to 260 ℃, and sampling and immersing the PCB in the hot oil furnace for 20s when the temperature is reached;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Blank test 1:
s1: performing Drill operation on the PCB for a specified number of times through a Drill hole coated with a micro Drill pin with the diameter of 0.2mm and containing a titanium nitride film layer, (wherein the specified number is the maximum Drill hole number of the expected Drill pin in the service life period, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 130 ℃ for 55 min;
s42: adjusting the temperature of the hot oil furnace to 262 ℃, and sampling and immersing the PCB in the hot oil furnace for 20s when the temperature is reached;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Blank test 2:
s1: performing Drill operation on the PCB for a specified number of times through a Drill hole coated with a micro Drill pin with the diameter of 0.2mm and containing a titanium carbide film layer, (wherein the specified number is the maximum Drill hole number of the expected Drill pin in the service life period, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking the PCB in an oven at 145 ℃ for 65 min;
s42: adjusting the temperature of the hot oil furnace to 264 ℃, and sampling and immersing the PCB in the hot oil furnace for 21s when the temperature reaches the temperature;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Blank test 3:
s1: performing Drill operation on the PCB for a specified number of times through a Drill hole coated with a micro Drill pin with the diameter of 0.2mm and containing an alumina film layer, (wherein the specified number is the maximum Drill hole number of the expected Drill pin in the service life period, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 125 ℃ for 50 min;
s42: adjusting the temperature of the hot oil furnace to 262 ℃, and sampling and immersing the PCB in the hot oil furnace for 20s when the temperature is reached;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
Blank test 4:
s1: drilling a PCB by a Drill hole coated with a micro Drill pin with a diameter of 0.2mm and containing a titanium carbonitride film layer for a specified number of Drill operations (the specified number is the maximum number of Drill holes of the expected Drill pin in the service life, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking the PCB in an oven at 140 ℃ for 65 min;
s42: adjusting the temperature of the hot oil furnace to 264 ℃, and sampling and immersing the PCB in the hot oil furnace for 21s when the temperature reaches the temperature;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
S1: performing Drill operation on the PCB for a specified number of times through a Drill hole coated with a micro Drill pin with the diameter of 0.2mm and containing a titanium aluminum nitride film layer, (wherein the specified number is the maximum Drill hole number of the expected Drill pin in the service life period, such as 4400 times);
s2: carrying out copper plating operation on the PCB subjected to the Drill operation;
s3: slicing and sampling the PCB after the copper plating operation;
s4: hot oil, specifically including:
s41: sampling the PCB, and baking in an oven at 130 ℃ for 50 min;
s42: adjusting the temperature of the hot oil furnace to 264 ℃, and sampling and immersing the PCB in the hot oil furnace for 21s when the temperature reaches the temperature;
s43: the hole wall is measured by a microscope, whether the PCB has white spots and bubbles under thermal shock and whether the PCB has a layering phenomenon on the board surface or in the hole is detected, and meanwhile, the roughness of the hole wall, the nail head and the lamp wick are measured.
The following are the results of the measurements taken by the microscope in examples 1 to 3 above:
Figure GDA0002196592890000091
the requirements for pore wall quality during the useful life are pore roughness: within 25um, nail head: 150%, wick: within 50um, it can be known from the above test results that the drilling needles used in examples 1 to 3 can meet the requirements, i.e., the service life of the drilling needles used in examples 1 to 3 can reach 4400 times.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.

Claims (3)

  1. The utility model provides a drilling technology effect detection method of PCB circuit board drilling needle, a serial communication port, PCB circuit board drilling needle includes the stalk portion and the tungsten carbide cutting part of being connected with the stalk portion, the tungsten carbide cutting part contains the cobalt metal, and its characterized in that, tungsten carbide cutting part diameter is 0.2mm, tungsten carbide cutting part skin is equipped with a plurality of layers of rete, the material of rete is titanium nitride, titanium carbide, aluminium oxide and titanium carbonitride's mixture, or titanium carbide and titanium aluminium nitride's mixture, or titanium aluminium carbonitride, and the detection method includes:
    hole site precision detection and hole wall quality detection, wherein the hole site precision detection is obtained by a hole site deviation amount, and the hole wall quality detection is used for checking the hole wall quality through slicing;
    the hole site precision detection includes:
    processing specified positions and specified number of drill holes on a PCB (printed Circuit Board) by a drilling machine, and then detecting hole position precision of hole positions on the PCB by an image detection device;
    set up the target surface as the bull's-eye with drilling target location, the distance between the adjacent target circle of target surface is 1mil, exports the target surface picture of drilling on the PCB circuit board through the chart mode, then through chart analysis hole site deviation, include:
    counting the number of the drill holes in each circular target ring, and respectively calculating the percentage of the drill holes falling into each circular target ring;
    a plurality of drilling needles with the same specification are adopted to repeat drilling operation at the same designated position and the same designated number on different PCB boards respectively, the accumulated drilling points in each circular target ring are counted, and the accumulated drilling percentage falling into each circular target ring is calculated respectively;
    establishing a plane coordinate system by taking the target center as an origin, setting an X-axis standard upper limit, an X-axis standard lower limit, a Y-axis standard upper limit and a Y-axis standard lower limit, respectively counting an X-axis average value and a Y-axis average value, calculating an X-axis standard deviation and a Y-axis standard deviation, and finally obtaining an offset average value, an offset standard deviation, an offset specification upper limit and an offset specification lower limit.
  2. 2. The method for detecting the effect of the drilling process of the drilling needle of the PCB circuit board as recited in claim 1, wherein the method for detecting the quality of the hole wall comprises the following steps:
    s1: performing Drill operation;
    s2: copper plating operation;
    s3: sampling;
    s4: and (3) hot oil, which is used for detecting whether the PCB has white spots and bubbles under thermal shock and whether the PCB has layering phenomenon on the surface or in the hole.
  3. 3. The method for detecting the drilling process effect of the drilling needle of the PCB circuit board as recited in claim 2, wherein the step S4 comprises the following steps: s41: sampling the PCB and placing the PCB in an oven at the temperature of 120-150 ℃ for baking for 40-80 min;
    s42: adjusting the temperature of the hot oil furnace to 257 and 266 ℃, and sampling and immersing the PCB in the hot oil furnace for 20-21s when the temperature is reached;
    s43: the pore wall quality was measured by microscopy.
CN201910730447.7A 2019-08-08 2019-08-08 PCB circuit board drilling needle and drilling process effect detection method Active CN110446352B (en)

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CN111203931B (en) * 2020-01-18 2022-06-07 信泰电子（西安）有限公司 Method for detecting damage of drill bit of circuit board drilling machine
CN111351432A (en) * 2020-04-13 2020-06-30 深圳市强华科技发展有限公司 PCB hole position processing process capability assessment method

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CN1568135A (en) * 2003-06-13 2005-01-19 华通电脑股份有限公司 Manufacturing method for multilayer printed circuit board and inter-layer ducting structure formed thereby
CN101537505B (en) * 2008-12-30 2011-05-25 南京依利安达电子有限公司 Small-aperture high-density drilling method of printed circuit board
TWM442204U (en) * 2012-05-31 2012-12-01 Tct Global Ltd Processing cutter

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