CN110418032A - Camera module and electronic device - Google Patents
Camera module and electronic device Download PDFInfo
- Publication number
- CN110418032A CN110418032A CN201810402440.8A CN201810402440A CN110418032A CN 110418032 A CN110418032 A CN 110418032A CN 201810402440 A CN201810402440 A CN 201810402440A CN 110418032 A CN110418032 A CN 110418032A
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- support portion
- camera module
- circuit board
- printed circuit
- container
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- 230000003287 optical effect Effects 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 description 20
- 239000003990 capacitor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000003447 ipsilateral effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of camera module and electronic devices.Camera module includes receiving module, emitting mould train and bracket.Bracket includes the first support portion and the second support portion.Second support zone in the first support portion side and opposite first support portion project upwards.Second support portion offers device slot.Receiving module is arranged in the first support portion.The second support portion side opposite with device slot is arranged in emitting mould train.In camera module and electronic device of the invention, receiving module and emitting mould train can be separately positioned on height different the first support portion and the second support portion by bracket, so that the upper surface of receiving module and emitting mould train is remained basically stable, be conducive to the information of signal and receiving module received signal acquisition object that camera module is issued according to emitting mould train.Other electronic devices that camera module can be accommodated in device slot, can keep the safe distance of other electronic devices and bracket, be conducive to the Miniaturization Design of camera module and electronic device.
Description
Technical field
The present invention relates to image acquisition technology, in particular to a kind of camera module and electronic device.
Background technique
In the camera module of the relevant technologies, flight time ranging (Time of flight, TOF) mould group can pass through inspection
It surveys after being reflected from the signal that emitting mould train issues by object and reaches the time used in receiving module to determine flight time ranging mould
The distance between group and object, to obtain the three-dimensional information of object.Flight time ranging mould group can usually be incited somebody to action by bracket
Emitting mould train and receiving module group is in pairs takes the photograph so that the upper surface of emitting mould train and both receiving modules is remained basically stable, however, often
The double brackets for taking the photograph mould group of the stent-type seen itself are needed to keep between certain safety between bracket and mould group there are certain wall thickness
Away from being unfavorable for the Miniaturization Design of camera module so that the size of camera module increases.
Summary of the invention
Embodiments of the present invention provide a kind of camera module and electronic device.
A kind of camera module of embodiment of the present invention includes receiving module, emitting mould train and bracket, the bracket packet
The first support portion and the second support portion are included, second support zone is in the side and relatively described first of first support portion
Support portion projects upwards, and second support portion offers device slot, and the receiving module is arranged in first support portion, institute
It states emitting mould train and second support portion side opposite with the device slot is set.
In the camera module of embodiment of the present invention, receiving module and emitting mould train can be separately positioned on height by bracket
It spends on different the first support portion and the second support portion, so that the upper surface of receiving module and emitting mould train is remained basically stable, favorably
The signal and receiving module received signal issued in camera module according to emitting mould train obtains the information of object.In device slot
Other electronic devices that camera module can be accommodated, can keep the safe distance of other electronic devices and bracket, be conducive to
The Miniaturization Design of camera module.
In some embodiments, first support portion offers the first container and the second container, and described first
Container and second container are located at the opposite two sides of first support portion, and it is logical that first container offers first
Hole, the first through hole are connected to first container and second container.In this way, the first container and the second container
The element of receiving module can be accommodated, be supported, receiving module stable structure is kept, is conducive to receiving module and receives emitting mould train hair
Signal out.
In some embodiments, the receiving module includes camera lens, optical filter and imaging sensor, the camera lens setting
In first support portion, described image sensor is arranged in first container and is located at the image side of the camera lens, described
Optical filter is arranged in second container and between the camera lens and described image sensor.In this way, emitting mould train can
With the signal that emits beam, the light signal that object reflexes to receiving module is converged to imaging sensor to obtain object by camera lens
Three-dimensional information.Optical filter can make the light of relevant wavelength pass through, and filter out unrelated light, be conducive to improve camera module
The accuracy of detection.
In some embodiments, the camera module includes the first printed circuit board, the bracket and described image
Sensor is arranged in first printed circuit board.In this way, bracket and the first printed circuit board can be fixedly connected, wherein bracket
Cooperate with the first printed circuit board so that the first container forms relatively closed space, imaging sensor setting is in the first receiving
The interference of external environment is not readily susceptible in slot, so that imaging sensor can work normally.Imaging sensor and the first printing
Circuit board may be implemented to be electrically connected.
In some embodiments, the camera module includes the first flexible circuit board, first flexible circuit board
First printed circuit board is connected, first flexible circuit board is provided with company far from one end of first printed circuit board
Connect device.In this way, the first printed circuit board can be attached by the first flexible circuit board and external circuitry, so that class can be controlled
Imaged sensor acquires light signal, while the light signal that imaging sensor acquires can be transmitted to external circuit and carried out
It handles to obtain the three-dimensional information of object.
In some embodiments, the camera module includes the second printed circuit board, second printed circuit board
It is arranged in second support portion, second printed circuit board, one opposite with the bracket is arranged in the emitting mould train
Side.In this way, emitting mould train and the second printed circuit board may be implemented to be electrically connected, transmitting can control by the second printed circuit board
Mould group emits beam signal.
In some embodiments, the camera module includes the second flexible circuit board, second flexible circuit board
Connect first printed circuit board and second printed circuit board.In this way, the first printed circuit board and the second printed circuit
Plate can be carried out data transmission by the second flexible circuit board, and camera module can be associated with the letter of receiving module and emitting mould train
Breath reaches the time used in receiving module after being reflected from the signal that emitting mould train issues by object so as to camera module detection, really
The distance between camera module and object are determined, to obtain the three-dimensional information of object.
In some embodiments, second support portion offers the second through-hole, and second through-hole is connected to the device
Part slot, second printed circuit board cover set second through-hole.It is appreciated that the second printed circuit board is connect with bracket one
Other electronic devices of camera module can be set in side, in this way, the side being connect on the second printed circuit board with bracket
Other electronic devices can pass through the second through-hole and be arranged in device slot.Wherein, bracket, the first printed circuit board and the second printing
Circuit board cooperates so that device slot forms relatively closed space, other electronic devices being arranged in device slot are not readily susceptible to
External interference, so as to work normally.The safe distance that can be kept with bracket is arranged in device slot in other electronic devices,
At the same time it can also optimize the space setting of camera module, be conducive to the Miniaturization Design of camera module.
In some embodiments, second support portion includes positioning column, and the positioning column wears second printing
Circuit board.In this way, the second printed circuit board is formed with through-hole corresponding with positioning column, the second printed circuit board can pass through positioning
Column be quickly mounted between on, meanwhile, positioning column can limit the displacement of the second printed circuit board, be conducive to keep camera
Modular structure is stablized, and the reliability of camera module is increased.
A kind of electronic device of embodiments of the present invention includes camera module described in any of the above-described embodiment.
The electronic device of embodiment of the present invention uses the camera module of embodiment of the present invention, and bracket can will image
The receiving module and emitting mould train of head mould group are separately positioned on height different the first support portion and the second support portion, so that connecing
The upper surface for receiving mould group and emitting mould train is remained basically stable, and signal and reception that camera module is issued according to emitting mould train are conducive to
The information of mould group received signal acquisition object.Other electronic devices of camera module, Ke Yibao can be accommodated in device slot
The safe distance for holding other electronic devices and bracket is conducive to the Miniaturization Design of electronic device and camera module.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the schematic perspective view of the camera module of embodiment of the present invention；
Fig. 2 is the top view of the camera module of embodiment of the present invention；
Fig. 3 is diagrammatic cross-section of the camera module along the direction III-III of Fig. 2；
Fig. 4 is the stereoscopic schematic diagram of the bracket of embodiment of the present invention；
Fig. 5 is the right view of the camera module of embodiment of the present invention；With
Fig. 6 is the floor map of the electronic device of embodiment of the present invention.
Main element symbol description:
Electronic device 100, camera module 10, receiving module 11, camera lens 112, optical filter 114, imaging sensor 116,
Emitting mould train 12, bracket 13, the first support portion 132, the first container 1322, the second container 1324, first through hole 1326, half
Circular groove 1328, the second support portion 134, device slot 1342, the second through-hole 1344, positioning column 1346, position limiting structure 1348, first print
Printed circuit board 14, the first flexible circuit board 15, connector 152, the second printed circuit board 16, the second flexible circuit board 17, capacitor
Device 18.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.In
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected.It can
To be mechanical connection, it is also possible to be electrically connected.It can be directly connected, can also can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Also referring to Fig. 1, Fig. 2 and Fig. 3, a kind of camera module 10 of embodiment of the present invention includes receiving module
11, emitting mould train 12 and bracket 13.Bracket 13 includes the first support portion 132 and the second support portion 134.Second support portion 134
In the first support portion 132 side and opposite first support portion 132 project upwards.Second support portion 134 offers device slot
1342.Receiving module 11 is arranged in the first support portion 132.The setting of emitting mould train 12 is in the second support portion 134 and device slot 1342
Opposite side.
In the camera module 10 of embodiment of the present invention, bracket 13 can distinguish receiving module 11 and emitting mould train 12
It is arranged on height different the first support portion 132 and the second support portion 134, so that receiving module 11 and emitting mould train 12 is upper
Surface is remained basically stable, and 11 received signal of signal and receiving module that camera module 10 is issued according to emitting mould train 12 is conducive to
Obtain the information of object.Other electronic devices that camera module 10 can be accommodated in device slot 1342 can keep other electricity
The safe distance of sub- device and bracket 13 is conducive to the Miniaturization Design of camera module 10.
Specifically, in the present embodiment, the setting of receiving module 11 exists in the first support portion 132, the setting of emitting mould train 12
Second support portion 134 side opposite with device slot 1342.In other embodiments, emitting mould train 12 may be provided at first
Support part 132, receiving module 12 may be provided at the second support portion 134 side opposite with device slot 1342.
In some embodiments, emitting mould train 12 can be Laser emission mould group, and receiving module 11 is photosensitive mould group.Such as
This, camera module 10 can be flight time ranging mould group, anti-by object by detecting the signal issued from emitting mould train 12
The time used in receiving module 11 is reached after penetrating to determine the distance between camera module 10 and object, thus camera module
The three-dimensional information of 10 available objects.In one example, emitting mould train 12 can be vertical cavity surface emitting laser
(Vertical Cavity Surface Emitting Laser, VCSEL).
In some embodiments, bracket 13 is an integral structure.In this way, 13 structure of bracket is simple, stablizes, be conducive to excellent
Change the space setting of camera module 10.It is manufactured for example, bracket 13 can be integrally formed by plastic material.Certainly, bracket 13
It is integrally manufactured that metal material can be used.
In some embodiments, the first support portion 132 offers the first container 1322 and the second container 1324.The
One container 1322 and the second container 1324 are located at the opposite two sides of the first support portion 132.First container 1322 offers
First through hole 1326.First through hole 1326 is connected to the first container 1322 and the second container 1324.
In this way, the first container 1322 and the second container 1324 can accommodate, support the element of receiving module 11, keep
11 stable structure of receiving module is conducive to receiving module 11 and receives the signal that emitting mould train 12 issues.
Specifically, in some embodiments, the first container 1322 and device slot 1342 are arranged at intervals on bracket 13
It is ipsilateral.
In some embodiments, receiving module 11 includes camera lens 112, optical filter 114 and imaging sensor 116.Camera lens
112 are arranged in the first support portion 132.Imaging sensor 116 is arranged in the first container 1322 and is located at the image side of camera lens 112.
Optical filter 114 is arranged in the second container 1324 and between camera lens 112 and imaging sensor 116.
The signal in this way, emitting mould train 12 can emit beam, camera lens 112 believe the light that object reflexes to receiving module 11
Number imaging sensor 116 is converged to obtain the three-dimensional information of object.Optical filter 114 can make the light of relevant wavelength logical
It crosses, filters out unrelated light, be conducive to improve the accuracy that camera module 10 detects.Wherein, first through hole 1326 is open small
In the size of the second container 1324, the setting of optical filter 114 can keep 114 position of optical filter steady in the second container 1324
It is fixed.Light can be transmitted to imaging sensor 116 by first through hole 1326 after optical filter 114.
Referring to Fig. 4, in some embodiments, the flat shape of the second container 1324 is square.Second container
1324 four angles, which are formed, outwardly extending half slot 1328.
In this way, half slot 1328 can be convenient the installation of the optical filter 114 in the second container 1324 and take out, can also facilitate
Dispensing is carried out to fix optical filter 114 to optical filter 114.In other examples, camera lens 112 can be carried out by half slot 1328
Positioning, is conducive to the assembly of camera module 10.
In some embodiments, imaging sensor 116 include charge-coupled device (Charge Coupled Device,
CCD) sensor or complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor,
CMOS) sensor.
Referring to Fig. 3, in some embodiments, camera module 10 includes the first printed circuit board 14.13 He of bracket
Imaging sensor 116 is arranged in the first printed circuit board 14.
In this way, bracket 13 can be fixedly connected with the first printed circuit board 14, wherein bracket 13, receiving module 11 and first
Printed circuit board 14 cooperates so that the first container 1322 and the second container 1324 form relatively closed space, image sensing
Device 116 and optical filter 114, which are separately positioned in the first container 1322 and the second container 1324, can be not readily susceptible to the external world
The interference of environment, so that imaging sensor 116 can work normally.Imaging sensor 116 and the first printed circuit board 14 can be with
Realize electrical connection.
Referring to Fig. 5, in some embodiments, camera module 10 includes the first flexible circuit board 15.First is flexible
Circuit board 15 connects the first printed circuit board 14.First flexible circuit board 15 is provided with far from one end of the first printed circuit board 14
Connector 152.
In this way, the first printed circuit board 14 can be attached by the first flexible circuit board 15 and external circuitry, thus
It can control imaging sensor 116 and acquire light signal, while the light signal that imaging sensor 116 acquires can be transmitted to
External circuit is handled to obtain the three-dimensional information of object.The setting of connector 152 can be convenient the second flexible circuit board 17
With the plug of external circuit.
Referring to Fig. 3, in some embodiments, camera module 10 includes the second printed circuit board 16.Second
Printed circuit board 16 is arranged in the second support portion 134.The setting of emitting mould train 12 is opposite with bracket 13 in the second printed circuit board 16
Side.
In this way, emitting mould train 12 and the second printed circuit board 16 may be implemented to be electrically connected, pass through the second printed circuit board 16
It can control emitting mould train 12 to emit beam signal.
In some embodiments, camera module 10 includes the second flexible circuit board 17.Second flexible circuit board 17 connects
Connect the first printed circuit board 14 and the second printed circuit board 16.
In this way, the first printed circuit board 14 and the second printed circuit board 16 can be counted by the second flexible circuit board 17
According to transmission, camera module 10 can be associated with the information of receiving module 11 and emitting mould train 12 so as to camera module 10 detection from
The signal that emitting mould train 12 issues reaches the time used in receiving module 11 after being reflected by object, determines camera module 10 and object
The distance between body, to obtain the three-dimensional information of object.
In some embodiments, the second support portion 134 offers the second through-hole 1344.Second through-hole 1344 is connected to device
Slot 1342.Second printed circuit board 16 lid sets the second through-hole 1344.
It is appreciated that the electricity of camera module 10 can be set in the side that the second printed circuit board 16 is connect with bracket 13
Container piece 18 leads in this way, the capacitor element 18 for the side connecting on the second printed circuit board 16 with bracket 13 can pass through second
Hole 1344 is arranged in device slot 1342.Wherein, bracket 13, the first printed circuit board 14 and the cooperation of the second printed circuit board 16 make
It obtains device slot 1342 and forms relatively closed space, the capacitor element 18 being arranged in device slot 1342 is not readily susceptible to extraneous dry
It disturbs, so as to work normally.The safe distance that can be kept with bracket 13 is arranged in device slot 1342 in capacitor element 18, together
When, the space setting of camera module 10 can also be optimized, be conducive to the Miniaturization Design of camera module 10.
Likewise, the capacitor element 18 of camera module 10 can with imaging sensor 116 is ipsilateral is arranged at intervals on first
Printed circuit board 14.In this way, the setting of imaging sensor 116 is in the first receiving when bracket 13 is connect with the first printed circuit board 14
Slot 1322, and the capacitor element 18 on the first printed circuit board 14 can be set in device slot 1342, can keep and bracket 13
Safe distance, likewise, can optimize the space setting of camera module 10, the miniaturization for being conducive to camera module 10 set
Meter.
In some embodiments, the capacitor element 18 of camera module 10 can be arranged with the ipsilateral interval of emitting mould train 12
In the second printed circuit board 16.In this way, the space of camera module 10 can be made full use of, it is equally beneficial for camera module 10
Miniaturization setting.
Also referring to Fig. 1 and Fig. 4, in some embodiments, the second support portion 134 includes positioning column 1346.Positioning
Column 1346 wears the second printed circuit board 16.
In this way, the second printed circuit board 16 is formed with through-hole corresponding with positioning column 1346, the second printed circuit board 16 can
To be quickly mounted on the second support portion 134 by positioning column 1346, meanwhile, positioning column 1346 can limit the second printing electricity
The displacement of road plate 16 is conducive to keep 10 stable structure of camera module, increases the reliability of camera module 10.
Specifically, in the illustrated embodiment, the flat shape of the second support portion 134 is in rectangle.Positioning column 1346
Quantity is three and is in three corner locations of the angular distribution in the second support portion 134.In this way, positioning column 1346 can keep
Two printed circuit boards 16 are less likely to occur to be displaced.
Certainly, in other embodiments, the quantity of positioning column 1346 can be not limited to embodiment discussed above, and
It can according to need using the positioning column 1346 more than two or three.
In some embodiments, the second support portion 134 includes position limiting structure 1348, and 1348 projection of position limiting structure is second
The position of proximal edge is leaned in the upper surface of support portion 134, and position limiting structure 1348 limits the accommodating of the second printed circuit board 16 of positioning
Slot.In this way, positioning column 1346 and the cooperation of position limiting structure 1348 can make the second printed circuit board 16 be less likely to occur to be displaced, have
Conducive to the structural stability for keeping camera module 10, increase the reliability of camera module 10.
Referring to Fig. 6, a kind of electronic device 100 of embodiments of the present invention includes the camera shooting of any of the above-described embodiment
Head mould group 10.
For the electronic device 100 of embodiment of the present invention using the camera module 10 of embodiment of the present invention, bracket 13 can
The receiving module 11 of camera module 10 and emitting mould train 12 are separately positioned on different the first support portion 132 of height and the
On two support portions 134, so that the upper surface of receiving module 11 and emitting mould train 12 is remained basically stable, be conducive to camera module 10
The signal and 11 received signal of receiving module that issue according to emitting mould train 12 obtain the information of object.It can be received in device slot 1342
Hold the capacitor element 18 of camera module 10, electronics dress can be conducive to the safe distance of holding capacitor device 18 and bracket 13
Set the Miniaturization Design of 100 and camera module 10.
In some embodiments, electronic device 100 includes but is not limited to mobile phone, tablet computer, laptop, intelligence
Electronic devices such as wearable device, door lock, car-mounted terminal, unmanned plane etc..In the example in the figures, electronic device 100 is mobile phone.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific
Feature, structure, material or feature are contained at least one embodiment or example of the invention.In the present specification, right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that: In
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (10)
1. a kind of camera module, which is characterized in that including receiving module, emitting mould train and bracket, the bracket includes first
Support portion and the second support portion, side and relatively described first support portion of second support zone in first support portion
It projects upwards, second support portion offers device slot, and the receiving module is arranged in first support portion, the transmitting
Second support portion side opposite with the device slot is arranged in mould group.
2. camera module as described in claim 1, which is characterized in that first support portion offer the first container and
Second container, first container and second container are located at the opposite two sides of first support portion, and described
One container offers first through hole, and the first through hole is connected to first container and second container.
3. camera module as claimed in claim 2, which is characterized in that the receiving module includes camera lens, optical filter and figure
As sensor, in first support portion, described image sensor is arranged in first container and position for the camera lens setting
In the image side of the camera lens, the optical filter setting is in second container and is located at the camera lens and described image sensor
Between.
4. camera module as claimed in claim 3, which is characterized in that the camera module includes the first printed circuit
Plate, the bracket and described image sensor are arranged in first printed circuit board.
5. camera module as claimed in claim 4, which is characterized in that the camera module includes the first flexible circuit
Plate, first flexible circuit board connect first printed circuit board, and first flexible circuit board is far from first print
One end of printed circuit board is provided with connector.
6. camera module as claimed in claim 4, which is characterized in that the camera module includes the second printed circuit
Plate, in second support portion, the emitting mould train is arranged in second printed circuit for the second printed circuit board setting
The plate side opposite with the bracket.
7. camera module as claimed in claim 6, which is characterized in that the camera module includes the second flexible circuit
Plate, second flexible circuit board connect first printed circuit board and second printed circuit board.
8. camera module as claimed in claim 6, which is characterized in that second support portion offers the second through-hole, institute
It states the second through-hole and is connected to the device slot, second printed circuit board cover sets second through-hole.
9. camera module as claimed in claim 6, which is characterized in that second support portion includes positioning column, described fixed
Position column wears second printed circuit board.
10. a kind of electronic device, which is characterized in that including the described in any item camera modules of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810402440.8A CN110418032A (en) | 2018-04-28 | 2018-04-28 | Camera module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810402440.8A CN110418032A (en) | 2018-04-28 | 2018-04-28 | Camera module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110418032A true CN110418032A (en) | 2019-11-05 |
Family
ID=68357144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810402440.8A Pending CN110418032A (en) | 2018-04-28 | 2018-04-28 | Camera module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110418032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913196A (en) * | 2019-12-26 | 2020-03-24 | 昆山丘钛微电子科技有限公司 | TOF module and electronic product |
Citations (10)
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