CN206105602U - Wafer grinding device - Google Patents
Wafer grinding device Download PDFInfo
- Publication number
- CN206105602U CN206105602U CN201620844963.4U CN201620844963U CN206105602U CN 206105602 U CN206105602 U CN 206105602U CN 201620844963 U CN201620844963 U CN 201620844963U CN 206105602 U CN206105602 U CN 206105602U
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- China
- Prior art keywords
- top lap
- frame
- drive mechanism
- screw
- fixed plate
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- Expired - Fee Related
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Abstract
The utility model provides a wafer grinding device, includes frame, top lap, lower lapping plate, screw rod drive mechanism, slip table mechanism, load motor and top lap driving motor, the top lap is located the top of lower lapping plate, load motor is installed in the frame, and load motor's output shaft passes through shaft coupling and screw rod drive mechanism butt joint, and top lap driving motor's output shaft passes through the shaft coupling to be connected with clamping device, and clamping device is connected with the top lap, and top lap driving motor installs on last grinder fixed plate, screw rod drive mechanism includes ball and nut seat, and ball rotationally installs in the frame, and the nut seat cover is adorned on ball, nut seat and the linkage of last grinder fixed plate, slip table mechanism includes slider and slip table, and the slider can slide the ground suit from top to bottom on the slip table, and the slip table is fixed in the frame, and slider and last grinder fixed plate are even. The utility model discloses high, the useless piece rate of machining efficiency is low, surface quality is good, quality uniformity that grind is better.
Description
Technical field
This utility model is related to a kind of lapping device of chip, is a kind of thinning machining tool of single-chip.
Background technology
In hyundai electronicses manufacturing industry, the range of application of monocrystalline silicon piece is more and more extensive.Entirely manufacturing in monocrystalline silicon piece
Cheng Zhong, the thinning work of silicon chip are not only measured greatly, but also decide the total quality of silicon single crystal wafer.But at present, monocrystal silicon
The cmp of piece is thinning, the main or mode using contact pressure-loaded, and this may result in silicon chip working (machining) efficiency
Low, waste paper rate is high, and surface quality is poor, and the quality conformance of grinding is also difficult to be effectively controlled, this have become manufacture it is low into
Originally, the short slab of short cycle and high quality silicon chip.
The content of the invention
In order to overcome, the working (machining) efficiency of the thinning machining tool of existing single-chip is low, waste paper rate is high, surface quality is poor, grinding
The unmanageable deficiency of quality conformance, this utility model provides that a kind of high in machining efficiency, waste paper rate is low, surface quality is good
Good, the preferable wafer polishing apparatus of quality conformance of grinding.
This utility model solve technical scheme that its technical problem adopted for：
A kind of wafer polishing apparatus, including frame, top lap, lower abrasive disk, lead-screw drive mechanism, slipway mechanism, use
In drive lead-screw drive mechanism loading motor and for drive top lap rotate top lap motor, it is described on grind
Mill is located at the top of the lower abrasive disk；
The loading motor is installed in frame, and the output shaft of the loading motor is by shaft coupling and lead screw transmission machine
Structure is docked, and the output shaft of the top lap motor is connected with clamping device by shaft coupling, the clamping device with it is upper
Abrasive disk connects, and the top lap motor is arranged in upper lapping device fixed plate；
The lead-screw drive mechanism includes ball-screw and nut seat, and the ball-screw is installed in rotation on frame
On, the nut seat is sleeved on ball-screw, and the nut seat is linked with the upper lapping device fixed plate；
Described slipway mechanism includes slide block and slide unit, and the slide block can slide up and down to and be sleeved on slide unit, the cunning
Platform is fixed in frame, and the slide block is connected with upper lapping device fixed plate.
Further, the lower abrasive disk is located in grinding cover, and the grinding cover is fixed on lower bottom base.
Wafer polishing apparatus of the present utility model are a kind of thinning machining tools of new monocrystalline silicon piece, by traditional contact
Formula cmp technology is improved, and monocrystalline silicon piece is ground thinning, by the control of PLC, can be set up new
Automatic grinding system.
The beneficial effects of the utility model are：Traditional contact cmp technology is improved, to chip
Contactless loading processing is carried out, by the control of PLC, new automatic grinding system can be set up, quality is obtained higher
Surface nature.
Description of the drawings
Fig. 1 is the structural representation of lapping device of the present utility model.
Fig. 2 is the structural representation of equipment of the present utility model.
Fig. 3 is the left view of equipment of the present utility model.
Fig. 4 is the axonometric drawing of equipment of the present utility model.
In figure, 1- loading motors, 2- shaft couplings, 3- bearings, 4- drive leading screw, 5- slide units, 6- top lap motors,
Abrasive disk, 11- grinding covers, 12- frames under the upper lapping device fixed plates of 7-, 8- clamping devices, 9- top laps, 10-.
Specific embodiment
Below in conjunction with the accompanying drawings this utility model is further described.
With reference to Fig. 1～Fig. 4, a kind of wafer polishing apparatus, including frame 12, top lap 9, lower abrasive disk 10, leading screw are passed
Motivation structure 4, slipway mechanism, the loading motor 1 for driving lead-screw drive mechanism and for drive top lap rotate on grind
Mill motor 6, the top lap 9 are located at the top of the lower abrasive disk 10；
The loading motor 1 is installed in frame 12, and the output shaft of the loading motor 1 is passed with leading screw by shaft coupling
Motivation structure is docked, and the output shaft of the top lap motor 6 is connected with clamping device 8 by shaft coupling, the clamping dress
Put 8 to be connected with top lap 9, the top lap motor 6 is arranged in upper lapping device fixed plate 7；
The lead-screw drive mechanism 4 includes ball-screw and nut seat, and the ball-screw is installed in rotation on frame
On 12, the nut seat is sleeved on ball-screw, and the nut seat is linked with the upper lapping device fixed plate；
Described slipway mechanism includes slide block and slide unit 5, and the slide block can slide up and down to and be sleeved on slide unit 5, described
Slide unit is fixed in frame 12, and the slide block is connected with upper lapping device fixed plate 7.
Further, the lower abrasive disk 10 is located in grinding cover 11, and the grinding cover 11 is fixed on lower bottom base.
As Fig. 2, loading motor 1 drive 4 device of leading screw to move linearly up and down, loading motor 1 is installed in overall outer
In structure fixing device 12, docked with 4 device of leading screw is driven by shaft coupling 2.Top lap motor 6 is ground on driving
Disk 9 is rotated, and top lap 9 is connected with clamping device 8, and clamping device 8 is by shaft coupling and top lap motor 6 pairs
Connect；4 device of leading screw is driven to be to be installed in overall external structure by bearing block by two bearings 3 up and down coordinated with which to fix
On device 12；5 device of slide unit is connected with upper lapping device fixed plate 7 by slide block, described to drive 4 device of leading screw to pass through thereon
Feed screw nut seat is connected with upper lapping device fixed plate 7, and loading motor 1 drives leading screw 4 to rotate, and entirely upper lapping device is along cunning
Platform 5 does and moves linearly up and down；
The top lap 9 is connected on top lap motor 6 by clamping device 8, is driven by top lap motor 6
Its rotation；The lower grinding disc device is that lower abrasive disk 10 is placed in grinding cover 11, and grinding cover 11 is fixed in frame 12.
Loading motor 1 drives the ball screw turns of lead-screw drive mechanism 4 by shaft coupling 2 with certain rotational speed.Feed screw nut seat
Be connected with upper lapping device fixed plate 7, drive feed screw apparatus driven by feed screw nut seat go up lapping device fixed plate 7 along
The upper and lower linear slide of slipway mechanism.After lower lapping device is fixed, polishing pad is placed on lower abrasive disk 10, can pass through leading screw
Slipway mechanism adjusts the gap between upper and lower abrasive disk.The clamping device 8 of top lap 9 is integrally fixed on seat, first by crystalline substance
Piece is attached on top lap 9, and 8 lower end of clamping device and top lap 9 connect, and top lap motor 6 passes through shaft coupling and clamping
Device 8 connects, and top lap motor 6 drives top lap 9 to rotate with certain rotational speed.
It should be appreciated that above-mentioned specific embodiment of the present utility model is used only for exemplary illustration or explains this reality
With new principle, and do not constitute to restriction of the present utility model.Therefore, without departing from spirit and scope of the present utility model
In the case of any modification, equivalent substitution and improvements done etc., should be included within protection domain of the present utility model.Additionally,
This utility model claims are intended to fall into scope and border or this scope and border
Whole in equivalents changes and modifications example.
Claims (2)
1. a kind of wafer polishing apparatus, it is characterised in that：Including frame, top lap, lower abrasive disk, lead-screw drive mechanism, cunning
Platform mechanism, the loading motor for driving lead-screw drive mechanism and the top lap for driving top lap to rotate drive electricity
Machine, the top lap are located at the top of the lower abrasive disk；
The loading motor is installed in frame, and the output shaft of the loading motor is by shaft coupling and lead-screw drive mechanism pair
Connect, the output shaft of the top lap motor is connected with clamping device by shaft coupling, the clamping device and upper grinding
Disk connects, and the top lap motor is arranged in upper lapping device fixed plate；
The lead-screw drive mechanism includes ball-screw and nut seat, and the ball-screw is installed in rotation in frame, institute
State nut seat to be sleeved on ball-screw, the nut seat is linked with the upper lapping device fixed plate；
Described slipway mechanism includes slide block and slide unit, and the slide block can slide up and down to and be sleeved on slide unit, and the slide unit is solid
It is scheduled in frame, the slide block is connected with upper lapping device fixed plate.
2. wafer polishing apparatus as claimed in claim 1, it is characterised in that：The lower abrasive disk is located in grinding cover, described
Grinding cover is fixed on lower bottom base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620844963.4U CN206105602U (en) | 2016-08-03 | 2016-08-03 | Wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620844963.4U CN206105602U (en) | 2016-08-03 | 2016-08-03 | Wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206105602U true CN206105602U (en) | 2017-04-19 |
Family
ID=58511284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620844963.4U Expired - Fee Related CN206105602U (en) | 2016-08-03 | 2016-08-03 | Wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206105602U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141898A (en) * | 2016-08-03 | 2016-11-23 | 浙江工业大学 | Wafer polishing apparatus |
-
2016
- 2016-08-03 CN CN201620844963.4U patent/CN206105602U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141898A (en) * | 2016-08-03 | 2016-11-23 | 浙江工业大学 | Wafer polishing apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170419 Termination date: 20190803 |