CN110376994A - A kind of wafer automated production control system and method - Google Patents
A kind of wafer automated production control system and method Download PDFInfo
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- CN110376994A CN110376994A CN201910707224.9A CN201910707224A CN110376994A CN 110376994 A CN110376994 A CN 110376994A CN 201910707224 A CN201910707224 A CN 201910707224A CN 110376994 A CN110376994 A CN 110376994A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32368—Quality control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The embodiment of the present invention provides a kind of wafer automated production control system and method, this method comprises: MES system, Communications service layer module, board automation platform and automation equipment, wherein, MES system automates platform by Communications service layer module and board and communicates with automation equipment, and the production relevant information in production process is sent to MES system by automation equipment；MES system generates the first control instruction according to production relevant information and is sent to automation equipment.In the embodiment of the present invention, production relevant information in production process is sent to MES system by automation equipment, MES system generates the first control instruction according to the production relevant information, the operation preparatory phase of wafer production, production process and/or production output stage are controlled, improve the automation and the level of informatization of wafer production, wafer production board efficiency and product yield are promoted, wafer production management cost is reduced.
Description
Technical field
The present invention relates to wafer fabrication techniques field, in particular to a kind of wafer automated production control system and method.
Background technique
Comprising working procedures and corresponding a variety of production equipments in wafer production process, production process is along with many materials
Material consumption, consumptive material need fine-grained management, and production process Quality Control results will affect backend process selection, increase quality control
Before, during and after between visualized data monitor, it is achieved that wafer automated production and production process on-line monitoring and production result
Data analysis is extremely important, and the automation of existing silicon wafer production technology and the level of informatization be not high, inadequate to Technical innova- tion
Finely, creation data collect insufficient and utilization rate it is low, so as to cause production efficiency and product yield it is not high and manage at
This is higher.
Summary of the invention
The embodiment of the present invention provides a kind of wafer automated production control system and method, solves existing wafer production process
Middle automation is low with the level of informatization, and system development cycle is long, and O&M cost is high, is unfavorable for secondary development, so as to cause
The problem of production efficiency is low with product yield and operation management higher cost.
According to an embodiment of the present invention in a first aspect, providing a kind of wafer automated production control system, comprising: manufacture hold
Row MES system, Communications service layer module, board automation platform and automation equipment；
Wherein, the MES system automates Platform communication, the machine by the Communications service layer module and the board
Platform automates platform and is communicated by default communication protocol with the automation equipment；
The automation equipment is used for wafer production, and the production relevant information in production process is sent to the board
Automate platform；
The board automation platform is used to the format conversion of the production relevant information be corresponding with the MES system
Format, and the production relevant information is sent to the MES system；
The MES system is used to generate the first control instruction, first control instruction according to the production relevant information
It is controlled for operation preparatory phase, production process and/or the production output stage to wafer production；
Board automation platform is also used to receive first control instruction from the MES system, and by described the
The format conversion of one control instruction is format corresponding with the default communication protocol, and first control instruction is sent to
The automation equipment.
Optionally, the MES system includes: factory modeling module, plan scheduled production module, handling of goods and materials module；
The factory modeling module, for determining normal data, reference format and system function in the operation preparatory phase
Energy Modeling and Design unit, for being defined to the production relevant information, the reference format is used for the normal data
The definition of system function module basic function attribute, the system function Modeling and Design unit are configured for module parameter, are realized
Configurableization of functional module, lifting system scalability are safeguarded with secondary development is conducive to.
The plan scheduled production module, for, according to production technology work order information, determining production in the operation preparatory phase
And the plan of arranging an order according to class and grade；
The handling of goods and materials module, in operation preparatory phase letter related to material is determined in the production process
Breath.
Optionally, the MES system further include: board management module, production process control module, quality management module,
Inventory management module；
The board management module, for determining the facility information of the automation equipment, and according to the facility information
Export prompt information；
The production process control module, for determining product information corresponding with process flow in the production process
And control instruction；
The quality management module, for determining quality information corresponding with process flow in the production process；
The inventory management module, for determining product inventory letter corresponding with process flow in the production process
Breath.
Optionally, the handling of goods and materials module, for determining crystal pulling raw material information in crystal pulling technique process；
The quality management module, in crystal pulling technique process, determine in the automation equipment with crystal pulling furnace phase
The first quality information closed；
The production process control module is used in crystal pulling technique process, determines that crystal bar encodes, and according to the crystalline substance
Stick, which encodes, determines crystal block coding.
Optionally, the production process control module, for being encoded and being determined according to the crystal block in moulding process flow process
Machined parameters in first wafer coding and wafer fabrication processes, and determine that machining control instructs according to the machined parameters；
The quality management module is used in moulding process flow process, the second quality information after determining wafer processing；
The handling of goods and materials module, for determining the relevant information of grinding wafer material in moulding process flow process.
Optionally, the production process control module, in polishing process process, determination to be corresponding with polishing process
Polish control instruction；
The quality management module, for the third quality information in polishing process process, after determining polishing wafer；
The handling of goods and materials module, for determining the relevant information of polishing fluid in polishing process process.
Optionally, the production process control module, for determining second of wafer after cleaning in cleaning process flow
Wafer coding, and determine that be packaged to wafer fragment first is packaged control instruction；
The quality management module, for the 4th quality information in cleaning process flow, after determining wafer cleaning；
The inventory management module, for determining the inventory information of the wafer after being packaged in cleaning process flow.
Optionally, the production process control module is used in epitaxial growth technology process, determines crystalline substance after epitaxial growth
Round third wafer coding, and control instruction is packaged to epitaxial wafer fragment is packaged second；
The quality management module, for the 4th matter in epitaxial growth technology process, after determining wafer epitaxial growth
Measure information；
The inventory management module, in epitaxial growth technology process, determining inventory's letter of the epitaxial wafer after being packaged
Breath.
Optionally, the MES system further include: Enterprise Resource Planning interface module, data statistic analysis mould
Block；
The ERP system interface module, in the production output stage, the MES system to be counted with ERP system
According to transmission；
The data statistic analysis module, for exporting production report in the production output stage.
Optionally, the system also includes manual operation interface modules；
The board automation platform is also used to
The corresponding format in interface, and the production relevant information is sent to the manual operation interface module；
The manual operation interface module is used for according to the production relevant information, output display information；
The manual operation interface module is also used to be instructed according to input, determines the second control instruction；
The manual operation interface module automates platform to the board by the Communications service layer module and sends institute
State the second control instruction；
The board automation platform is also used to receive second control instruction from the manual operation interface module, and
It is format corresponding with the default communication protocol by the format conversion of second control instruction, and second control is referred to
Order is sent to the automation equipment.
Second aspect according to an embodiment of the present invention provides a kind of wafer automated production control method, is applied to such as the
Wafer automated production control system described in one side, which comprises
Automation equipment carries out wafer production, and it is automatic that the production relevant information in production process is sent to the board
Change platform；
It is format corresponding with MES system that board, which automates platform for the format conversion of the production relevant information, and will
The production relevant information is sent to the MES system；
The MES system generates the first control instruction according to the production relevant information, and first control instruction is used for
The operation preparatory phase of wafer production, production process and/or production output stage are controlled；
The board automates platform and receives first control instruction from the MES system, and described first is controlled
The format conversion of instruction is format corresponding with the default communication protocol, and by first control instruction be sent to it is described from
Dynamicization equipment.
In the embodiment of the present invention, MES system and automation equipment pass through Communications service layer module and board automation platform
Information exchange is carried out, the production relevant information in production process is sent to MES system by automation equipment, and MES system is according to this
It produces relevant information and generates the first control instruction, to the operation preparatory phase of wafer production, production process and/or production output rank
Duan Jinhang control, improves the automation and the level of informatization of wafer production, promotes wafer production board efficiency and product yield, drop
Low wafer production management cost.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is the structural schematic diagram of wafer automated production control system provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of MES system provided in an embodiment of the present invention；
Fig. 3 is the flow diagram of wafer automated production control method provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention provides a kind of wafer automated production control system 100, comprising: manufacture executes system
System (Manufacturing Execution System, MES) 101, Communications service layer module 102, board automate platform 103
With automation equipment 104；
In embodiments of the present invention, MES system 101 automates platform 103 by Communications service layer module 102 and board and leads to
Letter, board automate platform 103 and are communicated by default communication protocol with automation equipment 104.The default communication protocol can make
With the communication protocol between existing semiconductor equipment and host, such as: international semiconductor industry association standard
(Semiconductor Equipment and Materials International Standard, SEMI Standard)
Agreement, semiconductor equipment communication standard interface (SEMI Equipment Communication Standard, SECS) I agreement,
SECS II agreement, common apparatus model (Generic Equipment Model, GEm) agreement, high speed SECS messaging service
(High-Speed SECS Message Services, HSMS) agreement, exclusive data link (Melsec Net) agreement ,/use
In process control OLE (Object Linking and Embedding for Process Control, OPC) agreement, can
Programmed logic controller (Programmable Logic Controller, PLC) agreement, control and communication link system
(Control&Communication Link, CC-Link) etc., it is preferable that SECS agreement or PLC agreement are used, half
Has mature use in conductor industry, use scope is extensive and performance is stablized.It is understood that the embodiment of the present invention is to pre-
If the type of communications protocol is not specifically limited.
Automation equipment 104 is used for wafer production, which includes all kinds of involved in wafer production process
Equipment, such as: crystal pulling furnace, crystal bar cutting equipment, grinding wafer equipment, polishing wafer equipment, epitaxial growth equipment etc., the present invention
Embodiment is not specifically limited the type of automation equipment 104.
Production relevant information in production process is simultaneously sent to board automation platform 103 by automation equipment 104, by this
Board automates platform 103 and is transmitted to MES system 101 for relevant information is produced.The production relevant information may include: production object
Expect information, the device-dependent message of automation equipment 104, machined parameters in process of manufacture etc., the embodiment of the present invention pair
The content of production relevant information is not specifically limited.
MES system 101 is used to generate the first control instruction according to production relevant information, and automates platform 103 by board
First control instruction is sent to automation equipment 104.
Include database 101a and Business Logic 101b in MES system 101 shown in fig. 1, passes through 101a pairs of database
Production relevant information is stored, and Business Logic 101b generates the first control instruction according to production relevant information.
First control instruction was used for the operation preparatory phase of wafer production, production process and/or production output stage
It is controlled, such as: production material is recorded, wafer machined parameters are set and adjusted, to monitor wafer processed
Journey and product quality information, real time monitoring etc..
The format conversion that board automation platform 103 is used to produce relevant information is lattice corresponding with MES system 101
Formula, and by the format conversion of the first control instruction be format corresponding with default communication protocol.MES system 101 and automation
Data format used in equipment 104 has certain difference, and board automates platform 103 and produces relevant information and first in forwarding
It is formatted when control instruction, realizes the information exchange between MES system 101 and automation equipment 104.
In the embodiment of the present invention, MES system and automation equipment pass through Communications service layer module and board automation platform
Information exchange is carried out, the production relevant information in production process is sent to MES system by automation equipment, and MES system is according to this
It produces relevant information and generates the first control instruction, to the operation preparatory phase of wafer production, production process and/or production output rank
Duan Jinhang control, improves the automation and the level of informatization of wafer production, promotes wafer production board efficiency and product yield, drop
Low wafer production management cost.
Wafer automated production control system 100 shown in fig. 1 further include: manual operation interface module 105；
Manual operation interface module 105 automates platform 103 with board by Communications service layer module 102 and is communicated.
The artificial Operating Interface Module 105 obtains production relevant information from board automation platform 103, and according to the production
Relevant information, output display information, which informs staff for that will produce relevant information, convenient for processing to wafer
Production is monitored.
Manual operation interface module 105 is also used to be instructed according to input, determines the second control instruction, and the second control is referred to
Order is sent to board automation platform 103.Wherein, input instruction is the instruction of staff's input, manual operation interface module
105 instruct according to the input, determine the second control instruction, which is used for the Operational preparation rank to wafer production
Section, production process and/or production the output stage controlled, such as: production material is recorded, to wafer machined parameters into
Row setting and adjustment, monitoring wafer processing quality etc..
It is understood that the format conversion that board automation platform 103 is used to produce relevant information is and artificial behaviour
Make the corresponding format of interface module 105, and by the format conversion of the second control instruction is lattice corresponding with default communication protocol
Formula.Data format used in manual operation interface module 105 and automation equipment 104 has certain difference, board automation
Platform 103 is formatted in forwarding production relevant information and when the second control instruction, manual operation interface module 105 with from
Information exchange between dynamicization equipment 104.
In the embodiment of the present invention, by MES system to the automation control realized to wafer production, by manual operation circle
Face mould block is realized to the manual control of wafer production, keeps wafer production control more flexible, improve wafer production automation and
The level of informatization promotes the efficiency and product yield of wafer production board, reduces wafer production management cost.
It optionally, may include multiple MES systems 101 in wafer automated production control system 100, such as: including 2
MES system 101 is main MES system and secondary MES system, by the way that multiple MES systems 101 are arranged, it is ensured that system operational safety respectively
Stablize, realize load balancing and supports mutually.
Board automates platform 103 can only carry out information exchange with an automation equipment 104, and board automates platform
103 can also carry out information exchange with more automation equipments 104, and the embodiment of the present invention is to board automation platform 103 and certainly
Corresponding relationship between dynamicization equipment 104 is not specifically limited.
It further, include multiple functional modules in MES system 101, it is raw to wafer by multiple Implement of Function Module
Operation preparatory phase, production process and/or the production output stage of production are controlled.
Referring to fig. 2, MES system 101 includes: factory modeling module 1011, plan scheduled production module 1012, board management module
1013, handling of goods and materials module 1014, production process control module 1015, quality management module 1016, inventory management module 1017,
Enterprise Resources Plan (Enterprise Resource Planning, ERP) system interface module 1018, data statistic analysis mould
Block 1019.
Wherein, factory modeling module 1011, for determining normal data, reference format in the operation preparatory phase and being
System function modeling design cell, the normal data is for being defined the production relevant information, the reference format
For the definition of system function module basic function attribute, the system function Modeling and Design unit is configured for module parameter,
Realize that configurableization of functional module, lifting system scalability are safeguarded with secondary development is conducive to.
Specifically, factory modeling module 1011 provides factory modeling system, determines the criterion numeral of manufacturing execution system operation
According to system function Modeling and Design, by normal data define production relevant information come support realize MES system other each function
Can functions of modules realization, by system function Modeling and Design improve system scalability with standardization.
The normal data content may include: shop equipment information: all shop equipment information of typing to modeling,
And device attribute is identified according to the normal data of definition, attribute information includes device type, and equipment state defines,
Corresponding equipment information database table is written in equipment management special identifier etc. after typing；
Material data: establishing production material coding rule, the attribute information of material, and defines to be associated between material and close
System, such as silicon wafer production first define polysilicon item number and association attributes, resettle associated monocrystalline silicon item number and association attributes, so
It is associated with out the finished product item number and association attributes of production silicon wafer afterwards, handling of goods and materials function is realized by item number and attribute information；
Process data: modeling is established and typing correlation item number production process route functions of modules, first definition and typing
Used process title and attribute information re-define simultaneously typing process flow name attribute information, then define process flow
With the relationship of process, that is, define the concrete technology route standard of certain silicon chip product, product is in actual production process according to determining
Process route realizes automated production, is the standard information of production process；
Personal information: modeling input system uses the information attribute information of relevant personnel group, realizes each function of MES
The authority managing and controlling of energy, including group's permission, personal authority, subsystems and its corresponding interface and button permissions, rights management
Help to comb systemic hierarchial management, establishes Information Security Mechanism；
Standard criterion data: the various field definitions that modeling defines and specification MES system uses realize that data report
Recognizableization and standardization are received, the scalability for defining field is increased；
Data collection: modeling defines the specification for all kinds of manufacturing parameters that board reports, and parses production number according to specification
According to realization production process real-time online monitoring simultaneously does respective action, such as produces SPC system used.
The system function Modeling and Design unit includes building for the DB Table attribute that MES functional module configures, MES is used
It makes, the attribute organizational system of real time data and historical data, the attribute organizational system of each system interface, organizational system MES system in MES data
Relevant attribute setting of Services etc..
Plan scheduled production module 1012, for, according to production technology work order information, determining production and row in operation preparatory phase
Shift plan.
Specifically, MES system provides the life that operation interface is established by production management personnel in ERP system by interface
Plan work order information is produced, then manufacturer is operated using MES system plan scheduled production functions of modules, daily according to manufacturer
Actual production operation situation is disassembled into production plan specific in MES system, and generates producers' plan of arranging an order according to class and grade, and realization is pressed
The material of the actual production of day/week/month and people initiative's scheduling.
Board management module 1013 for determining the facility information of automation equipment, and is exported according to facility information and is prompted
Information；
Specifically, all devices of the management of board management module 1013 production scene, the parameter information of recording equipment, including
The real-time status of equipment operation, equipment alarm message, and maintenance, repair message, provide interface display device after receiving data
Operation conditions realizes the plan of equipment by the data of equipment operation condition so that site administrator checks and quickly handles
Property management and equipment production performance efficiency analysis, solve bottleneck board production capacity to improve production efficiency of equipment and Related product production capacity
It is promoted.
Handling of goods and materials module 1014, for determining material relevant information in operation preparatory phase and production process.
Production process control module 1015, for determining product information corresponding with process flow and control in process of production
System instruction；
Quality management module 1016, for determining quality information corresponding with process flow in process of production；
Inventory management module 1017, for determining product inventory information corresponding with process flow in process of production.
Above-mentioned process flow be wafer production manufacture process flow, comprising: crystal pulling technique, moulding process, polishing process,
Cleaning process and epitaxial growth technology.
Specifically, handling of goods and materials module 1014, for determining crystal pulling raw material information in crystal pulling technique process；The crystal pulling
Raw material includes: raw material polysilicon, seed crystal, dopant etc., which mainly includes the outbound coding for managing material, disappears
Consume quantity, product incidence relation etc..
For crystal pulling technique process:
Quality management module 1016, for determining relevant to crystal pulling furnace in automation equipment in crystal pulling technique process
First quality information；First quality information is crystal pulling furnace parameter information, including hot-zone mass parameter, pressure parameter, detection phase
Parameter information (crystal bar is containing oxygen value, boule diameter, crystal bar crystal orientation, V-groove depth, core offset etc.) is closed, first matter is passed through
Information control crystal pulling furnace temperature, pressure and pulling rate etc. are measured, to reach the crystal bar and correlated quality ginseng of target size parameter
Number, major measure form real-time crystal pulling process billboard and check, carry out production process control, sampling by SPC using parameter
Detection.
Production process control module 1015 is used in crystal pulling technique process, determines that crystal bar encodes, and compile according to crystal bar
Code determines crystal block coding.Production process control module 1015 is produced according to factory modeling module setting process with material relationships
Process control generates Workshop Production Management (work in progress, WIP) data, forms crystal bar coding, forms phase after cutting
Associated crystal block coding.
For moulding process flow process:
Production process control module 1015, for being encoded according to crystal block and determining that the first wafer is compiled in moulding process flow process
Machined parameters in code and wafer fabrication processes, and determine that machining control instructs according to machined parameters；
In moulding process flow process, wire cutting is carried out to crystal block (Block) and generates wafer (Wafer), production process controls mould
Block 1015 generates the first wafer coding (Wafer ID) by crystal block coding (Block ID) and carries out hard stamp；
Production process control module 1015 controls and collects cutting process parameter, including cutting speed, cutting time-consuming, cutting
Liquid uses.
Production process control module 1015 sets formation progress chamfering according to process recipe (Recipe) and grinding reaches phase
The parameter request answered.
Quality management module 1016 is used in moulding process flow process, the second quality information after determining wafer processing；Matter
Amount 1016 real-time reception board reporting parameters of management module simultaneously do quality monitoring, including chamfer angle and grinding effect parameter are examined
It surveys, minimum thickness difference etc. between second quality information, including wafer planarization degree, wafer.
Handling of goods and materials module 1014, for determining the relevant information of grinding wafer material in moulding process flow process.Material
The management grinding bond material of management module 1014, including metal material and resin material.
For polishing process process:
1015 production process control module 1015 of production process control module, in polishing process process, determine with
The corresponding polishing control instruction of polishing process；Production process control module 1015 is according to process path system in factory modeling
Journey is machined out mode by polishing fluid change chemical activity and reaches the harmful superficial layer increase flatness of removal.Polishing control
Flow velocity, temperature, pH value (PH) value and the pressure and other parameters of instruction control polishing fluid are to reach polishing effect.
Quality management module 1016, for the third quality information in polishing process process, after determining polishing wafer；Matter
It measures management module 1016 and collects polishing process parameter, which includes polishing flow velocity, the cores such as polish temperature, pressure
Heart parameter further includes that the wafer bow of detection machine measurement, angularity, thickness deviation, edge thickness deviation, edge are tilted/collapsed
It falls into.
Handling of goods and materials module 1014, for determining the relevant information of polishing fluid in polishing process process.Handling of goods and materials mould
Block 1014 mainly manages polishing fluid service condition.
For cleaning process flow:
Production process control module 1015, in cleaning process flow, determining that the second wafer of wafer after cleaning is compiled
Code, and determine that be packaged to wafer fragment first is packaged control instruction；Production process control module 1015 is according to modelled process
Route processing procedure, the second wafer coding after determining cleaning surface layer, carries out soft stamp according to Wafer ID, finally determines to wafer point
The first packing control instruction that piece is packaged, carries out fragment packing according to product hierarchy.
Quality management module 1016, for the 4th quality information in cleaning process flow, after determining wafer cleaning；Matter
It measures management module 1016 and carries out manufacturing process for cleaning parameter and defective data collection, the 4th quality information includes wafer planarization degree and edge
Defect (such as particle, scratch and haze etc.) detection.
Inventory management module 1017, for determining the inventory information of the wafer after being packaged in cleaning process flow.Fragment
By being partly put in storage in flakes as finished product after packing, inventory management module 1017 carries out stock control to finished product, which includes
Product hierarchy classification.
For epitaxial growth technology process:
Production process control module 1015 determines the of wafer after epitaxial growth in epitaxial growth technology process
Three wafers coding, and control instruction is packaged to epitaxial wafer fragment is packaged second；Production process control module 1015 is according to building
Mold technique route processing procedure, the second wafer coding after determining epitaxial growth, carries out soft stamp according to Wafer ID, and finally determining pair
The second packing control instruction that epitaxial wafer fragment is packaged, carries out fragment packing according to product hierarchy.
Quality management module 1016, for the 4th matter in epitaxial growth technology process, after determining wafer epitaxial growth
Measure information；Quality management module 1016 carries out epitaxial growth process parameter and defective data is collected, and the 4th quality information includes outer
Prolong piece flatness and edge defect (such as particle, scratch and haze etc.) detection；
Inventory management module 1017, in epitaxial growth technology process, determining inventory's letter of the epitaxial wafer after being packaged
Breath.Inventory management module 1017 carries out stock control to epitaxial wafer finished product, which includes product hierarchy classification.
ERP system interface module 1018, in the production output stage, MES system to carry out data transmission with ERP system；
ERP system interface module can exchange data in various ways, such as database to database (DB-To-DB) and File Transfer Protocol
Modes such as (File Transfer Protocol, FTP) carry out system building, can also support using the ERP product such as SAP, RFC
The method that itself is supported, it is preferable that use ERP and MES data library as the DB-To-DB method of interface.MES system provides object
Expect product investment, output and process report information, supports ERP semi-finished product and finished goods inventory management and cost accounting.
Data statistic analysis module 1019, for exporting production report in the production output stage.Data statistic analysis module
1019 predominantly production managers provide production and operation situation and properties of product qualitative data chart and the various indexs of production process
Data are monitored in real time and are analyzed, and realize fining, digitization operation management and decision, scientific improving production efficiency and production
Quality；
Such as utilize extraction-conversion-load (Extract-Transform-Load, ETL) or inscriptions on bones or tortoise shells program
(Oracle Procedure) carries out data collecting and establishes corresponding data warehouse (Data Warehouse, DW), for institute, enterprise
There is the decision-making process of rank, the strategy set of all types data support is provided.It is individual data storage, for analysis
Property report and decision support purpose and create.For the enterprise for needing business intelligence, when service guidance flow scheme improvements, monitoring are provided
Between, cost, quality and control, greatly saved the cost of enterprise, improved economic benefit.
In the embodiment of the present invention, MES system and automation equipment pass through Communications service layer module and board automation platform
Information exchange is carried out, the production relevant information in production process is sent to MES system by automation equipment, and MES system is according to this
It produces relevant information and generates the first control instruction, to the operation preparatory phase of wafer production, production process and/or production output rank
Duan Jinhang control, improves the automation and the level of informatization of wafer production, improves wafer production efficiency, reduces wafer production management
Cost.
Referring to Fig. 3, the embodiment of the present invention also provides a kind of wafer automated production control method, applied to such as above-mentioned crystalline substance
Circle automated production control system, the specific steps are as follows:
Step 301: automation equipment carries out wafer production, and the production relevant information in production process is sent to board
Automate platform；
Step 302: it is format corresponding with MES system that board, which automates platform for the format conversion for producing relevant information,
And production relevant information is sent to MES system；
Step 303:MES system generates the first control instruction according to production relevant information；
In embodiments of the present invention, the first control instruction be used for the operation preparatory phase of wafer production, production process and/
Or the production output stage is controlled；
MES system includes: factory modeling module, plan scheduled production module, handling of goods and materials module；
Wherein, factory modeling module determines normal data and system function Modeling and Design, criterion numeral in operation preparatory phase
According to for being defined to production relevant information；System function Modeling and Design carries out parametrization configuration to each functional module；
Plan scheduled production module in operation preparatory phase according to production technology work order information, determines production and the plan of arranging an order according to class and grade；
Handling of goods and materials module determines material relevant information in operation preparatory phase and production process.
MES system further include: board management module, production process control module, quality management module, stock control mould
Block；
Board management module determines the facility information of automation equipment, and exports prompt information according to facility information；
Production process control module determines product information corresponding with process flow and control instruction in process of production；
Quality management module determines quality information corresponding with process flow in process of production；
Inventory management module determines product inventory information corresponding with process flow in process of production.
Further, production process control module determines that crystal bar encodes in crystal pulling technique process, and is compiled according to crystal bar
Code determines crystal block coding；
Handling of goods and materials module determines crystal pulling raw material information in crystal pulling technique process；
Quality management module determines the first mass letter relevant to crystal pulling furnace in automation equipment in crystal pulling technique process
Breath.
Further, production process control module encodes according to crystal block in moulding process flow process and determines that the first wafer is compiled
Machined parameters in code and wafer fabrication processes, and determine that machining control instructs according to machined parameters；
Second quality information of the quality management module in moulding process flow process, after determining wafer processing；
Handling of goods and materials module determines the relevant information of grinding wafer material in moulding process flow process.
Further, production process control module determines polishing control corresponding with polishing process in polishing process process
System instruction；
Third quality information of the quality management module in polishing process process, after determining polishing wafer；
Handling of goods and materials module determines the relevant information of polishing fluid in polishing process process.
Further, production process control module determines the second wafer volume of wafer after cleaning in cleaning process flow
Code, and determine that be packaged to wafer fragment first is packaged control instruction；
Fourth quality information of the quality management module in cleaning process flow, after determining wafer cleaning；
Inventory management module determines the inventory information of the wafer after being packaged in cleaning process flow.
Further, production process control module is in epitaxial growth technology process, determines of wafer after epitaxial growth
Three wafers coding, and control instruction is packaged to epitaxial wafer fragment is packaged second；
Fourth quality information of the quality management module in epitaxial growth technology process, after determining wafer epitaxial growth；
Inventory management module determines the inventory information of the epitaxial wafer after being packaged in epitaxial growth technology process.
MES system further include: ERP system interface module, data statistic analysis module；
Wherein, ERP system interface module carries out data transmission in production output stage, MES system with ERP system；
Data statistic analysis module exports production report in the production output stage.
Further, system further include: manual operation interface module, method further include:
It is format corresponding with manual operation interface that board, which automates platform for the format conversion for producing relevant information, and will
Production relevant information is sent to manual operation interface module；Manual operation interface module is according to production relevant information, output display
Information；Manual operation interface module is instructed according to input, determines the second control instruction；Manual operation interface module passes through communication garment
Layer module of being engaged in sends the second control instruction to board automation platform；Board automates platform and receives from manual operation interface module
Second control instruction, and be format corresponding with default communication protocol by the format conversion of the second control instruction, and second is controlled
System instruction is sent to automation equipment.
Step 304: board automates platform and receives the first control instruction from MES system, and by the lattice of the first control instruction
Formula is converted into format corresponding with default communication protocol, and the first control instruction is sent to automation equipment.
In the embodiment of the present invention, MES system and automation equipment pass through Communications service layer module and board automation platform
Information exchange is carried out, the production relevant information in production process is sent to MES system by automation equipment, and MES system is according to this
It produces relevant information and generates the first control instruction, to the operation preparatory phase of wafer production, production process and/or production output rank
Duan Jinhang control, improves the automation and the level of informatization of wafer production, improves wafer production efficiency, reduces wafer production management
Cost.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (11)
1. a kind of wafer automated production control system characterized by comprising manufacture executes MES system, Communications service layer mould
Block, board automation platform and automation equipment, wherein
The MES system automates Platform communication, the board automation by the Communications service layer module and the board
Platform is communicated by default communication protocol with the automation equipment；
The automation equipment is used for wafer production, and it is automatic that the production relevant information in production process is sent to the board
Change platform；
The board automation platform is used to the format conversion of the production relevant information be lattice corresponding with the MES system
Formula, and the production relevant information is sent to the MES system, the MES system stores production process information to right
Answer database；
The MES system is used to generate the first control instruction according to the production relevant information, and first control instruction is used for
The operation preparatory phase of wafer production, production process and/or production output stage are controlled；
The board automation platform is also used to receive first control instruction from the MES system, and described first is controlled
The format conversion of system instruction is format corresponding with the default communication protocol, and first control instruction is sent to described
Automation equipment.
2. system according to claim 1, which is characterized in that the MES system includes: factory modeling module, plan row
Produce module, handling of goods and materials module；
The factory modeling module, for determining that normal data, reference format and system function are built in the operation preparatory phase
Mould design cell, for the normal data for being defined to the production relevant information, the reference format is used for system
The definition of functional module basic function attribute, the system function Modeling and Design unit are configured for module parameter；
The plan scheduled production module, for, according to production technology work order information, determining production and row in the operation preparatory phase
Shift plan；
The handling of goods and materials module, for determining material relevant information in the operation preparatory phase and the production process.
3. system according to claim 2, which is characterized in that the MES system further include: board management module, production
Process control module, quality management module, inventory management module；
The board management module is exported for determining the facility information of the automation equipment, and according to the facility information
Prompt information；
The production process control module, for determining product information corresponding with process flow and control in the production process
System instruction；
The quality management module, for determining quality information corresponding with process flow in the production process；
The inventory management module, for determining product inventory information corresponding with process flow in the production process.
4. system according to claim 3, which is characterized in that
The handling of goods and materials module, for determining crystal pulling raw material information in crystal pulling technique process；
The quality management module, for determining relevant to crystal pulling furnace in the automation equipment in crystal pulling technique process
First quality information；
The production process control module is compiled in crystal pulling technique process, determining crystal bar coding, and according to the crystal bar
Code determines crystal block coding.
5. system according to claim 4, which is characterized in that
The production process control module, for being encoded according to the crystal block and determining that the first wafer is compiled in moulding process flow process
Machined parameters in code and wafer fabrication processes, and determine that machining control instructs according to the machined parameters；
The quality management module is used in moulding process flow process, the second quality information after determining wafer processing；
The handling of goods and materials module, for determining the relevant information of grinding wafer material in moulding process flow process.
6. system according to claim 5, which is characterized in that
The production process control module, in polishing process process, determining that polishing control corresponding with polishing process refers to
It enables；
The quality management module, for the third quality information in polishing process process, after determining polishing wafer；
The handling of goods and materials module, for determining the relevant information of polishing fluid in polishing process process.
7. system according to claim 6, which is characterized in that
The production process control module, in cleaning process flow, determining the second wafer coding of wafer after cleaning, with
And determine that be packaged to wafer fragment first is packaged control instruction；
The quality management module, for the 4th quality information in cleaning process flow, after determining wafer cleaning；
The inventory management module, for determining the inventory information of the wafer after being packaged in cleaning process flow.
8. system according to claim 7, which is characterized in that
The production process control module is used in epitaxial growth technology process, determines the third crystalline substance of wafer after epitaxial growth
Circle coding, and control instruction is packaged to epitaxial wafer fragment is packaged second；
The quality management module, for the 4th mass letter in epitaxial growth technology process, after determining wafer epitaxial growth
Breath；
The inventory management module, for determining the inventory information of the epitaxial wafer after being packaged in epitaxial growth technology process.
9. system according to claim 8, which is characterized in that the MES system further include: Enterprise Resources Plan ERP system
System interface module, data statistic analysis module；
The ERP system interface module, for carrying out data biography in the production output stage, the MES system and ERP system
It is defeated；
The data statistic analysis module, for exporting production report and product parameters analysis in the production output stage, with
And provide creation data and corrresponding quality data-interface.
10. system according to claim 1, which is characterized in that the system also includes: manual operation interface module；
The board automation platform is also used to
Corresponding format, and the production relevant information is sent to the manual operation interface module；
The manual operation interface module is used for according to the production relevant information, output display information；
The manual operation interface module is also used to be instructed according to input, determines the second control instruction；
The manual operation interface module automates platform to the board by the Communications service layer module and sends described the
Two control instructions；
Board automation platform is also used to receive second control instruction from the manual operation interface module, and by institute
The format conversion for stating the second control instruction is format corresponding with the default communication protocol, and will second control instruction hair
Give the automation equipment.
11. a kind of wafer automated production control method, which is characterized in that be applied to as described in any one of claims 1 to 10
Wafer automated production control system, which comprises
Automation equipment carries out wafer production, and the production relevant information in production process is sent to the board automation and is put down
Platform；
It is format corresponding with MES system that board, which automates platform for the format conversion of the production relevant information, and will be described
Production relevant information is sent to the MES system；
The MES system generates the first control instruction according to the production relevant information, and first control instruction is used for crystalline substance
Operation preparatory phase, production process and/or the production output stage of circle production are controlled；
The board automates platform and receives first control instruction from the MES system, and by first control instruction
Format conversion be format corresponding with the default communication protocol, and first control instruction is sent to the automation
Equipment.
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