CN110913196A - TOF module and electronic product - Google Patents
TOF module and electronic product Download PDFInfo
- Publication number
- CN110913196A CN110913196A CN201911371941.5A CN201911371941A CN110913196A CN 110913196 A CN110913196 A CN 110913196A CN 201911371941 A CN201911371941 A CN 201911371941A CN 110913196 A CN110913196 A CN 110913196A
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- China
- Prior art keywords
- receiving unit
- circuit board
- connector
- unit
- tof module
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- 238000010304 firing Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Studio Devices (AREA)
Abstract
The invention provides a TOF module and an electronic product, wherein the TOF module comprises a support, a receiving unit, an emitting unit and a connecting part, the receiving unit comprises a first circuit board, the emitting unit comprises a second circuit board, the second circuit board is electrically connected to the first circuit board through the connecting part, and the receiving unit and the emitting unit are respectively installed on the support. In the TOF module and the electronic product provided by the invention, the receiving unit and the transmitting unit are respectively made into split modules and then are installed on the bracket, and the receiving unit and the transmitting unit do not need to be installed on the same circuit board, so that the heating sources are separated, a large amount of space is arranged at the bottom of the transmitting unit, a heat dissipation structure is convenient to arrange, heat dissipation is convenient, the influence of the heating sources on other components is reduced to the minimum, and the receiving unit and the transmitting unit are respectively made as independent modules, so that the process difficulty in production is reduced.
Description
Technical Field
The invention relates to the technical field of TOF (time of flight), in particular to a TOF module and an electronic product.
Background
TOF (Time of Flight) technology, which continuously sends light pulses to a target, reflects after encountering the target object, then receives light returning from the object with a sensor, calculates the distance of the object to be photographed by calculating the Time difference or phase difference between the light emission and the emission to generate depth information, and further combines with conventional phase-to-phase photographing, thereby presenting the three-dimensional contour of the object in the form of images with different colors representing different distances.
The TOF module usually includes two parts of emission unit and camera unit to emission unit and camera unit all set up on the plastic supporting seat, and be connected in same circuit board. However, the TOF module with such a structure is not favorable for heat dissipation of the TOF module, and the process is complex.
The foregoing description is provided for general background information and is not admitted to be prior art.
Disclosure of Invention
The invention aims to provide a TOF module and an electronic product, which have good heat dissipation performance and reduced process difficulty.
The invention provides a TOF module, which comprises a support, a receiving unit, a transmitting unit and a connecting part, wherein the receiving unit comprises a first circuit board, the transmitting unit comprises a second circuit board, the second circuit board is electrically connected to the first circuit board through the connecting part, and the receiving unit and the transmitting unit are respectively arranged on the support.
In one embodiment, the bracket includes a first mounting portion and a second mounting portion, the receiving unit is disposed on the first mounting seat, and the transmitting unit is disposed on the second mounting seat.
In one embodiment, the second mounting portion includes a mounting seat, and the second circuit board of the transmitting unit is disposed on the top of the mounting seat.
In one embodiment, the first mounting portion has a first mounting hole, the top of the mounting base has a second mounting hole, the receiving unit is disposed in the first mounting hole, and the transmitting unit is disposed in the second mounting hole.
In one embodiment, the bracket includes an upper surface, the receiving unit protrudes above the upper surface, the mounting base protrudes above the upper surface, and the heights of the tops of the receiving unit and the emitting unit are consistent.
In one embodiment, the receiving unit further includes a receiving unit body, the receiving unit body includes a receiving unit bracket and a lens assembly, the lens assembly is disposed on the receiving unit bracket, the first circuit board is disposed at the bottom of the receiving unit bracket, and the receiving unit body is electrically connected to the first circuit board.
In one embodiment, the emission unit includes an emission body for emitting light, the emission body is disposed on the second circuit board, and the emission body is electrically connected to the second circuit board.
In one embodiment, the transmitting unit further includes a first connector electrically connected to the second circuit board, the connecting portion includes a second connector, a connecting plate and a third connector, the connecting plate is connected between the second connector and the third connector to electrically connect the second connector and the third connector, the second connector is electrically connected to the first connector, and the third connector is electrically connected to the first circuit board.
In one embodiment, the TOF module further includes a fourth connector electrically connected to the first circuit board.
The invention also provides an electronic product comprising the TOF module.
In the TOF module and the electronic product provided by the invention, the receiving unit and the transmitting unit are respectively made into split modules and then are installed on the bracket, and the receiving unit and the transmitting unit do not need to be installed on the same circuit board, so that the heating sources are separated, a large amount of space is arranged at the bottom of the transmitting unit, a heat dissipation structure is convenient to arrange, heat dissipation is convenient, the influence of the heating sources on other components is reduced to the minimum, and the receiving unit and the transmitting unit are respectively made as independent modules, so that the process difficulty in production is reduced.
Drawings
Fig. 1 is a schematic perspective assembly structure of a TOF module according to an embodiment of the invention.
FIG. 2 is an exploded view of the TOF module of FIG. 1.
Fig. 3 is a cross-sectional view of the TOF module shown in fig. 1.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1 to fig. 3, a tof (time of flight) module according to an embodiment of the present invention includes a bracket 11, a receiving unit 13, a transmitting unit 15, and a connecting portion 17. The receiving unit 13 includes a first circuit board 132, the transmitting unit 15 includes a second circuit board 152, the second circuit board 152 is electrically connected to the first circuit board 132 through the connecting portion 17, and the receiving unit 13 and the transmitting unit 15 are respectively mounted on the bracket 11.
In this TOF module, because receiving element 13 and transmitting element 15 make split type module respectively, install on support 11 again, need not to install receiving element 13 and transmitting element 15 on same circuit board, consequently separated the source that generates heat, and transmitting element 15's bottom has a large amount of spaces to be convenient for set up heat radiation structure, be convenient for dispel the heat, reduce the influence of the source that generates heat to other parts to minimum, and receiving element 13 and transmitting element 15 make respectively as independent module, the technological degree of difficulty in the production has been reduced.
In this embodiment, the bracket 11 includes a first mounting portion 112 and a second mounting portion 114, the first mounting portion 112 has a first mounting hole 115, the second mounting portion 114 has a second mounting hole 116, the receiving unit 13 is disposed in the first mounting hole 115, and the transmitting unit 15 is disposed in the second mounting hole 116. Specifically, the second mounting portion 114 includes a mounting seat 117, and the second mounting hole 116 opens on the mounting seat 117. More specifically, the second mounting hole 116 opens at the top of the mount 117. Specifically, the second wiring board 152 is mounted on top of the mounting base 117. Thus, the bottom of the emission unit 15 is provided with the mounting seat 117, and the heat dissipation of the emission unit 15 can be accelerated through the mounting seat 117, so that the heat dissipation performance of the TOF module is improved. Specifically, the holder 11 includes an upper surface 119, the receiving unit 13 protrudes above the upper surface 119, and the mounting seat 117 protrudes above the upper surface 119, so that the heights of the tops of the receiving unit 13 and the emitting unit 15 are substantially uniform.
In this embodiment, the receiving unit 13 further includes a receiving unit body 134, the receiving unit body 134 includes a receiving unit bracket 136 and a lens assembly 137, the lens assembly 137 is disposed on the receiving unit bracket 136, the first circuit board 132 is disposed at the bottom of the receiving unit bracket 136, and the receiving unit body 134 is electrically connected to the first circuit board 132. Specifically, the top of the receiving unit 13 for receiving light protrudes above the top of the holder 11. Specifically, the receiving unit body 134 further includes an imaging chip.
In this embodiment, the emitting unit 15 includes an emitting body 154 for emitting light, the emitting body 154 is disposed on the second circuit board 152, and the emitting body 154 is electrically connected to the second circuit board 152. The emission unit 15 further comprises an electronic device 156, the electronic device 156 also being provided on the second wiring board 152. The transmitting unit 15 further includes a first connector 158, and the first connector 158 is electrically connected to the second circuit board 152.
In this embodiment, the connection portion 17 includes a second connector 172, a connection plate 174 and a third connector 176, the connection plate 174 is connected between the second connector 172 and the third connector 176 to electrically connect the second connector 172 and the third connector 176, the second connector 172 is electrically connected to the first connector 158, and the third connector 176 is electrically connected to the first circuit board 132, so as to electrically connect the second circuit board 152 to the first circuit board 132. Specifically, the second connector 172 is mated with the first connector 158. The connection plate 174 may be a flexible circuit board.
In this embodiment, the TOF module further includes a fourth connector 19, and the fourth connector 19 is electrically connected to the first circuit board 132 to electrically connect the TOF module with an external circuit.
The invention also provides an electronic product comprising the TOF module.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the purpose of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The TOF module is characterized by comprising a support (11), a receiving unit (13), an emitting unit (15) and a connecting portion (17), wherein the receiving unit (13) comprises a first circuit board (132), the emitting unit (15) comprises a second circuit board (152), the second circuit board (152) is electrically connected to the first circuit board (132) through the connecting portion (17), and the receiving unit (13) and the emitting unit (15) are respectively installed on the support (11).
2. The TOF module according to claim 1, wherein the holder (11) comprises a first mounting portion (112) and a second mounting portion (114), the receiving unit (13) being provided at the first mounting portion (112) and the emitting unit (15) being provided at the second mounting portion (114).
3. The TOF module of claim 2, wherein the second mounting portion (114) includes a mounting seat (117), the second circuit board (152) of the firing unit (15) being disposed on top of the mounting seat (117).
4. The TOF module of claim 3, wherein the first mounting portion (112) defines a first mounting hole (115), the top of the mounting base (117) defines a second mounting hole (116), the receiving unit (13) is disposed in the first mounting hole (115), and the emitting unit (15) is disposed in the second mounting hole (116).
5. A TOF module according to claim 3 wherein the holder (11) comprises an upper surface (119), the receiving unit (13) protruding above the upper surface (119), the mounting seat (117) protruding above the upper surface (119), the top of the receiving unit (13) and the emitting unit (15) being at the same height.
6. The TOF module of claim 1, wherein the receiving unit (13) further comprises a receiving unit body (134), wherein the receiving unit body (134) comprises a receiving unit support (136) and a lens assembly (137), wherein the lens assembly (137) is disposed on the receiving unit support (136), wherein the first circuit board (132) is disposed at a bottom of the receiving unit support (136), and wherein the receiving unit body (134) is electrically connected to the first circuit board (132).
7. The TOF module of claim 1, wherein the emission unit (15) comprises an emission body (154) for emitting light, the emission body (154) being disposed on the second circuit board (152), and the emission body (154) being electrically connected to the second circuit board (152).
8. The TOF module of claim 1, wherein the transmit unit (15) further comprises a first connector (158), the first connector (158) being electrically connected to the second circuit board (152), the connection portion (17) comprising a second connector (172), a connection plate (174), and a third connector (176), the connection plate (174) being connected between the second connector (172) and the third connector (176) to electrically connect the second connector (172) and the third connector (176), the second connector (172) being electrically connected to the first connector (158), the third connector (176) being electrically connected to the first circuit board (132).
9. The TOF module of claim 1, further comprising a fourth connector (19), the fourth connector (19) being electrically connected to the first wiring board (132).
10. An electronic product comprising a TOF module according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911371941.5A CN110913196A (en) | 2019-12-26 | 2019-12-26 | TOF module and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911371941.5A CN110913196A (en) | 2019-12-26 | 2019-12-26 | TOF module and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110913196A true CN110913196A (en) | 2020-03-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911371941.5A Pending CN110913196A (en) | 2019-12-26 | 2019-12-26 | TOF module and electronic product |
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| Country | Link |
|---|---|
| CN (1) | CN110913196A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111123292A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109756654A (en) * | 2017-11-01 | 2019-05-14 | 浙江舜宇智能光学技术有限公司 | TOF camera module and its manufacturing method and TOF depth image imaging method and electronic equipment |
| CN208908464U (en) * | 2018-11-23 | 2019-05-28 | 南昌欧菲生物识别技术有限公司 | Camera mould group and electronic device |
| CN110418032A (en) * | 2018-04-28 | 2019-11-05 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
-
2019
- 2019-12-26 CN CN201911371941.5A patent/CN110913196A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109756654A (en) * | 2017-11-01 | 2019-05-14 | 浙江舜宇智能光学技术有限公司 | TOF camera module and its manufacturing method and TOF depth image imaging method and electronic equipment |
| CN110418032A (en) * | 2018-04-28 | 2019-11-05 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
| CN208908464U (en) * | 2018-11-23 | 2019-05-28 | 南昌欧菲生物识别技术有限公司 | Camera mould group and electronic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111123292A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
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