Summary of the invention
Embodiments of the present invention provide a kind of optical finger print recognizer component and electronic device.
A kind of optical finger print recognizer component of embodiment of the present invention includes:
Plate, the lower surface of the plate are formed with the boss for protruding from the lower surface;
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor, the optical finger print
Sensor is fitted in the lower surface of the boss.
The optical finger print recognizer component of embodiment of the present invention, optical fingerprint sensor are fitted in the following table of the boss
Face, so that the optical path of the light reflected from finger surface increases, reflection light is projected to the projected area of optical fingerprint sensor
It is bigger, keep the pixel utilization rate of optical fingerprint sensor higher, and the collected fingerprint image of optical finger print recognizer component is more clear
It is clear.
In some embodiments, the optical fingerprint sensor includes photosensitive layer and the light that is arranged on the photosensitive layer
Layer is learned, the optical layer is formed with microlens array or mesh-structured, and the upper surface of the optical layer is fitted in the boss
Lower surface.
In this way, microlens array can converge light, help that the light of more finger reflections is made to be projected to photosensitive layer,
Improve the pixel utilization rate of optical fingerprint sensor.It is mesh-structured that photosensitive layer is enabled to obtain more light to form fingerprint number
According to, help to improve optical finger print recognizer component detection fingerprint accuracy.
In some embodiments, optical fingerprint sensor includes photosensitive layer and the optical layer that is arranged on photosensitive layer, convex
The lower surface of platform is formed with mesh-structured, mesh-structured composition optical layer.
In this way, mesh-structured enable photosensitive layer to obtain more light to form finger print data, optics is helped to improve
The accuracy of fingerprint recognition component detection fingerprint.
In some embodiments, optical fingerprint sensor includes photosensitive layer and the optical layer that is arranged on photosensitive layer, convex
The lower surface of platform is formed with microlens array, and microlens array constitutes optical layer.
In this way, microlens array can converge light, help that the light of more finger reflections is made to be projected to photosensitive layer.
In some embodiments, the photosensitive layer forms induction zone, and the optical layer covers the induction zone.
In this way, optical layer covering induction zone helps that the light of more finger reflections is made to be projected to induction zone, to mention
The data volume of high collected finger print information.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and the company for connecting the multiple light-sensitive element
Link, the multiple light-sensitive element form the induction zone.
In this way, light-sensitive element can incude the light injected from optical layer and be converted to electric signal to collect fingerprint letter
Breath.
In some embodiments, the optical finger print identification mould group includes circuit board assemblies, and the circuit board assemblies connect
Connect the lower surface of the photosensitive layer.
In this way, the finger print information that circuit board assemblies can get photosensitive layer is transmitted to the external electrical of optical fingerprint sensor
Road is to realize fingerprint identification function.
In some embodiments, the optical finger print identification mould group includes pio chip and control unit, the circuit
Board group part includes first circuit board and second circuit board, and the first circuit board connects the lower surface and described of the photosensitive layer
Two circuit boards, the pio chip and described control unit setting are in the first circuit board, and described control unit is for controlling
The pio chip reads the output signal of the photosensitive layer and is transmitted to described control unit, and described control unit is also used to deposit
The output signal of the photosensitive layer is stored up, and the output signal of the photosensitive layer is transmitted to by external electrical by the second circuit board
Road.
In this way, pio chip reads the electric signal with finger print information of the output of photosensitive layer, and finger print information will be had
The electric signal of photosensitive layer be stored in control unit, then will be with the electric signal of the photosensitive layer of finger print information by second circuit board
It is transmitted to external circuit, so that external circuit be made to get finger print information, and then carries out fingerprint recognition.
In some embodiments, the first circuit board is provided with the first connector, and the second circuit board is provided with
Second connector, first connector and second connector are detachably connected, and the second circuit board is flexible electrical
Road plate.
In this way, the first connector and the second connector are detachably connected so that when second circuit board damages, it can be by first
Circuit board and second circuit board separation are to be individually replaced second circuit board, and no replacement is required, and entire optical finger print identifies mould group.
In some embodiments, the plate is cover board, and the optical finger print recognizer component includes display screen, described aobvious
Display screen is fitted in the lower surface of the cover board.
In this way, display screen can show picture, optical finger print recognizer component is made to have the function of showing picture.
In some embodiments, the optical finger print identification mould group includes light source, and the light source is located at the plate
Lower section, the light source are configured to emit light to the top of the plate, and the optical fingerprint sensor is configured to receive
By the light for the light source transmitting that the top of the plate is reflected.
In this way, the light of light source transmitting is projected to photosensitive layer after handling digital reflex, so that photosensitive layer be made to get finger
Finger print information.
In some embodiments, the plate is cover board, and the optical finger print recognizer component includes display screen, described aobvious
The upper surface of display screen offers mounting groove, and the boss and the optical fingerprint sensor are arranged in the mounting groove, described
Display screen is fitted in the lower surface of the optical fingerprint sensor and the lower surface of the cover board.
In this way, in the mounting groove that the upper surface that display screen is arranged in optical fingerprint sensor is opened up, optical finger print sensing
Device not will lead to the thickness for increasing optical finger print recognizer component, be conducive to keep optical finger print recognizer component lightening.
In some embodiments, the optical finger print recognizer component includes display screen, and the plate is the display screen
Lower substrate.
In this way, convenient for assembly display screen and cover board.
A kind of electronic device of embodiment of the present invention, the optical finger print recognizer component including any of the above-described embodiment.
The electronic device of embodiment of the present invention, the optical fingerprint sensor of optical finger print recognizer component are fitted in described convex
The lower surface of platform, so that the optical path of the light reflected from finger surface increases, reflection light is projected to optical fingerprint sensor
Projected area is bigger, keeps the pixel utilization rate of optical fingerprint sensor higher, and the collected fingerprint of optical finger print recognizer component
Image is apparent.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate;It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, a kind of optical finger print recognizer component 10 of embodiment of the present invention includes plate 12 and optical finger print
Identify mould group 14.The lower surface of plate 12 is formed with the boss 122 for protruding from lower surface.Optical finger print identifies that mould group 14 includes light
Fingerprint sensor 142 is learned, optical fingerprint sensor 142 is fitted in the lower surface of boss 122.
The optical finger print recognizer component 10 of embodiment of the present invention, optical fingerprint sensor 142 are fitted under boss 122
Surface, so that the optical path of the light reflected from finger surface increases, reflection light is projected to the projection of optical fingerprint sensor 142
Area is bigger, keeps the pixel utilization rate of optical fingerprint sensor 142 higher, and the collected fingerprint of optical finger print recognizer component 10
Image is apparent.
The optical finger print recognizer component 10 of embodiment of the present invention can be applied to but be not limited to unlock, file encryption, payment
The application scenarios such as verifying, authentication.
It is appreciated that optical fingerprint sensor 142 is remoter from the surface of finger, optical fingerprint sensor is reflexed to from finger
The projected area of 142 reflection light is bigger.Cmos sensor can be used in optical fingerprint sensor 142.
Specifically, plate 12 includes clear area, and clear area covers optical finger print in the orthographic projection of optical fingerprint sensor 142
Sensor 142.Plate 12 can be the lower substrate etc. of cover board, display screen.
In some embodiments, optical fingerprint sensor 142 includes photosensitive layer 1422 and is arranged on photosensitive layer 1422
Optical layer 1424, optical layer 1424 is formed with microlens array or mesh-structured, and the upper surface of optical layer 1424 is fitted in convex
The lower surface of platform 122.Optical layer 1424 is formed with microlens array or mesh-structured, it is understood that is 1424 shape of optical layer
At there is microlens array and mesh-structured.
In this way, microlens array can converge light, help that the light of more finger reflections is made to be projected to photosensitive layer
1422, improve the pixel utilization rate of optical fingerprint sensor 142.It is mesh-structured that photosensitive layer 1422 is enabled to obtain more light
To form finger print data, the accuracy that optical finger print recognizer component 10 detects fingerprint is helped to improve.
Specifically, when optical finger print recognizer component 10 acquires fingerprint, finger acts on 142 top of optical fingerprint sensor
On dielectric surface, the light that finger reflects is converged to photosensitive layer 1422 by the microlens array of optical layer 1424, so that photosensitive layer
1422 can obtain more light to form finger print data.
Specifically, mesh-structured formation pinhole imaging system area.Pinhole imaging system area is formed with multiple apertures, and each aperture can use
Light is projected photosensitive layer 1422 by pinhole imaging system principle.Aperture can be blind hole or through-hole.Through-hole is upper through optical layer 1424
Surface and lower surface.Blind hole runs through the upper surface or lower surface of optical layer 1424.In one example, aperture is blind hole, and blind
The lower surface of optical layer 1424 is run through in hole.
When optical finger print recognizer component 10 acquires fingerprint, finger is placed on the dielectric surface of the top of plate 12, from finger
The light of reflection is projected to photosensitive layer 1422 behind pinhole imaging system area, and photosensitive layer 1422 is enabled to obtain more light to be formed
Finger print data improves the data volume of collected finger print information, helps to improve the accuracy of optical finger print recognizer component 10.
In some embodiments, optical fingerprint sensor 142 includes photosensitive layer 1422 and is arranged on photosensitive layer 1422
Optical layer 1424, the lower surface of boss 122 is formed with mesh-structured, mesh-structured composition optical layer 1424.
In this way, mesh-structured enable photosensitive layer 1422 to obtain more light to form finger print data, help to improve
The accuracy of optical finger print recognizer component 10.
In such an embodiment, aperture can be blind hole or through-hole.Upper surface and boss 122 of the through-hole through plate 12
Lower surface.Blind hole is through the upper surface of plate 12 or the lower surface of boss 122.In one example, aperture is blind hole, and blind
The lower surface of boss 122 is run through in hole.
In some embodiments, optical fingerprint sensor packet 142 includes photosensitive layer 1422 and is arranged on photosensitive layer 1422
Optical layer 1424, the lower surface of boss 122 is formed with microlens array, and microlens array constitutes optical layer 1424.
In this way, microlens array can converge light, help that the light of more finger reflections is made to be projected to photosensitive layer
1422。
Specifically, when optical finger print recognizer component 10 acquires fingerprint, finger acts on the dielectric surface of the top of plate 12
On, the light that finger reflects is converged to photosensitive layer 1422 by the microlens array of optical layer 1424, enables photosensitive layer 1422
More light is obtained to form finger print data.
In some embodiments, photosensitive layer 1422 is formed with induction zone (area active area, AA) 1422a, optical layer
1424 covering induction zone 1422a.
In this way, optical layer 1424, which covers induction zone 1422a, helps that the light of more finger reflections is made to be projected to induction
Area 1422a, to improve the data volume of collected finger print information.Optical layer 1424 covers induction zone 1422a, it is possible to understand that
For the size of optical layer 1424 is not less than the size of induction zone 1422a, preferably, the size of optical layer 1424 is greater than induction zone
The size of 1422a.
In some embodiments, photosensitive layer 1422 includes multiple light-sensitive element (not shown) and the multiple light-sensitive elements of connection
Connection line (not shown), multiple light-sensitive elements form induction zone 1422a.
In this way, light-sensitive element can incude the light injected from optical layer 1424 and be converted to electric signal to collect fingerprint
Information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on optical finger print sensing
When on the dielectric surface of 142 top of device, the light reflected from finger is projected to photosensitive layer 1422 by optical layer 1424, multiple photosensitive
Light of the element senses with finger print information is simultaneously converted into electric signal.
Further, photosensitive layer 1422 includes substrate (not shown), and multiple light-sensitive elements and connection line are formed in substrate
On.In some instances, substrate can be semiconductor base.Multiple light-sensitive elements and connection line can be formed by photoetching process
In substrate.Multiple light-sensitive elements can form induction zone (area active area, AA) 1422a of array, other areas in substrate
Domain forms non-inductive area (the non-area AA), and non-inductive area is provided with connection line.Light-sensitive element is, for example, photodiode.
In some embodiments, optical finger print identification mould group 14 includes circuit board assemblies 144, and circuit board assemblies 144 connect
Connect the lower surface of photosensitive layer 1422.
In this way, the finger print information that photosensitive layer 1422 is got can be transmitted to optical fingerprint sensor by circuit board assemblies 144
142 external circuit is to realize fingerprint identification function.
Specifically, connection line is electrically connected multiple light-sensitive elements and circuit board assemblies 144, and multiple light-sensitive element inductions have
The light of finger print information is simultaneously converted into after electric signal, and the finger print information that connection line will acquire is transferred to circuit board assemblies
144, to realize the external circuit that the finger print information that photosensitive layer 1422 is got is transmitted to optical fingerprint sensor 142.
In some embodiments, optical finger print identification mould group 14 includes pio chip 146 and control unit 148, circuit
Board group part 144 includes first circuit board 1442 and second circuit board 1444, and first circuit board 1442 connects under photosensitive layer 1422
Surface and second circuit board 1444, pio chip 146 and control unit 148 are arranged in first circuit board 1442, control unit 148
For controlling the output signal of the reading photosensitive layer 1422 of pio chip 146 and being transmitted to control unit 148, control unit 148 is also
The output signal of photosensitive layer 1422 is transmitted to for storing the output signal of photosensitive layer 1422, and by second circuit board 1444
External circuit.
In this way, pio chip 146 reads the electric signal with finger print information of the output of photosensitive layer 1422, and will be with finger
The electric signal of the photosensitive layer 1422 of line information is stored in control unit 148, then will be believed with fingerprint by second circuit board 1444
The electric signal transmission of the photosensitive layer 1422 of breath so that external circuit be made to get finger print information, and then is referred to external circuit
Line identification.
In some embodiments, first circuit board 1442 is provided with the first connector 1443, and second circuit board 1444 is set
It is equipped with the second connector 1445, the first connector 1443 and the second connector 1445 are detachably connected, second circuit board 1444
For flexible circuit board.
In this way, the first connector 1443 and the second connector 1445 are detachably connected so that the damage of second circuit board 1444
When, it can be by first circuit board 1442 and the separation of second circuit board 1444 to be individually replaced second circuit board 1444, it is whole that no replacement is required
A optical finger print identifies mould group 14.
Specifically, the first connector 1443 and the second connector 1445, which respectively include plug-in unit, plug and socket etc., plays connection
The component of effect.In one embodiment, the first connector 1443 and the second connector 1445 are that can insert to slotting respectively
Part, when the first connector 1443 and the second connector 1445 to it is slotting when, first circuit board 1442 is connected with second circuit board 1444
To realize that signal transmits.When the first connector 1443 and the second connector 1445 disconnect, first circuit board 1442 and the second electricity
1444 open circuit of road plate.
Referring to Fig. 2, in some embodiments, plate 12 is cover board 124, optical finger print recognizer component 10 includes display
Screen 16, display screen 16 is fitted in the lower surface of cover board 124.Display screen 16 can be touch display screen 16.
In this way, display screen 16 can show picture, makes optical finger print recognizer component 10 have the function of showing picture, can be used for
Electronic device.Specifically, in the present embodiment, display screen 16 and boss 122 and optical fingerprint sensor 142 interval are arranged.
Display screen 16 can be OLED display screen, liquid crystal display or plasma display etc..
Referring to Fig. 3, in some embodiments, optical finger print identifies that mould group 14 includes light source 141, and light source 141 is located at
The lower section of plate 12, light source 141 are configured to emit light to the top of plate 12, and optical fingerprint sensor 142 is configured to
Receive the light emitted by the light source 141 that the top of plate 12 is reflected.
In this way, the light that light source 141 emits is projected to photosensitive layer 1422 after handling digital reflex, so that photosensitive layer 1422 be made to obtain
Get the finger print information of finger.
Specifically, light source 141 emits incident ray to the top of plate 12, and incident ray is projected to plate after passing through plate 12
12 top of part.When finger touches the upper surface of plate 12, the incident ray issued from light source 141 is reflected to form instead by finger
Light is penetrated, reflection light is projected to the light-sensitive element of photosensitive layer 1422 after boss 122 and optical layer 1424, and light-sensitive element will be thrown
The reflection light being incident upon on light-sensitive element is converted to the electric signal with finger print information and output, and pio chip 146 reads photosensitive
The electric signal of element output is simultaneously transmitted to control unit 148, and control unit 148 handles the electric signal of light-sensitive element output to obtain
The finger print information of finger.
In addition, the position of light source 141 is adjustable, so that the incident ray that light source 141 emits is through optical fingerprint sensor
142 and boss 122 be emitted to the top of plate 12.In this way, optical finger print identification mould group 14 is compact-sized.
Referring to Fig. 4, in some embodiments, plate 12 is cover board 124, optical finger print recognizer component 10 includes display
Screen 16, the upper surface of display screen 16 offer mounting groove 162, and boss 122 and optical fingerprint sensor 142 are arranged in mounting groove
In 162, display screen 16 is fitted in the lower surface of optical fingerprint sensor 142 and the lower surface of cover board 124.
In this way, the mounting groove that the upper surface of display screen 16 opens up is arranged in boss 122 and optical fingerprint sensor 142
In 162, boss 122 and optical fingerprint sensor 142 not will lead to the thickness for increasing optical finger print recognizer component 10, be conducive to make
Optical finger print recognizer component 10 is lightening.
Specifically, when display screen 16 is fitted in the lower surface of photosensitive layer 1422, display screen 16 can be active luminescence display
Shielding 16 (such as OLED or AMOLED), display screen 16 can be used as light source to the field emission light above induction zone 1422a, so that
When the upper surface position that finger is placed on cover board 124 corresponding with induction zone 1422a carries out fingerprint recognition, induction zone 1422a
Enough light can be received to form finger print information.In this way, using display screen 16 as optical finger print identification mould group 14
Light source, additional light source that no setting is required can reduce the component of electronic device, facilitate the volume for reducing electronic device, to make
Electronic device is lightening.
Further, the depth of mounting groove 162 is corresponding with the sum of the thickness of boss 122 and optical fingerprint sensor 142, convex
Platform 122 and optical fingerprint sensor 142 are arranged in mounting groove 162.In this way, on the one hand making the preferably patch of display screen 16
It closes in the lower surface of cover board 124, another aspect boss 122 not will lead to the thickness for increasing optical finger print recognizer component 10, make light
It is more frivolous to learn fingerprint recognition component 10.
Referring to Fig. 5, in some embodiments, optical finger print recognizer component 10 includes display screen 16, and plate 12 is aobvious
The lower substrate 164 of display screen 16.
In this way, the lower substrate 164 using display screen 16 forms boss 122, without increasing additional element, structure is simple.
Specifically, display screen 16 includes upper substrate, lower substrate 164 and shining between upper substrate and lower substrate 164
Element (for self light emitting display panel, light-emitting component is, for example, Organic Light Emitting Diode (OLED) or luminescence of plasma element)
And/or switching device (for liquid crystal display, switching device is, for example, transistor).Glass system can be used in upper and lower substrates 164
At.Boss 122 is formed in the lower surface of lower substrate 164.In addition, the upper surface of display screen 16 is provided with cover board 124.
A kind of electronic device of embodiment of the present invention, the optical finger print recognizer component including any of the above-described embodiment
10。
The optical fingerprint sensor 142 of the electronic device of embodiment of the present invention, optical finger print recognizer component 10 is fitted in
The lower surface of boss 122, so that the optical path of the light reflected from finger surface increases, reflection light is projected to optical finger print sensing
The projected area of device 142 is bigger, keeps the pixel utilization rate of optical fingerprint sensor 142 higher, and optical finger print recognizer component 10
Collected fingerprint image is apparent.
Electronic device includes but is not limited to that mobile phone, tablet computer, wearable device, entrance guard device, ATM machine etc. use optics
The electronic device of fingerprint identification function.
For example, optical finger print recognizer component 10 can be used for mobile phone unlock, file encryption, payment when electronic device is mobile phone
The application scenarios such as verifying.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or show
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
It closes.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three,
Unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.