CN210678251U

CN210678251U - Magnetic attraction type polishing clamp and polishing device

Info

Publication number: CN210678251U
Application number: CN201921139558.2U
Authority: CN
Inventors: 王广才; 王静; 李菁; 欧琳
Original assignee: Nankai University
Current assignee: Nankai University
Priority date: 2019-07-19
Filing date: 2019-07-19
Publication date: 2020-06-05
Anticipated expiration: 2029-07-19

Abstract

The utility model belongs to the technical field of the polishing, concretely relates to formula polishing anchor clamps and burnishing device are inhaled to magnetism. The utility model provides a magnetic attraction type polishing clamp which comprises a clamp body, wherein a first seam allowance is arranged on the front surface of the clamp body, and a piece to be polished is placed on the first seam allowance surface; the back surface of the clamp body is provided with a plurality of blind holes, and magnets are placed in the blind holes; after the piece to be polished is placed on the first stop surface, the magnet placed in the blind hole can adsorb the piece to be polished on the first stop surface. The utility model discloses a formula polishing anchor clamps are inhaled to magnetism adopts magnetic force to adsorb and puts the piece and get the piece, need not to adopt the bonding agent, need not the oven heating, can accomplish at room temperature and put the piece and get the piece process. Not only is the time spent shorter in the process of taking and loading the piece, but also the problem that the traditional polishing machine is easy to fragment when the piece is put and taken by adopting an adhesive is solved.

Description

Magnetic attraction type polishing clamp and polishing device

Technical Field

The utility model belongs to the technical field of the polishing, concretely relates to formula polishing anchor clamps and burnishing device are inhaled to magnetism.

Background

In the semiconductor industry, a cylindrical bar is formed by mechanically rounding a monocrystalline silicon bar, wafers with a certain thickness are formed by cutting the monocrystalline silicon bar, chamfering processing is performed on the peripheries of the wafers, and then a wafer grinding machine is used for performing coarse grinding to form a monocrystalline silicon wafer with a certain thickness and a relatively flat surface. The integrated circuit chip is manufactured by using the monocrystalline silicon wafer, and the subsequent processes such as oxidation, photoetching, corrosion, diffusion, ion implantation and the like are required to be carried out, wherein the processes require that the wafer has a mirror surface smooth surface, so that the polished wafer needs to be subjected to single-side or double-side polishing.

The conventional wafer polishing process needs to adopt the following three steps to complete the polishing process: firstly, a wafer is bonded on a ceramic disc with a large diameter and high flatness by using an adhesive with rosin as a main component. When wafers are bonded, an adhesive is required to be coated on a ceramic disc, the wafers are placed on the ceramic disc and placed in an oven to be heated for about 1 hour, the adhesive can be heated and melted to be liquid, the ceramic disc and the wafers are taken out of the oven, under the condition that the adhesive is still liquid before the temperature is completely reduced, a proper tool is used for compacting the wafer and the ceramic disc, the wafer and the ceramic disc are attached flatly, and the wafer and the ceramic disc are cooled for later use; and secondly, mounting the ceramic disc bonded with the wafer on a polishing machine, enabling the wafer face to be downward in contact with a polishing pad, introducing polishing liquid, applying appropriate pressure, and performing planetary rotary polishing. And thirdly, taking down the polished wafer together with the ceramic disc from the polishing machine, putting the polished wafer into an oven for heating for about 1 hour to melt the adhesive into liquid, taking the ceramic disc out of the oven, and taking down the wafer from the ceramic disc under the condition that the adhesive is still in a liquid state before the temperature is not completely reduced. As can be seen from the conventional polishing process, the wafer loading and the wafer taking of the polishing process need to use an adhesive, and both the two steps need to be heated in an oven, so that certain time and electric energy are consumed, and the processes of loading and taking wafers are complicated. Regardless of the time required for the polishing step, only two steps, i.e., loading and picking, take at least about 4 hours. In addition, when the wafer is taken, the adhesive is filled between the wafer and the ceramic disc, the surfaces of the wafer and the ceramic disc are relatively flat, vacuum is formed between the wafer and the ceramic disc, and the wafer is not easy to take off from the surface of the ceramic disc. If the diameter of the wafer is larger, for example, greater than or equal to 6 inches (phi 150mm), and the thickness of the wafer is thinner, for example, less than or equal to 0.35mm, the wafer is easy to fragment when the wafer is taken out. After polishing a relatively thin quartz glass wafer, 5 of 10 wafers had broken pieces with a breakage rate as high as 50%.

When a ferrite is used as a substrate (the thickness of the soft magnetic ferrite substrate used at present is generally 0.25-0.3mm, and the outer diameter of the wafer is 76mm) to prepare the thin-film indium antimonide Hall element chip, a layer of indium antimonide thin film is vacuum-evaporated on the ferrite wafer, the indium antimonide thin film needs high-temperature annealing, a thin oxide thin film is formed on the surface of the indium antimonide thin film after the high-temperature annealing, and the thin oxide thin film needs to be polished and removed. In the optical industry, the surface of glass needs to be polished, and in the mechanical industry, part of parts also need to be polished, so that polishing is a commonly used process in the industries of semiconductors, optics, machinery and the like. When the thin film type indium antimonide Hall element chip is prepared, a soft magnetic ferrite thin wafer with the thickness of 0.25-0.3mm and the outer diameter of 76mm needs to be used as a substrate, the ferrite wafer needs to be subjected to single-side polishing, the ferrite wafer is easier to fragment than a monocrystalline silicon wafer, if the ferrite wafer is polished by adopting a traditional polishing method, the fragment rate caused by taking the wafer is up to more than 50%, and the manufacturing cost of the thin film type indium antimonide Hall element chip is increased.

In conclusion, the conventional polishing method has the defects that the time for loading and taking the wafer is long, the adhesive and the oven are required for heating, the energy consumption is increased, and the processes of loading and taking the wafer are complicated. For a ferrite wafer with a thinner thickness and a more fragile material, the wafer is more likely to be broken when being taken, and the problem that the breaking rate is as high as more than 50% is faced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a formula polishing anchor clamps are inhaled to the piece that faces when solving and adopting traditional polishing method with get the piece time than longer, the process is loaded down with trivial details, get the piece high scheduling problem of piece rate of piece. Formula polishing anchor clamps are inhaled to cooperation magnetism, the utility model discloses provide a supporting can slow start, slow stop, the rotatory burnishing device of planet that can just reverse rotation in addition.

The magnetic attraction type polishing clamp provided by the utility model comprises a clamp body, wherein the front surface of the clamp body is provided with a first spigot, and the first spigot surface is used for placing a piece to be polished; the back surface of the clamp body is provided with a plurality of blind holes, and magnets are placed in the blind holes; after the piece to be polished is placed on the first stop surface, a magnet placed in the blind hole can adsorb the piece to be polished on the first stop surface.

In a preferred embodiment of the above magnetic attraction type polishing clamp, a second spigot is provided on the back surface of the clamp body, a weight member is placed on the second spigot surface, and the blind holes are uniformly distributed on the second spigot surface.

In a preferred embodiment of the above magnetic attraction type polishing clamp, a through hole penetrating through the first spigot surface is formed in a bottom surface of each blind hole, and the through hole is used for preventing vacuum adsorption between the to-be-polished piece and the first spigot surface.

In a preferred embodiment of the above magnetic attraction type polishing clamp, the clamp body is in a cylindrical or rectangular cylinder structure.

In a preferred embodiment of the magnetic attraction type polishing clamp, the second spigot surface is circular, and the blind holes are uniformly arranged around the center of the second spigot surface; and/or the number of the blind holes is 8-12.

In a preferred embodiment of the above magnetic attraction type polishing jig, a depth of the first spigot is smaller than a thickness of the member to be polished.

In a preferred embodiment of the magnetic attraction type polishing jig, an outer edge of the side wall of the first spigot is provided with a round angle.

In the preferred embodiment of the magnetic type polishing clamp, a handle is arranged on the second spigot surface and used for an operator to take and place the magnetic type polishing clamp.

In a preferred embodiment of the magnetic attraction type polishing clamp, a threaded through hole penetrating through the second spigot surface is formed in the center of the first spigot surface, and the threaded through hole is used for fixing a screw; a countersunk hole is formed in the first spigot surface and is coaxial with the threaded through hole; after the screw is fixed in the threaded through hole, the head of the screw can be completely sunk in the countersunk hole, and the part of the tail of the screw, which penetrates through and is higher than the second spigot surface, can be convenient for an operator to take and place the magnetic-type polishing clamp.

In a preferred embodiment of the above magnetic attraction type polishing jig, the magnet is a rubidium-iron-boron strong magnet, a ferromagnetic ferrite magnet, or a magnet formed of an energized coil.

The utility model provides a polishing device, which comprises a central gear, a planetary gear meshed with the central gear and an internal gear meshed with the planetary gear; the polishing device further comprises a supporting plate, a polishing pad paved on the supporting plate and a first central gear base plate placed on the polishing pad; the central gear is placed on the first central gear base plate; the number of the planetary gears is at least three, and each planetary gear is provided with at least one accommodating through hole for placing the polishing clamp; the polishing device further comprises a driving motor, the polishing clamp is placed behind the accommodating through hole, the driving motor can drive the central gear to rotate, the central gear drives the planetary gear to rotate, the planetary gear drives the magnetic type polishing clamp to rotate, and friction is generated between the polishing piece to be polished on the first spigot surface and the polishing pad.

In a preferred embodiment of the polishing device, the polishing device further comprises a first inner gear backing plate, and a circular hole slightly smaller than the inner diameter of the inner gear is formed in the first inner gear backing plate; the inner gear is placed on the first inner gear backing plate, and the planetary gear is placed on the upper surfaces of the first sun gear backing plate and the first inner gear backing plate.

In a preferred embodiment of the above polishing apparatus, an upper edge and a lower edge of an inner edge of the first internal gear shim plate are both provided with chamfers; and/or the upper edge and the lower edge of the outer edge of the first central gear cushion plate are both provided with chamfers.

In a preferred embodiment of the above polishing apparatus, the polishing apparatus further comprises a second sun gear pad having the same structure as the first sun gear pad, the second sun gear pad being for covering the sun gear from above; and/or the polishing device further comprises a second internal gear backing plate for covering the internal gear from above.

In a preferred embodiment of the above polishing apparatus, a lower surface of the second sun gear backing plate and a lower surface of the second internal gear backing plate are both provided with a spacer; the gasket is used for enabling gaps to be formed between the second sun gear base plate and the planet gear and between the second inner gear base plate and the planet gear.

In a preferred embodiment of the polishing apparatus, each planetary gear is provided with at least one magnetic attracting head for attracting magnetic particles ground off from a member to be polished.

In a preferred embodiment of the polishing apparatus, each planetary gear is provided with four accommodating through holes for placing the magnetic attraction type polishing clamp; and/or four magnetic attracting heads are arranged on each planetary gear.

In a preferred embodiment of the above polishing apparatus, the polishing apparatus further comprises a polishing liquid spray assembly and a water leakage preventing frame disposed along an outer edge of the support plate; the polishing solution spraying assembly is used for spraying polishing solution to the polishing device; a transparent cover plate is arranged above the water leakage prevention frame, and can prevent polishing liquid from spilling out of the polishing device and enable an operator to observe the working state of the polishing device through the transparent cover plate; and a water outlet is arranged below the water leakage prevention frame and used for discharging the polishing liquid out of the polishing device.

In a preferred embodiment of the polishing device, the polishing device further comprises a control unit, a reed switch is arranged above the water leakage prevention frame, and a magnet is arranged on the transparent cover plate corresponding to the reed switch; the reed switch is electrically connected with the control unit, when the transparent cover plate is opened, the magnet leaves the reed switch and accordingly the reed switch is disconnected, and the control unit controls the polishing device to stop working according to a disconnection signal of the reed switch.

In a preferred embodiment of the above polishing apparatus, the polishing apparatus further comprises an optoelectronic position sensor capable of recording the number of rotations of the sun gear and transmitting the number of rotations signal to the control unit.

In a preferred embodiment of the above polishing apparatus, the polishing pad has grid-like indentations; and/or the driving motor is a speed-adjustable motor; and/or the driving motor can rotate clockwise and counterclockwise.

In a preferred embodiment of the above polishing apparatus, the polishing apparatus can be used for polishing a ferrite substrate material of a thin film type indium antimonide hall element chip.

Compared with the prior art, the utility model has the advantages of it is following:

the utility model discloses a formula polishing anchor clamps are inhaled to magnetism adopts magnetic force to adsorb and puts the piece and get the piece, need not to adopt the bonding agent, need not the oven heating, can accomplish at room temperature and put the piece and get the piece process. The rubidium iron boron strong magnet can be repeatedly used, so that the energy consumption is reduced, the consumption of raw materials is reduced, and the production cost is reduced. Not only is the time spent shorter in the process of taking and loading the piece, but also the problem that the traditional polishing machine is easy to fragment when the piece is put and taken by adopting an adhesive is solved. Further details regarding more specific advantageous effects are provided in the following detailed description.

The magnetic attraction type polishing clamp is characterized by comprising a clamp body, wherein a first spigot is formed in the front face of the clamp body, and a piece to be polished is placed on the first spigot face; the back surface of the clamp body is provided with a plurality of blind holes, and magnets are placed in the blind holes;

after the piece to be polished is placed on the first stop surface, a magnet placed in the blind hole can adsorb the piece to be polished on the first stop surface.

Scheme 2, according to scheme 1 formula polishing anchor clamps are inhaled to magnetism, its characterized in that, the second tang has been seted up to the back of anchor clamps body, is used for placing the weight piece on the second tang face, and the blind hole distributes uniformly on the second tang face.

Scheme 3, according to scheme 2 the formula polishing anchor clamps are inhaled to magnetism, its characterized in that, set up the through-hole that pierces through the first tang face in the bottom surface of every blind hole, the through-hole is used for preventing wait to polish produce vacuum adsorption between piece and the first tang face.

Scheme 4, according to scheme 3 formula polishing anchor clamps are inhaled to magnetism, its characterized in that, the anchor clamps body is cylinder or rectangular cylinder structure.

Scheme 5, according to scheme 4 the magnetic attraction type polishing clamp is characterized in that the second spigot surface is circular, and the blind holes are uniformly arranged around the circle center of the second spigot surface; and/or the number of the blind holes is 8-12.

The magnetic attraction type polishing clamp according to claim 6 or any one of claims 1 to 5, wherein the depth of the first seam allowance is smaller than the thickness of the piece to be polished.

Scheme 7, according to scheme 1-5 any one the magnetic-type polishing anchor clamps that characterized in that, the outer edge of the lateral wall of first tang sets up to the fillet.

Scheme 8, according to scheme 1 to 5 any one inhale formula polishing anchor clamps, its characterized in that, be provided with the handle on the second tang face, the handle is used for operating personnel to get and puts formula polishing anchor clamps are inhaled to magnetism.

Scheme 9, the magnetic attraction type polishing clamp according to any one of schemes 1 to 5, characterized in that a threaded through hole penetrating through the second spigot surface is provided at a center position of the first spigot surface, the threaded through hole being used for fixing a screw; a countersunk hole is formed in the first spigot surface and is coaxial with the threaded through hole;

after the screw is fixed in the threaded through hole, the head of the screw can be completely sunk in the countersunk hole, and the tail of the screw penetrates through and is higher than the part of the second spigot surface, so that an operator can conveniently take and place the magnetic-type polishing clamp.

Scheme 10, the magnetic attraction type polishing jig according to any one of schemes 1 to 5, characterized in that the magnet is a rubidium iron boron strong magnet, a strong ferrite magnet, or a magnet formed by an electrified coil.

Scheme 11, a polishing apparatus, characterized in that, the polishing apparatus includes a sun gear, a planetary gear meshing with the sun gear, and an internal gear meshing with the planetary gear; the polishing device further comprises a supporting plate, a polishing pad paved on the supporting plate and a first central gear base plate placed on the polishing pad; the central gear is placed on the first central gear base plate;

the number of the planetary gears is at least three, and each planetary gear is provided with at least one accommodating through hole for placing the magnetic attraction type polishing clamp in any one of the schemes 1 to 10;

the polishing device further comprises a driving motor, after the polishing clamp is placed in the accommodating through hole, the driving motor can drive the central gear to rotate, the central gear drives the planetary gear to rotate, the planetary gear drives the polishing clamp to rotate, and friction is generated between a piece to be polished on the first spigot surface and the polishing pad.

Scheme 12 and the polishing device according to scheme 11, wherein the polishing device further comprises a first inner gear backing plate, and a circular hole slightly smaller than the inner diameter of the inner gear is formed in the first inner gear backing plate;

the inner gear is placed on the first inner gear backing plate, and the planetary gear is placed on the upper surfaces of the first sun gear backing plate and the first inner gear backing plate.

Scheme 13, the polishing apparatus according to scheme 12, wherein both the upper and lower edges of the inner edge of the first internal gear backing plate are provided with chamfers; and/or the like and/or,

the upper edge and the lower edge of the outer edge of the first central gear base plate are both provided with chamfers.

The polishing apparatus according to claim 14 or 13, further comprising a second sun gear pad having the same structure as the first sun gear pad, the second sun gear pad being configured to cover the sun gear from above;

and/or the polishing device further comprises a second internal gear backing plate for covering the internal gear from above.

The polishing apparatus according to claim 15 or 14, wherein both the lower surface of the second sun gear backing plate and the lower surface of the second inner gear backing plate are provided with a gasket;

the gasket is used for enabling gaps to be formed between the second sun gear base plate and the planet gear and between the second inner gear base plate and the planet gear.

The polishing apparatus according to claim 16 or 11, wherein each of the planetary gears is provided with at least one magnetic attracting head for attracting magnetic particles ground off from a member to be polished.

The polishing apparatus according to claim 17 or 16, wherein each of the planetary gears is provided with four receiving through holes for placing the polishing jig according to any one of claims 1 to 10; and/or each planetary gear is provided with 4 magnetic attracting heads.

Scheme 18, the polishing apparatus of claim 16, further comprising a slurry spray assembly and a water leakage prevention frame disposed along an outer edge of the support plate;

the polishing solution spraying assembly is used for spraying polishing solution to the polishing device;

a transparent cover plate is arranged above the water leakage prevention frame, and can prevent polishing liquid from spilling out of the polishing device and enable an operator to observe the working state of the polishing device through the transparent cover plate;

and a water outlet is arranged below the water leakage prevention frame and used for discharging the polishing liquid out of the polishing device.

Scheme 19 and the polishing device according to scheme 18, wherein the polishing device further comprises a control unit, a reed switch is arranged above the water leakage preventing frame, and a magnet is arranged on the transparent cover plate in a position corresponding to the reed switch;

the reed switch is electrically connected with the control unit, when the transparent cover plate is opened, the magnet leaves the reed switch and accordingly the reed switch is disconnected, and the control unit controls the polishing device to stop working according to a disconnection signal of the reed switch.

The polishing apparatus according to claim 20 or 19, wherein the polishing apparatus further comprises a photoelectric position sensor, and the photoelectric position sensor is capable of recording the number of rotations of the sun gear and sending the number of rotations to the control unit.

Scheme 21, the polishing apparatus according to any one of schemes 11 to 20, wherein the polishing pad is provided with grid-like indentations;

and/or the driving motor is a speed-adjustable motor;

and/or the driving motor can rotate clockwise and counterclockwise.

The polishing apparatus according to claim 22 or 21, wherein the polishing apparatus can be used for polishing a ferrite substrate material of a thin film type indium antimonide hall element chip.

Drawings

Fig. 1a is a front oblique view of a magnetic attraction type polishing jig according to an embodiment of the present invention;

fig. 1b is a back oblique view of a magnetic attraction type polishing jig according to an embodiment of the present invention;

FIG. 1c is a front view of the magnetic attraction type polishing clamp of the present invention after adsorbing a polishing object;

fig. 2a is a back elevation view of a magnetic-type polishing fixture according to an embodiment of the present invention;

FIG. 2b is a cross-sectional view taken along the line A-A in FIG. 2 a;

FIG. 2c is an enlarged view of a portion of region B of FIG. 2B;

fig. 3 is a back oblique view of a magnetic attraction type polishing jig with a center screw according to an embodiment of the present invention;

FIG. 4 is a front view of a polishing apparatus according to an embodiment of the present invention (the polishing jig has no counterweight and omits the second sun gear pad plate and the second inner gear pad plate);

FIG. 5 is a front view of a polishing apparatus of an embodiment of the present invention (the polishing fixture is without a counterweight, showing a second sun gear backing plate and a second inner gear backing plate);

fig. 6 is a front view of a polishing apparatus according to an embodiment of the present invention (polishing jig with a weight, and showing a second sun gear pad plate and a second inner gear pad plate).

Reference numerals: 1-a clamp body, 11-a first spigot, 12-a second spigot, 13-a blind hole, 14-a through hole, 15-a threaded through hole and 16-a counter bore; 2-sun gear, 21-first sun gear backing plate, 22-second sun gear backing plate; 3-planet gear, 31-containing through hole, 32-magnetic attraction head; 4-internal gear, 41-first internal gear backing plate, 42-second internal gear backing plate; 5-polishing pad.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be implemented in many different ways than those herein described and one skilled in the art can do so without departing from the spirit and scope of the present invention, which is not limited to the specific implementations disclosed below.

For the sake of clarity, the following description will be made by taking ferrite as an example of the object to be polished. In this embodiment, the polishing object is a circular thin ferrite sheet with an outer diameter of 76mm and a thickness of 0.25-0.3mm, and the utility model utilizes the characteristic that the circular ferrite sheet can be adsorbed by the magnet. Besides ferrite, the polishing article of the present invention can also be made of materials such as iron, silicon steel, permalloy, rubidium, iron, boron, etc. which can be adsorbed by magnetic force.

Referring first to fig. 1a-1c, fig. 1a-1c are front oblique view, back oblique view and front view after adsorbing the polishing piece of the magnetic attraction type polishing clamp according to an embodiment of the present invention. As shown in fig. 1a-1c, the magnetic attraction type polishing clamp of the present invention comprises a clamp body 1, wherein a first seam allowance 11 is formed on the front surface of the clamp body 1, and a ferrite is placed on the first seam allowance surface; the back of the clamp body 1 is provided with a plurality of blind holes 13, and magnets are placed in the blind holes 13. As an example, the second seam allowance 12 may be opened on the back surface of the clamp body 1, and the blind hole 13 is opened on the second seam allowance surface. On the second spigot face, for placing a weight (shown in fig. 6 placed on the second spigot face) for increasing the weight of the clamp body 1, thereby increasing the friction. After the ferrite is placed on the first stop face, the magnet placed inside the blind hole 13 can adsorb the ferrite on the first stop face.

Particularly, the utility model discloses a formula polishing clamp's appearance is inhaled to magnetism can set up to the cylinder structure, also can set up to the rectangular cylinder structure, can also set up formula polishing clamp into other suitable shapes with magnetism according to actual need by the technical personnel in the field, like rhombohedron, dysmorphism body and so on, the utility model discloses not inject formula polishing clamp's shape to magnetism. The magnetic attraction type clamp can be made of materials which do not generate adsorption on a magnetic field, such as 304# or 316# stainless steel, aluminum alloy, nylon, epoxy resin, plastic and the like. The magnetic attraction type polishing clamp of the embodiment is a cylinder structure made of 304# stainless steel. Specifically, a clamp body 1 with an outer diameter of 80mm and a length of 50mm is lathed by using a 304# stainless steel bar stock, and then a first spigot 11 with a depth of 0.2mm and a diameter of 76.4mm is lathed on a plane of the clamp body 1 (the front surface of the clamp body 1), wherein the first spigot 11 is concentric with the front surface of the clamp body 1. The plane of the first spigot 11 (i.e. the first spigot face) can receive a ferrite disc. And turning a second spigot 12 with the diameter of 75mm and the depth of 10mm on the other plane of the clamp body 1 (the back of the clamp body 1), wherein the second spigot 12 is concentric with the back of the clamp body 1. The flat surface of the second spigot 12 (i.e. the second spigot surface) can receive a weight member.

With reference to fig. 1b, the blind holes 13 are evenly distributed over the second spigot face. In the present embodiment, the number of the blind holes 13 is 8, and the blind holes are uniformly arranged around the center of the second spigot surface. In some embodiments, the number of blind holes 13 may also be set to other suitable numbers, such as 10, 12. It should be noted here that since the blind holes 13 are uniformly arranged on the second spigot surface, after the magnet is placed in the blind holes 13, the magnet can generate uniform attraction force on the edge of the ferrite disk placed on the first spigot surface. For example, when 8 blind holes are provided, the 8 blind holes may be uniformly provided on a circumference concentric with the second spigot surface and having a diameter of 60 mm. In other words, the 8 blind holes 13 uniformly surround the position close to the outer edge of the second spigot surface, so that not only can the ferrite be ensured to be subjected to uniform adsorption force, but also the edge warping phenomenon of the ferrite can be avoided. Can also evenly set up 4 blind holes 13 again on the circumference that is 30mm with the second spigot face concentric circles, diameter, these do not all deviate from the utility model discloses a protection scope.

By way of example, each blind hole 13 may have a diameter of 10.2mm and a depth of 49.3 mm. The magnet in the blind hole 13 can be a rubidium-iron-boron strong magnet, and the thickness of the rubidium-iron-boron strong magnet can be 4 mm. It should be noted that, the magnet of the present invention can be selected by those skilled in the art according to actual needs, as long as the purpose of adsorbing the polishing object can be achieved. For example, besides the rubidium-iron-boron strong magnet, the magnet of the present invention may be a strong ferrite magnet, and the strong magnetic force generated after the coil is energized may be used as a magnet to adsorb the member to be polished.

Referring to fig. 2a, fig. 2a is a back elevation view of a magnetic attraction type polishing jig according to an embodiment of the present invention. As shown in fig. 2a, a through hole 14 penetrating through the first spigot surface is formed in the bottom surface of each blind hole 13, the through hole 14 is a circular hole with a diameter of 2mm, and the through hole 14 and the blind hole 13 are coaxial. The through hole 14 is for preventing vacuum suction between the ferrite and the first seam allowance face. Specifically, when the ferrite wafer is taken out after polishing, the through holes 14 serve as air release holes to prevent vacuum adsorption between the ferrite wafer and the first seam allowance surface due to the presence of the polishing liquid. In other words, with these through holes 14, the ferrite disk is easily removed.

Referring to fig. 2B and 2c, fig. 2B is a sectional view taken along a-a direction in fig. 2a, and fig. 2c is a partially enlarged view of a region B in fig. 2B. As shown in fig. 2b and 2c, the outer edge of the sidewall of the first seam allowance 11 is provided with a rounded corner, i.e., at the upper right corner in fig. 2 c. The radius of the round corner can be set to 0.5mm, and those skilled in the art can also set the radius of the round corner to 0.1-1mm or other reasonable sizes according to the actual design requirements. The fillet can prevent the edge of the clamp body 1 from being sharp and scratching the polishing pad (described further below) when the clamp body 1 rotates, and can also reduce the frictional resistance except for the piece to be polished. In addition, other corners of the clamp body 1 can be subjected to blunting treatment.

More specifically, the depth of the first seam allowance is generally slightly smaller than the thickness of the body to be polished. In the embodiment, the thickness of the ferrite disc of the piece to be polished is 0.25-0.3mm, so the depth of the first seam allowance can be set to be less than 0.25mm, for example, to be 0.2 mm. Preferably, the first spigot surface is chamfered. The thickness between the bottom of the blind hole 13 and the first stop face is 0.5mm (or less than 0.5mm), and this design is to ensure that the magnet in the blind hole 13 can give the maximum attraction force to the ferrite on the first stop face. Preferably, the bottom surface of the blind hole 13 needs to be chamfered.

The utility model discloses an operation mode that ferrite was put into to formula burnishing fixture is inhaled to magnetism as follows: first, a circular thin ferrite sheet is placed with the first spigot surface 11 facing upward, and the ferrite plane is parallel to the first spigot surface 11 (since the inner diameter of the first spigot surface is 76.4mm and the outer diameter of the ferrite is 76mm, the ferrite can be placed in the first spigot surface, the thickness of the ferrite is 0.25-0.3mm, the depth of the first spigot surface 11 is 0.2mm, and after the ferrite is mounted, one surface of the ferrite is about 0.05-0.1 mm higher than the fixture body). Then, the left hand is used for protecting the ferrite round slice to prevent the ferrite round slice from falling off, the clamp body 1 is reversed to enable the back face of the clamp body to be upward, at the moment, the right hand is used for placing the rubidium-iron-boron strong magnet into each blind hole 13 of the second spigot face, the characteristic that the rubidium-iron-boron strong magnet adsorbs the ferrite is utilized, the ferrite is firmly adsorbed on the first spigot face, at the moment, the left hand is loosened, and the ferrite round slice cannot fall off. Fig. 1c is a schematic front view of the fixture body 1 after adsorbing ferrite.

In a specific embodiment, referring back to fig. 1a and 1b, a threaded through hole 15 penetrating through the second spigot surface is opened at the central position of the first spigot surface, and the threaded through hole 15 is used for fixing a screw; a countersunk hole 16 is arranged on the first spigot surface and coaxial with the threaded through hole 15; after the screw is fixed in the threaded through hole 15, the head of the screw can be completely sunk in the counter bore 16, and the design is such that the head of the screw does not exceed the first stop face, i.e. the adsorption of the first stop face to the ferrite is not affected. The part of the tail part of the screw penetrating through the second spigot surface can facilitate the operator to take and place the magnetic-type polishing clamp. Referring to fig. 3, fig. 3 is a back oblique view of a magnetic attraction type polishing clamp with a center screw according to an embodiment of the present invention. As shown in fig. 3, the screw protruding from the central portion of the second spigot surface can be used as a handle, which is convenient for an operator to pick and place the magnetic attraction type polishing clamp. By way of example, the threaded through hole 15 is suitable for a half-headed cross screw of M6, and the counter bored hole 16 may have a diameter of 12mm and a depth of 8 mm.

Alternatively, the threaded through hole 15 and the countersunk hole 16 may not be formed in the center of the first spigot surface, and only a handle needs to be arranged on the second spigot surface, so that the purpose of conveniently taking and placing the magnetic-type polishing clamp by an operator can be achieved. The utility model discloses do not prescribe a limit to the concrete structure, the form of handle. In other words, those skilled in the art can flexibly set the structure of the handle according to actual requirements without departing from the scope of the present invention.

The utility model also provides a burnishing device. Referring to fig. 4, fig. 4 is a front view of a polishing apparatus according to an embodiment of the present invention (the polishing jig does not have a weight, and the second sun gear pad plate and the second inner gear pad plate are omitted). As shown in fig. 4, the polishing device of the present invention includes a planetary gear rotating mechanism (three planetary gears 3 in this embodiment) composed of a sun gear 2, a planetary gear 3 and an internal gear 4, wherein the sun gear 2 is engaged with the planetary gear 3, and the planetary gear 3 is engaged with the internal gear 4. The polishing apparatus further includes a support plate (not shown in fig. 4), a polishing pad 5 laid on the support plate, and a first sun gear pad 21 placed on the polishing pad 5, the first sun gear pad 21 and the second sun gear pad 22 having outer diameters larger than that of the sun gear 2, the sun gear 2 being placed on the first sun gear pad 21. Each planetary gear 3 is provided with an accommodating through-hole 31 for placing the above-described magnetic attraction type polishing jig. In the present embodiment, four receiving through-holes 31 are uniformly provided on each planetary gear 3. This burnishing device still includes driving motor (not shown in fig. 4), places after holding through-hole 31 at the polishing anchor clamps, and driving motor can drive sun gear 2 and rotate, and sun gear 2 drives planetary gear 3 and rotates, and planetary gear 3 drives magnetism and inhales formula polishing anchor clamps and rotate, and then makes to be located and produces the friction between ferrite on the first tang face and polishing pad 5, polishes the ferrite promptly.

Further, the polishing device further comprises a first inner gear backing plate 41, and a large circular hole slightly smaller than the inner diameter of the inner gear 4 is formed in the first inner gear backing plate 41. The internal gear 4 is placed on the first internal gear pad plate 41, and the planetary gears 3 are placed on the upper surfaces of the first sun gear pad plate 21 and the first internal gear pad plate 41.

Specifically, a support plate made of a nylon material having a thickness of 20mm and the same size as the outer shape of the internal gear 4 may be used, a polishing pad 5 having a thickness of about 5mm and having grid-like indentations and the same size as the support plate may be laid on the support plate, a first internal gear pad 41 having an outer shape and a thickness of 20mm and the same size as the outer shape of the support plate may be placed on the polishing pad 5, and a large circular hole may be formed in the center of the first internal gear pad, and the inner diameter of the large circular hole is smaller than the inner diameter of the internal gear 4. A first sun gear pad plate 21 is placed at the center of the polishing pad 5, a through hole and a key groove which are matched with the sun gear 2 and have the diameter of 10.5mm are formed in the center of the sun gear pad plate 21, and the sun gear 2 is placed on the sun gear pad plate 21. 3 planetary gears 3 are uniformly disposed between the internal gear 4 and the sun gear 2, and the planetary gears 3 are disposed on the upper surfaces of the first sun gear pad 21 and the first internal gear pad 41. In other words, 1 sun gear, 3 planetary gears, and 1 ring gear are all on the plane formed by the first ring gear backing plate 41 and the first sun gear backing plate 21.

Those skilled in the art can understand, according to the utility model discloses burnishing device's structural design, no longer need accurate cooperation design between burnishing pad 5 and the magnetism formula of inhaling polishing clamp 1, in other words, the utility model discloses a burnishing device is when polishing the operation, polishing pad 5 only need lay in the backup pad can, then magnetism formula of inhaling polishing clamp 1 openly directly press on this burnishing pad 5 can, so, magnetism formula of inhaling polishing clamp 1 is at the pivoted in-process, and the ferrite disk that is located on the first tang face can contact and produce the friction with burnishing pad 5. However, the existing polishing machine often requires a precise design of the mechanical cooperation between the polishing pad and the polishing jig, which undoubtedly increases the design and processing costs. Compared with the prior art, the utility model discloses a burnishing device no longer needs accurate cooperation design, can greatly practice thrift mechanical design and processing cost.

Further, in order to ensure smooth rotation and convenient installation of the planetary gear 3, chamfers of 10mm and 5mm can be respectively arranged at the upper edge and the lower edge of the inner edge of the first inner gear backing plate 41; and a 10mm and 5mm chamfer is provided at the upper and lower edges of the outer edge of the first sun gear shim plate 21, respectively.

In a specific embodiment, referring to fig. 5, fig. 5 is a front view of a polishing apparatus (polishing jig without counterweight, showing second sun gear pad plate and second inner gear pad plate) according to an embodiment of the present invention. As shown in fig. 5, the polishing device of the present invention further includes a second sun gear pad 22 and a second internal gear pad 42 having the same structure as the first sun gear pad 21, the second sun gear pad 22 is used to cover the sun gear 2 from above, and the second internal gear pad 42 is used to cover the internal gear 4 from above. Thus, the centers of 1 backing plate, 1

polishing pad

5, 2 sun gear pads (first sun gear pad 21 and second sun gear pad 22) and 1 sun gear 2 can be fixed to the center of the backing plate by a center shaft made of 304# stainless steel with a spline structure. The edge of the 1 supporting plate, the 1 polishing pad 5, the 2 internal gear backing plates (the first internal gear backing plate 41 and the second internal gear backing plate 42) and the 1 internal gear are aligned all around, and the components can be locked and fixed by screws and nuts through holes on the edge. The internal gear 4 and the sun gear 2 are fixed by the above method, the planetary gear 3 is positioned up and down by 2 sun gear backing plates (the first sun gear backing plate 21 and the second sun gear backing plate 22) and 2 internal gear backing plates (the first internal gear backing plate 41 and the second internal gear backing plate 42), and the circumference of the planetary gear 3 is positioned by meshing with the sun gear 2 and the internal gear 4. The outer edges of the first and second sun gear pad plates 22 and the inner edges of the first and second inner gear pad plates 42 are also provided with chamfers, which allow smooth rotation of the planetary gear and prevent the planetary gear 3 from being pressed by the two fixed sun gear pad plates and the two inner gear pad plates and from being unable to rotate.

As an example, the present invention provides a drive motor that is a variable speed motor. A planetary rotating structure is formed under the driving of the speed-adjustable motor. The specific connection and mounting manner between the adjustable speed motor and the central gear mechanism will not be described in detail, and those skilled in the art can flexibly set the connection and mounting manner according to actual conditions. Preferably, the outer edges of the four receiving through holes 31 uniformly distributed on each planet gear do not intersect or are tangent to the outer edges of the two sun gear pads or the outer edges of the inner holes of the two inner gear pads when the planet gears rotate, so as to ensure that the polishing device does not collide with the pads. It should be noted that, when the driving motor is started, if the starting speed of the driving motor is fast, the rotating speed reaches the rated rotating speed of the driving motor quickly, the friction force is relatively large at this time, the ferrite disk is easy to slide out of the first stop surface, and the ferrite sheet sliding out of the first stop surface is easy to be collided and chipped. For this reason, a slow start and a slow stop are adopted to solve the problem. The method specifically comprises the following steps: because the driving motor is a speed-adjustable motor, the speed-adjustable motor can be controlled by a PLC (programmable logic controller), and when the driving motor is started, the driving motor can be slowly started, for example, the driving motor reaches a rated rotating speed within 1 minute; also, when the drive motor is turned off, the drive motor may be stopped slowly, e.g., within 1 minute. The ferrite circular sheet is started or stopped slowly each time, so that the problem that the ferrite circular sheet easily slides out of the first stop surface can be effectively solved.

For example, the adjustable-speed motor can rotate clockwise or counterclockwise (i.e., the motor can rotate forward or backward), so that the rotation direction of the motor can be flexibly controlled when the polishing device performs polishing operation, for example, the motor can be controlled to rotate clockwise for 30 minutes, then stopped for 10 seconds, then rotated counterclockwise for 30 minutes, and then stopped for 10 seconds, and then cyclically repeated, so that the ferrite wafer can be polished more uniformly.

As a preferable embodiment, a spacer is provided on each of the lower surface of the second sun gear backing plate 22 and the lower surface of the second internal gear backing plate 42, and the spacer is used to provide a gap between the second sun gear backing plate 22 and the second internal gear backing plate 42 and the planetary gear 3, and the gap can ensure smooth rotation of the planetary gear 3 and prevent the planetary gear 3 from being pressed by the two fixed sun gear backing plates and the two fixed internal gear backing plates and not rotating. By way of example, the thickness of the shim may be 1 mm.

In a specific embodiment, with continued reference to fig. 4 and 5, the planet gear 3 is provided with at least one attracting head 32, the attracting head 32 being adapted to attract magnetic particles that are ground off from ferrite. Specifically, in the present embodiment, four receiving through holes 31 are uniformly provided on each planetary gear 3, the number of the magnetic suction heads 32 is also uniformly set to four, and the magnetic suction heads 32 and the receiving through holes 31 are distributed in a staggered manner. The magnetic suction head 32 is used for adsorbing the magnetic powder particles ground by the polishing device from the ferrite wafer on the magnetic suction head, so that the polishing effect of the ferrite wafer is better.

As an example, referring to fig. 6, fig. 6 is a front view of a polishing apparatus according to another embodiment of the present invention (polishing jig with weights, and showing a second sun gear pad and a second inner gear pad). As shown in fig. 6, a weight member is placed on the second spigot surface of the polishing jig. The person skilled in the art can calculate the weight of the weight element to be added according to the friction force to be applied.

In a specific embodiment, the polishing apparatus further comprises a polishing liquid spray assembly and a water leakage prevention frame disposed along an outer edge of the support plate. The polishing solution spraying assembly is used for spraying polishing solution to the polishing device; a transparent cover plate is arranged above the water leakage prevention frame, and can prevent polishing liquid from spilling out of the polishing device and enable an operator to observe the working state of the polishing device through the transparent cover plate; a water outlet is arranged below the water leakage prevention frame and used for discharging the polishing liquid out of the polishing device. Although the structural schematic diagrams of the spray assembly, the water leakage prevention frame, the transparent cover plate and the water outlet are not given in the drawings, those skilled in the art can understand that the assemblies can increase the safety of the polishing device in the process of polishing ferrite, and the specific structural configuration of the supporting device or the auxiliary equipment can be flexibly set according to the practical application scene. For example, the spray assembly may be mounted on the transparent cover plate, the spray opening is located above the second sun gear pad 22, a water pump (belonging to the spray assembly) is mounted in a bucket for holding polishing liquid, the water pump pumps the polishing liquid in the bucket to the spray opening through a water pipe, the polishing liquid is sprayed into the polishing device through the spray opening, during the polishing operation of the polishing device, the polishing liquid is discharged to the water leakage prevention frame, the polishing liquid collected by the water leakage prevention frame flows into the bucket for holding polishing liquid outside the polishing device through a water outlet and a water pipe, and the water pump pumps the polishing liquid to the spray pipe opening through a water pipe, so that a polishing liquid circulation is formed, and the polishing liquid can be used in a circulating and reciprocating manner.

Further, can also install a tongue tube on leak protection water frame, install a magnet on transparent cover's the corresponding position, like rubidium iron boron strong magnet, when transparent cover opens, rubidium iron boron strong magnet leaves the tongue tube, the tongue tube disconnection, PLC automatic stop driving motor's rotation to stop the suction pump work, can prevent like this that the polishing solution that has corrosivity from drenching to the outside, sun gear and planetary gear stop rotating simultaneously, can avoid crowding hurting operating personnel's finger.

Further, can also be in the utility model discloses a last photoelectric position sensor that sets up of burnishing device utilizes this photoelectric position sensor to take notes sun gear 2's rotatory number of times to pass to the PLC controller, realize burnishing device's automatic control.

If the thin film type indium antimonide Hall element chip is used for linear measurement, the used substrate is a non-magnetic substrate, and a monocrystalline silicon wafer, a quartz glass wafer or a ceramic wafer can be used; if the substrate is used for a switch type application occasion, such as a direct current brushless motor, the substrate needs to use a magnetic substrate made of soft magnetic ferrite materials, and the magnetic substrate is used for converging an external magnetic field to an indium antimonide sensitive layer to obtain higher magnetic field intensity. Therefore, when indium antimonide hall element chip is used for switch type application, the utility model discloses a burnishing device can be used to polish the ferrite substrate material of thin film type indium antimonide hall element chip.

As described above, in the present embodiment, the polishing apparatus can polish 12 ferrite disks at a time. The time for installing a ferrite wafer on each polishing clamp is less than 30 seconds, when the wafer is taken, another rubidium iron boron strong magnet is used for adsorbing the rubidium iron boron magnet installed in the blind hole 13, the time consumption is short, and the time is less than 10 seconds, so that the rubidium iron boron strong magnets in all the blind holes of one clamp body 1 can be taken down. Installing 12 ferrite wafers, wherein the time is less than 6 minutes; after polishing, 12 pieces of ferrite are taken down, and the time is less than 3 minutes. The total time of loading and taking the wafer is within 10 minutes, and the traditional polishing device needs at least 4 hours for loading and taking the wafer, compared with the prior polishing device, the efficiency is improved by more than 24 times.

The utility model discloses a burnishing device adopts magnetic force to adsorb and puts the piece and get the piece, need not to adopt the bonding agent, need not the oven heating, can accomplish at room temperature and put the piece and get the piece process. The rubidium iron boron strong magnet can be repeatedly used, so that the energy consumption is reduced, the consumption of raw materials is reduced, the production cost is reduced, and the problem that the conventional polishing machine is easy to fragment when a bonding agent is adopted for taking the sheet is solved.

In addition, most of parts of the polishing device are made of nylon, the whole structure of the polishing device is light, the total weight of the polishing device does not exceed 400 kilograms, and the polishing device can be placed on a floor with common bearing, while the traditional polishing machine can be generally placed on the first floor due to heavier equipment, if the polishing device is placed on the floor above the second floor, the bearing design and the structure of a building need to be increased, and the use cost of the equipment is increased. Parts such as sun gear, planetary gear, internal gear, two internal gear backing plates, backup pad of this embodiment adopt the nylon preparation, and during sun gear and planetary gear rotary motion, usable polishing solution accomplished the lubrication, need not to add extra lubricating oil, has avoided the ferrite disk to receive the pollution of lubricating oil. In addition, the planetary rotating structure composed of the sun gear, the planetary gear and the inner gear is light and fast, the sun gear and the planetary gear can be driven to rotate only by one speed-adjustable motor with the power of 800W, the polishing clamp is provided with a weight piece, 12 polishing clamps are installed, and the power of the motor can be met. Traditional burnishing machine needs 5 motors, and 4 motors drive 4 ceramic discs respectively, and 1 big disc rotation below the motor drive that power ratio is great, and the structure is more complicated, has increased the weight of burnishing machine simultaneously, has also increased the energy consumption.

The utility model discloses a burnishing device also need not the higher ceramic disc of roughness. The size of the ceramic disc is large, the outer diameter of the common ceramic disc is about 400-500 mm, the thickness of the common ceramic disc is about 20mm, the weight of the common ceramic disc is about 7 kilograms, and the common ceramic disc is heavy. Importantly, such ceramic disks are relatively expensive to manufacture. In addition, when in use, the clamp falls on the ground carelessly and is easy to crack, and the clamp body, the planet gear and other parts of the utility model are leather and solid and durable.

The utility model discloses a burnishing device can stop at any time, inspects polishing effect, compares with traditional burnishing machine, and is very convenient. Still have slow start, slow stop, clockwise and anticlockwise rotation's function, sometimes still need temporary stopping to inspect polishing effect, if adopt the sign that polishing time ended as polishing, then inaccurate, the effect is not good. Generally speaking, in the planetary rotary polishing process, no matter whether the ferrite wafer rotates forwards or backwards, no matter whether the ferrite wafer rotates fast or slowly, the friction passing distance of the ferrite wafer on a polishing pad is in direct proportion to the number of times of one rotation of a central gear, the polishing effect of the ferrite wafer corresponds to the number of times of the rotation of the central gear, a PLC is adopted to record the number of times of the rotation of a central sheave, the number of times of the total rotation of the central sheave is set according to experience, when the cumulative number of times of the rotation of the central sheave recorded by the PLC is equal to the total number of times, the work of a polishing machine can be automatically stopped, the rotation of a motor is stopped, and the work of a water pump.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make modifications and changes without departing from the spirit and scope of the present invention.

Claims

1. A magnetic attraction type polishing clamp is characterized by comprising a clamp body, wherein a first spigot is formed in the front face of the clamp body, and a piece to be polished is placed on the first spigot face; the back surface of the clamp body is provided with a plurality of blind holes, and magnets are placed in the blind holes;

2. A magnetic attraction type polishing clamp according to claim 1, characterized in that the back of the clamp body is provided with a second spigot, a second spigot surface is used for placing a weight member, and the blind holes are uniformly distributed on the second spigot surface.

3. A magnetic attraction type polishing clamp as claimed in claim 2, wherein a through hole penetrating through the first spigot surface is provided on the bottom surface of each blind hole, and the through hole is used for preventing vacuum adsorption between the piece to be polished and the first spigot surface.

4. A magnetic attraction type polishing clamp as claimed in claim 3, characterized in that the clamp body is of a cylindrical or rectangular cylinder structure.

5. A magnetic attraction type polishing clamp as claimed in claim 4, wherein the second spigot surface is circular, and the blind holes are uniformly arranged around the center of the second spigot surface; and/or the number of the blind holes is 8-12.

6. The magnetic attraction type polishing clamp according to any one of claims 1 to 5, wherein the depth of the first spigot is smaller than the thickness of the piece to be polished.

7. A magnetic attraction type polishing clamp according to any one of claims 1 to 5, characterized in that the outer edge of the side wall of the first spigot is provided with a rounded corner.

8. A magnetic type polishing clamp according to any one of claims 2 to 5, wherein a handle is arranged on the second spigot surface and used for an operator to pick and place the magnetic type polishing clamp.

9. The magnetic attraction type polishing clamp according to any one of claims 2 to 5, wherein a threaded through hole penetrating through the second spigot surface is formed in the center of the first spigot surface, and the threaded through hole is used for fixing a screw; a countersunk hole is formed in the first spigot surface and is coaxial with the threaded through hole;

10. The magnetic attraction type polishing jig according to any one of claims 1 to 5, wherein the magnet is a rubidium iron boron strong magnet, a strong ferrite magnet, or a magnet formed of an energized coil.

11. A polishing apparatus characterized by comprising a sun gear, a planetary gear meshed with the sun gear, and an internal gear meshed with the planetary gear; the polishing device further comprises a supporting plate, a polishing pad paved on the supporting plate and a first central gear base plate placed on the polishing pad; the central gear is placed on the first central gear base plate;

the number of the planetary gears is at least three, and each planetary gear is provided with at least one accommodating through hole for placing the magnetic attraction type polishing clamp in any one of claims 1 to 10;

12. The polishing device as claimed in claim 11, further comprising a first inner gear backing plate, wherein the first inner gear backing plate is provided with a circular hole slightly smaller than the inner diameter of the inner gear;

13. The polishing apparatus as claimed in claim 12, wherein an upper side and a lower side of an inner edge of the first internal gear shim plate are each provided with a chamfer; and/or the like and/or,

14. The polishing apparatus as recited in claim 13, further comprising a second sun gear pad having the same structure as the first sun gear pad, the second sun gear pad being for covering the sun gear from above;

15. The polishing apparatus as recited in claim 14, wherein a lower surface of the second sun gear pad plate and a lower surface of the second internal gear pad plate are each provided with a spacer;

16. The polishing apparatus as recited in claim 11, wherein each of the planetary gears is provided with at least one attracting head for attracting magnetic particles ground off from a member to be polished.

17. The polishing apparatus as set forth in claim 16, wherein each of the planetary gears is provided with four receiving through-holes for placing the polishing jig of any one of claims 1 to 10; and/or each planetary gear is provided with 4 magnetic attracting heads.

18. The polishing apparatus as recited in claim 16, further comprising a slurry spray assembly and a water leakage preventing frame disposed along an outer edge of the support plate;

19. The polishing device according to claim 18, further comprising a control unit, wherein a reed switch is arranged above the water leakage prevention frame, and a magnet is arranged on the transparent cover plate in a position corresponding to the reed switch;

20. A polishing apparatus according to claim 19, characterized in that it further comprises an electro-optical position sensor capable of recording the number of rotations of the sun gear and sending the number of rotations signal to the control unit.

21. The polishing apparatus according to any one of claims 11 to 20, wherein the polishing pad is provided with grid-like indentations;

and/or the driving motor is a speed-adjustable motor;

and/or the driving motor can rotate clockwise and counterclockwise.

22. The polishing apparatus as set forth in claim 21, wherein the polishing apparatus can be used for polishing a ferrite substrate material of a thin film type indium antimonide hall element chip.