CN110385632A - Magnetic-type polishing clamp and burnishing device - Google Patents
Magnetic-type polishing clamp and burnishing device Download PDFInfo
- Publication number
- CN110385632A CN110385632A CN201910655129.9A CN201910655129A CN110385632A CN 110385632 A CN110385632 A CN 110385632A CN 201910655129 A CN201910655129 A CN 201910655129A CN 110385632 A CN110385632 A CN 110385632A
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- Prior art keywords
- backing plate
- seam allowance
- gear
- burnishing device
- magnetic
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- 230000008569 process Effects 0.000 abstract description 10
- 238000007517 polishing process Methods 0.000 abstract description 9
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 46
- 239000012530 fluid Substances 0.000 description 28
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
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- 239000000463 material Substances 0.000 description 13
- 238000013461 design Methods 0.000 description 10
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 10
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- 238000010521 absorption reaction Methods 0.000 description 5
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
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- 238000012545 processing Methods 0.000 description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
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- 241001391944 Commicarpus scandens Species 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to polishing technology fields, and in particular to a kind of magnetic-type polishing clamp and burnishing device.The present invention is in order to solve the problems, such as in traditional polishing process upper piece and to take piece process is tedious, time-consuming and rupture diaphragm, magnetic-type polishing clamp proposed by the present invention includes chuck body, the front of the chuck body offers the first seam allowance, is used to place polished part on the first seam allowance face；The back side of the chuck body offers multiple blind holes, is used to place magnet in blind hole；After polished part is placed on the first seam allowance face, polished part can be adsorbed on the first seam allowance face by the magnet being placed in blind hole.Magnetic-type polishing clamp of the invention is using magnetic-adsorption film releasing and takes piece, without bonding agent, heats without baking oven, film releasing can be completed at room temperature and take piece process.Not only the used time is shorter during taking piece and load, but also solves the problems, such as that conventional polisher is easy fragment using bonding agent film releasing and when taking piece.
Description
Technical field
The invention belongs to polishing technology fields, and in particular to a kind of magnetic-type polishing clamp and burnishing device.
Background technique
In semicon industry, single-crystal silicon bar materials form a cylindrical bar, the shape after wire cutting after machinery is round as a ball
At certain thickness disk, these disk peripheries carry out chamfer machining, are then roughly ground with wafer lapping machine, and being formed has certain thickness
The relatively flat monocrystalline silicon wafer in the surface of degree.IC chip is made using monocrystalline silicon wafer crystal, is aoxidized, light
The later process such as quarter, burn into diffusion, ion implanting, these processes need wafer to have the bright and clean surface of mirror surface, this just need by
Wafer after grinding carries out single or double polishing.
Traditional polishing wafer technique needs to complete polishing process using following three steps: the first step, to rosin
Wafer it is bigger to be bonded in a diameter, in the relatively high ceramic disk of flatness by bonding agent as main component.Wafer is viscous
When connecing, bonding agent need to be spread by applying in ceramic disk, wafer is placed in ceramic disk, heating in baking oven, heating about 1 are put into
Hour or so, bonding agent can be heated fusing becomes liquid, ceramic disk is taken out out of baking oven together with wafer, In
Temperature without before declining completely, in the case that bonding agent is still liquid, with suitable tool by wafer and ceramic disk it
Between be compacted, wafer and ceramic disk attachment are smooth, stand-by after cooling；Second step installs the ceramic disk of bonding wafer
On polishing machine, wafer is contacted with polishing pad downwards, is passed through polishing fluid, applies suitable pressure, carries out planetary rotation polishing.
Third step removes polished wafer together with ceramic disk from polishing machine, is put into heating in baking oven, and heating about 1 is small
When or so, bonding agent can be heated fusing becomes liquid, and ceramic disk is then taken out baking oven, is not fallen completely in temperature
Before coming, in the case that bonding agent is also maintained at liquid condition, wafer is removed from ceramic disk.From traditional polishing process mistake
Journey can be seen that the wafer upper piece of polishing process and take piece, need using bonding agent, and this two step is required to add in an oven
Heat needs to expend the regular hour, consumes certain electric energy, upper piece and takes the process of piece comparatively laborious.Do not consider polishing step
The required time only upper piece and takes this two step of piece, and the time for needing to expend at least needs 4 hours or so.In addition, when taking piece, it is brilliant
Bonding agent is filled between round and ceramic disk, and wafer and ceramic disk surface are relatively flat, between wafer and ceramic disk
Vacuum is formd, it is a very difficult thing that wafer is taken off from ceramic disk surface.If diameter wafer is bigger, such as larger than
Equal to 6 inches (Ф 150mm), wafer thickness is such as less than equal to 0.35mm, when taking piece, unless you give your whole attention to it, then wafer holds very much than relatively thin
Rupture diaphragm.It compares after relatively thin quartz glass disk polished, has 5 fragments in 10, fragment rate is up to 50%.
Using ferrite for substrate, (thickness of presently used soft magnetic ferrite substrate is generally 0.25~0.3mm, disk
Outer diameter is 76mm) when preparing film-type indium antimonide Hall unit chip, one layer of indium antimonide of vacuum evaporation is thin on ferrite wafer
Film, this layer of indium stibide film need high annealing, can form one layer of very thin oxygen on the surface of indium stibide film after high annealing
Compound film needs to get rid of the very thin sull polishing of this layer.In optics industry, need to throw glass surface
Light, in machinery industry, part is also required to polish, so polishing is that one kind generally makes in industries such as semiconductor, optics, machinery
Technique.When preparing film-type indium antimonide Hall unit chip, need to use with a thickness of 0.25~0.3mm, disk outer diameter is
The soft magnetic ferrite thin discs of 76mm need to carry out ferrite wafer into single-sided polishing, ferrite wafer compares monocrystalline as substrate
Silicon wafer is easier fragment, polishes according to traditional polishing processes, because fragment rate is up to 50% or more caused by taking piece, increases thin
The manufacturing cost of membranous type indium antimonide Hall unit chip.
In conclusion using traditional polishing processes, upper piece and take the piece time long, needs to be added with bonding agent and baking oven
Heat increases energy consumption, upper piece, the disadvantages of taking piece process comparatively laborious.For thickness than relatively thin and more fragile material ferrite
Disk, the more easily fragment when taking piece, is faced with the problem that fragment rate is up to 50% or more.
Summary of the invention
The present invention provides a kind of magnetic-type polishing clamp, with faced when solving using traditional polishing processes upper piece and when taking piece
Between it is long, process is comparatively laborious, the problems such as taking the fragment rate of piece high.Cooperate magnetic-type polishing clamp, the present invention additionally provides
It is a kind of it is matched can delay startup, it is slow stop, can positive and negative rotation planetary rotation burnishing device.
Magnetic-type polishing clamp provided by the invention includes chuck body, and the front of the chuck body offers first and stops
Mouthful, for placing polished part on the first seam allowance face；The back side of the chuck body offers multiple blind holes, uses in the blind hole
In placement magnet；After the polished part is placed on first seam allowance face, the magnet energy that is placed in the blind hole
It is enough that the polished part is adsorbed on first seam allowance face.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the back side of the chuck body offers second and stops
Mouthful, for placing counterweight on the second seam allowance face, and the blind hole is evenly distributed on second seam allowance face.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, is offered in the bottom surface of each blind hole and penetrate institute
The through-hole in the first seam allowance face is stated, the through-hole generates vacuum suction for preventing between the polished part and first seam allowance face
It is attached.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the chuck body is in cylindrical body or rectangular cylinder knot
Structure.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, second seam allowance face is rounded, the blind hole
The center of circle around second seam allowance face is uniformly arranged；And/or the quantity of the blind hole is 8-12.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the depth of first seam allowance is less than described polished
The thickness of part.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the outer of the side wall of first seam allowance is set as round
Angle.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, second seam allowance is provided with handle on face, described
Handle picks and places the magnetic-type polishing clamp for operator.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the center in first seam allowance face, which offers, is worn
The tapped through hole in saturating second seam allowance face, the tapped through hole are used for fixing screws；On first seam allowance face with the spiral shell
Line through-hole is concentric to be also provided with counter sink；After the screw is fixed on the tapped through hole, the head energy of the screw
Enough to be submerged in the counter sink completely, the tail portion of the screw, which penetrates and is higher than the part in second seam allowance face, to be convenient for
Operator picks and places the magnetic-type polishing clamp.
In the preferred embodiment of above-mentioned magnetic-type polishing clamp, the magnet is rubidium iron boron strong magnet, strong magnet oxygen
Magnet body or the magnet formed by hot-wire coil.
A kind of burnishing device provided by the invention include central gear, the planetary gear engaged with the central gear and with
The internal gear of the planetary gear engagement；The burnishing device further includes support plate, is laid with and the polishing pad in the support plate
With the first central gear backing plate being placed on the polishing pad；The central gear is placed in the first central gear backing plate
On；The planetary gear is at least three, and above-mentioned for placing at least provided with one on each planetary gear
The receiving opening of polishing clamp；The burnishing device further includes driving motor, is placed in described accommodate in the polishing clamp and leads to
After hole, the driving motor can drive the central gear to rotate, and the central gear drives the planetary gear rotation,
The planetary gear drives the magnetic-type polishing clamp rotation, so that being located at the polished part on first seam allowance face
Friction is generated between the polishing pad.
In the preferred embodiment of above-mentioned burnishing device, the burnishing device further includes the first internal gear backing plate, described
The circular hole for being slightly less than the internal gear internal diameter is offered on first internal gear backing plate；The internal gear is placed in first internal tooth
It takes turns on backing plate, and the planetary gear is placed in the upper table of the first central gear backing plate and the first internal gear backing plate
Face.
In the preferred embodiment of above-mentioned burnishing device, the bottom and upper segment on the interior edge of the first internal gear backing plate is equal
It is set as chamfering；And/or the bottom and upper segment of the outer of the first central gear backing plate is disposed as chamfering.
In the preferred embodiment of above-mentioned burnishing device, the burnishing device further includes and the first central gear pad
The identical second central gear backing plate of hardened structure, the second central gear backing plate are used to cover the central gear from top；
And/or the burnishing device further includes secondary annulus backing plate, and the secondary annulus backing plate is used to cover institute from top
State internal gear.
In the preferred embodiment of above-mentioned burnishing device, the lower surface of the second central gear backing plate and described second
The lower surface of internal gear backing plate is provided with gasket；The gasket is for making the second central gear backing plate and secondary annulus
There is gap between backing plate and the planetary gear.
In the preferred embodiment of above-mentioned burnishing device, at least one magnetically attractive is provided on each planetary gear
Head, the magnetically attractive head is for adsorbing the magnetic particle for being ground to get off on polished part.
In the preferred embodiment of above-mentioned burnishing device, there are four for placing for setting on each planetary gear
The receiving opening for the magnetic-type polishing clamp stated；And/or there are four magnetically attractive heads for setting on each planetary gear.
In the preferred embodiment of above-mentioned burnishing device, the burnishing device further includes polishing fluid spray assemblies and along institute
State the preventing water leakage frame of support plate outer setting；The polishing fluid spray assemblies are used to spray polishing fluid to the burnishing device；
Transparent cover plate is provided with above the preventing water leakage frame, the transparent cover plate can prevent polishing fluid from spilling the polishing dress
It sets, and the working condition for making operator observe the burnishing device by the transparent cover plate；The preventing water leakage frame
Lower section is provided with discharge outlet, and the discharge outlet is for polishing fluid to be discharged to outside the burnishing device.
In the preferred embodiment of above-mentioned burnishing device, burnishing device further includes control unit, the preventing water leakage frame
Top be provided with tongue tube, position corresponding with the tongue tube is provided with magnet on the transparent cover plate；The tongue tube
It is electrically connected with the control unit, when the transparent cover plate is opened, the magnet leaves the tongue tube, and therefore makes described
Tongue tube disconnects, and described control unit controls the burnishing device according to the cut-off signal of the tongue tube and stops working.
In the preferred embodiment of above-mentioned burnishing device, the burnishing device further includes photoelectrical position sensor, described
Photoelectrical position sensor is able to record the number of revolutions of the central gear, and the number of revolutions signal is sent to the control
Unit processed.
In the preferred embodiment of above-mentioned burnishing device, the polishing cushion has latticed impression；And/or
The driving motor is adjustable speed motor；And/or person, the driving motor, which is able to carry out, to be rotated clockwise and rotates counterclockwise.
In the preferred embodiment of above-mentioned burnishing device, the burnishing device can be used in film-type indium antimonide Hall
The Chiral Materials of Ferrite Substrate material of element chip is polished.
Compared with prior art, the invention has the following advantages that
Magnetic-type polishing clamp of the invention is using magnetic-adsorption film releasing and takes piece, without bonding agent, is not necessarily to baking oven
Heating, film releasing can be completed at room temperature and take piece process.It can be used repeatedly for rubidium iron boron strong magnet, reduces energy consumption, reduces
The consumption of raw material, reduces production cost.Not only the used time is shorter during taking piece and load, but also solves tradition
The problem of polishing machine is easy fragment using bonding agent film releasing and when taking piece.It is embodied below about more specific beneficial effect
It is further described in detail in mode.
Scheme 1, a kind of magnetic-type polishing clamp, which is characterized in that the magnetic-type polishing clamp includes chuck body, institute
The front for stating chuck body offers the first seam allowance, is used to place polished part on the first seam allowance face；The back of the chuck body
Face offers multiple blind holes, is used to place magnet in the blind hole；
After the polished part is placed on first seam allowance face, the magnet being placed in the blind hole can be incited somebody to action
The polished part is adsorbed on first seam allowance face.
Scheme 2, magnetic-type polishing clamp according to scheme 1, which is characterized in that the back side of the chuck body opens up
There is the second seam allowance, is used to place counterweight on the second seam allowance face, and the blind hole is evenly distributed in second seam allowance face
On.
Scheme 3, the magnetic-type polishing clamp according to scheme 2, which is characterized in that opened in the bottom surface of each blind hole
Equipped with the through-hole for penetrating first seam allowance face, the through-hole is for preventing between the polished part and first seam allowance face
Generate vacuum suction.
Scheme 4, magnetic-type polishing clamp according to scheme 3, which is characterized in that the chuck body in cylindrical body or
Rectangular cylinder structure.
Scheme 5, magnetic-type polishing clamp according to scheme 4, which is characterized in that second seam allowance face is in circle
Shape, the blind hole are uniformly arranged around the center of circle in second seam allowance face；And/or the quantity of the blind hole is 8-12.
Scheme 6, the magnetic-type polishing clamp according to any one of scheme 1 to 5, which is characterized in that described first stops
The depth of mouth is less than the thickness of the polished part.
Scheme 7, the magnetic-type polishing clamp according to any one of scheme 1 to 5, which is characterized in that described first stops
The outer of the side wall of mouth is set as fillet.
Scheme 8, the magnetic-type polishing clamp according to any one of scheme 1 to 5, which is characterized in that described second stops
Handle is provided on mouth face, the handle picks and places the magnetic-type polishing clamp for operator.
Scheme 9, the magnetic-type polishing clamp according to any one of scheme 1 to 5, which is characterized in that described first stops
The center in mouth face offers the tapped through hole for penetrating second seam allowance face, and the tapped through hole is used for fixing screws；Institute
State on the first seam allowance face with the tapped through hole is concentric is also provided with counter sink；
After the screw is fixed on the tapped through hole, the head of the screw can be submerged in the countersunk head completely
In hole, the tail portion of the screw, which penetrates and is higher by the part in second seam allowance face, to pick and place the magnetic convenient for operator
Formula polishing clamp.
Scheme 10, the magnetic-type polishing clamp according to any one of scheme 1 to 5, which is characterized in that the magnet is
Rubidium iron boron strong magnet, strong magnet oxysome magnet or the magnet formed by hot-wire coil.
Scheme 11, a kind of burnishing device, which is characterized in that the burnishing device includes central gear and the centre tooth
The internal gear taking turns the planetary gear of engagement and being engaged with the planetary gear；The burnishing device further include support plate, be laid with
Polishing pad in the support plate and the first central gear backing plate being placed on the polishing pad；The central gear is placed in
On the first central gear backing plate；
The planetary gear is at least three, and is used for the side of placement at least provided with one on each planetary gear
The receiving opening of magnetic-type polishing clamp described in any one of case 1 to 10；
The burnishing device further includes driving motor, described after the polishing clamp is placed in the receiving opening
Driving motor can drive the central gear to rotate, and the central gear drives the planetary gear rotation, the planet tooth
Wheel drives the polishing clamp rotation, so that between the polished part and the polishing pad that are located on first seam allowance face
Generate friction.
Scheme 12, the burnishing device according to scheme 11, which is characterized in that the burnishing device further includes the first internal tooth
Backing plate is taken turns, offers the circular hole for being slightly less than the internal gear internal diameter on the first internal gear backing plate；
The internal gear is placed on the first internal gear backing plate, and the planetary gear is placed in described first
The upper surface of heart gear backing plate and the first internal gear backing plate.
Scheme 13, burnishing device according to scheme 12, which is characterized in that the interior edge of the first internal gear backing plate
Bottom and upper segment is disposed as chamfering；And/or
The bottom and upper segment of the outer of the first central gear backing plate is disposed as chamfering.
Scheme 14, burnishing device according to scheme 13, which is characterized in that the burnishing device further includes and described
The identical second central gear backing plate of one central gear backing structure, the second central gear backing plate are used to cover institute from top
State central gear；
And/or the burnishing device further includes secondary annulus backing plate, the secondary annulus backing plate be used for from
Side covers the internal gear.
Scheme 15, the burnishing device according to scheme 14, which is characterized in that the following table of the second central gear backing plate
Face and the lower surface of the secondary annulus backing plate are provided with gasket；
The gasket is for making between the second central gear backing plate and secondary annulus backing plate and the planetary gear
With gap.
Scheme 16, the burnishing device according to scheme 11, which is characterized in that be provided on each planetary gear to
A few magnetically attractive head, the magnetically attractive head is for adsorbing the magnetic particle for being ground to get off on polished part.
Scheme 17, burnishing device according to scheme 16, which is characterized in that be provided with four on each planetary gear
A receiving opening for polishing clamp described in any one of placement schemes 1 to 10；And/or each planet tooth
4 magnetically attractive heads are provided on wheel.
Scheme 18, burnishing device according to scheme 16, which is characterized in that the burnishing device further includes polishing fluid spray
Drench component and the preventing water leakage frame along support plate outer setting；
The polishing fluid spray assemblies are used to spray polishing fluid to the burnishing device；
Transparent cover plate is provided with above the preventing water leakage frame, it is described that the transparent cover plate can prevent polishing fluid from spilling
Burnishing device, and the working condition for making operator observe the burnishing device by the transparent cover plate；
Discharge outlet is provided with below the preventing water leakage frame, the discharge outlet is used to polishing fluid being discharged to the polishing
Outside device.
Scheme 19, the burnishing device according to scheme 18, which is characterized in that burnishing device further includes control unit, institute
It states and is provided with tongue tube above preventing water leakage frame, position corresponding with the tongue tube is provided with magnetic on the transparent cover plate
Body；
The tongue tube is electrically connected with the control unit, and when the transparent cover plate is opened, the magnet leaves described
Tongue tube, and therefore disconnect the tongue tube, described control unit controls the throwing according to the cut-off signal of the tongue tube
Electro-optical device stops working.
Scheme 20, the burnishing device according to scheme 19, which is characterized in that the burnishing device further includes optoelectronic position
Sensor, the photoelectrical position sensor are able to record the number of revolutions of the central gear, and by the number of revolutions signal
It is sent to described control unit.
Scheme 21, the burnishing device according to any one of scheme 11 to 20, which is characterized in that the polishing strap
There is latticed impression；
And/or the driving motor is adjustable speed motor；
And/or person, the driving motor, which is able to carry out, to be rotated clockwise and rotates counterclockwise.
Scheme 22, the burnishing device according to scheme 21, which is characterized in that the burnishing device can be used in film
The Chiral Materials of Ferrite Substrate material of type indium antimonide Hall unit chip is polished.
Detailed description of the invention
Fig. 1 a is the front oblique view of the magnetic-type polishing clamp of an embodiment of the present invention；
Fig. 1 b is the back side oblique view of the magnetic-type polishing clamp of an embodiment of the present invention；
Fig. 1 c is that magnetic-type polishing clamp of the invention adsorbs the front view after polished part；
Fig. 2 a is the rear elevation view of the magnetic-type polishing clamp of an embodiment of the present invention；
The cross-sectional view in the direction A-A along Fig. 2 a Fig. 2 b；
Fig. 2 c is the partial enlarged view of B area in Fig. 2 b；
Fig. 3 is the back side oblique view of the magnetic-type polishing clamp with central screw of an embodiment of the present invention；
Fig. 4 is that (polishing clamp is omitted without counterweight for the front view of the burnishing device of an embodiment of the present invention
Two central gear backing plates and secondary annulus backing plate)；
Fig. 5 is that (polishing clamp shows second without counterweight for the front view of the burnishing device of an embodiment of the present invention
Central gear backing plate and secondary annulus backing plate)；
Fig. 6 is that (polishing clamp band counterweight, and shows second for the front view of the burnishing device of an embodiment of the present invention
Central gear backing plate and secondary annulus backing plate).
Appended drawing reference: 1- chuck body, the first seam allowance of 11-, the second seam allowance of 12-, 13- blind hole, 14- through-hole, 15- screw thread are logical
Hole, 16- counter sink；2- central gear, 21- the first central gear backing plate, 22- the second central gear backing plate；3- planetary gear,
31- receiving opening, 32- magnetically attractive head；4- internal gear, 41- the first internal gear backing plate, 42- secondary annulus backing plate；5- polishing pad.
Specific embodiment
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention.But the present invention can be with
Much it is different from other way described herein to implement, those skilled in the art can be without prejudice to intension of the present invention the case where
Under do similar popularization, therefore the present invention is not limited to the specific embodiments disclosed below.
For the ease of clearly demonstrating a specific embodiment of the invention, below using ferrite as polished part for into
Row explanation.In the present embodiment, it is 76mm that polished part, which is outer diameter, with a thickness of the ferrite thin rounded flakes of 0.25-0.3mm, originally
Ferrite wafer is utilized in invention can be by the characteristic of magnet absorption.In addition to ferrite, polished part of the invention can be with
It is the material that iron, silicon rigid, permalloy, rubidium iron boron etc. can be attracted by the magnetic force.
With reference first to Fig. 1 a-1c, Fig. 1 a-1c is that the front of the magnetic-type polishing clamp of an embodiment of the present invention is oblique respectively
Front view after view, back side oblique view and the polished part of absorption.As illustrated by figures 1 a-1 c, the magnetic-type polishing folder of the present invention
Tool includes chuck body 1, and the front of chuck body 1 offers the first seam allowance 11, is used to place ferrite on the first seam allowance face；Folder
The back side of tool ontology 1 offers multiple blind holes 13, is used to place magnet in blind hole 13.It as an example, can also be in fixture
The back side of ontology 1 opens up the second seam allowance 12, and blind hole 13 is provided on the second seam allowance face at this time.Match on second seam allowance face for placing
Heavy mail (shows the counterweight being placed on the second seam allowance face) in Fig. 6, which is used to increase the weight of chuck body 1,
To increase frictional force.After ferrite is placed on the first seam allowance face, the magnet being placed in blind hole 13 can be by iron oxygen
Body is adsorbed on the first seam allowance face.
Specifically, the shape of magnetic-type polishing clamp of the invention can be set to cylindrical structure, also can be set
For rectangular cylinder structure, other conjunctions can also be set by magnetic-type polishing clamp according to actual needs by those skilled in the art
Suitable shape, such as rhombogen, obform body, the present invention are not defined the shape of magnetic-type polishing clamp.Magnetic-type folder
The making material of tool can not generate magnetic field using 304# or 316# stainless steel, aluminium alloy, nylon, epoxy resin, plastics etc.
The material of absorption.The magnetic-type polishing clamp of the present embodiment is the cylindrical structure made of 304# stainless steel.Specifically, it uses
304# stainless steel bar, one outer diameter of vehicle is 80mm, the chuck body 1 that length is 50mm, then flat at one of chuck body 1
Face (front of chuck body 1) one depth of vehicle is 0.2mm, the first seam allowance 11 that diameter is 76.4mm, first seam allowance 11 with
The front concentric of chuck body 1.The plane (i.e. the first seam allowance face) of first seam allowance 11 can place ferrite wafer.In fixture
Another plane (back side of chuck body 1) one diameter of vehicle of ontology 1 is 75mm, and depth is the second seam allowance 12 of 10mm, the
The back side concentric of two seam allowances 12 and chuck body 1.The plane (i.e. the second seam allowance face) of second seam allowance 12 can place counterweight.
B referring to Fig.1, blind hole 13 are evenly distributed on the second seam allowance face.In the present embodiment, the quantity of blind hole 13 is 8
It is a, and be uniformly arranged around the center of circle in the second seam allowance face.In some embodiments, the quantity of blind hole 13 may be arranged as other
Suitable quantity, such as 10,12.It should be noted that since blind hole 13 is evenly provided on the second seam allowance face,
So, after placing magnet in blind hole 13, magnet can be to the side for the ferrite wafer being placed on the first seam allowance face
Edge generates uniform adsorption capacity.For example, this 8 blind holes can be evenly arranged in and the second seam allowance when 8 blind holes are arranged
On face concentric, the circumference that diameter is 60mm.In other words, this 8 blind holes 13 are equably looped around close to the second seam allowance face outer
Position, not only can guarantee that ferrite by uniform adsorption capacity, can also avoid ferrite from alice phenomenon occur.Also
Can with the second seam allowance face concentric, diameter be 30mm circumference on be uniformly arranged 4 blind holes 13 again, these without departure from this
The protection scope of invention.
As an example, the diameter of each blind hole 13 can be 10.2mm, depth can be 49.3mm.Magnet in blind hole 13
It can be rubidium iron boron strong magnet, the thickness of rubidium iron boron strong magnet can be 4mm.It should be noted that magnet of the invention can be with
Any appropriate kicker magnet is selected according to actual needs by those skilled in the art, as long as can be realized the mesh for adsorbing polished part
?.For example, magnet of the invention can also be strong magnet oxysome magnet in addition to rubidium iron boron strong magnet, also can use
The strong magnetic force that coil generates after being powered adsorbs polished part as magnet.
Referring to Fig. 2 a, Fig. 2 a is the rear elevation view of the magnetic-type polishing clamp of an embodiment of the present invention.Such as Fig. 2 a institute
Show, the bottom surface of each blind hole 13 offers the through-hole 14 for penetrating the first seam allowance face, and through-hole 14 is the round hole of diameter 2mm, and logical
Hole 14 and blind hole 13 are concentric.Through-hole 14 is for preventing from generating vacuum suction between ferrite and the first seam allowance face.Specifically,
When ferrite wafer polishing terminates to take piece, these through-holes 14 can prevent ferrite wafer and the first seam allowance face as air vent
Between due to there is polishing fluid generate vacuum suction.In other words, there are these through-holes 14, ferrite wafer is just easy to remove
Come.
Referring to Fig. 2 b and 2c, the cross-sectional view in the direction A-A along Fig. 2 a Fig. 2 b, Fig. 2 c is the partial enlargement of B area in Fig. 2 b
Figure.As shown in figs. 2 b and 2 c, the outer of the side wall of the first seam allowance 11 is set as fillet, i.e. the position in the upper right corner in Fig. 2 c.The circle
The radius at angle can be set to 0.5mm, and those skilled in the art can also need to set the radius of the fillet according to actual design
It is set to 0.1-1mm or other reasonable sizes.The fillet can prevent chuck body 1 when chuck body 1 is rotated
Corner is sharp keen and scratches polishing pad (being hereafter described further to polishing pad), while can also reduce in addition to polished part
Frictional resistance.In addition, other corners of chuck body 1 can also make blunt processing.
More specifically, the depth of the first seam allowance is typically slightly less than the thickness of polished body.In the present embodiment, polished part iron
Oxysome disk with a thickness of 0.25-0.3mm, therefore the depth of the first seam allowance can be set smaller than 0.25mm, such as be arranged
For 0.2mm.Preferably, the first seam allowance face angle Xu Qing.Between the bottom of blind hole 13 and the first seam allowance face with a thickness of 0.5mm (
0.5mm can be less than), which is in order to which the magnet guaranteed in blind hole 13 can be to the ferrite positioned at the first seam allowance face with most
Big adsorption capacity.Preferably, the 13 bottom surface angle Xu Qing of blind hole.
It is as follows that magnetic-type polishing clamp of the invention is put into ferritic mode of operation: firstly, make the first seam allowance face 11 to
On, ferrite thin rounded flakes are put into, ferrite plane is parallel with the first seam allowance face 11 (since the internal diameter in the first seam allowance face is
76.4mm, ferritic outer diameter is 76mm, thus ferrite can be put into the first seam allowance face；It is ferritic with a thickness of 0.25~
The depth of 0.3mm, the first seam allowance face 11 are 0.2mm, and after installing ferrite, a ferritic face will be higher by chuck body
0.05~0.1mm or so).Then, ferrite circle sheet is protected with left hand, prevents ferrite circle sheet from falling down, then by fixture
Ontology 1 is inverted, keeps its back side up, is put into the strong magnetic of rubidium iron boron in each blind hole 13 in the second seam allowance face with the right hand at this time
Iron, adsorbs ferritic characteristic using rubidium iron boron strong magnet, ferrite is firmly adsorbed on the first seam allowance face, unclamps at this time left
Hand, ferrite circle sheet would not fall down.The front schematic view of chuck body 1 after adsorbing ferrite is as illustrated in figure 1 c.
In a kind of specific embodiment, referring back to Fig. 1 a and 1b, the center in the first seam allowance face, which offers, is worn
The tapped through hole 15 in saturating second seam allowance face, tapped through hole 15 are used for fixing screws；It is coaxial with tapped through hole 15 on first seam allowance face
The heart is also provided with counter sink 16；After screw is fixed on tapped through hole 15, the head of screw can be submerged in counter sink completely
In 16, this design will not influence the first seam allowance face and ferritic suction so that screw head does not exceed the first seam allowance face
It is attached.The part that the tail portion of screw penetrates the second seam allowance face can pick and place magnetic-type polishing clamp convenient for operator.Reference Fig. 3,
Fig. 3 is the back side oblique view of the magnetic-type polishing clamp with central screw of an embodiment of the present invention.As shown in figure 3, the
The central part screw outstanding in two seam allowance faces can be used as handle, and operator is facilitated to pick and place magnetic-type polishing clamp.As
Example, the tapped through hole 15 are suitable for the cup head plus screw of M6, and the diameter of counter sink 16 can be 12mm, depth 8mm.
Alternatively it is possible to not open up tapped through hole 15 and counter sink 16 in the center in the first seam allowance face, only need
One handle is set on the second seam allowance face, equally can achieve the mesh for picking and placing magnetic-type polishing clamp convenient for operator
's.The present invention is not defined the specific structure of handle, form.In other words, those skilled in the art can be according to practical need
The structure for flexibly setting handle is sought, these are without departure from protection scope of the present invention.
The present invention also provides a kind of burnishing devices.Referring to Fig. 4, Fig. 4 is the burnishing device of an embodiment of the present invention
Front view (the second central gear backing plate and secondary annulus backing plate is omitted without counterweight in polishing clamp).Such as Fig. 4 institute
Show, burnishing device of the invention includes planetary gear rotating mechanism (this that central gear 2, planetary gear 3 and internal gear 4 form
Planetary gear 3 in embodiment is three), wherein central gear 2 is engaged with planetary gear 3, planetary gear 3 is nibbled with internal gear 4
It closes.Burnishing device further includes support plate (being not shown in Fig. 4), the polishing pad 5 being layed in support plate and is placed on polishing pad 5
The first central gear backing plate 21, the outer diameter of the first central gear backing plate 21 and the second central gear backing plate 22 is greater than central gear
2 outer diameter, central gear 2 are placed on the first central gear backing plate 21.It is provided on each planetary gear 3 above-mentioned for placing
The receiving opening 31 of magnetic-type polishing clamp.In the present embodiment, equably setting is logical there are four accommodating on each planetary gear 3
Hole 31.The burnishing device further includes driving motor (being not shown in Fig. 4), after polishing clamp is placed in receiving opening 31, is driven
Dynamic motor can drive central gear 2 to rotate, and central gear 2 drives planetary gear 3 to rotate, and planetary gear 3 drives magnetic-type throwing
Light fixture rotation so that be located at the first seam allowance face on ferrite and polishing pad 5 between generate friction, i.e., to ferrite into
Row polishing.
Further, burnishing device further includes the first internal gear backing plate 41, offers and is slightly less than on the first internal gear backing plate 41
The big hole of 4 internal diameter of internal gear.Internal gear 4 is placed on the first internal gear backing plate 41, and planetary gear 3 is placed in first
The upper surface of heart gear backing plate 21 and the first internal gear backing plate 41.
Specifically, one can be made using the nylon material with a thickness of 20mm identical with 4 outer dimension of internal gear
Support plate is laid with the polishing that the thickness with latticed impression of a size identical as support plate is about 5mm on the supporting plate
Pad 5, it is the first internal gear backing plate of 20mm that the shape same thickness of an outer dimension and support plate is put in face on the pad 5
41, the central part of the first internal gear backing plate separates a big hole, and the internal diameter of big hole is less than the internal diameter of internal gear 4.It is polishing
A first central gear backing plate 21 is placed in the center of pad 5, does one in the centre of central gear backing plate 21
The matched diameter of heart gear 2 is the through-hole and a keyway of 10.5mm, and central gear 2 is placed on central gear backing plate 21.In
3 planetary gears 3 are uniformly placed between internal gear 4 and central gear 2, planetary gear 3 is placed in the first central gear backing plate 21
With the upper surface of the first internal gear backing plate 41.In other words, 1 central gear, 3 planetary gears and 1 internal gear, first
In the plane that internal gear backing plate 41 and the first central gear backing plate 21 are formed.
It will be appreciated by persons skilled in the art that the structure according to burnishing device of the present invention designs, polishing pad 5 and magnetic
Accurate matching design is no longer needed between formula polishing clamp 1, in other words, burnishing device of the invention is carrying out polishing operation
When, polishing pad 5 only needs to be layed in support plate, and then magnetic-type 1 front of polishing clamp is directly born against on the polishing pad 5
, so, magnetic-type polishing clamp 1 in the course of rotation, the ferrite wafer on the first seam allowance face
It is contacted with polishing pad 5 and generates friction.And existing polishing machine generally requires to match the machinery between polishing pad and polishing clamp
It closes and carries out accurate design, undoubtedly increase design and processing cost.Compared with the existing technology, burnishing device of the invention is no longer
Accurate matching design is needed, Machine Design and processing cost can be greatly saved.
Further, to guarantee 3 smooth rotation of planetary gear and easy for installation, can also in the first internal gear backing plate 41 edge
Bottom and upper segment the chamfering of a 10mm and 5mm is respectively set；And the top in the outer of the first central gear backing plate 21
The chamfering of a 10mm and 5mm is respectively set below.
In a kind of specific embodiment, referring to Fig. 5, Fig. 5 is facing for the burnishing device of an embodiment of the present invention
Scheme (polishing clamp shows the second central gear backing plate and secondary annulus backing plate without counterweight).As shown in figure 5, this hair
Bright burnishing device further includes the second central gear backing plate 22 identical with 21 structure of the first central gear backing plate and the second internal tooth
Backing plate 42 is taken turns, the second central gear backing plate 22 is used to cover central gear 2 from top, and secondary annulus backing plate 42 is used for from top
Cover internal gear 4.So, 1 support plate, 1 polishing pad, 5,2 central gear backing plate (the first central gear backing plates 21
With the second central gear backing plate 22) and 1 central gear 2 center, a 304# stainless steel with keyway arrangements can be passed through
The central axis of production is fixed on the center of support plate.1 support plate, 1 polishing pad, 5,2 internal gear backing plate (the first internal gears
Backing plate 41 and secondary annulus backing plate 42) and 1 internal gear, surrounding alignment in edge can use screw by the through-hole on edge
These components are locked with nut.Internal gear 4 and central gear 2 are fixed by the above method, and planetary gear 3 passes through 2
Central gear backing plate (the first central gear backing plate 21 and the second central gear backing plate 22) and 2 internal gear backing plate (the first internal tooths
Take turns backing plate 41 and secondary annulus backing plate 42) complete positioning up and down, 3 circumference of planetary gear by with central gear 2 and internal gear 4
Carry out engaged gears positioning.First and second central gear backing plates, 22 outer and the first and second internal gear backing plates pressure 42 it is interior
Along being also arranged to chamfering, these chamferings can allow planetary gear smooth rotation, after planetary gear 3 can also be prevented to be fixed
Two central gear backing plates and two internal gear backing plates are compressed and can not be rotated.
As an example, driving motor provided by the present invention is adjustable speed motor.It is formed under the drive of adjustable speed motor
A kind of planetary rotation structure.Herein about the specific mode for connecting, installing between adjustable speed motor and the central gear mechanism
It is no longer described in detail, those skilled in the art can flexible setting according to the actual situation.Preferably, it is rotated in planetary gear
When, the outer of equally distributed four receiving openings 31 above each planetary gear, not with the outer of two central gear backing plates
Or the inner hole outer intersection or tangent of two internal gear backing plates, to guarantee that burnishing device does not collide with these backing plates.It needs
Illustrate, when starting driving motor, if driving motor starting speed is quickly, revolving speed quickly reaches specified turn of driving motor
Speed, with regard to bigger, ferrite wafer is easy to skid off the first seam allowance face frictional force at this time, skids off the ferrite in the first seam allowance face
Thin slice is easy to be collided and fragment.For this purpose, solving this problem by the way of the gentle stopping of delay startup.Specifically: by
It is adjustable speed motor in the driving motor, adjustable speed motor can be controlled using PLC (programmable controller), in starting driving electricity
When machine, driving motor can be made slowly to start, such as reach rated speed in 1 minute；It equally, can when closing driving motor
So that driving motor slowly stops, such as stopping operating in 1 minute.It is all made of that delay startup is gentle to stop when starting or stoping every time
Only, so, it can effectively solve the problems, such as that ferrite circle sheet easily slides out the first seam allowance face.
As an example, the adjustable speed motor can both be rotated clockwise, (i.e. motor can also be rotated counterclockwise
Can rotate forward, can invert), it designs in this way, so that burnishing device when carrying out polishing operation, can neatly control the rotation of motor
Direction, such as can control after motor rotates clockwise 30 minutes, stop 10 seconds, another mistake hour hands rotate 30 minutes, then stop 10
Second, it moves in circles in this way, makes the polishing of ferrite wafer can more evenly.
As a preferred embodiment, lower surface and secondary annulus backing plate 42 in the second central gear backing plate 22
Lower surface be provided with gasket, the gasket is for making the second central gear backing plate 22 and secondary annulus backing plate 42 and planet tooth
There is gap, which can guarantee 3 smooth rotation of planetary gear, in two after preventing planetary gear 3 to be fixed between wheel 3
Heart gear backing plate and two internal gear backing plates are compressed and can not be rotated.As an example, the thickness of the gasket can be 1mm.
In a kind of specific embodiment, with continued reference to Figure 4 and 5, at least one magnetically attractive head is provided on planetary gear 3
32, magnetically attractive head 32 is ground the magnetic particle to get off for adsorbing ferrite.Specifically, in the present embodiment, each planet tooth
Four receiving openings 31 are uniformly arranged on wheel 3, the quantity of magnetically attractive head 32 is also equably set as four, and magnetically attractive head 32 and receiving
Through-hole 31 is distributed in alternating expression.Burnishing device is ground to the magnetic powder particle absorption got off by magnetic suction head 32 from ferrite wafer
On magnetically attractive head, can allow ferrite wafer polishing effect more preferably.
As an example, reference Fig. 6, Fig. 6 is the front view (polishing of the burnishing device of another embodiment of the invention
Clamp strap counterweight, and show the second central gear backing plate and secondary annulus backing plate).As shown in fig. 6, the of polishing clamp
Counterweight is placed on two seam allowance faces.The frictional force that those skilled in the art can according to need application, which calculates, needs increased match
The weight of heavy mail.
In a kind of specific embodiment, burnishing device further includes polishing fluid spray assemblies and is arranged along support plate outer
Preventing water leakage frame.Polishing fluid spray assemblies are used to spray polishing fluid to burnishing device；It is provided with above preventing water leakage frame
Bright cover board, transparent cover plate can prevent polishing fluid from spilling burnishing device, and throw operator by transparent cover plate observation
The working condition of electro-optical device；Discharge outlet is provided with below preventing water leakage frame, discharge outlet is used to for polishing fluid to be discharged to polishing dress
It sets outer.Although not providing the structural schematic diagram of spray assemblies, preventing water leakage frame, transparent cover plate and discharge outlet in attached drawing,
It will be appreciated by persons skilled in the art that these components can increase safety of burnishing device during polishing ferrite
Property, corollary apparatus or auxiliary device, specific structure setting can be flexibly set according to practical application scene.For example,
Spray assemblies can be mounted on above transparent cover plate, so that spray port is located at the top of the second central gear backing plate 22, holding
The polishing fluid in bucket is passed through water pipe by one suction pump (belonging to spray assemblies) of installation configuration, suction pump in the bucket of polishing fluid
It is extracted into spray port, by spray port, polishing fluid is sprayed to inside burnishing device, carries out the process of polishing operation in burnishing device
In, polishing fluid is arranged to preventing water leakage frame, and the polishing fluid that preventing water leakage frame is collected into is flowed into polishing dress by discharge outlet and water pipe
It sets outside to hold in the bucket of polishing fluid, polishing fluid is extracted into spray nozzle by water pipe again by suction pump, and material is thus formed one
The circulation of a polishing fluid, polishing fluid can be used circularly.
Further, a tongue tube can also be installed on preventing water leakage frame, installed on the corresponding position of transparent cover plate
One magnet, such as rubidium iron boron strong magnet, when transparent cover plate is opened, rubidium iron boron strong magnet leaves tongue tube, and tongue tube disconnects,
PLC is automatically stopped the rotation of driving motor, and the pump work that stops pumping, and can prevent having corrosive polishing fluid sprinkle in this way
To outside, while central gear and planetary gear stop rotating, can be to avoid the crowded finger for hurting operator.
Further, a photoelectrical position sensor can also be set on burnishing device of the invention, utilize the photopotential
The number of revolutions of sensor records center gear 2 is set, and is transmitted to PLC controller, realizes the automatic control to burnishing device.
Film-type indium antimonide Hall unit chip, if being used for linear measurement, the substrate used is non-magnetic substrate, can be with
Use monocrystalline silicon wafer crystal, quartz glass disk or ceramic disks；If switching mode application is used for, such as in DC Brushless Motor
It uses, then substrate needs the magnetic substrates using soft magnetic ferrite, for externally-applied magnetic field to be converged to indium antimonide sensitive layer
Place, obtains higher magnetic field strength.Therefore, of the invention when indium antimonide Hall unit chip is used for switching mode application
Burnishing device can be used for polishing the Chiral Materials of Ferrite Substrate material of film-type indium antimonide Hall unit chip.
As described above, in the present embodiment, burnishing device can once polish 12 ferrite wafers.Each polishing clamp
Is installed less than 30 seconds the time of a piece of ferrite wafer, when taking piece, is mounted on blind hole 13 with the absorption of another rubidium iron boron strong magnet
Interior nd-fe-b magnet, the used time is shorter, can be strong by the rubidium iron boron in all blind holes of a chuck body 1 less than 10 seconds
Magnet is removed.12 ferrite wafers are installed, the used time was less than 6 minutes；12 ferrites are removed after polishing, the used time was less than 3 minutes.
It load and takes the total time of piece about within 10 minutes, traditional burnishing device load and piece is taken at least to need 4 hours, with this phase
Than efficiency improves 24 times or more.
Burnishing device of the invention is using magnetic-adsorption film releasing and takes piece, without bonding agent, heats without baking oven, In
Film releasing can be completed at room temperature and take piece process.It can be used repeatedly for rubidium iron boron strong magnet, reduces energy consumption, reduces raw material
Consumption, reduce production cost, and solve the problems, such as to be easy fragment when conventional polisher takes piece using bonding agent.
In addition, the burnishing device of the present embodiment, most of components are made of nylon, and burnishing device overall structure compares
Lightly, total weight is no more than 400 kilograms, can be placed on the flooring of general load-bearing, and traditional polishing machine compares because of equipment
Weight, can only generally be placed on Stall, if being placed on the flooring of second floor or more, need to increase the weighted design and structure of building,
Increase the cost that equipment uses.The central gear of the present embodiment, planetary gear, internal gear, two internal gear backing plates, support plates
Equal components are made of nylon, when central gear and planetary gear rotary motion, lubrication are completed using polishing fluid, without adding
Add additional lubricating oil, avoids pollution of the ferrite wafer by lubricating oil.In addition, by central gear, planetary gear and interior
The planetary rotation structure that gear is constituted is more brisk, it is only necessary to which the adjustable speed motor that a power is 800W can drive centre tooth
Wheel and planetary gear are rotated, and counterweight on polishing clamp band installs 12 polishing clamps, and power of motor can meet and make
With.Under conventional polisher needs 5 motors, 4 motors that 4 ceramic disks, the biggish motor of 1 power ratio is driven to drive respectively
Face great circle disc spins, structure is more complicated, while increasing the weight of polishing machine, also increases energy consumption.
The burnishing device of the invention ceramic disk relatively high without flatness.Ceramic disk size is bigger, generally
Ceramic disk outer diameter about 400~500mm, thickness about 20mm, weight is about 7 kilograms, than heavier.Importantly, this pottery
Porcelain disk manufacturing cost is relatively high.In addition, when in use, accidentally fall on the ground, it is easy to break, and fixture sheet of the invention
The components such as body, planetary gear are sturdy durable.
Burnishing device of the invention can stop at any time, check polishing effect, compared with conventional polisher, extremely just
Benefit.Also have the function of delay startup, slow stopping, being rotated both clockwise and counterclockwise, hesitation is also needed to check polishing effect sometimes,
According to the mark that polishing time terminates as polishing, then inaccurate, effect is bad.In general, ferrite wafer is in planet
It rotates in polishing process, whether rotates forward or invert, whether fast or slow, ferrite wafer friction on polishing cushion is logical
The distance crossed is directly proportional to the number that central gear rotates a circle, time of polishing effect and the central gear rotation of ferrite wafer
Number is corresponding, and using PLC come the number of revolutions of records center sheave, and rule of thumb, setting center sheave total needs to rotate
Number, when PLC record center sheave add up number of revolutions be equal to total degree when, the work of polishing machine can be automatically stopped,
Stop motor rotation, stop pumping pump work, thereby realizes the automation of polishing process.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting the present invention, any this field skill
Art personnel without departing from the spirit and scope of the present invention, can make possible variation and modification, therefore guarantor of the invention
Shield range should be subject to the range that the claims in the present invention are defined.
Claims (10)
1. a kind of magnetic-type polishing clamp, which is characterized in that the magnetic-type polishing clamp includes chuck body, the fixture sheet
The front of body offers the first seam allowance, is used to place polished part on the first seam allowance face；The back side of the chuck body offers
Multiple blind holes, the blind hole are interior for placing magnet；
After the polished part is placed on first seam allowance face, being placed in magnet in the blind hole can will be described
Polished part is adsorbed on first seam allowance face.
2. magnetic-type polishing clamp according to claim 1, which is characterized in that the back side of the chuck body offers
Two seam allowances, for placing counterweight on the second seam allowance face, and the blind hole is evenly distributed on second seam allowance face.
3. magnetic-type polishing clamp according to claim 2, which is characterized in that offered in the bottom surface of each blind hole
The through-hole in first seam allowance face is penetrated, the through-hole is for preventing from generating between the polished part and first seam allowance face
Vacuum suction.
4. magnetic-type polishing clamp according to claim 3, which is characterized in that the chuck body is in cylindrical body or rectangle
Column structure.
5. magnetic-type polishing clamp according to claim 4, which is characterized in that second seam allowance face is rounded, institute
Blind hole is stated to be uniformly arranged around the center of circle in second seam allowance face；And/or the quantity of the blind hole is 8-12.
6. a kind of burnishing device, which is characterized in that the burnishing device includes central gear, the row that engages with the central gear
Star gear and the internal gear engaged with the planetary gear；The burnishing device further includes support plate, is laid with and the support plate
On polishing pad and the first central gear backing plate for being placed on the polishing pad；The central gear is placed in described first
On heart gear backing plate；
The planetary gear is at least three, and wants at least provided with one for placing right on each planetary gear
The receiving opening of magnetic-type polishing clamp described in asking any one of 1 to 5；
The burnishing device further includes driving motor, after the polishing clamp is placed in the receiving opening, the driving
Motor can drive the central gear to rotate, and the central gear drives the planetary gear rotation, the planetary gear band
The polishing clamp rotation is moved, so that generating between the polished part and the polishing pad that are located on first seam allowance face
Friction.
7. burnishing device according to claim 6, which is characterized in that the burnishing device further includes the first internal gear pad
Plate offers the circular hole for being slightly less than the internal gear internal diameter on the first internal gear backing plate；
The internal gear is placed on the first internal gear backing plate, and the planetary gear is placed in first centre tooth
Take turns the upper surface of backing plate and the first internal gear backing plate.
8. burnishing device according to claim 7, which is characterized in that the top on the interior edge of the first internal gear backing plate and
It is disposed as chamfering below；And/or
The bottom and upper segment of the outer of the first central gear backing plate is disposed as chamfering.
9. burnishing device according to claim 8, which is characterized in that the burnishing device further includes and first center
The identical second central gear backing plate of gear backing structure, the second central gear backing plate are used to cover the center from top
Gear；
And/or the burnishing device further includes secondary annulus backing plate, and the secondary annulus backing plate is used for from top lid
State internal gear in residence.
10. burnishing device according to claim 9, which is characterized in that the lower surface of the second central gear backing plate and
The lower surface of the secondary annulus backing plate is provided with gasket；
The gasket is for making to have between the second central gear backing plate and secondary annulus backing plate and the planetary gear
Gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655129.9A CN110385632A (en) | 2019-07-19 | 2019-07-19 | Magnetic-type polishing clamp and burnishing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910655129.9A CN110385632A (en) | 2019-07-19 | 2019-07-19 | Magnetic-type polishing clamp and burnishing device |
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| CN110385632A true CN110385632A (en) | 2019-10-29 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1064126A (en) * | 1996-08-21 | 1998-03-06 | Parusutetsuku Kogyo Kk | Holder for stamper |
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