CN110383423B - 制品的压印设备和方法 - Google Patents

制品的压印设备和方法 Download PDF

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Publication number
CN110383423B
CN110383423B CN201780077125.6A CN201780077125A CN110383423B CN 110383423 B CN110383423 B CN 110383423B CN 201780077125 A CN201780077125 A CN 201780077125A CN 110383423 B CN110383423 B CN 110383423B
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China
Prior art keywords
substrate
pattern
discharge port
stage
discharge
Prior art date
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Active
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CN201780077125.6A
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English (en)
Chinese (zh)
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CN110383423A (zh
Inventor
近藤阳介
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Publication of CN110383423A publication Critical patent/CN110383423A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
    • B29C2037/0046—In-mould printing, in-mould transfer printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201780077125.6A 2016-12-13 2017-12-11 制品的压印设备和方法 Active CN110383423B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-241685 2016-12-13
JP2016241685A JP6821414B2 (ja) 2016-12-13 2016-12-13 インプリント装置、及び物品の製造方法
PCT/JP2017/044432 WO2018110517A1 (ja) 2016-12-13 2017-12-11 インプリント装置、及び物品の製造方法

Publications (2)

Publication Number Publication Date
CN110383423A CN110383423A (zh) 2019-10-25
CN110383423B true CN110383423B (zh) 2023-06-30

Family

ID=62558597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780077125.6A Active CN110383423B (zh) 2016-12-13 2017-12-11 制品的压印设备和方法

Country Status (6)

Country Link
US (1) US11524429B2 (cg-RX-API-DMAC7.html)
JP (1) JP6821414B2 (cg-RX-API-DMAC7.html)
KR (1) KR102239964B1 (cg-RX-API-DMAC7.html)
CN (1) CN110383423B (cg-RX-API-DMAC7.html)
TW (1) TWI659453B (cg-RX-API-DMAC7.html)
WO (1) WO2018110517A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7118712B2 (ja) * 2018-04-13 2022-08-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7149870B2 (ja) * 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201016443A (en) * 2008-09-25 2010-05-01 Canon Kk Imprint apparatus and method of manufacturing article
CN105301894A (zh) * 2014-06-10 2016-02-03 佳能株式会社 压印装置及物品制造方法
CN105319861A (zh) * 2014-06-06 2016-02-10 佳能株式会社 光刻装置和物品制造方法
WO2016052345A1 (ja) * 2014-10-01 2016-04-07 大日本印刷株式会社 インプリント装置、インプリント方法およびインプリント装置の制御方法
CN105487334A (zh) * 2014-10-03 2016-04-13 佳能株式会社 压印装置、压印方法及物品制造方法
CN105652591A (zh) * 2014-12-02 2016-06-08 佳能株式会社 压印装置及物品的制造方法
JP2016134608A (ja) * 2015-01-22 2016-07-25 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5697345B2 (ja) * 2010-02-17 2015-04-08 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP5850717B2 (ja) * 2010-12-02 2016-02-03 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP6180131B2 (ja) * 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6177346B2 (ja) * 2013-11-06 2017-08-09 キヤノン株式会社 インプリント用型のパターンの決定方法、インプリント方法及び装置
JP2016025230A (ja) * 2014-07-22 2016-02-08 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP6450105B2 (ja) * 2014-07-31 2019-01-09 キヤノン株式会社 インプリント装置及び物品製造方法
JP2016051862A (ja) * 2014-09-02 2016-04-11 キヤノン株式会社 インプリント装置、および物品の製造方法
US20160288378A1 (en) * 2015-04-03 2016-10-06 Canon Kabushiki Kaisha Imprint material discharging device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201016443A (en) * 2008-09-25 2010-05-01 Canon Kk Imprint apparatus and method of manufacturing article
CN105319861A (zh) * 2014-06-06 2016-02-10 佳能株式会社 光刻装置和物品制造方法
CN105301894A (zh) * 2014-06-10 2016-02-03 佳能株式会社 压印装置及物品制造方法
WO2016052345A1 (ja) * 2014-10-01 2016-04-07 大日本印刷株式会社 インプリント装置、インプリント方法およびインプリント装置の制御方法
CN105487334A (zh) * 2014-10-03 2016-04-13 佳能株式会社 压印装置、压印方法及物品制造方法
CN105652591A (zh) * 2014-12-02 2016-06-08 佳能株式会社 压印装置及物品的制造方法
JP2016134608A (ja) * 2015-01-22 2016-07-25 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法

Also Published As

Publication number Publication date
TW201822252A (zh) 2018-06-16
KR20190094396A (ko) 2019-08-13
JP2018098366A (ja) 2018-06-21
US11524429B2 (en) 2022-12-13
JP6821414B2 (ja) 2021-01-27
KR102239964B1 (ko) 2021-04-14
WO2018110517A1 (ja) 2018-06-21
CN110383423A (zh) 2019-10-25
TWI659453B (zh) 2019-05-11
US20190291309A1 (en) 2019-09-26

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