CN108242411A - The method and system of defect on management and control line - Google Patents
The method and system of defect on management and control line Download PDFInfo
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- CN108242411A CN108242411A CN201611206324.6A CN201611206324A CN108242411A CN 108242411 A CN108242411 A CN 108242411A CN 201611206324 A CN201611206324 A CN 201611206324A CN 108242411 A CN108242411 A CN 108242411A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Abstract
The present invention provides a kind of method and system for defect on management and control line, and this method includes：According to different technological requirements, by analysis of history data come board grade in definition wires, in processing procedure on implementing line from can be performed with highest level board is selected in board；When implementing processing procedure on line using selected board, the operating condition of selected board and the practical condition of the product on selected board are monitored；Result update based on the monitoring is analyzed for described with the historical data of board grade in definition wires, and update or maintain the grade of the selected board.Method and system provided by the present invention for defect on management and control line requires to define board grade according to different process, high-grade board is preferentially selected for producing, board and production situation are monitored in real time simultaneously, detection performance it can change early and make improvement counter-measure in time, product quality can be effectively improved and maximumlly utilize board production capacity.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of method for defect on management and control line and are
System.
Background technology
In production, quality control is very crucial.At present, for semiconductor company, there are many low yields every year
The generation of case, some are even up to Rejection standard.And reason of searching to the bottom needs the race goods of each step on detailed inspection line to remember
Record, this will take a substantial amount of time and energy, necessarily will also result in more to the influence of product.By dividing historical data
Analysis finds that more than 90% low yield case is all related to defect on line.Therefore, it is particularly important to the management and control of defect on line.
The exception on line only can be just found after case occurs at present.In order to investigate thoroughly that it is a large amount of that basic reason needs to spend
Time.It needs that the board restriction of suspection is not only expended the time so manually before this, but also influences production
Energy.In addition, at present for the management and control of defect, all products are all using unified standard, and there is no consider board on line
Intrinsic difference does not account for the difference of different process yet.Therefore, it is necessary to implement more efficiently management and control to defect on line.
Invention content
In view of the deficiencies of the prior art, on the one hand, the present invention provides a kind of method for defect on management and control line, the side
Method includes：According to different technological requirements, by analysis of history data come board grade in definition wires, on line is implemented
From highest level board being selected to perform in board during processing procedure；When implementing processing procedure on line using selected board, prison
Control the operating condition of the selected board and the practical condition of the product on the selected board；And base
It is analyzed in the result update of the monitoring for described with the historical data of board grade in definition wires, and described in update or maintenance
The grade of selected board.
In one embodiment of the invention, the technological requirement is by defining key stratum, critical defect specification, crucial system
In journey board this three at least one of define.
In one embodiment of the invention, the historical data includes at least one of the following：Critical defect data,
Technological ability data, course learning data, failure model and effect analysis data and general rule data.
In one embodiment of the invention, when simultaneously board is selected for the production of multiple products and for the multiple production
When the highest level board of product is same board, based on the respective predetermined defect specification of the multiple product and/or for described
Multiple products respectively for available board number determine the priority of the multiple product selection highest level board.
In one embodiment of the invention, the operating condition of the monitoring selected board and described selected
The step of practical condition of the product on board selected, further comprises：It is processed based on the selected board
The defects of product, data calculated the currently benchmark the product produced on the selected board the defects of；It and will be currently in institute
The actual defects situation of the product produced on selected board is stated compared with the defect benchmark, and determines that the reality lacks
Whether sunken situation is within the defect benchmark, for determining the grade of maintenance or the update selected board.
In one embodiment of the invention, it when determining the actual defects situation when within the defect benchmark, ties up
Hold the grade of the selected board；When determining the actual defects situation not when within the defect benchmark, will described in
The grade of selected board degrades.
In one embodiment of the invention, the method further includes：After the grade of board is degraded, board is analyzed
Degradation reason simultaneously improves board based on the reason.
In one embodiment of the invention, the method further includes：When determining the actual defects situation not described
When within defect benchmark, the product currently produced on the selected board is marked for subsequent processing, and
Automatic sampling monitoring is carried out to the product subsequently produced on the selected board.
In one embodiment of the invention, the data based on the selected board processed product the defects of
It calculates and currently removes outlier during benchmark the product produced on the selected board the defects of, to exclude exceptional value to knot
The influence of fruit.
On the other hand, the present invention also provides a kind of system for defect on management and control line, the system comprises：Analyze mould
Block, for according to different technological requirements, by analysis of history data come board grade in definition wires, on line is implemented
From highest level board being selected to perform in board during processing procedure；Monitoring module is using selected board for monitoring
Implement the operating condition of the selected board and the practical life of the product on the selected board during processing procedure on line
Production situation；And management module, for being analyzed based on the update of the result of the monitoring for described with board grade in definition wires
Historical data, and update or maintain the grade of the selected board.
Method and system provided by the present invention for defect on management and control line requires to define board etc. according to different process
Grade preferentially selects high-grade board for producing, while board and production situation are monitored in real time, can detection property early
It can change and make improvement counter-measure in time, product quality can be effectively improved and maximumlly utilize board production capacity.
Description of the drawings
The drawings below of the present invention is used to understand the present invention in this as the part of the present invention.Shown in the drawings of this hair
Bright embodiment and its description, principle used to explain the present invention.
In attached drawing：
Fig. 1 shows the flow chart of according to embodiments of the present invention, the defect on management and control line method；
Fig. 2A and Fig. 2 B show the schematic diagram for selecting board for product according to the method for the embodiment of the present invention；And
Fig. 3 shows the structure diagram of according to embodiments of the present invention, the defect on management and control line system.
Specific embodiment
In the following description, a large amount of concrete details are given in order to provide more thorough understanding of the invention.So
And it is obvious to the skilled person that the present invention may not need one or more of these details and be able to
Implement.In other examples, in order to avoid with the present invention obscure, for some technical characteristics well known in the art not into
Row description.
It should be understood that the present invention can be implemented in different forms, and it should not be construed as being limited to what is proposed here
Embodiment.Disclosure will be made thoroughly and complete, and will fully convey the scope of the invention on the contrary, providing these embodiments
Those skilled in the art.
The purpose of term as used herein is only that description specific embodiment and not as the limitation of the present invention.Make herein
Used time, " one " of singulative, "one" and " described/should " be also intended to include plural form, unless context is expressly noted that separately
Outer mode.It is also to be understood that term " composition " and/or " comprising ", when being used in this specification, determines the feature, whole
Number, step, operation, the presence of element and/or component, but be not excluded for one or more other features, integer, step, operation,
The presence or addition of element, component and/or group.Herein in use, term "and/or" includes any and institute of related Listed Items
There is combination.
Just the exception on line can be only found after case occurs at present, so that it is a large amount of to investigate thoroughly that basic reason needs to spend
Time, and due to need the board restriction of suspection is got up manually, also influence production capacity.
The present invention provides a kind of method and system for defect on management and control line, is required to define board according to different process
Grade preferentially selects high-grade board for producing, while board and production situation are monitored in real time, can detect early
Performance change simultaneously makes improvement counter-measure in time, can effectively improve product quality and maximumlly utilize board production capacity.
With reference to the method and system of the specific embodiment description present invention.Fig. 1 shows according to embodiments of the present invention
The flow chart of the method 100 of defect on management and control line.As shown in Figure 1, the method 100 of defect is including following on management and control line
Step：
In step S110, according to different technological requirements, by analysis of history data come board grade in definition wires, with
In in processing procedure on implementing line from highest level board being selected to perform in board.
The ability and performance of the required board of different technological requirements also difference, therefore, on to line board into
What kind of need clearly to be technological requirement before row grade classification.In one example, can by one in the lower list of definition or
It is multinomial to define specific technological requirement：Key stratum, critical defect specification and crucial process work bench.In other examples, also may be used
By by other it is any suitable in a manner of and parameter come definition process requirement.
According to different technological requirements, the historical data through being collected into database can be analyzed, in definition wires
The grade of board.In one example, the historical data analyzed can include at least one of the following：Critical defect number
According to, technological ability (CP) data, course learning (lesson learn) data, failure model and effect analysis (FMEA) data with
And general rule (general rule) data.In other examples, the historical data analyzed can also include other data.
It is defined based on the grade to board on line, can consider that process window is preferentially selected in processing procedure on subsequent implementation line
Relatively high-grade board is selected, such as from processing procedure on line can be implemented with highest level board is selected in board, so as to carry
The production capacity of high board and the yield of product.
In one embodiment, when simultaneously for the production selection board of multiple products and for the highest of the multiple product
When grade board is same board, based on the respective predetermined defect specification of the multiple product and/or for the multiple product
Available board number determines the priority of the multiple product selection highest level board for respectively.
The schematic diagram of product selection board is illustratively described as below with reference to Fig. 2A and Fig. 2 B.
As shown in Figure 2 A, while the production for product A (such as batch (lot) A) and product B (such as batch B) selects machine
Platform.By the definition to board grade, it is assumed that in board 1-6, for product A (batch A)：Board 1 is highest level
Board, board 2 and 3 are the second grade boards, and board 4 and 5 is tertiary gradient board, and board 6 is fourth estate board；For production
For product B (batch B)：Board 1-3 is highest level board, and board 4 and 5 is the second grade board, and board 6 is tertiary gradient machine
Platform.
In this case, the board of highest level is board 1 for product A, the board of highest level for product B
Also it is board 1, then when the predetermined defect specification of such as fruit product A is higher than the predetermined defect specification requirement of product B, product A has choosing
It selects a good opportunity the priority of platform 1.
And the board of highest level is also board 1 for product B, also has board 2 and board for product B in addition
3 be also highest level board, i.e., available board also has board 2 and board 3 in addition to board 1 for product B, and product A has
The priority of board 1 is selected, therefore product B is also an option that board 2 or board 3, can be finally product A as shown in Figure 2 A
(batch A) selects board 1, and is product B (batch B) selection boards 2 or board 3.
In other examples, the two can also be combined, i.e., ought simultaneously for multiple products production select board and
When highest level board for the multiple product is same board, the respective predetermined defect of the multiple product can be based on
Specification and for the multiple product respectively for both available board numbers determine the multiple product selection highest
The priority of grade board.
In addition, for same product, during in different process or process phases, the highest level board for the product
It is different.Such as shown in Figure 2 B, it is entered down after product A selections board 1, product B selection boards 3 in the examples described above
One process/technique, in the process/technique, respectively product A and product B have selected 6 He of board suitable for their part
Board 8.
Below the method 100 of defect on management and control line is used for continuing on according to embodiments of the present invention referring back to Fig. 1
Subsequent step.
In step S120, when implementing processing procedure on line using selected board, the fortune of the selected board is monitored
The practical condition of market condition and the product on the selected board.
In one embodiment, the operating condition of the monitoring selected board and in the selected board
On product practical condition the step of may further include：Based on the processed product of the selected board
The defects of data calculate the currently benchmark (baseline) the product produced on the selected board the defects of；It and ought
The actual defects situation of the preceding product produced on the selected board determines described compared with the defect benchmark
Whether actual defects situation is within the defect benchmark, for determining maintenance or the update selected board
Grade.
For example, the currently benchmark the product produced on the selected board the defects of can be calculated by following formula：
Wherein, n is the number of the selected processed batch of board (loti), and adder defect are folded
Add defect.Due to semiconductor fabrication, there are many processes, are likely to generate defect per procedure, when process more than one, lack
Sunken data will be more and more, so as to influence correctly to judge.And pass through the superposition to front layer defective data, it will be appreciated which is lacked
It is that front layer generates to fall into, which defect is generated when layer, in this way can be according to when the process conditions and system of layer and front layer
The producing cause of the clear and definite defect of environment is made, so as to improve technological level, improves production yield.
In addition, data are calculated currently described selected based on the selected board processed product the defects of
Outlier can be removed during the defects of product produced on the board selected benchmark.Outlier is very big and very small value, this
A little values may be because error band is next, it is also possible to and it is not error, but these data are seldom, without representativeness, so can
To remove it, to exclude influence of the exceptional value to result, so as to avoid influencing subsequent processing.Illustratively, system may be used
Method (such as passing through formula Q3+3*IQR, Q1-3*IQR) the removal outlier of box figure (box plot) in meter.
In step S130, the result update based on the monitoring is for the analysis with the history of board grade in definition wires
Data, and update or maintain the grade of the selected board.
Then above example, when the actual defects situation of product for determining currently to produce on the selected board
When calculating the defects of within benchmark, the grade of the selected board can be maintained.When determining currently described selected
Board on the actual defects situation of product that produces not calculated the defects of within benchmark when, can be by the selected machine
The grade of platform degrades.Actual defects situation and defect base based on the product currently produced on the selected board
Accurate comparison, can find to be defined the variation of the board performance of grade in time, maximum so as to dynamically change board grade
Change ground and utilize board production capacity.
Illustratively, it can be deviateed based on the actual defects situation of the product currently produced on the selected board and lacked
The degree for falling into benchmark carries out board appropriate degradation.In addition, after the grade of board is degraded, board degradation can be analyzed
Reason simultaneously improves board based on the reason, to make counter-measure in time, advanced optimizes subsequently to the utilization of board.
In another example, when the actual defects situation of product for determining currently to produce on the selected board
During not calculating the defects of within benchmark, the product currently produced on the selected board can also be marked with
For subsequent processing, and the product to subsequently being produced on the selected board carries out automatic sampling monitoring.Due to
It determines currently in the actual defects situation of the product produced on the selected board not calculated the defects of within benchmark,
Therefore present lot can be marked to notify subsequent product that it is benign, to be paid attention to during subsequent processing using suitably arranging
It applies.For the product for subsequently continuing to run on the board, based on warning taken from the overturned card ahead, so sampling monitoring is carried out to it automatically, with
Its practical condition is understood in time.
In addition, historical data can be updated based on monitored results, so as to subsequently be got over to the analysis result of historical data
Come more accurate, so as to more accurately define board grade, form effective benign cycle, realize effective pipe to defect on line
Control, effectively improves product quality.
Based on above description, above-mentioned 100 basis of method for defect on management and control line that the embodiment of the present invention is provided
Different process requirement defines board grade, preferentially selects high-grade board for producing, while to board and production feelings
Condition monitors in real time, detection performance can change early and make improvement counter-measure in time, can effectively improve product quality and most
Bigization ground utilizes board production capacity.
According to another aspect of the present invention, a kind of system for defect on management and control line is additionally provided.Fig. 3 shows basis
The embodiment of the present invention, on management and control line the system 300 of defect structure diagram.As shown in figure 3, for defect on management and control line
System 300 include analysis module 310, monitoring module 320 and management module 330.The modules can perform above respectively
Each step/function for the method for defect on management and control line of middle combination Fig. 1 and Fig. 2 descriptions.Below only to being used for management and control line
The major function of each unit of the system 300 of upper defect is described, and omits the detail content having been described above.
Analysis module 310 is used for according to different technological requirements, by analysis of history data come board grade in definition wires,
For in processing procedure on implementing line from highest level board being selected to perform in board.
The selected board when implementing processing procedure on line using selected board for monitoring of monitoring module 320
The practical condition of operating condition and the product on the selected board.
Management module 330 is for the result update based on the monitoring for the analysis with board grade in definition wires
Historical data, and update or maintain the grade of the selected board.
In one example, specific technological requirement can be defined by one or more in the lower list of definition：It is crucial
Layer, critical defect specification, crucial process work bench.In other examples, other any suitable modes and parameter can also be passed through
Carry out definition process requirement.
According to different technological requirements, analysis module 310 can analyze the historical data through being collected into database,
With the grade of board in definition wires.In one example, the historical data that analysis module 310 is analyzed can include it is following in
At least one of：Critical defect data, technological ability (CP) data, course learning (lesson learn) data, failure mode with
Impact analysis (FMEA) data and general rule (general rule) data.In other examples, analysis module 310 is divided
The historical data of analysis can also include other data.
It is defined based on the grade to board on line, can consider that process window is preferentially selected in processing procedure on subsequent implementation line
Relatively high-grade board is selected, such as from processing procedure on line can be implemented with highest level board is selected in board, so as to carry
The production capacity of high board and the yield of product.
In one embodiment, when simultaneously for the production selection board of multiple products and for the highest of the multiple product
When grade board is same board, based on the respective predetermined defect specification of the multiple product and/or for the multiple product
Available board number determines the priority of the multiple product selection highest level board for respectively.
In one embodiment, the monitoring of monitoring module 320 may further include：Based on the selected board
The defects of processed product, data calculated the currently benchmark the product produced on the selected board the defects of
(baseline)；And by the actual defects situation of the product currently produced on the selected board and the defect base
Standard compares, and determine the actual defects situation whether within the defect benchmark, for determine maintain or more
The grade of the new selected board.Wherein, the data based on the selected board processed product the defects of
Calculate currently can remove outlier the product produced on the selected board the defects of during benchmark.
In one embodiment, when monitoring module 320 determines the product currently produced on the selected board
Actual defects situation calculated the defects of within benchmark when, management module 330 can maintain the grade of the selected board.
When monitoring module 320 determines that the actual defects situation of product that is currently produced on the selected board is not being calculated
When within defect benchmark, management module 330 can degrade the grade of the selected board.
In one example, when monitoring module 320 determines the reality of product currently produced on the selected board
Border defect situation not calculated the defects of within benchmark when, management module 330 can also be to currently in the selected board
The product of upper production is marked for subsequent processing, and may indicate that monitoring module 320 to subsequently in the selected machine
The product produced on platform carries out automatic sampling monitoring.
In one example, management module 330 can be updated historical data based on monitored results, so that analysis module
310 is subsequently more and more accurate to the analysis result of historical data, so as to more accurately define board grade, is formed effective good
Property cycle, realize effective management and control to defect on line, effectively improve product quality.
Based on above description, above-mentioned 300 basis of system for defect on management and control line that the embodiment of the present invention is provided
Different process requirement defines board grade, preferentially selects high-grade board for producing, while to board and production feelings
Condition monitors in real time, detection performance can change early and make improvement counter-measure in time, can effectively improve product quality and most
Bigization ground utilizes board production capacity.
Although describing the above example embodiment by reference to attached drawing, it should be understood that the above example embodiment is only example
Property, and be not intended to limit the scope of the invention to this.Those of ordinary skill in the art can carry out various change wherein
Become and change, be made without departing from the scope of the present invention and spiritual.All such changes and modifications are intended to be included in appended right will
It asks within required the scope of the present invention.
Those of ordinary skill in the art may realize that each exemplary lists described with reference to the embodiments described herein
Member and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually
It is performed with hardware or software mode, specific application and design constraint depending on technical solution.Professional technician
Described function can be realized using distinct methods to each specific application, but this realization is it is not considered that exceed
The scope of the present invention.
In the specification provided in this place, numerous specific details are set forth.It is to be appreciated, however, that the implementation of the present invention
Example can be put into practice without these specific details.In some instances, well known method, structure is not been shown in detail
And technology, so as not to obscure the understanding of this description.
Similarly, it should be understood that in order to simplify the present invention and help to understand one or more of each inventive aspect,
To in the description of exemplary embodiment of the present invention, each feature of the invention be grouped together into sometimes single embodiment, figure,
Or in descriptions thereof.However, the method for the present invention should be construed to reflect following intention：It is i.e. claimed
The present invention claims the more features of feature than being expressly recited in each claim.More precisely, such as corresponding power
As sharp claim reflects, inventive point is that the spy of all features less than some disclosed single embodiment can be used
It levies to solve the technical issues of corresponding.Therefore, it then follows thus claims of specific embodiment are expressly incorporated in this specific
Embodiment, wherein each claim is in itself as separate embodiments of the invention.
It will be understood to those skilled in the art that other than mutually exclusive between feature, any combinations pair may be used
All features and so disclosed any method disclosed in this specification (including adjoint claim, abstract and attached drawing)
Or all processes or unit of equipment are combined.Unless expressly stated otherwise, this specification (will including adjoint right
Ask, make a summary and attached drawing) disclosed in each feature can be replaced by the alternative features for providing identical, equivalent or similar purpose.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included certain features rather than other feature, but the combination of the feature of different embodiments means in of the invention
Within the scope of and form different embodiments.For example, in detail in the claims, embodiment claimed it is one of arbitrary
It mode can use in any combination.
The above description is merely a specific embodiment or the explanation to specific embodiment, protection of the invention
Range is not limited thereto, and any one skilled in the art in the technical scope disclosed by the present invention, can be easily
Expect change or replacement, should be covered by the protection scope of the present invention.Protection scope of the present invention should be with claim
Subject to protection domain.
Claims (10)
- A kind of 1. method for defect on management and control line, which is characterized in that the method includes：According to different technological requirements, by analysis of history data come board grade in definition wires, for being made on line is implemented Cheng Shicong can be performed with highest level board is selected in board；When implementing processing procedure on line using selected board, the operating condition of the selected board is monitored and in the institute The practical condition of product on the board of selection；AndResult update based on the monitoring is analyzed for described with the historical data of board grade in definition wires, and updates or tie up Hold the grade of the selected board.
- 2. the method as described in claim 1, which is characterized in that the technological requirement is by defining key stratum, critical defect is advised Lattice are defined at least one in crucial process work bench this three.
- 3. the method as described in claim 1, which is characterized in that the historical data includes at least one of the following：It is fatal Defective data, technological ability data, course learning data, failure model and effect analysis data and general rule data.
- 4. the method as described in claim 1, which is characterized in that select board and for institute for the production of multiple products when simultaneously When the highest level board for stating multiple products is same board, based on the respective predetermined defect specification of the multiple product and/or For the multiple product respectively for available board number determine the excellent of the multiple product selection highest level board First grade.
- 5. the method as described in claim 1, which is characterized in that the operating condition of the monitoring selected board and The step of practical condition of product on the selected board, further comprises：The data calculating of the defects of based on the selected board processed product is currently on the selected board The defects of product of production benchmark；AndThe actual defects situation of the product currently produced on the selected board is compared with the defect benchmark, and The actual defects situation is determined whether within the defect benchmark, for determining that maintenance or update are described selected Board grade.
- 6. method as claimed in claim 5, which is characterized in thatWhen determining the actual defects situation when within the defect benchmark, the grade of the selected board is maintained；When determining the actual defects situation not when within the defect benchmark, the grade of the selected board is carried out Degrade.
- 7. method as claimed in claim 6, which is characterized in that the method further includes：After the grade of board is degraded, Analysis board degradation reason simultaneously improves board based on the reason.
- 8. method as claimed in claim 6, which is characterized in that the method further includes：When determining the actual defects situation Not when within the defect benchmark, the product currently produced on the selected board is marked for follow-up Processing, and the product to subsequently being produced on the selected board carries out automatic sampling monitoring.
- 9. method as claimed in claim 5, which is characterized in that based on the processed product of the selected board Defective data calculating currently removes outlier in the defect benchmark of the product produced on the selected board, with row Except influence of the exceptional value to result.
- 10. a kind of system for defect on management and control line, which is characterized in that the system comprises：Analysis module, for according to different technological requirements, by analysis of history data come board grade in definition wires, for In processing procedure on implementing line from highest level board being selected to perform in board；Monitoring module, for monitoring the operation feelings of the selected board when implementing processing procedure on line using selected board The practical condition of condition and the product on the selected board；AndManagement module, for being analyzed based on the update of the result of the monitoring for described with the history number of board grade in definition wires According to, and update or maintain the grade of the selected board.
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| CN201611206324.6A CN108242411B (en) | 2016-12-23 | 2016-12-23 | Method and system for managing defects on a line |
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| CN201611206324.6A CN108242411B (en) | 2016-12-23 | 2016-12-23 | Method and system for managing defects on a line |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110646426A (en) * | 2019-09-23 | 2020-01-03 | 上海华力微电子有限公司 | Method for evaluating white pixel difference of different machine tables of CIS product |
| US11663679B2 (en) | 2019-10-11 | 2023-05-30 | International Business Machines Corporation | Generating mode change alerts with automatic detection from sensor data |
| US11868932B2 (en) | 2020-09-30 | 2024-01-09 | International Business Machines Corporation | Real-time opportunity discovery for productivity enhancement |
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| CN110646426A (en) * | 2019-09-23 | 2020-01-03 | 上海华力微电子有限公司 | Method for evaluating white pixel difference of different machine tables of CIS product |
| CN110646426B (en) * | 2019-09-23 | 2022-02-11 | 上海华力微电子有限公司 | Method for evaluating white pixel difference of different machine tables of CIS product |
| US11663679B2 (en) | 2019-10-11 | 2023-05-30 | International Business Machines Corporation | Generating mode change alerts with automatic detection from sensor data |
| US11868932B2 (en) | 2020-09-30 | 2024-01-09 | International Business Machines Corporation | Real-time opportunity discovery for productivity enhancement |
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