CN109406984A - The full ecological chain intelligent test analyzing method of integrated circuit - Google Patents
The full ecological chain intelligent test analyzing method of integrated circuit Download PDFInfo
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- CN109406984A CN109406984A CN201811076377.XA CN201811076377A CN109406984A CN 109406984 A CN109406984 A CN 109406984A CN 201811076377 A CN201811076377 A CN 201811076377A CN 109406984 A CN109406984 A CN 109406984A
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a kind of full ecological chain intelligent test analyzing methods of integrated circuit, including data collection layer, big data processing analysis layer and application layer, the analysis of integrated circuit testing parameter index, wafer test yield analysis, testing time analysis, wafer MAP chart information, SummaryCheck and analysis, TouchDown, Report, SQLHistory analysis are provided；The full ecological chain intelligent test analyzing method of integrated circuit provided by the invention, realize real-time, mobility and the intelligence of corporate office, have the characteristics that teledata intercommunication and remote data backup, it is highly-safe, by continuous data accumulation, based on 6 months to 1 year data accumulations, introduce industrial big data analysis model, realize data retrieval, tracking, analysis, early warning, the anticipation etc. to full ecological chain test information, Instructing manufacture, improving production efficiency and test yield.
Description
Technical field
The present invention relates to ic test technique fields, furtherly more particularly to a kind of full ecological chain of integrated circuit
Intelligent test analyzing method.
Background technique
Currently, China's IC industry is faced with the period of important strategic opportunities of development, innovation phase and the phase of assaulting fortified position, a side
Face, world market pattern accelerate adjustment, and scale of investment rises rapidly, and the market share accelerates to concentrate to strong enterprises；On the other hand,
Mobile intelligent terminal and chip are in explosive growth, and the new industry situation such as internet, Internet of Things, big data is fast-developing, integrated circuit
There is new trend in technological evolvement.
Recent years, big data are always a very popular topic.When people continue saying it with interest in Internet era magnanimity
When data band comes chance how and value, and visible chip big data at any time is had ignored in IC industry
Value, such as integrated circuit test data.Currently, integrated circuit testing generates the big data that various data are more than 300G daily, often
200,000,000 multiple chips of moon test, every chips test parameter averagely about 6000, every chips test function vector average about 10,
000,000, test data is also in sustainable growth, if the deployment of building distribution on line formula data, centralized information processing etc. exist
Line interactive information processing platform, research and development integrated circuit testing mass data (being daily more than the data of 300G) online analysis and processing
With offline depth digging technology, the test result of each link of integrated circuit is exercised supervision and analyzed, or even passes through some numbers
According to trend problem place, yield issues break into come before just take necessary measure, thus reduction very
To the accident for avoiding product quality, reduce the cost of chip production operation, for domestic and international integrated circuit relevant enterprise provide it is professional,
The online interaction information system services of safety, this is also the valence that magnanimity test data is embodied in future integrated circuits industry development
Value.
Domestic IC industry test informationization also faces following challenge and demand:
(1) physical services group system demand
The value of visible chip big data at any time in IC industry, as PCM process data, verify data, wafer are surveyed
The integrated circuit datas information such as data, QA data are tried, nearly all chip requires tight by many links before entering market
The test of lattice, and the capital of each link generates massive information data.Therefore, domestic IC enterprises', which is badly in need of one, has intelligence
Can, efficiently and formed a huge data network physical services group system, take into account safe early warning supporting system, comprehensively
The functions such as safety guarantee support system, efficient operation management support system, highly integrated data-interface is provided for upper layer application,
It realizes respective virtual, provides application service for the user on platform, form a complete ecosphere, be IC industry
User provides a whole set of safely controllable, intelligent monitoring, safe early warning, the integrated circuit base frame platform of dynamic monitoring and service.
(2) demand of online information interactive service system
IC industrial chain includes IC design, manufacture, encapsulation, test and support auxiliary above three link
Equipment and the links such as material, but each link is limited due to itself scale, technology etc., it is impossible to bear the information system of great number
It unites cost, so the following demand for servicing this cost is relatively low innovation service for online interaction will appear outburst, layout is interconnected
The innovation service and solution at net integrated circuit data center meet each link enterprise of IC industrial chain self-service clothes on demand
The online interaction Information Service Mode of business will become the ecosystems good interactions such as IC design, manufacture, packaging and testing
The pillar of development.
(3) demand is excavated and analyzed to mass data
In IC industry, a chips will be by test verifying before entering market, it will usually have tens even
Up to a hundred test items, other than test only returns to Pass/Fail, other project results all contain specific test number
According to, and the functional characteristic of chip at least in a certain respect is reflected, if it is the chip of volume production, few then shipment in 1 year nearly million is more
Then every month all arrives several ten million, it can be seen that these test results will be a great data treasure-house, if these data
Statistics and analysis can be fully subject to, for the characteristic of chip entirety, and the problem of design, technique, encapsulation etc.
It is very valuable.Future supervises the test result of each link of every a collection of chip if establishing a set of system and process
It superintends and directs and analyzes, even by the place of the trend problem of some data, before yield issues are broken into
Necessary measure is just taken, to reduce the accident for even avoiding product quality, reduces the cost of chip production operation, this is also
The value that magnanimity test data is embodied in future integrated circuits industry development.
In the prior art, integrated circuit testing environment is all in the dust proof workshops such as thousand grades, hundred grades, ten grades, production operation people
Member needs to supervise multiple devices, alarm abnormal if there is test etc., and tester table pause waits operator to go to handle, and
And it is different surely quickly navigate to problem where, distance, abnormal conditions, personnel, anomaly timeliness etc. between board all can
Treatment effeciency is influenced, if that more tester tables exception occur simultaneously, just will appear simultaneously, quickly to be handled, equipment
It can only stop working, waste, production capacity are low etc. when causing machine.
In conclusion the present invention provides a kind of full ecological chain intelligent test analyzing method of integrated circuit, based on big data+
AI algorithm fusion is extracted, is split, analysis, merging, and is realized multi-platform and is interconnected, for integrated circuit testing and information
Graphical analysis in real time converts intuitive chart for complicated, multiplicity data, and supports the function such as anticipation, early warning, prediction
Energy.
Summary of the invention
The present invention is to solve above-mentioned technical problem and the technical solution adopted is that provide a kind of full ecological chain intelligence of integrated circuit
Energy method for testing and analyzing, wherein the specific technical proposal is:
Including data collection layer, big data processing analysis layer and application layer, integrated circuit testing parameter index point is provided
Analysis, wafer test yield analysis, testing time analysis, wafer MAP chart information, SummaryCheck and analysis, TouchDown,
Report (report), SQLHistory (test record) analysis, this technology have the characteristics that data interchange and data backup, safety
Property it is high, be able to achieve data retrieval, tracking and the function of analysis to complete ecological chain information, be conducive to real time monitoring test result.
Step 1: R1: the values of information such as input product title Device, test lot number Lot, tester table Tester are write from memory
Think empty, i.e. full search.
Step 2: selecting the initial time needed in R3 and terminating the time, default initial time is the tool opening time
30 days forward, default stop-time was the tool opening time.
Step 3: selecting CP (wafer test) or FT (finished product test) in R4, it is related to the database location of search.
Step 4: selection uses the data or local data of database in R5, all symbols then can be shown in L1
The information of conjunction condition finally selects which specific data to need to read further according to actual needs, reads temp file or csv text
Part.Key data inquirement way includes: that " SQL Search " is the temp file for inquiring lane database；" SQL Read " is to read
The temp file of lane database；" SQL DC Parameter " is the csv file in reading database；" Local Search " is
Obtain the temp file in local drive；" Local Read " is the temp file read in local drive；"Local DC
Parameter " is the csv file read in local drive.
Step 5: the file in reading can show progress in R5, it can be shown in R7 after the completion of reading, real-time display is read
The piece number and progress taken.
Step 6: can show all parameter informations in L1 if what is read is csv file.
Including following population parameter information；
L11:TC is total number measured amount；RC is repetition measurement quantity；WC is that total number measured amount subtracts repetition measurement quantity；
L12: ProductName can have multiple ProductNames；
L13: the lot number name of appointed product under one's name；
L14: the WaferID and FlowID of appointed product name lot number under one's name；
L15: the lot number statistical information of ProductName, LC are lot number quantity, TC product test total quantity thus；RC product thus
Repetition measurement quantity；Product test total quantity subtracts repetition measurement quantity to WC thus；
L16: the statistical information of specified lot number, TC lot number total number measured amount thus；RC lot number repetition measurement quantity thus；WC is thus
Lot number total number measured amount subtracts repetition measurement quantity；
L17: the test end time of specified WaferID；
L18: red indicates this for the data of repetition measurement；
Step 7: the featured function button in selection U1, different function can show different data formats in C1.Mainly
Including function it is as follows: " test parameter index analysis ", the specific targets of Main Analysis DC parameter；" yield analysis ", main point
Analyse the yield information and specific site, Bin information of wafer or FT file；" time analysis ", Main Analysis wafer or FT file
Testing time information and touchdown information；" TskMap " mainly checks that the Map figure information of wafer and various map are related
Audit function；" SummaryCheck " mainly checks the summary and analysis result of wafer or FT file；" TouchDown ",
Completely the practical touchdown number of a piece of wafer and site test number to Main Analysis；" Report ", mainly generates not
With the different reports of customer requirement；" SQLHistory " mainly checks that the information of lane database, including CP test record, FT are surveyed
Trial record etc..
Step 8: selecting corresponding function according to actual needs in U1, new analysis data are generated.
Step 9: the different tab of selection C1, can be shown with multiple terminals such as wechat push, mail push, local holdings.
Featured function illustrates:
(1) test parameter index analysis
Data Integration: U311:X, Y, Site, FlowPF are fixed column, and XY represents its XY coordinate on wafer, Site generation
This coordinate of table is which specific station test, and the final result that FlowPF represents this coordinate is pass or fail.It arranges below
Different data can be accordingly shown according to selected test item difference, and a test item is two column, and first is classified as its test item
Pass/fail is as a result, second is classified as the specific test value of test item.
U312: testing how many die on wafer, with regard to how many row information.
U313: specific data are shown；
It realizes setting: Remove FlowFail: the value that this die final result is fail is rejected；
Remove ItemFail: by this test item the result is that the value of fail is rejected；
Remove Outliers: the value for the interquartile-range IQR that 1.5 times are greater than test value is rejected；
Remove ExOutliers: the value for the interquartile-range IQR that 3 times are greater than test value is rejected；
By Site: a point site whether is needed to be calculated when statistics；
The subtype of support:
NormalDistribution: normal distribution
ScatterPlot: scatter plot
BarHistogram: column histogram
BoxPlot: box figure
ValueMap: the Map figure of test item
Chart type:
HighLimit: the upper limit
LowLimit: lower limit
Max: maximum value
Min: minimum value
Mean: average value
Median: median
Sigma: standard deviation
+ 3Sigma: average value adds 3 times of standard deviations
- 3Sigma: average value subtracts 3 times of standard deviations
Quartile1: first quartile
Quartile3: third quartile
" numerical analysis " is that numerical value is carried out to the analysis such as average value, standard deviation.
Technical advantage: Visual Chart intuitively is generated by being converted into several hundred or even thousands of test parameters, together
When, test value Map can be formed by any one test parameter in the distribution of a map figure, it can be clearly by color change
Whether have regional and tendency, more intuitively judge that wafer itself whether there is problem, the test value point of whole map if finding out
Cloth is also extremely important for fab.
(2) yield analysis is tested
Data Integration: U321: column heading is preset parameter, FinalYield, FirstYield, RetestYield,
RecoverYield, FinalPass, FirstPass, RetestCount, RecoverCount, TesterID, PCID, respectively
Represent final yield, initial yield, repetition measurement rate, response rate, final pass number, initial pass number, repetition measurement quantity, reply quantity,
Test machine number, needle card number.
U322: the source data quantity of selection, how many data file is with regard to how many row.
U323: specific data are shown.
The subtype of support:
Rectification Lot yield analysis figure: the value of different Lot is shown with different colours, can clearly find out LOT it
Between yield difference；
ProberCard yield analysis figure: forming test yield analysis figure for different test conditions, different hard to check
Yield difference before part；
Site yield analysis linear graph: different site are made into linear schedule, intuitively find out yield difference between site；
FailBin analysis chart: the quantity of all failbin is arranged from big to small, and by each bin and before
The quantity of all bin is cumulative, makees the cumulative percentage line of item.It can be seen that dominant failure and is made as caused by which BIN
At influence have it is much.
Single Site failure analysis figure: it takes three failbin of maximum quantity to be made into superposition histogram, passes through each site
Highly intuitive find out SITE yield difference；
Multiple Site linear graphs: it takes three failbin of maximum quantity to be made into linear graph, sees whether due to site difference
Caused by fail quantity become larger；
Technical advantage: between rectification Lot yield, ProberCard influence factor, test site, FailBin factor etc.
Various dimensions remove analysis test yield figure, from final yield, initial yield, repetition measurement rate, response rate, each Lot's of express statistic
summary.Can clearly it find out and analyzed area and tendency.
(3) time analysis
Data Integration: U331: column heading is preset parameter, TotalTime, NormalTestTime,
RetestTestTime、NormalPauseTime、NormalTotalTime、RetestPauseTime、
RetestTotalTime, RetestFirstDieTime, TesterID, PCID respectively represent total testing time, proper testing
It is time out during time out, proper testing total time, repetition measurement during time, repetition measurement testing time, proper testing, multiple
Survey total time, first die time of repetition measurement, test machine number, needle card number.
U332: the source data quantity of selection, how many data file is with regard to how many row.
U333: specific data are shown.
Rectification Lot yield analysis figure: the value of different Lot is shown with different colours, can clearly find out LOT it
Between testing time difference.
TouchDown analysis: TouchDowndetail: the time of each touchdown is shown.
Technical advantage: by checking every testing time, every actual testing time can be obtained.And for test
Time long piece can go to see time interval by touchdown, time elongated reason be found, to improve production effect
Rate.
(4)TskMap
The mainly MAP chart of analysis CP test, the distribution of distribution, repetition measurement and reply Bin including all BIN pass through respectively
Whether the MAP chart judged after kind of algorithm is abnormal etc., multiple map can also stack up, analyze the distribution of fail bin.
Data Integration: U351: 4 are classified as preset parameter, BinCount, BinYield, S2S Count, S2S before column heading
Yield respectively represents the quantity of BIN, the percentage of BIN, Site difference number, Site difference percentage, is followed by specific
Site information, how many site represent the quantity of each BIN of each site with regard to how many column data.
U332: the source data quantity of selection, how many data file is with regard to how many row.
U333: specific data are shown
Recover/Retest color is distinguished: the height of response rate is intuitively found out, if there is apparent pattern schemes
Shape then illustrates that hardware is variant, to follow-up test and improves yield progress instruction.
" SummaryCheck " checks test summary, and is judged automatically according to the judgment rule of specific product,
Rapidly find out abnormal data.Yield judgement: it is intuitively seen by color where ging wrong；It can also directly first test failure or exception
Test it is several.
The other innovation of this system:
System function automatically updates, in order to guarantee that exe used in everyone is latest edition, it is necessary to exe version
A judgement is done, it, can be in work if a newest exe executable file will be re-downloaded from server lower than latest edition
Its version number is found in the top after tool is opened.
(2) all configuration files are shared, are taken precautions against with configuration file maloperation: the full ecological chain intelligence test analysis of integrated circuit
Assemble many configuration files, each configuration file has its corresponding function, such as device setting is configured with the model of map
It encloses, yield setting is configured with the judgment rule of product.If administrator has updated configuration file, other people should also make
With newest configuration file.It can choose after any pair of configuration file has operation and modified configuration file uploaded into service
Device can will use under the configuration file on server to local again before using configuration file every time.In addition it is accidentally grasped if there is any
When making or is uncertain, it also can choose and do not upload modified configuration file, only update local configuration file, when confirmation nothing
Reselection upload server after accidentally, the configuration file for avoiding maloperation from using owner are all accidentally updated.
(3) the analysis core algorithm of autonomous innovation:
Centered on some fail, 8 points that make a circle in its week (upper left, upper, upper right, the right side, bottom right, under, lower-left, a left side)
Any one fail is looked for again, if not thinking that 9 palace lattice fail numbers are current fail summation, if there is continuing with any one
A fail again centered on, certainly before that fail point cannot calculate wherein, until 8 points of surrounding do not have fail, such as
The standard that fruit fail sum is greater than judgement thinks fail, shows on the diagram.
It needs that fail to remove outside before when its difficult point is to judge, cannot compute repeatedly, therefore be circulated throughout
Cheng Zhonghui is there are two list variable, and one is current all fail lists counted on, the other is centered on current fail
Fail list, dynamic update two lists, guarantee do not compute repeatedly.
The vertical and horizontal continuous failure algorithm particular content of Map figure is, centered on a fail, first with the searching of X-axis transverse direction both sides
Fail, it is then failure that continuous fail number, which is greater than expected, if there is pass in the middle, is all reset；Then it is longitudinally found with Y-axis
Fail, same to X-axis.
Its difficult point is that X-axis and Y-axis needs calculate separately, and needs to merge result simultaneously, so make when algorithm
With the value of two variable storage X-axis and Y-axis, finally result altogether is put into a final variable again, uses this
Variable describes final result.
The Site algorithm particular content that continuously fails is centered on a fail, to find continuous site identical with it,
Judge whether fail, be expected if continuous fail is greater than, for failure.
Its difficult point, which is almost all of CP all, can carry out repetition measurement, the test knot before needing to replace final result
Fruit, but its testing sequence cannot be changed, whether consistent then judge its site, then judge the quantity of continuous fail, therefore first will
Site grouping is looped to determine, and uses a dictionary using XY coordinate as key, testing sequence is as value, by phase after repetition measurement
Same XY is that the value of key is replaced, and is listed all pass/fail results with a sequence list, finally by sequence
List goes whether the quantity for judging continuously to fail is greater than expection.
The TD algorithm particular content that continuously fails is, centered on a fail, find with its continuous touchdown, such as
There is a fail in fruit touchdown, then add up fail number, is expected once being greater than, is then failure.Its difficult point is to judge
Whether touchdown is continuous, can equally encounter repetition measurement problem, therefore before being also required to replace the value after repetition measurement, then
Judged according to the time to be grouped, as soon as being linked up pass/fail with sequence list, can judge whether that fail is continuous.
Original -> repetition measurement distribution map, lists the die of all repetition measurements, and before No. BIN compares, if from fail to
Pass is then indicated with green, fail to fail, but No. BIN does not become, and is indicated with yellow, and No. BIN also becomes, then with red
It indicates.Its difficult point is to be showed with Visual Chart, needs all to list all BIN, among number filling circle,
And circle size is accordingly changed according to Digital size, and is distinguished with different colours.
The present invention has the following beneficial effects with respect to the prior art:
By researching and developing final yield, initial yield, repetition measurement rate, the grid table of response rate and visualization, testing time, test
The on-line intelligences analysis modules such as Map figure, have Wafer Lot Yield summary, Wafer Lot BinMap, Wafer
Lot StackMap、Probe/Setting、6sigma、 Test time、SummaryCheck、Probe/Setting、
The analytic function of the various dimensions such as Report is interconnected by the analysis of big data as a result, realizing multi-platform, by certain
Algorithm extract, split, analysis, the methods of merging, these data are converted to the file and chart being easily understood, allow different necks
The people in domain can quickly obtain desired analysis result.
The full ecological chain intelligence test analysis of integrated circuit of the present invention, realizes the real-time, mobility and intelligence of corporate office
Property, have the characteristics that teledata intercommunication and remote data backup, it is highly-safe, by continuous data accumulation, it is based on 6 months
To 1 year data accumulation, introduce industrial big data analysis model, realize the data retrieval to full ecological chain test information, tracking,
Analysis, early warning, anticipation etc., Instructing manufacture, improving production efficiency and test yield.
Detailed description of the invention
Fig. 1 is the flow diagram of the full ecological chain intelligent test analyzing method of integrated circuit.
Fig. 2 is the schematic diagram of the 6th step display parameter information.
Fig. 3 is the schematic diagram that specific data are shown in test parameter index analysis.
Fig. 4 is the schematic diagram of numerical analysis.
Fig. 5 is the schematic diagram that specific data are shown.
Fig. 6 is the schematic diagram of Site yield analysis linear graph.
Fig. 7 is the schematic diagram of Site linear graph.
Fig. 8 is the schematic diagram that specific data are shown in time analysis.
Fig. 9 is the schematic diagram of TouchDown analysis.
Figure 10 is the schematic diagram that the specific data of TskMap are shown.
Figure 11 is the schematic diagram that Recover/Retest color is distinguished.
Figure 12 is the schematic diagram of SummaryCheck.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.
The full ecological chain intelligent test analyzing method of integrated circuit, comprising: data collection layer, big data processing analysis layer and
Application layer provides the analysis of integrated circuit testing parameter index, wafer test yield analysis, testing time analysis, wafer MAP chart letter
Breath, SummaryCheck and analysis, TouchDown, Report (report), SQLHistory (test record) analysis, this technology
Have the characteristics that data interchange and data backup, it is highly-safe, be able to achieve the data retrieval to complete ecological chain information, tracking and point
The function of analysis is conducive to real time monitoring test result.
Step 1: R1: the values of information such as input product title Device, test lot number Lot, tester table Tester are write from memory
Think empty, i.e. full search.
Step 2: selecting the initial time needed in R3 and terminating the time, default initial time is the tool opening time
30 days forward, default stop-time was the tool opening time.
Step 3: selecting CP (wafer test) or FT (finished product test) in R4, it is related to the database location of search.
Step 4: selection uses the data or local data of database in R5, all symbols then can be shown in L1
The information of conjunction condition finally selects which specific data to need to read further according to actual needs, reads temp file or csv text
Part.Key data inquirement way includes: that " SQL Search " is the temp file for inquiring lane database；" SQL Read " is to read
The temp file of lane database；" SQL DC Parameter " is the csv file in reading database；" Local Search " is
Obtain the temp file in local drive；" Local Read " is the temp file read in local drive；"Local DC
Parameter " is the csv file read in local drive.
Step 5: the file in reading can show progress in R5, it can be shown in R7 after the completion of reading, real-time display is read
The piece number and progress taken.
Step 6: can show all parameter informations in L1 if what is read is csv file.
Including following population parameter information
L11:TC is total number measured amount；RC is repetition measurement quantity；WC is that total number measured amount subtracts repetition measurement quantity.
L12: ProductName can have multiple ProductNames.
L13: the lot number name of appointed product under one's name.
L14: the WaferID and FlowID of appointed product name lot number under one's name.
L15: the lot number statistical information of ProductName, LC are lot number quantity, TC product test total quantity thus；RC product thus
Repetition measurement quantity；Product test total quantity subtracts repetition measurement quantity to WC thus.
L16: the statistical information of specified lot number, TC lot number total number measured amount thus；RC lot number repetition measurement quantity thus；WC is thus
Lot number total number measured amount subtracts repetition measurement quantity.
L17: the test end time of specified WaferID.
L18: such as Fig. 2, the data that this is repetition measurement are indicated.
Step 7: the featured function button in selection U1, different function can show different data formats in C1.Mainly
Including function it is as follows: " test parameter index analysis ", the specific targets of Main Analysis DC parameter；" yield analysis ", main point
Analyse the yield information and specific site, Bin information of wafer or FT file；" time analysis ", Main Analysis wafer or FT file
Testing time information and touchdown information；" TskMap " mainly checks that the Map figure information of wafer and various map are related
Audit function；" SummaryCheck " mainly checks the summary and analysis result of wafer or FT file；
" TouchDown ", completely the practical touchdown number of a piece of wafer and site test number to Main Analysis；
" Report " mainly generates the different reports of different clients requirement；" SQLHistory " mainly checks the information of lane database,
Including CP test record, FT test record etc..
Step 8: selecting corresponding function according to actual needs in U1, new analysis data are generated.
Step 9: the different tab of selection C1, can be shown with multiple terminals such as wechat push, mail push, local holdings.
Featured function illustrates:
(1) test parameter index analysis
Data Integration: U311:X, Y, Site, FlowPF are fixed column, and XY represents its XY coordinate on wafer, Site generation
This coordinate of table is which specific station test, and the final result that FlowPF represents this coordinate is pass or fail.It arranges below
Different data can be accordingly shown according to selected test item difference, and a test item is two column, and first is classified as its test item
Pass/fail is as a result, second is classified as the specific test value of test item.
U312: testing how many die on wafer, with regard to how many row information.
U313: specifically data are shown, such as Fig. 3.
It realizes setting: Remove FlowFail: the value that this die final result is fail is rejected；
Remove ItemFail: by this test item the result is that the value of fail is rejected；
Remove Outliers: the value for the interquartile-range IQR that 1.5 times are greater than test value is rejected；
Remove ExOutliers: the value for the interquartile-range IQR that 3 times are greater than test value is rejected；
By Site: a point site whether is needed to be calculated when statistics；
The subtype of support:
NormalDistribution: normal distribution
ScatterPlot: scatter plot
BarHistogram: column histogram
BoxPlot: box figure
ValueMap: the Map figure of test item
Chart type:
HighLimit: the upper limit
LowLimit: lower limit
Max: maximum value
Min: minimum value
Mean: average value
Median: median
Sigma: standard deviation
+ 3Sigma: average value adds 3 times of standard deviations
- 3Sigma: average value subtracts 3 times of standard deviations
Quartile1: first quartile
Quartile3: third quartile
" numerical analysis " is that numerical value is carried out to the analysis such as average value, standard deviation, such as Fig. 4.
Technical advantage: Visual Chart intuitively is generated by being converted into several hundred or even thousands of test parameters, together
When, test value Map can be formed by any one test parameter in the distribution of a map figure, it can be clearly by color change
Whether have regional and tendency, more intuitively judge that wafer itself whether there is problem, the test value point of whole map if finding out
Cloth is also extremely important for fab.
(2) yield analysis is tested
Data Integration: U321: column heading is preset parameter, FinalYield, FirstYield, RetestYield,
RecoverYield, FinalPass, FirstPass, RetestCount, RecoverCount, TesterID, PCID, respectively
Represent final yield, initial yield, repetition measurement rate, response rate, final pass number, initial pass number, repetition measurement quantity, reply quantity,
Test machine number, needle card number.
U322: the source data quantity of selection, how many data file is with regard to how many row.
U323: specifically data are shown, such as Fig. 5.
The subtype of support:
Rectification Lot yield analysis figure: the value of different Lot is shown with different colours, can clearly find out LOT it
Between yield difference；
ProberCard yield analysis figure: forming test yield analysis figure for different test conditions, different hard to check
Yield difference before part；
Site yield analysis linear graph: being made into linear schedule for different site, intuitively finds out yield difference between site, such as
Fig. 6；
FailBin analysis chart: the quantity of all failbin is arranged from big to small, and by each bin and before
The quantity of all bin is cumulative, makees the cumulative percentage line of item.It can be seen that dominant failure and is made as caused by which BIN
At influence have it is much.
Single Site failure analysis figure: it takes three failbin of maximum quantity to be made into superposition histogram, passes through each site
Highly intuitive find out SITE yield difference
Multiple Site linear graphs: it takes three failbin of maximum quantity to be made into linear graph, sees whether due to site difference
Caused by fail quantity become larger, such as Fig. 7.
Technical advantage: between rectification Lot yield, ProberCard influence factor, test site, FailBin factor etc.
Various dimensions remove analysis test yield figure, from final yield, initial yield, repetition measurement rate, response rate, each Lot's of express statistic
summary.Can clearly it find out and analyzed area and tendency.
(3) time analysis
Data Integration: U331: column heading is preset parameter, TotalTime, NormalTestTime,
RetestTestTime、NormalPauseTime、NormalTotalTime、RetestPauseTime、
RetestTotalTime, RetestFirstDieTime, TesterID, PCID respectively represent total testing time, proper testing
It is time out during time out, proper testing total time, repetition measurement during time, repetition measurement testing time, proper testing, multiple
Survey total time, first die time of repetition measurement, test machine number, needle card number.
U332: the source data quantity of selection, how many data file is with regard to how many row.
U333: specifically data are shown, such as Fig. 8.
Rectification Lot yield analysis figure: the value of different Lot is shown with different colours, can clearly find out LOT it
Between testing time difference
TouchDown analysis: the time of each touchdown, such as Fig. 9 TouchDowndetail: are shown.
Technical advantage: by checking every testing time, every actual testing time can be obtained.And for test
Time long piece can go to see time interval by touchdown, time elongated reason be found, to improve production effect
Rate.
(4)TskMap
The mainly MAP chart of analysis CP test, the distribution of distribution, repetition measurement and reply Bin including all BIN pass through respectively
Whether the MAP chart judged after kind of algorithm is abnormal etc., multiple map can also stack up, analyze the distribution of fail bin.
Data Integration: U351: 4 are classified as preset parameter, BinCount, BinYield, S2S Count, S2S before column heading
Yield respectively represents the quantity of BIN, the percentage of BIN, Site difference number, Site difference percentage, is followed by specific
Site information, how many site represent the quantity of each BIN of each site with regard to how many column data.
U332: the source data quantity of selection, how many data file is with regard to how many row.
U333: specifically data are shown, such as Figure 10.
Recover/Retest color is distinguished: the height of response rate is intuitively found out, if there is apparent pattern schemes
Shape then illustrates that hardware is variant, to follow-up test and improves yield progress instruction, such as Figure 11.
" SummaryCheck " checks test summary, and is judged automatically according to the judgment rule of specific product,
Rapidly find out abnormal data.Yield judgement: it is intuitively seen by color where ging wrong；It can also directly first test failure or exception
Test it is several, such as Figure 12.
The other innovation of this system:
(1) system function automatically updates, in order to guarantee that exe used in everyone is latest edition, it is necessary to exe editions
Originally judgement is done, it, can be if a newest exe executable file will be re-downloaded from server lower than latest edition
Its version number is found in the top after tool open.Realize that code is as follows:
(2) all configuration files are shared, are taken precautions against with configuration file maloperation: the full ecological chain intelligence test analysis of integrated circuit
Assemble many configuration files, each configuration file has its corresponding function, such as device setting is configured with the model of map
It encloses, yield setting is configured with the judgment rule of product.If administrator has updated configuration file, other people should also make
With newest configuration file.It can choose after any pair of configuration file has operation and modified configuration file uploaded into service
Device can will use under the configuration file on server to local again before using configuration file every time.In addition it is accidentally grasped if there is any
When making or is uncertain, it also can choose and do not upload modified configuration file, only update local configuration file, when confirmation nothing
Reselection upload server after accidentally, the configuration file for avoiding maloperation from using owner are all accidentally updated.
Ftp_server=' 172.28.0.95 '
Username=' bigdata '
Password=' sinoictest1 '
Ftp=FTP ()
Ftp.set_debuglevel (2) # opens debugging level 2, shows details
Ftp.connect (ftp_server, 21) # connection
Ftp.login (username, password) # is logged in, and is replaced if anonymous login with empty string
The upper transmitting file 2 of #
Remotepath=' BigData TskMap_Config.ini '
Bufsize=1024
Localpath=Path+ ' TskMap_Config.ini '
Fp=open (localpath, ' rb ')
Ftp.storbinary (' STOR '+remotepath, fp, bufsize) upper transmitting file of #
Ftp.set_debuglevel (0) # closes debugging
fp.close()
Ftp.quit (), # exited ftp server
(3) the analysis core algorithm of autonomous innovation:
Centered on some fail, 8 points that make a circle in its week (upper left, upper, upper right, the right side, bottom right, under, lower-left, a left side)
Any one fail is looked for again, if not thinking that 9 palace lattice fail numbers are current fail summation, if there is continuing with any one
A fail again centered on, certainly before that fail point cannot calculate wherein, until 8 points of surrounding do not have fail, such as
The standard that fruit fail sum is greater than judgement thinks fail, shows on the diagram.
It needs that fail to remove outside before when its difficult point is to judge, cannot compute repeatedly, therefore be circulated throughout
Cheng Zhonghui is there are two list variable, and one is current all fail lists counted on, the other is centered on current fail
Fail list, dynamic update two lists, guarantee do not compute repeatedly.Realize that part key code is as follows:
The vertical and horizontal continuous failure algorithm particular content of Map figure is, centered on a fail, first with the searching of X-axis transverse direction both sides
Fail, it is then failure that continuous fail number, which is greater than expected, if there is pass in the middle, is all reset；Then it is longitudinally found with Y-axis
Fail, same to X-axis.
Its difficult point is that X-axis and Y-axis needs calculate separately, and needs to merge result simultaneously, so make when algorithm
With the value of two variable storage X-axis and Y-axis, finally result altogether is put into a final variable again, uses this
Variable describes final result.Realize that part key code is as follows:
The Site algorithm particular content that continuously fails is centered on a fail, to find continuous site identical with it,
Judge whether fail, be expected if continuous fail is greater than, for failure.
Its difficult point, which is almost all of CP all, can carry out repetition measurement, the test knot before needing to replace final result
Fruit, but its testing sequence cannot be changed, whether consistent then judge its site, then judge the quantity of continuous fail, therefore first will
Site grouping is looped to determine, and uses a dictionary using XY coordinate as key, testing sequence is as value, by phase after repetition measurement
Same XY is that the value of key is replaced, and is listed all pass/fail results with a sequence list, finally by sequence
List goes whether the quantity for judging continuously to fail is greater than expection.Realize that key code is as follows:
The TD algorithm particular content that continuously fails is, centered on a fail, find with its continuous touchdown, such as
There is a fail in fruit touchdown, then add up fail number, is expected once being greater than, is then failure.Its difficult point is to judge
Whether touchdown is continuous, can equally encounter repetition measurement problem, therefore before being also required to replace the value after repetition measurement, then
Judged according to the time to be grouped, as soon as being linked up pass/fail with sequence list, can judge whether that fail is continuous.
Realize that key code is as follows:
Original -> repetition measurement distribution map, lists the die of all repetition measurements, and before No. BIN compares, if from fail to
Pass is then indicated with green, fail to fail, but No. BIN does not become, and is indicated with yellow, and No. BIN also becomes, then with red
It indicates.Its difficult point is to be showed with Visual Chart, needs all to list all BIN, among number filling circle,
And circle size is accordingly changed according to Digital size, and is distinguished with different colours.Realize that part key code is as follows:
Real-time, mobility and the intelligence of corporate office are realized in the full ecological chain intelligence test analysis of integrated circuit of the present invention
Property；Have the characteristics that teledata intercommunication and remote data backup, it is highly-safe, by continuous data accumulation, it is based on 6 months
To 1 year data accumulation, introduce industrial big data analysis model, realize the data retrieval to full ecological chain test information, tracking,
Analysis, early warning, anticipation etc., Instructing manufacture, improving production efficiency and test yield.
Although the present invention is disclosed as above with preferred embodiment, however, it is not to limit the invention, any this field skill
Art personnel, without departing from the spirit and scope of the present invention, when can make a little modification and perfect therefore of the invention protection model
It encloses to work as and subject to the definition of the claims.
Claims (7)
1. a kind of full ecological chain intelligent test analyzing method of integrated circuit, it is characterised in that:
Including data collection layer, big data processing analysis layer and application layer, the analysis of integrated circuit testing parameter index, crystalline substance are provided
Circle test yield analysis, testing time analysis, wafer MAP chart information, SummaryCheck and analysis, TouchDown,
Report, SQLHistory analysis；
Step 1: R1: input includes but is not limited to name of product Device, test lot number Lot, tester table Tester information
Value, is defaulted as sky, i.e. full search；
Step 2: selected in R3 need initial time and terminate the time, default initial time be the tool opening time forward
30 days, default stop-time was the tool opening time；
Step 3: selecting wafer test or finished product test in R4, it is related to the database location of search；
Step 4: selection uses the data or local data of database in R5, then, it can be shown in L1 and all meet item
The information of part finally selects specific data to need to read further according to actual needs, reads temp file or csv file；
Step 5: the file in reading can show progress in R5, can be shown in R7 after the completion of reading, what real-time display was read
The piece number and progress；
Step 6: can show all parameter informations in L1 if what is read is csv file；
Including but not limited to following population parameter information；
L11:TC is total number measured amount；RC is repetition measurement quantity；WC is that total number measured amount subtracts repetition measurement quantity；
L12: ProductName；
L13: the lot number name of appointed product under one's name；
L14: the WaferID and FlowID of appointed product name lot number under one's name；
L15: the lot number statistical information of ProductName, LC are lot number quantity, TC product test total quantity thus；RC product repetition measurement thus
Quantity；Product test total quantity subtracts repetition measurement quantity to WC thus；
L16: the statistical information of specified lot number, TC lot number total number measured amount thus；RC lot number repetition measurement quantity thus；WC lot number thus
Total number measured amount subtracts repetition measurement quantity；
L17: the test end time of specified WaferID；
L18: red indicates this for the data of repetition measurement；
Step 7: the featured function button in selection U1, different function can show different data formats in C1；
Step 8: selecting corresponding function according to actual needs in U1, new analysis data are generated；
Step 9: selecting the different tab of C1, including but not limited to wechat push, mail push, local holding terminal are shown.
2. the full ecological chain intelligent test analyzing method of integrated circuit as described in claim 1, it is characterised in that:
Featured function illustrates:
1) test parameter index analysis:
Data Integration: U311, X, Y, Site, FlowPF are fixed column, and XY represents its XY coordinate on wafer, and Site represents this
Coordinate is which specific station test, and the final result that FlowPF represents this coordinate is pass or fail, behind arrange basis
Selected test item difference can accordingly show different data, and a test item is two column, and first is classified as the pass/ of its test item
Fail is as a result, second is classified as the specific test value of test item；
U312 tests how many corresponding row information of how many die on wafer；
U313, specific data are shown；
It realizes setting: Remove FlowFail, the value that this die final result is fail is rejected；
Remove ItemFail, by this test item the result is that the value of fail is rejected；
Remove Outliers rejects the value for the interquartile-range IQR that 1.5 times are greater than test value；
Remove ExOutliers rejects the value for the interquartile-range IQR that 3 times are greater than test value；
Whether By Site, when statistics need a point site to be calculated；
The subtype of support:
NormalDistribution, normal distribution；
ScatterPlot, scatter plot；
BarHistogram, column histogram；
BoxPlot, box figure；
ValueMap, the Map figure of test item；
Chart type:
HighLimit: the upper limit
LowLimit: lower limit
Max: maximum value
Min: minimum value
Mean: average value
Median: median
Sigma: standard deviation
+ 3Sigma: average value adds 3 times of standard deviations
- 3Sigma: average value subtracts 3 times of standard deviations
Quartile1: first quartile
Quartile3: third quartile
Numerical analysis is that numerical value is carried out average value, standard error analysis.
3. the full ecological chain intelligent test analyzing method of integrated circuit as claimed in claim 2, it is characterised in that:
2) yield analysis is tested
Data Integration: U321: column heading is preset parameter, FinalYield, FirstYield, RetestYield,
RecoverYield, FinalPass, FirstPass, RetestCount, RecoverCount, TesterID, PCID, respectively
Represent final yield, initial yield, repetition measurement rate, response rate, final pass number, initial pass number, repetition measurement quantity, reply quantity,
Test machine number, needle card number.
U322: the source data quantity of selection, how many data file is with regard to how many row.
U323: specific data are shown.
The subtype of support:
Rectification Lot yield analysis figure: the value of different Lot is shown with different colours, can clearly be found out between LOT
Yield difference；
ProberCard yield analysis figure: forming test yield analysis figure for different test condition, come check different hardware it
Preceding yield difference；
Site yield analysis linear graph: different site are made into linear schedule, intuitively find out yield difference between site；
FailBin analysis chart: the quantity of all failbin is arranged from big to small, and by each bin and before all
The quantity of bin is cumulative, makees the cumulative percentage line of item.It can be seen that dominant failure be as caused by which BIN, and caused by
Influence has much.
Single Site failure analysis figure: it takes three failbin of maximum quantity to be made into superposition histogram, passes through the height of each site
Degree intuitively finds out SITE yield difference；
Multiple Site linear graphs: taking three failbin of maximum quantity to be made into linear graph, sees whether to cause due to site difference
Fail quantity become larger；
Technical advantage: between rectification Lot yield, ProberCard influence factor, test site, the multidimensional such as FailBin factor
Degree removes analysis test yield figure, from final yield, initial yield, repetition measurement rate, response rate, each Lot's of express statistic
summary.Can clearly it find out and analyzed area and tendency.
4. the full ecological chain intelligent test analyzing method of integrated circuit as claimed in claim 3, it is characterised in that:
3) time analysis
Data Integration: U331, column heading are preset parameter, TotalTime, NormalTestTime, RetestTestTime,
NormalPauseTime、NormalTotalTime、RetestPauseTime、RetestTotalTime、
RetestFirstDieTime, TesterID, PCID, when respectively representing total testing time, proper testing time, repetition measurement test
Between, time out during time out, proper testing total time, repetition measurement during proper testing, repetition measurement total time, repetition measurement
First die time, test machine number, needle card number；
U332: the source data quantity of selection, how many data file is with regard to how many row；
U333: specific data are shown；
Lot yield analysis figure is rectified and improved, the value of different Lot is shown with different colours, shows that the testing time is poor between LOT
It is different；
TouchDown analysis, TouchDowndetail show the time of each touchdown.
5. the full ecological chain intelligent test analyzing method of integrated circuit as claimed in claim 4, it is characterised in that:
4)TskMap
It analyzes the MAP chart of CP test, distribution, repetition measurement including all BIN and replys the distribution of Bin, by sentencing after various algorithms
Whether disconnected MAP chart is abnormal, multiple map can stack up, and analyzes the distribution of fail bin；
Data Integration: U351: 4 are classified as preset parameter, BinCount, BinYield, S2S Count, S2S before column heading
Yield respectively represents the quantity of BIN, the percentage of BIN, Site difference number, Site difference percentage, is followed by specific
Site information, how many site just correspond to how many column data, represent the quantity of each BIN of each site；
U332: the source data quantity of selection, how many data file is with regard to how many row；
U333: specific data are shown:
Recover/Retest color is distinguished: intuitively finding out the height of response rate, if there is apparent pattern figure, then
Illustrate that hardware is variant, to follow-up test and improves yield progress instruction；
" SummaryCheck " checks test summary, and is judged automatically according to the judgment rule of specific product, quickly
Find out abnormal data；Yield judgement: it is intuitively seen by color where ging wrong；It can directly first test failure or abnormal test number
?.
6. the full ecological chain intelligent test analyzing method of integrated circuit as claimed in claim 5, it is characterised in that: all configuration texts
Part is shared, is taken precautions against with configuration file maloperation: many configuration files are assembled in the full ecological chain intelligence test analysis of integrated circuit, each
Configuration file has its corresponding function, have maloperation or it is uncertain when, selection modified configuration file is not uploaded, only more
New local configuration file, reselection upload server after confirming errorless, the configuration text for avoiding maloperation from using owner
Part is all accidentally updated.
7. the full ecological chain intelligent test analyzing method of integrated circuit as claimed in claim 6, it is characterised in that:
Analyze core algorithm:
Centered on some fail, in 8 points that make a circle in its week, upper left, upper, upper right, the right side, bottom right, under, lower-left, a left side, then look for
Any one fail, if not thinking that 9 palace lattice fail numbers are current fail summation, if there is continuing with any one fail
Centered on again, fail point if fail sum is greater than not counting wherein, until around 8 points do not have fail, judge before
Standard i.e. think fail, show on the diagram；
It needs fail to remove outside before when its difficult point is to judge, cannot compute repeatedly, therefore, be had in cyclic process
Two list variables, one is current all fail lists counted on, the other is the fail centered on current fail is arranged
Table, dynamic update two lists, and guarantee does not compute repeatedly；
The vertical and horizontal continuous failure algorithm particular content of Map figure are as follows: centered on a fail, fail first is found with X-axis transverse direction both sides,
It is then failure that continuous fail number, which is greater than expected, if there is pass in the middle, is all reset；Then fail is found longitudinally with Y-axis, together
X-axis；
Its difficult point is that X-axis and Y-axis needs calculate separately, and needs to merge result simultaneously, uses two when so carrying out algorithm
Result altogether is finally put into a final variable again, uses this variable by the value of a variable storage X-axis and Y-axis
Describe final result；
The Site algorithm particular content that continuously fails is centered on a fail, to find continuous site identical with it, judgement
Whether fail, be expected if continuous fail is greater than, for failure；
Its difficult point is almost all of CP all and can carry out repetition measurement, the test result before needing to replace final result, but
Its testing sequence cannot be changed, whether consistent then judge its site, then judge the quantity of continuous fail, therefore, first by site
Grouping is looped to determine, and uses a dictionary using XY coordinate as key, testing sequence, will be identical after repetition measurement as value
XY is that the value of key is replaced, and lists all pass/fail results with a sequence list, goes finally by sequence list
Judge whether the quantity continuously to fail is greater than expection；
The TD algorithm particular content that continuously fails is, centered on a fail, find with its continuous touchdown, if
There is a fail in touchdown, then add up fail number, is expected once being greater than, is then failure；
Its difficult point is judge whether touchdown is continuous, can equally encounter repetition measurement problem, therefore, it is also desirable to after repetition measurement
Before value replaces, then judged according to the time to be grouped, as soon as pass/fail is linked up with sequence list,
It can judge whether that fail is continuous.
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