CN113138586A - Wafer automatic production control system and method - Google Patents
Wafer automatic production control system and method Download PDFInfo
- Publication number
- CN113138586A CN113138586A CN202010051444.3A CN202010051444A CN113138586A CN 113138586 A CN113138586 A CN 113138586A CN 202010051444 A CN202010051444 A CN 202010051444A CN 113138586 A CN113138586 A CN 113138586A
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- module
- automatic equipment
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- detection
- wafer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001514 detection method Methods 0.000 claims abstract description 47
- 238000013500 data storage Methods 0.000 claims abstract description 22
- 238000004891 communication Methods 0.000 claims abstract description 17
- 235000012431 wafers Nutrition 0.000 claims description 30
- 238000005259 measurement Methods 0.000 claims description 6
- 238000013075 data extraction Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000195 production control method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32252—Scheduling production, machining, job shop
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer automatic production control system and a method, comprising a control module, a data storage module, a communication module, a detection module, an automatic equipment platform and automatic equipment, wherein the control module is used for controlling the wafer automatic production; the control module controls the automation equipment platform, the data storage module, the communication module and the detection module; the communication module is used for transmitting data of the control module, the data storage module, the detection module, the automatic equipment platform and the automatic equipment; the automatic equipment platform receives the instruction to start and close the automatic equipment; the automatic equipment carries out various production operations on the wafer; the detection module detects the process of producing the wafer by the automatic equipment and the finished product; and the data storage module is used for storing the data of the automatic equipment platform and the detection module. The invention has simple structure and convenient operation, improves the automatic monitoring effect and effectively ensures the safety of data.
Description
Technical Field
The invention mainly relates to the field of wafer production detection, in particular to a wafer automatic production control system and a wafer automatic production control method.
Background
The existing automatic wafer production line is high in speed and efficiency, but defective products exist in automatic production, the reason analysis of the defective products is beneficial to improving the production process, and the real-time production record of the products is lacked.
The published Chinese invention patent, application number CN201910707224.9, patent name: a wafer automatic production control system and method, application date: 2019-08-01, the invention relates to a wafer automatic production control system and a method, and the method comprises the following steps: the system comprises an MES system, a communication service layer module, a machine automation platform and automation equipment, wherein the MES system is communicated with the automation equipment through the communication service layer module and the machine automation platform, and the automation equipment sends production related information in the production process to the MES system; and the MES system generates a first control instruction according to the production related information and sends the first control instruction to the automation equipment. In the embodiment of the invention, the automatic equipment sends the production related information in the production process to the MES system, and the MES system generates the first control instruction according to the production related information to control the production preparation stage, the production process and/or the production output stage of wafer production, so that the automation and informatization degree of wafer production is improved, the efficiency and the product yield of a wafer production machine are improved, and the wafer production management cost is reduced.
Disclosure of Invention
The invention provides a wafer automatic production control system and a method, aiming at the defects in the prior art, the wafer automatic production control system and the method are provided, and the wafer automatic production control system comprises a control module, a data storage module, a communication module, a detection module, an automatic equipment platform and automatic equipment;
the control module controls the automatic equipment platform, the data storage module, the communication module and the detection module;
the communication module is used for transmitting data of the control module, the data storage module, the detection module, the automatic equipment platform and the automatic equipment;
the automatic equipment platform receives an instruction to start and close the automatic equipment;
the automatic equipment carries out various production operations on the wafer;
the detection module detects the process of producing the wafer by the automatic equipment and the finished product;
and the data storage module is used for storing the data of the automatic equipment platform and the detection module.
Preferably, the data storage module comprises a server and a cloud storage.
Preferably, the device further comprises a display, and the display displays the detection result of the detection module in real time.
Preferably, the device also comprises an audible and visual alarm device, and the audible and visual alarm device is connected to the control module.
Preferably, the detection module comprises a camera module, a measurement module and a comparison module, data extraction is carried out on the image acquired by the camera module and a set standard value through the measurement module, and then data comparison is carried out through the comparison module to obtain a final result.
Preferably, the camera module further comprises an image processing module.
A method for controlling wafer automatic production is characterized by comprising the following procedures:
the first step is as follows: the control module receives a command to start an automatic equipment platform, and the automatic equipment platform is connected with the command automatic equipment through a serial port to produce wafers;
the second step is that: the automatic equipment sends production related information in the production process to the automatic equipment platform, and the automatic equipment platform feeds the information back to the control module;
the third step: the control module transmits a command to the detection module to detect the wafer, and the detection module collects a detection result;
the fourth step: the detection module transmits the data to the data storage module through the communication module and stores the data;
the fifth step: and classifying the detection results in real time, and transmitting the results to the control module to control the starting and stopping of the automation equipment.
The invention has the beneficial effects that: simple structure, convenient operation improves automatic monitoring effect and effectively guarantees the security of data.
Detailed Description
The invention comprises the following steps: the system comprises a control module, a data storage module, a communication module, a detection module, an automation equipment platform and automation equipment;
the control module controls the automatic equipment platform, the data storage module, the communication module and the detection module;
the communication module is used for transmitting data of the control module, the data storage module, the detection module, the automatic equipment platform and the automatic equipment;
the automatic equipment platform receives an instruction to start and close the automatic equipment;
the automatic equipment carries out various production operations on the wafer;
the detection module detects the process of producing the wafer by the automatic equipment and the finished product;
and the data storage module is used for storing the data of the automatic equipment platform and the detection module.
In this implementation, the data storage module preferably includes a server and a cloud storage.
The structure is favorable for storing and saving data, and the data loss is avoided.
In this implementation, the detection device further includes a display, and the display displays the detection result of the detection module in real time.
By the aid of the structure, operators can perform spot check on products in real time, effective manual inspection is guaranteed, and product quality is improved.
In this embodiment, the portable electronic device further comprises an audible and visual alarm device, and the audible and visual alarm device is connected to the control module.
By adopting the structure, the safety of the production environment is ensured, and the stability of the working environment of personnel is improved.
In this implementation, the detection module preferably includes a camera module, a measurement module and a comparison module, and the image acquired by the camera module and the set standard value are subjected to data extraction by the measurement module, and then subjected to data comparison by the comparison module to obtain a final result.
In this embodiment, the camera module further includes an image processing module.
By adopting the structure, the examination is carried out in a practical photographing mode, the automation degree is improved, and the detection precision is improved.
A method for controlling wafer automatic production is characterized by comprising the following procedures:
the first step is as follows: the control module receives a command to start an automatic equipment platform, and the automatic equipment platform is connected with the command automatic equipment through a serial port to produce wafers;
the second step is that: the automatic equipment sends production related information in the production process to the automatic equipment platform, and the automatic equipment platform feeds the information back to the control module;
the third step: the control module transmits a command to the detection module to detect the wafer, and the detection module collects a detection result;
the fourth step: the detection module transmits the data to the data storage module through the communication module and stores the data;
the fifth step: and classifying the detection results in real time, and transmitting the results to the control module to control the starting and stopping of the automation equipment.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.
Claims (7)
1. A wafer automatic production control system and a method are characterized by comprising a control module, a data storage module, a communication module, a detection module, an automatic equipment platform and automatic equipment;
the control module controls the automatic equipment platform, the data storage module, the communication module and the detection module;
the communication module is used for transmitting data of the control module, the data storage module, the detection module, the automatic equipment platform and the automatic equipment;
the automatic equipment platform receives an instruction to start and close the automatic equipment;
the automatic equipment carries out various production operations on the wafer;
the detection module detects the process of producing the wafer by the automatic equipment and the finished product;
and the data storage module is used for storing the data of the automatic equipment platform and the detection module.
2. The system and method of claim 1, wherein: the data storage module comprises a server and a cloud storage.
3. The system and method of claim 2, wherein: the device further comprises a display, and the detection result of the detection module is displayed on the display in real time.
4. The system and method of claim 3, wherein: the device also comprises an acousto-optic alarm device which is connected to the control module.
5. The system and method of claim 4, wherein: the detection module comprises a camera module, a measurement module and a comparison module, data extraction is carried out on the images acquired by the camera module and the set standard values through the measurement module, and then data comparison is carried out through the comparison module to obtain a final result.
6. The system and method of claim 5, wherein: the camera module also comprises an image processing module.
7. A method for controlling wafer automatic production is characterized by comprising the following procedures:
the first step is as follows: the control module receives a command to start an automatic equipment platform, and the automatic equipment platform is connected with the command automatic equipment through a serial port to produce wafers;
the second step is that: the automatic equipment sends production related information in the production process to the automatic equipment platform, and the automatic equipment platform feeds the information back to the control module;
the third step: the control module transmits a command to the detection module to detect the wafer, and the detection module collects a detection result;
the fourth step: the detection module transmits the data to the data storage module through the communication module and stores the data;
the fifth step: and classifying the detection results in real time, and transmitting the results to the control module to control the starting and stopping of the automation equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010051444.3A CN113138586A (en) | 2020-01-17 | 2020-01-17 | Wafer automatic production control system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010051444.3A CN113138586A (en) | 2020-01-17 | 2020-01-17 | Wafer automatic production control system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113138586A true CN113138586A (en) | 2021-07-20 |
Family
ID=76808383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010051444.3A Pending CN113138586A (en) | 2020-01-17 | 2020-01-17 | Wafer automatic production control system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113138586A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW518645B (en) * | 2001-09-24 | 2003-01-21 | Powerchip Semiconductor Corp | Method and system of automatic wafer manufacture quality control |
| TW535207B (en) * | 2002-05-08 | 2003-06-01 | Powerchip Semiconductor Corp | Method for automatically controlling defect-specification in manufacturing process of semiconductors |
| CN110376994A (en) * | 2019-08-01 | 2019-10-25 | 西安奕斯伟硅片技术有限公司 | A kind of wafer automated production control system and method |
-
2020
- 2020-01-17 CN CN202010051444.3A patent/CN113138586A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW518645B (en) * | 2001-09-24 | 2003-01-21 | Powerchip Semiconductor Corp | Method and system of automatic wafer manufacture quality control |
| TW535207B (en) * | 2002-05-08 | 2003-06-01 | Powerchip Semiconductor Corp | Method for automatically controlling defect-specification in manufacturing process of semiconductors |
| CN110376994A (en) * | 2019-08-01 | 2019-10-25 | 西安奕斯伟硅片技术有限公司 | A kind of wafer automated production control system and method |
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Application publication date: 20210720 |
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