CN208297723U - Photoelectricity mould group and electronic device - Google Patents

Abstract

The utility model discloses a kind of photoelectricity mould group and electronic devices.Photoelectricity mould group includes transmitter, receiver and bracket.Transmitter is for emitting laser；Receiver is for receiving laser；Bracket includes the first connecting portion and second connecting portion to connect, first connecting portion includes mounting surface, transmitter is arranged on mounting surface, second connecting portion includes the ontology and barrel to connect, ontology connects with first connecting portion, barrel extends from ontology to the direction of the top surface far from second connecting portion, and receiver is arranged in second connecting portion and flushes at the top of barrel exposure, the top of transmitter and receiver.In the photoelectricity mould group and electronic device of the utility model, bracket includes first connecting portion and second connecting portion, transmitter is arranged in first connecting portion, receiver is arranged in second connecting portion, so as to be flushed at the top of transmitter and receiver, therefore, receiver will not block the laser of transmitter transmitting, and photoelectricity mould group can obtain the depth data of more complete target object.

Description

Photoelectricity mould group and electronic device

Technical field

The utility model relates to consumer electronics fields, more specifically, are related to a kind of photoelectricity mould group and electronic device.

Background technique

Currently, in camera module, flight time ranging (Time of flight, TOF) mould group can by detection from The signal that emitting mould train issues reaches the time used in receiving module to determine the flight time after being reflected by object, and then by flying The row time obtains the distance between ranging mould group and object, to obtain the three-dimensional information of object.Emitting mould train can be used infrared Laser emits laser, and receiving module can be used camera and receive laser, but the small volume of infrared laser, the body of camera Product is larger, and laser that infrared laser projects outward is easy to be blocked by camera, reduces the area of laser projection, and more difficult obtains Obtain the depth data of the target object in complete object space.

Utility model content

The utility model embodiment provides a kind of photoelectricity mould group and electronic device.

The photoelectricity mould group of the utility model embodiment includes transmitter, receiver and bracket.The transmitter is for sending out Penetrate laser；The receiver is for receiving the laser；The bracket includes the first connecting portion and second connecting portion to connect, institute Stating first connecting portion includes mounting surface, and the transmitter is arranged on the mounting surface, and the second connecting portion includes connecting Ontology and barrel, the ontology connect with the first connecting portion, and the barrel is from the ontology to far from second connection The direction of the top surface in portion extends, and the receiver is arranged in the second connecting portion and exposes from the barrel, the transmitting It is flushed at the top of the top of device and the receiver.

In the photoelectricity mould group of the utility model embodiment, bracket includes first connecting portion and second connecting portion, transmitter It is arranged in first connecting portion, receiver is arranged in second connecting portion, so that the top of transmitter and the top of receiver are neat Flat, therefore, receiver will not block the laser of transmitter transmitting, and photoelectricity mould group can obtain the depth of more complete target object Degree evidence.

In some embodiments, the transmitter includes transmitting ontology and transmitter circuit board, the transmitter circuit Plate is arranged on the mounting surface, and the transmitting ontology is arranged in the transmitter circuit board；The receiver includes receiving Device circuit board, the second connecting portion and the hardened conjunction of the acceptor circuit；The transmitter circuit board and receiver electricity The connection of road plate.

In this way, transmitter circuit board, which can control transmitting ontology, persistently emits laser, acceptor circuit plate can be controlled and be connect Receive device and receive laser, acceptor circuit plate and transmitter circuit board electrically and mechanically, to realize to photoelectricity mould group to mesh Mark the ranging of object.

In some embodiments, the transmitter circuit board is rigid-flexible circuit board, and the acceptor circuit plate is Rigid-flexible circuit board.In this way, transmitter circuit board and acceptor circuit plate all have stronger rigidity, thus for transmitter and Receiver provides enough support strengths, and transmitter circuit board and acceptor circuit plate all have preferable bending, side Just the size of transmitter and receiver can also be reduced while assembling.

In some embodiments, the transmitter circuit board is printed circuit board (hardboard), the acceptor circuit plate For rigid-flexible circuit board.In this way, transmitter circuit board and acceptor circuit plate all have stronger rigidity, to be transmitter Enough support strengths is provided with receiver, and acceptor circuit plate also has a preferable bending, while ease of assembly Also it can reduce the size of receiver

In some embodiments, the transmitter circuit board is rigid-flexible circuit board, and the acceptor circuit plate is Printed circuit board (hardboard).So, on the one hand, transmitter circuit board and acceptor circuit plate all have stronger rigidity, thus Enough support strengths are provided for transmitter and receiver, and transmitter circuit board also has preferable bending, facilitates group Also it can reduce the size of transmitter while dress.

In some embodiments, the transmitter circuit board include first segment, third section and the connection first segment with The second segment of the third section is provided with transmitting connector in the third section；The acceptor circuit plate includes the first plate, the Second plate of three plates and connection first plate and the third plate is provided with reception connector on the third plate；Described Three plates are connect with the third section.

Setting transmitting connector in photoelectricity mould group, in this way, transmitter circuit board can be attached with external circuitry, thus It can control transmitter transmitting laser.Setting receives connector in photoelectricity mould group, in this way, acceptor circuit plate can be with external world's electricity Road is attached, and receives laser so as to control and receive device, while the laser signal that imaging sensor receives can be passed External circuit is transported to be handled to obtain the depth image of target object.Third plate is connect with the third section, transmitting connection Device and reception connector can share the same substrate, in this way, to reduce the size of entire photoelectricity mould group.

In some embodiments, the second connecting portion offers through hole, the second connecting portion and the reception Device circuit board combines and forms accommodating chamber, and the receiver further includes camera lens, optical filter and imaging sensor, and the camera lens is housed in In the barrel, described image sensor is arranged on the acceptor circuit plate and is housed in the accommodating chamber, the filter Mating plate is housed in the accommodating chamber and between the camera lens and described image sensor.

Since the camera lens, optical filter and imaging sensor of receiver are housed in accommodating chamber, in this way, camera lens, optical filter It can be protected well with imaging sensor, receiver can be also stably placed in second connecting portion.

In some embodiments, the second connecting portion further includes boss, the boss from the inner wall of the ontology to The center extension of the through hole, the camera lens and the optical filter are located at the opposite two sides of the boss.

Due to the position of boss limitation optical filter, optical filter will not be moved along the direction of camera lens optical axis, in this way, optical filter energy It is enough to be more steadily housed in accommodating chamber.

In some embodiments, the boss includes opposite the first face and the second face, first face more described the Two faces are close to described image sensor, and the optical filter is in conjunction with first face.

Since optical filter is in conjunction with the first face, in conjunction with mode include gluing, in this way, optical filter can be steadily housed in In accommodating chamber.

In some embodiments, the photoelectricity mould group further includes pedestal, and the pedestal offers light hole, the pedestal It is carried on the acceptor circuit plate, described image sensor is housed in the light hole, the second connecting portion carrying On the base.

Since the thickness of pedestal is greater than the thickness of imaging sensor, when second connecting portion is carried on pedestal, figure is increased As the distance between sensor and camera lens, in this way, imaging sensor can be made to be located at camera lens suitable by adjusting the thickness of pedestal The image side position of focal length, to realize preferably imaging effect.

In some embodiments, optical filter carrying on the base and with described image sensor interval.

In this way, optical filter does not have to directly carrying on the image sensor, and the imaging effect of imaging sensor is influenced, separately Outside, ontology no setting is required other support construction carries optical filter, keeps second connecting portion structure simpler.

The electronic device of the utility model embodiment includes photoelectricity mould group described in shell and any of the above-described embodiment, The photoelectricity mould group is arranged in the shell and for obtaining depth image.

In the electronic device of the utility model embodiment, bracket includes first connecting portion and second connecting portion, transmitter It is arranged in first connecting portion, receiver is arranged in second connecting portion, so that the top of transmitter and the top of receiver are neat Flat, therefore, receiver will not block the laser of transmitter transmitting, and photoelectricity mould group can obtain the depth of more complete target object Degree evidence.

The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.

Detailed description of the invention

In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment It will be apparent and be readily appreciated that, in which:

Fig. 1 is the structural schematic diagram of the electronic device of the utility model embodiment；

Fig. 2 is the structural schematic diagram of the photoelectricity mould group of the utility model embodiment；

Fig. 3 and Fig. 4 is the floor map of the photoelectricity mould group in Fig. 2；

Fig. 5 is the perspective exploded view of the photoelectricity mould group in Fig. 2；

Fig. 6 is the diagrammatic cross-section along line VI -- VI of the photoelectricity mould group in Fig. 3；

Fig. 7 and Fig. 8 is the floor map of the bracket of the utility model embodiment.

Main element and symbol description:

Electronic device 1000, shell 200, photoelectricity mould group 100, transmitter 10, transmitting ontology 11, transmitter circuit board 12, First segment 121, second segment 122, third section 123, transmitting connector 13, receiver 20, acceptor circuit plate 21, the first plate 211, Second plate 212, camera lens 22, optical filter 23, imaging sensor 24, receives connector 25, the connection of bracket 30, first at third plate 213 Portion 31, mounting surface 311, bottom surface 312, second connecting portion 32, ontology 321, barrel 322, through hole 323, accommodating chamber 324, boss 325, the first face 3251, the second face 3252, limiting slot 326, top surface 327, processor 40, projection window 50, acquisition window 60, company Connect device 70, pedestal 80, light hole 81.

Specific embodiment

The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing Same or similar element or element with the same or similar functions are indicated from beginning to end.In addition, describing with reference to the accompanying drawing The embodiments of the present invention be exemplary, be only used for explaining the embodiments of the present invention, and should not be understood as Limitations of the present invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down " It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.

Referring to Fig. 1, the electronic device 1000 of the utility model embodiment includes shell 200 and photoelectricity mould group 100.Electricity Sub-device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head and show equipment, access control system, automatic teller machine etc., this reality It is illustrated so that electronic device 1000 is mobile phone as an example with new embodiment, it will be understood that the concrete form of electronic device 1000 It can be other, this is not restricted.Photoelectricity mould group 100 is arranged in shell 200 and for obtaining depth image, shell 200 The protection such as dust-proof, waterproof, shatter-resistant can be provided to photoelectricity mould group 100.

Fig. 1 to Fig. 5 is please referred to, photoelectricity mould group 100 includes transmitter 10, receiver 20, bracket 30 and processor 40.Transmitting Device 10 and receiver 20 are co-located on bracket 30.Photoelectricity mould group 100 can be from the exposure of shell 200, specifically, on shell 200 It is formed with projection window 50 corresponding with transmitter 10, and acquisition window 60 corresponding with receiver 20.

Transmitter 10 is used to continue to emit laser to the target object of object space by projection window 50.Specifically, it sends out Emitter 10 includes transmitting ontology 11 and transmitter circuit board 12, and transmitting ontology 11 is arranged in transmitter circuit board 12.Transmitting is originally Body 11 is for emitting laser, and laser can be infrared light, and in one example, transmitter 11 can be vertical cavity surface-emitting laser Device (Vertical Cavity Surface Emitting Laser, VCSEL).Transmitter circuit board 12 can control transmitting originally Body 11 persistently emits laser.

Receiver 20 is used to receive the laser reflected by target object by acquisition window 60.Specifically, receiver 20 wraps Include acceptor circuit plate 21, camera lens 22, optical filter 23 and imaging sensor 24.Imaging sensor 24 is arranged in acceptor circuit plate Image side on 21 and positioned at camera lens 22, optical filter 23 is between camera lens 22 and imaging sensor 24.

Specifically, acceptor circuit plate 21 can control imaging sensor 24 and receive laser.Acceptor circuit plate 21 and hair Emitter circuit board 12 electrically and mechanically, to realize ranging to photoelectricity mould group 100 to target object.Camera lens 22 is for adopting Collect light, camera lens 22 can be individual lens, which is convex lens or concavees lens；It or is more pieces of lens, more pieces of lens It can be convex lens or concavees lens, or part is convex lens, is partially concavees lens.Optical filter 23 can pass through optical filtering to be infrared Piece can be used for adjusting the wavelength of light section of imaging, (prevent visible light specifically for only allowing infrared light to enter imaging sensor 24 Into imaging sensor 24), to guarantee the colors of image and clarity of infrared imaging formation.The center method of imaging sensor 24 The optical axis coincidence of line and camera lens 22.Imaging sensor 24 can using complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) imaging sensor or charge coupled cell (CCD, Charge-coupled Device) imaging sensor.When receiver 20 works, successively passed through by the laser that target object reflects It is reached on imaging sensor 24 after crossing camera lens 22, optical filter 23.In one example, receiver 20 is infrared camera.

Fig. 2 to Fig. 5 is please referred to, bracket 30 is whole L-shaped, and bracket 30 includes that the first connecting portion 31 to connect and second connect Socket part 32.

First connecting portion 31 is for carrying transmitter 10, and specifically, first connecting portion 31 includes opposite 311 He of mounting surface Bottom surface 312 (such as Fig. 8), transmitter 10 are arranged on mounting surface 311.In one example, mounting surface 311 can be plane, hair Emitter circuit board 12 is arranged on mounting surface 311, in conjunction with mode include glued, welding etc..In another example, mounting surface 311 are also possible to curved surface, concave surface, cascaded surface etc., such as mounting surface 311 is concave surface, and mounting surface 311 includes the first mounting surface and the Two mounting surfaces, the first mounting surface compare the second mounting surface closer to bottom surface 312.Transmitter circuit board 12 and the first mounting surface knot It closes, the top of transmitter 10 can be flushed with the second mounting surface.

Second connecting portion 32 is for carrying receiver 20, and specifically, second connecting portion 32 includes the ontology 321 and cylinder to connect Wall 322.Ontology 321 connects with first connecting portion 31, and barrel 322 is from ontology 321 to the top surface 327 far from second connecting portion 32 The direction of (such as Fig. 5) extends, and top surface 327 is flushed with mounting surface 311, and the setting of receiver 20 is in second connecting portion 32 and from barrel 322 exposures, specifically, the shape of barrel 322 is corresponding with camera lens 22, for example is cylinder.Camera lens 22 is housed in barrel 322 And from the exposure of barrel 322, second connecting portion 32 is combined with acceptor circuit plate 21.When transmitter 10 and receiver 20 are arranged simultaneously When on the same bracket 30, the top of transmitter 10 flushes (such as Fig. 6) with the top of receiver 20.

Processor 40 is all connected with transmitter 10 and receiver 20, processor 40 be used for detect laser flight (transmitting with Receiving) time to be to obtain the depth information of target object.Specifically, processor 40 detect transmitter 10 emit laser it is initial when At the time of quarter and receiver 20 receive reflection laser, to determine the flight time of laser, so that it is determined that photoelectricity mould group 100 and mesh The distance between object is marked, to obtain the depth image of target object.

To sum up, in the photoelectricity mould group 100 of the utility model embodiment and electronic device 1000, bracket 30 includes first connecting Socket part 31 and second connecting portion 32, transmitter 10 are arranged in first connecting portion 31, and receiver 20 is arranged in second connecting portion 32 On, so that the top of transmitter 10 and the top of receiver 20 flush, therefore, receiver 20 will not block the transmitting of transmitter 10 Laser, photoelectricity mould group 100 can obtain the depth data of more complete target object.In addition, first connecting portion 31 and second The ontology 321 of interconnecting piece 32 connects, and according to triangle (transmitter 10, receiver 20 and target object) ranging measuring principle, can make Transmitter 10 is smaller at a distance from receiver 20, improves the measurement accuracy of photoelectricity mould group 100.

In some embodiments, transmitter circuit board 12 is rigid-flexible circuit board, and acceptor circuit plate 21 is soft or hard Combined circuit plate, so, on the one hand, transmitter circuit board 12 and acceptor circuit plate 21 all have stronger rigidity, to be Transmitter 10 and receiver 20 provide enough support strengths, on the other hand, transmitter circuit board 12 and acceptor circuit plate 21 All have preferable bending, ease of assembly while can also reduce the size of transmitter 10 and receiver 20.In another example In son, transmitter circuit board 12 is printed circuit board (hardboard), and acceptor circuit plate 21 is rigid-flexible circuit board, in this way, hair Emitter circuit board 12 and acceptor circuit plate 21 all have stronger rigidity, to provide enough for transmitter 10 and receiver 20 Support strength, and acceptor circuit plate 21 also has preferable bending, and ease of assembly while can also reduce receiver 20 size.In other examples, transmitter circuit board 12 is rigid-flexible circuit board, and acceptor circuit plate 21 is printed circuit Plate (hardboard), so, on the one hand, transmitter circuit board 12 and acceptor circuit plate 21 all have stronger rigidity, thus for hair Emitter 10 and receiver 20 provide enough support strengths, and transmitter circuit board 12 also has preferable bending, convenient Also it can reduce the size of transmitter 10 while assembling.

Fig. 4 and Fig. 5 are please referred to, in some embodiments, transmitter circuit board 12 includes first segment 121, third section 123 and the second segment 122 of first segment 121 and third section 123 is connected, transmitting connector 13 is provided in third section 123 (such as figure 4).Acceptor circuit plate 21 includes the second plate of the first plate 211, third plate 213 and the first plate of connection 211 and third plate 213 212, it is provided on third plate 213 and receives connector 25 (such as Fig. 4).Third plate 213 is connect with third section 123.

Specifically, first segment 121 is combined with mounting surface 311, and second segment 122 is bent along the outer wall of first connecting portion 31, curved The angle of folding can be 90 °, i.e. second segment 122 is stepped, and the angle of bending can also be acute angle, i.e. second segment 122 is in " Z " Font.Transmitting connector 13 is provided in third section 123, in this way, transmitter circuit board 12 can be attached with external circuitry, Emit laser so as to control transmitter 10.In addition, transmitting connector 13 setting can be convenient transmitter circuit board 12 with The plug of external circuit.First plate 211 is combined with second connecting portion 32, and the second plate 212 is generally aligned in the same plane with the first plate 211, And second plate 212 be arranged side by side with second segment 122.It is provided on third plate 213 and receives connector 25, in this way, acceptor circuit Plate 21 can be attached with external circuitry, receive laser so as to control and receive device 20, while can be by imaging sensor 24 laser signal transmissions received are handled to external circuit to obtain the depth image of target object.In addition, the company of reception The setting for connecing device 25 can be convenient the plug of acceptor circuit plate 21 Yu external circuit.

Fig. 4 and Fig. 5 are please referred to, in one example, third plate 213 and third section 123 are that board structure, transmitter are electric altogether Road plate 12 and acceptor circuit plate 21 are mutually separated structure, in this way, transmitter circuit board 12 is accounted for acceptor circuit plate 21 It is smaller with space.In another example, transmitting connector 13 and reception connector 25 can share the same connector 70 and (such as scheme 4), the multiplexing of connector 70 can further reduce transmitter circuit board 12 and 21 the space occupied of acceptor circuit plate, such as This, to reduce the size of entire photoelectricity mould group 100.

Fig. 5 and Fig. 6 are please referred to, in some embodiments, second connecting portion 32 offers through hole 323, the second connection Portion 32 is combined to form accommodating chamber 324 with acceptor circuit plate 21.Receiver 20 further includes camera lens 22, optical filter 23 and image sensing Device 24.Camera lens 22 is housed in barrel 322, and imaging sensor 24 is arranged on acceptor circuit plate 21 and is housed in accommodating chamber In 324, optical filter 23 is housed in accommodating chamber 324 and between camera lens 22 and imaging sensor 24.Accommodating chamber 324 can be A part of 20 optical path of receiver.In one example, it is provided with screw thread on camera lens 22, is formed on the inner sidewall of barrel 322 Screw thread corresponding with 22 screw thread of camera lens, camera lens 22 and barrel 322 are engaged through the thread.Due to the camera lens 22 of receiver 20, filter Piece 23 and imaging sensor 24 are housed in accommodating chamber 324, and camera lens 22, optical filter 23 and imaging sensor 24 can be by very Good protection, in this way, receiver 20 can be also stably placed in second connecting portion 32.

Fig. 6 and Fig. 7 are please referred to, in some embodiments, second connecting portion 32 further includes boss 325, and boss 325 is from originally The inner wall of body 321 extends to the center of through hole 323, and camera lens 22 and optical filter 23 are located at the opposite two sides of boss 325. Specifically, boss 325 can be continuous structure, and the shape of boss 325 is corresponding with optical filter 23, such as annular boss 325 or figure Irregular boss 325 in 7 embodiments.Boss 325 or multiple, multiple boss 325 are with the center of through hole 323 Symmetrical centre is distributed on 321 inner wall of ontology.Optical filter 23 and boss 325 are inconsistent, in this way, photoelectricity mould group 100 by When to external force (such as hitting, fall), since boss 325 limits the position of optical filter 23, optical filter 23 will not be along 22 optical axis of camera lens Direction it is mobile, in this way, optical filter 23 can be more steadily housed in accommodating chamber 323.In one example, camera lens 22 with Boss 325 is spaced, and when assembling receiver 20, camera lens 22 is screwed togather along the optical axis of camera lens 22 into barrel 322, and optical filter 23 contradicts The side opposite with camera lens 22 of boss 325 is to indicate that optical filter 23 is installed in place.In another example, camera lens 22 is carried on On boss 325, when assembling receiver 20, camera lens 22 is contradicted in the side of boss 325 to indicate that camera lens 22 is installed in place, and is filtered Piece 23 is contradicted in the other side of boss 325 to indicate that optical filter 23 is installed in place.

Incorporated by reference to Fig. 8, in some embodiments, boss 325 includes opposite the first face 3251 and the second face 3252.The On one side 3251 compared with the second face 3252 close to imaging sensor 24, optical filter 23 is combined with the first face 3251, in conjunction with mode include It is glued.In this way, optical filter 23 can be steadily housed in accommodating chamber 323.When assembling receiver 20, camera lens 22 is from barrel 322 openings far from ontology 321 protrude into, and optical filter 23, imaging sensor 24 and acceptor circuit plate 21 are successively remote from ontology 321 Opening from barrel 322 protrudes into.In one example, limiting slot 326 is opened up on the first face 3251, the setting of optical filter 23 is limiting On slot 326.When photoelectricity mould group 100 is by external force (such as hit, fall), since limiting slot 326 limits the position of optical filter 23, Optical filter 23 will not be moved along the direction perpendicular to 22 optical axis of camera lens, in this way, optical filter 23 can be more steadily housed in In cavity 323.

Fig. 5 and Fig. 6 are please referred to, in some embodiments, photoelectricity mould group 100 further includes pedestal 80, and pedestal 80 offers Light hole 81, pedestal 80 are carried on acceptor circuit plate 21, and imaging sensor 24 is housed in light hole 81, second connecting portion 32 are carried on pedestal 80.When assembling receiver 20, first pedestal 80 is carried on acceptor circuit plate 21, optical filter 23 is set It sets on pedestal 80 to form a component；Then, one from barrel 322 far from ontology 321, which is open, protrudes into camera lens 22, then from Ontology 321 installs the component far from the other side of barrel 322.Since the thickness of pedestal 80 is greater than the thickness of imaging sensor 24, When second connecting portion 32 is carried on pedestal 80, the distance between imaging sensor 24 and camera lens 22 are increased, in this way, passing through tune The thickness of whole pedestal 80 can make imaging sensor 24 be located at the image side position of 22 proper focal length of camera lens, with realize preferably at As effect.

Referring to Fig. 5, in some embodiments, optical filter 23 can be carried on pedestal 80 and and imaging sensor 24 intervals.In this way, optical filter 23 does not have to directly be carried on imaging sensor 24, and influence the imaging effect of imaging sensor 24 Fruit keeps 32 structure of second connecting portion simpler in addition, ontology 321 no setting is required other support construction carries optical filter 23 It is single.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close Suitable mode combines.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three, unless separately There is clearly specific restriction.Although the embodiments of the present invention have been shown and described above, it is to be understood that above-mentioned Embodiment is exemplary, and should not be understood as limiting the present invention, and those skilled in the art are practical new at this It can make changes, modifications, alterations, and variations to the above described embodiments in the range of type, the scope of the utility model is by claim And its equivalent limits.

Claims (10)

1. a kind of photoelectricity mould group characterized by comprising

Transmitter, the transmitter is for emitting laser；

Receiver, the receiver is for receiving the laser；With

Bracket, the bracket include the first connecting portion and second connecting portion to connect, and the first connecting portion includes mounting surface, institute Transmitter is stated to be arranged on the mounting surface, the second connecting portion includes the ontology and barrel to connect, the ontology with it is described First connecting portion connects, and the barrel extends from the ontology to the direction of the top surface far from the second connecting portion, described to connect Device is received to be arranged in the second connecting portion and expose from the barrel, the top at the top of the transmitter and the receiver It flushes.

2. photoelectricity mould group according to claim 1, which is characterized in that the transmitter includes transmitting ontology and transmitter electricity Road plate, the transmitter circuit board are arranged on the mounting surface, and the transmitting ontology is arranged in the transmitter circuit board； The receiver includes acceptor circuit plate, the second connecting portion and the hardened conjunction of the acceptor circuit；The transmitter electricity Road plate is connect with the acceptor circuit plate.

3. photoelectricity mould group according to claim 2, which is characterized in that the transmitter circuit board is rigid-flexible circuit Plate, the acceptor circuit plate are rigid-flexible circuit board；Or

The transmitter circuit board is printed circuit board, and the acceptor circuit plate is rigid-flexible circuit board；Or

The transmitter circuit board is rigid-flexible circuit board, and the acceptor circuit plate is printed circuit board.

4. photoelectricity mould group according to claim 2, which is characterized in that the transmitter circuit board includes first segment, third The second segment of section and the connection first segment and the third section is provided with transmitting connector in the third section；

The acceptor circuit plate includes the second plate of the first plate, third plate and connection first plate and the third plate, institute It states and is provided with reception connector on third plate；

The third plate is connect with the third section.

5. photoelectricity mould group according to claim 2, which is characterized in that the second connecting portion offers through hole, described Second connecting portion and the hardened conjunction of the acceptor circuit form accommodating chamber, and the receiver further includes camera lens, optical filter and image Sensor, the camera lens are housed in the barrel, and described image sensor is arranged on the acceptor circuit plate and accommodates In the accommodating chamber, the optical filter be housed in the accommodating chamber and be located at the camera lens and described image sensor it Between.

6. photoelectricity mould group according to claim 5, which is characterized in that the second connecting portion further includes boss, described convex Platform extends from the inner wall of the ontology to the center of the through hole, and the camera lens and the optical filter are located at the boss Opposite two sides.

7. photoelectricity mould group according to claim 6, which is characterized in that the boss includes opposite the first face and second Face, the first face second face is close to described image sensor, and the optical filter is in conjunction with first face.

8. photoelectricity mould group according to claim 5, which is characterized in that the photoelectricity mould group further includes pedestal, the pedestal Light hole is offered, the pedestal is carried on the acceptor circuit plate, and described image sensor is housed in the light hole Interior, the second connecting portion carrying is on the base.

9. photoelectricity mould group according to claim 8, which is characterized in that optical filter carrying on the base and with institute State imaging sensor interval.

10. a kind of electronic device characterized by comprising

Shell；With

Photoelectricity mould group described in any one of claim 1-9, the photoelectricity mould group are arranged in the shell and for obtaining Depth image.