CN202964340U - Edge grinding machine for silicon wafers - Google Patents
Edge grinding machine for silicon wafers Download PDFInfo
- Publication number
- CN202964340U CN202964340U CN 201220720118 CN201220720118U CN202964340U CN 202964340 U CN202964340 U CN 202964340U CN 201220720118 CN201220720118 CN 201220720118 CN 201220720118 U CN201220720118 U CN 201220720118U CN 202964340 U CN202964340 U CN 202964340U
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- silicon wafer
- motor
- transmission device
- emery wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides an edge grinding machine for silicon wafers. The edge grinding machine comprises a support, a motor, a grinding wheel spindle, a grinding wheel, a pair of silicon wafer clamps and a transmission device. The grinding wheel spindle is fixedly mounted with the grinding wheel, the motor is fixedly mounted on the support, and the grinding wheel spindle is driven by the motor through a belt. The silicon wafer clamps are adjacently located by a side of the grinding wheel, and are fixedly mounted on the transmission device. The edge grinding machine has the advantages of low failure probability, high durability, convenience in operation and high accuracy; and space between the silicon wafer clamps and the grinding wheel can be adjusted by a screw rod transmission.
Description
Technical field
The utility model relates to the silicon chip edge polisher, belongs to mechanical manufacturing field.
Background technology
Silicon chip is after cutting, the edge of silicon chip leaves burr or flaw, the edge of silicon chip need to be polished flat, the mode that generally adopts at present is to superpose the silicon chip that multi-disc need be polished neat, adopt manual mode to polish on dry sanding paper, adopt this mode to require great effort time-consuming, the polishing low precision, misoperation produces scrap exactly.
The utility model content
The purpose of this utility model is to overcome above shortcomings in prior art, thereby provides a kind of reasonable in design, edging efficient high, the edge polisher of silicon chip easily easy and simple to handle.
The technical scheme in the invention for solving the above technical problem is: this silicon chip edge polisher, comprise support, motor, grinding wheel spindle, emery wheel, clamping fixture for silicon wafer and transmission device, described grinding wheel spindle and emery wheel fixed installation, motor is fixedly installed in support, motor adopts the belt transmission grinding wheel spindle, described clamping fixture for silicon wafer adjoins and is located at by emery wheel, and described clamping fixture for silicon wafer is fixedly mounted on transmission device.
Transmission device described in the utility model comprises slide block, slide rail, installing plate, handwheel, screw mandrel, Connection Block, fixedly mount slide rail on described installing plate, screw mandrel and Connection Block screw thread are installed, screw mandrel one end is connected and installed plate, the other end connects handwheel, Connection Block is fixedly connected with support, and slide block and slide rail are complementary slidably.
Emery wheel described in the utility model is the bowl abrasive wheel.
The utility model has the following advantages compared to existing technology: the utility model adopts the moving emery wheel of motor straight tape splicing, and the probability that is out of order simple in structure is low, adopts screw rod transmission to adjust distance between clamping fixture for silicon wafer and emery wheel, and precision easy and simple to handle is high.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is sectional structure schematic diagram of the present utility model.
Fig. 3 is the structural representation of transmission device part described in the utility model.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and by embodiment.
Embodiment:
Referring to Fig. 1 to Fig. 3, silicon chip edge polisher in the present embodiment, comprise support 1, motor 2, grinding wheel spindle 3, emery wheel 4, clamping fixture for silicon wafer 5 and transmission device 6, described grinding wheel spindle 3 and emery wheel 4 fixed installations, motor 2 is fixedly installed in support 1, motor 2 adopts belt transmission grinding wheel spindles 3, and described clamping fixture for silicon wafer 5 adjoins that to be located at emery wheel 4 other, and described clamping fixture for silicon wafer 5 is fixedly mounted on transmission device 6.
Emery wheel 4 described in the utility model is the bowl abrasive wheel.
Claims (3)
1. silicon chip edge polisher, it is characterized in that: comprise support, motor, grinding wheel spindle, emery wheel, clamping fixture for silicon wafer and transmission device, described grinding wheel spindle and emery wheel fixed installation, motor is fixedly installed in support, motor adopts the belt transmission grinding wheel spindle, described clamping fixture for silicon wafer adjoins and is located at by emery wheel, and described clamping fixture for silicon wafer is fixedly mounted on transmission device.
2. silicon chip edge polisher according to claim 1, it is characterized in that: described transmission device comprises slide block, slide rail, installing plate, handwheel, screw mandrel, Connection Block, fixedly mount slide rail on described installing plate, screw mandrel and Connection Block screw thread are installed, screw mandrel one end is connected and installed plate, the other end connects handwheel, and Connection Block is fixedly connected with support, and slide block and slide rail are complementary slidably.
3. silicon chip edge polisher according to claim 1 is characterized in that: described emery wheel is a bowl abrasive wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220720118 CN202964340U (en) | 2012-12-05 | 2012-12-05 | Edge grinding machine for silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220720118 CN202964340U (en) | 2012-12-05 | 2012-12-05 | Edge grinding machine for silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202964340U true CN202964340U (en) | 2013-06-05 |
Family
ID=48505469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220720118 Expired - Fee Related CN202964340U (en) | 2012-12-05 | 2012-12-05 | Edge grinding machine for silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202964340U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081914A (en) * | 2014-05-12 | 2015-11-25 | 苏州意玛斯砂光设备有限公司 | Edging device |
| CN106584285A (en) * | 2016-12-29 | 2017-04-26 | 苏州阿特斯阳光电力科技有限公司 | Method for repairing edge breakage of silicon wafers |
-
2012
- 2012-12-05 CN CN 201220720118 patent/CN202964340U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081914A (en) * | 2014-05-12 | 2015-11-25 | 苏州意玛斯砂光设备有限公司 | Edging device |
| CN106584285A (en) * | 2016-12-29 | 2017-04-26 | 苏州阿特斯阳光电力科技有限公司 | Method for repairing edge breakage of silicon wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 314031, No. 13, China energy saving Jiaxing Industrial Park, No. 1509, Chong Chong Road, Xiuzhou Industrial Park, Zhejiang, Jiaxing Patentee after: Zhejiang CIS Intelligent Equipment Co., Ltd. Address before: 314000, 318 Jiaxing Road, Xiuzhou Industrial Zone, Zhejiang, China Patentee before: Jiaxing Shunlian Rubber and Plastic Machinery Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20161205 |