CN110438454A - A kind of vapor deposition crucible with heating device - Google Patents
A kind of vapor deposition crucible with heating device Download PDFInfo
- Publication number
- CN110438454A CN110438454A CN201910718627.3A CN201910718627A CN110438454A CN 110438454 A CN110438454 A CN 110438454A CN 201910718627 A CN201910718627 A CN 201910718627A CN 110438454 A CN110438454 A CN 110438454A
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- CN
- China
- Prior art keywords
- evaporation source
- heating device
- source shutter
- vapor deposition
- shutter
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention relates to evaporation coating technique fields, in particular to a kind of vapor deposition crucible with heating device, crucible body including being equipped with nozzle, evaporation source shutter and controller, evaporation source shutter is located above nozzle, evaporation source shutter is equipped with heating device far from the one side of nozzle, it is that heat needed for the vapor deposition object that will adhere on evaporation source shutter is heated to steam state is provided by setting heating device, play the role of clearing up the material adhered on evaporation source shutter automatically, avoid in switching evaporation source shutter every time material falls back that material is caused in evaporation source to report to the leadship after accomplishing a task pollution, and can be avoided regular opening vapor deposition cavity replacement evaporation source shutter and caused by processing time extend, to improve production efficiency.
Description
Technical field
The present invention relates to evaporation coating technique field, in particular to a kind of vapor deposition crucible with heating device.
Background technique
Organic Light Emitting Diode (Organic Light-emitting Diode, referred to as OLED) is new one after LCD
The display in generation, it is main using vapor deposition making technology, and crucible is often multiple side by side or round as the evaporation source of evaporated device
Week arrangement, inside hold different types of metal or organic material, deposited to after the heated vaporization of material under high vacuum environment
Organic film is formed on glass substrate, is shone for realizing OLED device.It is deposited in processing procedure, general organic material cavity is with linear
Based on evaporation source, according to the design requirement of OLED display product, device film layer structure is often different, such as homogenous material vapor deposition
Film layer is deposited in film layer or more materials altogether, therefore to realize specific film forming sequence and film layer structure, it is necessary in evaporated device
Evaporation source shutter switches to change the evaporation source to form a film in cavity, switches film forming crucible principle for the corresponding evaporation source of crucible
Shutter, which is covered on crucible nozzle, can avoid material vapor spilling, and the crucible of no evaporation source shutter covering will be participated in into
Film.But when crucible nozzle has the covering of evaporation source shutter, the material vapor of interior evaporation, which can solidify, is then attached to evaporation source screening
On baffle, cracking is easy with lasting accumulation of the material on evaporation source shutter, when reaching certain thickness and is fallen off, is being steamed at this time
If falling in non-corresponding crucible in the shutter handoff procedure that rises, it will cause the cross stainings of material in evaporation source, therefore
Evaporation source shutter needs periodically processing, and processing mode mainly regularly stops evaporation film-forming at present or evaporation source cools down and beats
Vapor deposition cavity replacement evaporation source shutter is opened, then evaporation source heats up etc. after rate to be plated is stablized again and continues to form a film, and so will cause
Processing time is too long, reduces production efficiency.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of attachment that can be cleared up automatically on evaporation source shutter
Vapor deposition crucible.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of vapor deposition crucible with heating device, crucible body, evaporation source shutter and control including being equipped with nozzle
Device, the evaporation source shutter are located above the nozzle；
The evaporation source shutter is equipped with heating device far from the one side of the nozzle, and the heating device includes shell
Body, the inner cavity of the shell are equipped with heating unit and temperature sensor, and the heating unit setting is close in the housing cavity
On the one side of the evaporation source shutter, the heating unit, which is configured to supply, to be adhered on the evaporation source shutter
Heat needed for vapor deposition object is heated to steam state；
The controller is electrically connected with the heating unit and temperature sensor respectively, and the controller is configured as working as institute
It states when temperature sensor detects the current temperature value of the housing cavity higher than preset temperature value and controls the heating unit
Keep the heat currently generated that the housing cavity is made to maintain current temperature value.
The beneficial effects of the present invention are:
Due to accumulating excessive organic material on evaporation source shutter, in switching, organic material cracking, which falls off, causes to be deposited
Material in source is reported to the leadship after accomplishing a task the risk of pollution, is to provide the vapor deposition object that will adhere on evaporation source shutter to add by setting heating device
Heat needed for heat to steam state plays the role of clearing up the material adhered on evaporation source shutter automatically, avoids switching every time
Material falls back causes in evaporation source material to report to the leadship after accomplishing a task pollution when evaporation source shutter, and can be avoided regular opening vapor deposition cavity more
Change evaporation source shutter and caused by processing time extend, to improve production efficiency.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of vapor deposition crucible with heating device according to the present invention；
Fig. 2 is a kind of structural schematic diagram of the heating device of vapor deposition crucible with heating device according to the present invention；
Fig. 3 is a kind of structural schematic diagram of vapor deposition crucible with heating device according to the present invention；
Fig. 4 is a kind of structural schematic diagram of vapor deposition crucible with heating device according to the present invention；
Fig. 5 is a kind of structural schematic diagram of the film forming situation of vapor deposition crucible with heating device according to the present invention；
Label declaration:
1, crucible body；
2, evaporation source shutter；
3, heating device；301, shell；302, metal hose；303, bracket；304, magnet exciting coil；305, ceramic wafer；
306, magnetic stripe；307, the second elevating mechanism；
4, glass substrate.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
Fig. 1 is please referred to, technical solution provided by the invention:
A kind of vapor deposition crucible with heating device, crucible body, evaporation source shutter and control including being equipped with nozzle
Device, the evaporation source shutter are located above the nozzle；
The evaporation source shutter is equipped with heating device far from the one side of the nozzle, and the heating device includes shell
Body, the inner cavity of the shell are equipped with heating unit and temperature sensor, and the heating unit setting is close in the housing cavity
On the one side of the evaporation source shutter, the heating unit, which is configured to supply, to be adhered on the evaporation source shutter
Heat needed for vapor deposition object is heated to steam state；
The controller is electrically connected with the heating unit and temperature sensor respectively, and the controller is configured as working as institute
It states when temperature sensor detects the current temperature value of the housing cavity higher than preset temperature value and controls the heating unit
Keep the heat currently generated that the housing cavity is made to maintain current temperature value.
As can be seen from the above description, the beneficial effects of the present invention are:
Due to accumulating excessive organic material on evaporation source shutter, in switching, organic material cracking, which falls off, causes to be deposited
Material in source is reported to the leadship after accomplishing a task the risk of pollution, is to provide the vapor deposition object that will adhere on evaporation source shutter to add by setting heating device
Heat needed for heat to steam state plays the role of clearing up the material adhered on evaporation source shutter automatically, avoids switching every time
Material falls back causes in evaporation source material to report to the leadship after accomplishing a task pollution when evaporation source shutter, and can be avoided regular opening vapor deposition cavity more
Change evaporation source shutter and caused by processing time extend, to improve production efficiency.
Further, the heating unit includes metal hose, bracket and magnet exciting coil, the magnet exciting coil and the control
Device electrical connection processed, the bracket are fixed at the housing cavity, and the bracket is close to the side of the evaporation source shutter
Face is equipped with magnetic stripe, and the magnetic stripe is equipped with notch, and the excitation wire is wrapped on the magnetic stripe by the notch, the gold
Belong to hose and the bracket is set on the opposite another side of the one side of the evaporation source shutter, the metal hose
It is connect with the cooling water pipeline of peripheral hardware.
Seen from the above description, heating unit includes metal hose, bracket and magnet exciting coil, constitutes magnetic field induction vortex
Heating method, after heating unit energization, the high-frequency alternating magnetic field in magnet exciting coil generates vortex and generates heat in housing cavity,
Temperature information is passed to controller after reaching preset temperature value by the temperature value of temperature sensor monitoring housing cavity, is controlled
Device control is passed through the size of the electric current of magnet exciting coil to control the heat of magnet exciting coil generation, can be avoided that temperature is excessively high to be caused
The waste of the energy is cleared up using the organic material that the heating method that magnetic field induction is vortexed can adhere on to evaporation source shutter
While it is energy saving；By connecting the cooling water pipe of metal hose and peripheral hardware, recirculated cooling water can be passed through and realize excitation
The cooling of coil can be passed directly into cooling water when heating device needs to cool down and cool down.
Further, the shell is equipped with opening and the opening is arranged towards the evaporation source shutter, the heating
Device further includes ceramic wafer, and the ceramic wafer closes the opening of the shell, the ceramic wafer and the evaporation source shutter
Contact.
Seen from the above description, since ceramic wafer can bear very high temperature, intensity is high and magnetic line of force damped coefficient is low and
Heat-proof quality is good, therefore heat-insulated by setting ceramic wafer magnetic conduction, improves the heating device thermal efficiency and to can be avoided temperature excessively high
Burn out coil and internal wiring, additionally it is possible to avoid and influence evaporation process stability.
Further, the preset temperature value is 10-20 DEG C.
Seen from the above description, the 10-20 DEG C of temperature value for vapor deposition object vaporization in crucible body, therefore need to only guarantee shell
The temperature value of inner cavity is higher than 10-20 DEG C, can be avoided the excessively high waste for causing the energy of temperature in this way.
Further, the quantity of the quantity of the heating device, the quantity of evaporation source shutter and crucible body is equal
And the shape of the heating device is adapted with the shape of affiliated evaporation source shutter.
Seen from the above description, each evaporation source shutter is correspondingly arranged a heating device, can be improved each evaporation
The efficiency for the material cleaning adhered on source shield plate is conducive to the stability for promoting evaporation process.
Further, the quantity of the evaporation source shutter and the quantity of crucible body are equal, and multiple evaporation sources hide
Baffle shares a heating device.
It can be to evaporation source shutter as can be seen from the above description, sharing a heating device by multiple evaporation source shutters
Equipment mechanism and save the cost can be simplified again while the organic material cleaning of upper attachment.
It further, further include the first elevating mechanism, first elevating mechanism is arranged on the evaporation source shutter
And with the evaporation source shutter releasable connection, first elevating mechanism is electrically connected with the controller, first lifting
Mechanism is configured as controlling the evaporation source shutter to be risen or fallen above the nozzle, under the evaporation source shutter
When dropping on the nozzle, the controller controls the heating unit and stops heating.
Seen from the above description, the up and down motion realization of evaporation source shutter can be controlled by the first elevating mechanism of setting to cut
It changes.
Further, further include the second elevating mechanism, second elevating mechanism be arranged on the heating device and with
The heating device releasable connection, second elevating mechanism are configured as controlling the heating device in the evaporation source shield
It is risen or fallen above plate.
Please refer to Fig. 1 to Fig. 3, the embodiment of the present invention one are as follows:
Please refer to Fig. 1, a kind of vapor deposition crucible with heating device 3, crucible body 1, evaporation source including being equipped with nozzle
Shutter 2 and controller, the evaporation source shutter 2 are located above the nozzle；
The evaporation source shutter 2 is equipped with heating device 3 far from the one side of the nozzle, and the heating device 3 wraps
Shell 301 is included, the inner cavity of the shell 301 is equipped with heating unit and temperature sensor, and the heating unit is arranged in the shell
On the one side of the evaporation source shutter 2, the heating unit is configured to supply the evaporation source 301 inner cavity of body
Heat needed for the vapor deposition object adhered on shutter 2 is heated to steam state；
The controller is electrically connected with the heating unit and temperature sensor respectively, and the controller is configured as working as institute
It states and controls the heating list when temperature sensor detects the current temperature value of 301 inner cavity of shell higher than preset temperature value
Member keeps the heat currently generated that 301 inner cavity of shell is made to maintain current temperature value.
The preset temperature value is 10-20 DEG C；The preset temperature value and the selection of the vapor deposition object in crucible body 1 have
It closes, its vapourizing temperature of the difference of vapor deposition object selection is also just different.
Referring to figure 2., the heating unit includes metal hose 302, bracket 303 and magnet exciting coil 304, the excitation wire
Circle 304 is electrically connected with the controller, and the bracket 303 is fixed at 301 inner cavity of shell, and the bracket 303 is close
The one side of the evaporation source shutter 2 is equipped with magnetic stripe 306, and the magnetic stripe 306 is equipped with notch, and the excitation wire passes through institute
It states notch to be wrapped on the magnetic stripe 306, the metal hose 302 is arranged in the bracket 303 close to the evaporation source shield
On the opposite another side of the one side of plate 2, the metal hose 302 is connect with the cooling water pipeline of peripheral hardware；In order to make
Must be by the more preferable of the fixation of magnet exciting coil 304, it can be by the way that multiple magnetic stripes 306, the setting of specific magnetic stripe 306 be arranged on bracket 303
Position can refer to Fig. 2.
The heating unit can also directly adopt resistance wire, and the heating wire is in the S-shaped distribution in 301 inner cavity of shell；
301 inner cavity of shell is equipped with Graphite pad, institute between the one side and the heating unit of the evaporation source shutter 2
Graphite pad is stated to contact with the heating unit.
The shell 301 is equipped with opening and the opening is arranged towards the evaporation source shutter 2, the heating device 3
It further include ceramic wafer 305, the ceramic wafer 305 closes the opening of the shell 301, the ceramic wafer 305 and the evaporation
Source shield plate 2 contacts；Ceramic wafer 305 is also changed to micro-crystal plate in the actual implementation process.
The above-mentioned vapor deposition crucible with heating device 3 further includes the first elevating mechanism and the second elevating mechanism 307, and described
One elevating mechanism is arranged on the evaporation source shutter 2 and goes up and down with 2 releasable connection of evaporation source shutter, described first
Mechanism is electrically connected with the controller, and first elevating mechanism is configured as controlling the evaporation source shutter 2 in the spray
It is risen or fallen above mouth, when the evaporation source shutter 2 drops on the nozzle, the controller controls the heating
Unit stops heating.
Second elevating mechanism 307 be arranged on the heating device 3 and with 3 releasable connection of heating device, institute
It states the second elevating mechanism 307 and is configured as controlling the heating device 3 and risen or fallen above the evaporation source shutter 2.
Pneumatically or electrically driving method can be used in first elevating mechanism and the second elevating mechanism 307.
The quantity of the quantity of the heating device 3, the quantity of evaporation source shutter 2 and crucible body 1 is equal and described
The shape of heating device 3 is adapted with the shape of affiliated evaporation source shutter 2.
Referring to figure 4., the embodiment of the present invention two are as follows:
Embodiment two and the difference of embodiment one are: the quantity of the evaporation source shutter 2 and the quantity of crucible body 1
Equal, multiple evaporation source shutters 2 share a heating device 3.
The working principle of the above-mentioned vapor deposition crucible with heating device 3 are as follows:
Heating unit includes metal hose 302, bracket 303 and magnet exciting coil 304, constitutes the heating side of magnetic field induction vortex
Formula, after heating unit energization, the high-frequency alternating magnetic field in magnet exciting coil 304 generates vortex and generates heat in 301 inner cavity of shell,
Temperature information is passed to controller after reaching preset temperature value by the temperature value of temperature sensor monitoring 301 inner cavity of shell,
Controller control is passed through the size of the electric current of magnet exciting coil 304 to control the heat of the generation of magnet exciting coil 304；By by metal
Hose 302 is connect with the cooling water pipe of peripheral hardware, can be passed through the cooling that recirculated cooling water realizes magnet exciting coil 304, is filled in heating
It sets 3 and can be passed directly into cooling water when needing to cool down and cool down；
When heating device 3 works, it can be driven and be declined by the second elevating mechanism 307, ceramic wafer 305 and evaporation source shield
Plate 2 is bonded, and the high-frequency alternating magnetic field in magnet exciting coil 304 generates vortex and generates heat, evaporation source shutter in 301 inner cavity of shell
In the heated vaporization to the intracorporal other shutters of evaporated device chamber of the vapor deposition object adhered on 2, to realize on evaporation source shutter 2
The cleaning of attachment；
When evaporation source shutter 2 is covered on the nozzle of crucible body 1, controller, which controls magnet exciting coil 304, to be stopped producing
Heating device 3 can be promoted by the second elevating mechanism 307 and return to original position, need to clear up in evaporation source shutter 2 by heat amount
When, heating device 3 is dropped on evaporation source shutter 2 again by the second elevating mechanism 307 and is pasted with evaporation source shutter 2
It closes and realizes cleaning.
The case where above-mentioned vapor deposition crucible with heating device 3 includes forming a film and two kinds of situations of non-film, film forming can refer to
Fig. 5, it is assumed that there are three crucible bodies 1 to participate in vapor deposition processing procedure, and evaporation source screening is not covered on the nozzle of one of crucible body 1
Baffle 2, i.e., corresponding crucible body 1 participates in glass substrate film forming at this time；Steaming is covered on the nozzle of other two crucible bodies 1
Rise shutter 2, i.e., corresponding crucible body 1 has neither part nor lot in glass substrate film forming at this time, and Fig. 3 and Fig. 4 are that crucible body 1 is not joined
The case where forming a film with glass substrate.
In conclusion a kind of vapor deposition crucible with heating device provided by the invention, due to product on evaporation source shutter
Tire out excessive organic material, organic material cracking, which falls off, in switching causes the material in evaporation source to report to the leadship after accomplishing a task the risk of pollution, leads to
Crossing setting heating device is to provide heat needed for the vapor deposition object that will adhere on evaporation source shutter is heated to steam state, is played automatic
The effect of the material adhered on cleaning evaporation source shutter avoids the material falls back in switching evaporation source shutter every time from causing to steam
Material is reported to the leadship after accomplishing a task pollution in plating source, and can be avoided regular opening vapor deposition cavity replacement evaporation source shutter and caused by processing procedure when
Between extend, to improve production efficiency.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (8)
1. a kind of vapor deposition crucible with heating device, which is characterized in that crucible body, evaporation source shield including being equipped with nozzle
Plate and controller, the evaporation source shutter are located above the nozzle；
The evaporation source shutter is equipped with heating device far from the one side of the nozzle, and the heating device includes shell,
The inner cavity of the shell is equipped with heating unit and temperature sensor, and the heating unit setting is in the housing cavity close to described
On the one side of evaporation source shutter, the heating unit is configured to supply the vapor deposition that will adhere on the evaporation source shutter
Heat needed for object is heated to steam state；
The controller is electrically connected with the heating unit and temperature sensor respectively, and the controller is configured as when the temperature
Degree sensor detects that controlling the heating unit when the current temperature value of the housing cavity is higher than preset temperature value keeps
The heat currently generated makes the housing cavity maintain current temperature value.
2. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that the heating unit includes gold
Belong to hose, bracket and magnet exciting coil, the magnet exciting coil to be electrically connected with the controller, the bracket is fixed at the shell
Intracoelomic cavity, the bracket are equipped with magnetic stripe close to the one side of the evaporation source shutter, and the magnetic stripe is equipped with notch, described
Excitation wire is wrapped on the magnetic stripe by the notch, and the metal hose setting hides in the bracket close to the evaporation source
On the opposite another side of the one side of baffle, the cooling water pipeline of the metal hose and peripheral hardware is connected.
3. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that the shell be equipped with opening and
The opening is arranged towards the evaporation source shutter, and the heating device further includes ceramic wafer, and the ceramic wafer closes residence
The opening of shell is stated, the ceramic wafer is contacted with the evaporation source shutter.
4. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that the preset temperature value is
10-20℃。
5. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that the number of the heating device
The quantity of amount, the quantity of evaporation source shutter and crucible body is equal and the shape of the heating device and affiliated evaporation source hide
The shape of baffle is adapted.
6. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that the evaporation source shutter
The quantity of quantity and crucible body is equal, and multiple evaporation source shutters share a heating device.
7. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that further include the first elevator
Structure, first elevating mechanism be arranged on the evaporation source shutter and with the evaporation source shutter releasable connection, it is described
First elevating mechanism is electrically connected with the controller, and first elevating mechanism, which is configured as controlling the evaporation source shutter, to exist
It is risen or fallen above the nozzle, when the evaporation source shutter drops on the nozzle, the controller controls institute
It states heating unit and stops heating.
8. the vapor deposition crucible according to claim 1 with heating device, which is characterized in that further include the second elevator
Structure, second elevating mechanism are arranged on the heating device and go up and down with the heating device releasable connection, described second
Mechanism is configured as controlling the heating device to be risen or fallen above the evaporation source shutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910718627.3A CN110438454A (en) | 2019-08-05 | 2019-08-05 | A kind of vapor deposition crucible with heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910718627.3A CN110438454A (en) | 2019-08-05 | 2019-08-05 | A kind of vapor deposition crucible with heating device |
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| Publication Number | Publication Date |
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| CN110438454A true CN110438454A (en) | 2019-11-12 |
Family
ID=68433344
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910718627.3A Pending CN110438454A (en) | 2019-08-05 | 2019-08-05 | A kind of vapor deposition crucible with heating device |
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Citations (10)
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|---|---|---|---|---|
| JPS61110759A (en) * | 1984-11-01 | 1986-05-29 | Toshiba Corp | Vapor-depositing device |
| JPH03199371A (en) * | 1989-12-28 | 1991-08-30 | Oki Electric Ind Co Ltd | Device for forming thin film by vapor deposition |
| JPH03215663A (en) * | 1990-01-22 | 1991-09-20 | Hitachi Ltd | Sputtering device |
| JPH05132760A (en) * | 1991-11-08 | 1993-05-28 | Ulvac Japan Ltd | Vapor-deposition polymerization device |
| JPH10168559A (en) * | 1996-12-06 | 1998-06-23 | Ulvac Japan Ltd | Organic thin film forming device and method for reutilizing organic material |
| JP2008127642A (en) * | 2006-11-22 | 2008-06-05 | Toppan Printing Co Ltd | Vapor deposition system and method for regenerating vapor deposition material |
| CN201785478U (en) * | 2010-05-21 | 2011-04-06 | 昆山维信诺显示技术有限公司 | Evaporation plating device |
| CN204417579U (en) * | 2014-12-30 | 2015-06-24 | 上海天马有机发光显示技术有限公司 | A kind of evaporation coating device |
| CN207143326U (en) * | 2017-05-12 | 2018-03-27 | 京东方科技集团股份有限公司 | A kind of linear evaporation source and evaporated device |
| CN109930113A (en) * | 2017-12-15 | 2019-06-25 | 合肥鑫晟光电科技有限公司 | Evaporation coating device |
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2019
- 2019-08-05 CN CN201910718627.3A patent/CN110438454A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61110759A (en) * | 1984-11-01 | 1986-05-29 | Toshiba Corp | Vapor-depositing device |
| JPH03199371A (en) * | 1989-12-28 | 1991-08-30 | Oki Electric Ind Co Ltd | Device for forming thin film by vapor deposition |
| JPH03215663A (en) * | 1990-01-22 | 1991-09-20 | Hitachi Ltd | Sputtering device |
| JPH05132760A (en) * | 1991-11-08 | 1993-05-28 | Ulvac Japan Ltd | Vapor-deposition polymerization device |
| JPH10168559A (en) * | 1996-12-06 | 1998-06-23 | Ulvac Japan Ltd | Organic thin film forming device and method for reutilizing organic material |
| JP2008127642A (en) * | 2006-11-22 | 2008-06-05 | Toppan Printing Co Ltd | Vapor deposition system and method for regenerating vapor deposition material |
| CN201785478U (en) * | 2010-05-21 | 2011-04-06 | 昆山维信诺显示技术有限公司 | Evaporation plating device |
| CN204417579U (en) * | 2014-12-30 | 2015-06-24 | 上海天马有机发光显示技术有限公司 | A kind of evaporation coating device |
| CN207143326U (en) * | 2017-05-12 | 2018-03-27 | 京东方科技集团股份有限公司 | A kind of linear evaporation source and evaporated device |
| CN109930113A (en) * | 2017-12-15 | 2019-06-25 | 合肥鑫晟光电科技有限公司 | Evaporation coating device |
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Application publication date: 20191112 |