CN110375852A - The micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon and its implementation - Google Patents
The micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon and its implementation Download PDFInfo
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- CN110375852A CN110375852A CN201910577015.7A CN201910577015A CN110375852A CN 110375852 A CN110375852 A CN 110375852A CN 201910577015 A CN201910577015 A CN 201910577015A CN 110375852 A CN110375852 A CN 110375852A
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- 238000001228 spectrum Methods 0.000 title claims abstract description 82
- 229910001374 Invar Inorganic materials 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 20
- 125000006850 spacer group Chemical group 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 239000005304 optical glass Substances 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 6
- 230000003595 spectral effect Effects 0.000 description 4
- 238000001914 filtration Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000000701 chemical imaging Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2823—Imaging spectrometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2823—Imaging spectrometer
- G01J2003/2826—Multispectral imaging, e.g. filter imaging
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Abstract
The present invention relates to a kind of light spectrum image-forming chips, and in particular to a kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon and its implementation；Solve big existing spectrometer volume, stability and poor reliability, technical problem at high cost, the present invention provides a kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon and its implementation.A kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon is characterized in that including invar pinboard and planar array detector, invar pinboard has groove structure, and the position of planar array detector corresponds to the groove；The micro- narrow-band-filter spectrum groupware of microlens array component, multi-ribbon and planar array detector are set gradually in groove from the bottom to top；Microlens array described in the lower surface bonds of the micro- narrow-band-filter spectrum groupware of multi-ribbon；The upper surface of the micro- narrow-band-filter spectrum groupware of multi-ribbon is bonded the planar array detector.
Description
Technical field
The present invention relates to a kind of light spectrum image-forming chips, and in particular to a kind of micro- narrow-band filter array light spectrum image-forming of multi-ribbon
Chip and its implementation.
Background technique
Spectral imaging technology is that spectral information is obtained while obtaining object space information, to object while obtaining image
Matter carries out " fingerprint recognition ", completes the qualitative analysis and quantitative calculating of substance, realizes the comprehensive survey to target property and identification.
The key technology for realizing light spectrum image-forming is light splitting technology, and traditional spectrometer uses prism or grating by different waves
Long light is separated to form differentiable spectral line, is then received and is located using light of the planar array detector to each spectral line
Reason.Since beam splitter is to the dispersive power of light and the limitation of planar array detector Pixel size, in traditional spectrometer, face
Array detector needs could be efficiently separated and be received to spectrum apart from beam splitter a certain distance, this results in spectrum
The overall dimensions of instrument are very big.Further, since the elements discrete layout type mostly such as existing light splitting and detection, in order to guarantee its
Various environment can steady operation, therefore the stability etc. of adjustment and system to spectrometer also has higher precision to want
It asks, this results in increased costs.
Large-scale industrial application is also to spectrometer in lightweight, microminaturization, high reliability, low cost and portability etc.
Aspect proposes harsh demand, these factors promote the development of spectrometer to the side of the highly integrated light splitting of planar array detector on piece
To development.
Summary of the invention
In order to solve big existing spectrometer volume, stability and poor reliability, technical problem at high cost, the present invention is provided
A kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon and its implementation.
The technical solution of the invention is as follows:
A kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon, is characterized in that
Including invar pinboard and planar array detector, invar pinboard has groove structure, the position pair of planar array detector
Groove described in Ying Yu；
The micro- narrow-band-filter spectrum groupware of microlens array component, multi-ribbon is set gradually in groove from the bottom to top and face battle array is visited
Survey device；Microlens array described in the lower surface bonds of the micro- narrow-band-filter spectrum groupware of multi-ribbon；The micro- narrowband of multi-ribbon
The upper surface of optical filtering spectrum groupware is bonded the planar array detector；
It is at the micro- narrow-band-filter spectrum groupware lateral surface of groove inner wall and the multi-ribbon of the invar pinboard and described
Epoxy is filled in gap at the lower surface of the groove floor of invar pinboard and the micro- narrow-band-filter spectrum groupware of the multi-ribbon
Resin glue；
The micro- narrow-band-filter spectrum groupware of multi-ribbon includes being bonded motherboard and covering a plurality of on the bonding motherboard
With micro- narrow-band filter array；The micro- narrow-band filter array of multi-ribbon includes the multiple and different wave bands successively spliced side by side
Micro- narrow band filter；
The microlens array component includes spacer and is bonded in multiple lenticules of the spacer upper surface side by side；
The quantity of the lenticule is identical as the quantity of micro- narrow band filter；The thickness of the spacer is equal to the lenticule
Focal length；
Between the lower surface of the micro- narrow-band-filter spectrum groupware of multi-ribbon and the groove floor of the invar pinboard
Gap width is equal to the thickness of the spacer；
The coated surface of the focal plane of each lenticule and corresponding micro- narrow band filter is overlapped, and alignment precision is
±3μm；
The bottom portion of groove of the invar pinboard opens up window compatible with the shape of the microlens array；The window
The radial dimension of mouth is greater than the radial dimension of the microlens array；Hole for injecting glue is respectively provided on the side wall of the invar pinboard.
Further, the hole for injecting glue is threaded hole, and its axis is vertical with the axis of the invar pinboard.
Further, the micro- narrow-band filter array light spectrum image-forming chip of above-mentioned multi-ribbon further includes that setting turns in the invar
Fishplate bar outer and along axially through the invar pinboard two height adjusting holes；Two height adjusting holes are located at
The invar pinboard it is diagonal on.
Further, the quantity of micro- narrow band filter is 32.
Further, the base material of the bonding motherboard is K9.
Further, the base material of the bonding motherboard is quartz.
Further, the lenticule is cylindrical lenses.
Meanwhile the present invention also provides a kind of implementation method of the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon,
It is characterized in that, comprising the following steps:
1) planar array detector is chosen:
It requires L, spatial resolution R, response cutoff frequency λ and quantum efficiency to choose face battle array according to observed object object distance to visit
Survey device；
2) optical filter is chosen:
According to the coating single side narrowband of the service band of the planar array detector and the number of segment selection different-waveband needed
Optical filter；
3) the thinned coating single side narrow band filter of different-waveband is obtained:
3.1) the coating single side narrow band filter of one of wave band is coated with being adhered on one side with a thickness of 3- of filter coating
In the glass substrate that 10mm and surface figure accuracy are ± 5 μm；
3.2) the coating single side narrow band filter of bonding on a glass substrate is fixed to optical glass grinder
It on grinding head, is ground and is polished, until thickness deviation is ± 5 μm with a thickness of 100 μm；
3.3) the thinned single side that the coating single side narrow band filter disk stripping in step 3.2) obtains one of wave band is plated
Film narrow band filter；
4) step 3 is repeated until obtaining the thinned coating single side narrow band filter of other wave bands；
5) size of micro- narrow band filter to be cut is calculated:
6) cutting obtains micro- narrow band filter:
6.1) according to the size calculated in the step 5, using laser cutting machine to all wave bands in the step 4
Coating single side narrow band filter is thinned to be cut, obtains band and optical filter is thinned；Guarantee that optical filter cutting is thinned in each band
The smoothness at edge reaches the magnitude of half of Pixel size of planar array detector；And optical filter length direction and face battle array detection is thinned in band
The line direction keeping parallelism of device pixel, parallelism precision are given by:
φ=arctg (s/L1)
Wherein, L1 is the length of planar array detector target surface line direction；
6.2) it chooses each satisfactory band of wave band and each one of optical filter is thinned；
6.3) optical filter is thinned in the band to heat, until bonding agent softening, band are thinned optical filter and are detached from glass
Glass substrate obtains micro- narrow band filter of different-waveband；
6.4) micro- narrow band filter of each wave band is cleaned；
7) splice the micro- narrow-band-filter spectrum groupware of multi-ribbon；
7.1) according to the response curve of planar array detector and cutoff frequency scope of application computing system transmitance；
7.2) the satisfactory bonding motherboard of base material, and the graduation six on bonding motherboard are selected according to system transmitance
A positioning cross silk；
7.3) using dedicated micro- universal tool microscope splicing instrument and splice tooling for each micro- narrow-band-filter according to waveband selection sequence
Piece is bonded on the bonding motherboard, guarantees that the splicing precision of three coordinate directions is ± 3 μm, obtains the micro- narrowband filter of multi-ribbon
Light spectrum groupware.
8) narrow-band-filter spectrum groupware and invar pinboard are bonded:
The invar pinboard opening upwards are placed, tooling is recycled to support the narrow-band-filter spectrum groupware to pre-
If height, then from the hole for injecting glue injecting glue, the micro- narrow-band-filter spectrum groupware of multi-ribbon is bonded in invar pinboard, and guarantees
The splicing precision of three coordinate directions is ± 3 μm；
9) it is bonded planar array detector:
Planar array detector and invar pinboard are fastened, and planar array detector is bonded in the substrate frame of invar pinboard
It is interior, guarantee that the positioning graduation crosshair at four angles of bonding motherboard is overlapped with four angle pixels of planar array detector；
10) it is bonded microlens array:
The planar array detector being mutually bonded in step 9), invar pinboard and bonding motherboard are inverted, are put into from window micro-
Then microlens array component is bonded in the micro- narrow-band-filter spectrum groupware of multi-ribbon by lens array component, guarantee lenticule
Each lenticule in array component is aligned with corresponding micro- narrow band filter, and the center line of each lenticule and corresponding
The quasi- precision of micro- narrow band filter is ± 3 μm；
11) window glass is installed.
Further, the step 5) the following steps are included:
5.1) the width B of micro- narrow band filter (301) to be cut is calculated according to formula 1；
B=(v/n) × S formula 1
Wherein, v indicates planar array detector target surface longitudinal direction phase member number；
N indicates that spectrum gates port number；
S indicates the size of single phase member, unit um；
5.2) the length L of micro- narrow band filter to be cut is calculated according to formula 2；
L=u × S formula 2
Wherein, u indicates planar array detector target surface transverse direction phase member number.
The beneficial effect of the present invention compared with prior art is:
1, the present invention by be integrated in planar array detector target surface multi-ribbon narrow-band filter array realize on piece light splitting from
And achieve the purpose that light spectrum image-forming, it does not need using traditional prism or grating beam splitting, also not needing slit can be realized picture
Formula is segmented multispectral section of light spectrum image-forming, is swept and complete more/EO-1 hyperion of observed object can be realized in data processing and reconstruct by pushing away
The acquisition of data cube.
2, the present invention is based on the spectrum chips of multi-ribbon filter arrays on piece light splitting using mature narrow band filter goods
Frame product, optical grinding polish cold processing technique, Solid Laser Precise Cutting Technology, on piece precision splicing etc. to realize, own
Sport technique segment is all mature technology, and machining accuracy can guarantee, therefore easy to accomplish and mass production.
3, the present invention is based on more/high light spectrum image-forming instrument integrated level of the band light spectrum image-forming chip is higher, more light and small
Type can substantially reduce the structural volume and weight of optical spectrum imagers, micromation and small light hair to spectral imaging apparatus
Exhibition has important impetus.
Detailed description of the invention
Fig. 1 is the cross-sectional view of a specific embodiment of the invention；
Fig. 2 is the structural schematic diagram of the micro- narrow-band-filter spectrum groupware of multi-ribbon in the embodiment；
Fig. 3 is the connection schematic diagram of multi-ribbon micro- the narrow-band-filter spectrum groupware and invar pinboard in the embodiment；
Fig. 4 is the flow chart of the embodiment.
Appended drawing reference are as follows:
1- invar pinboard, 101- hole for injecting glue, 102- height adjusting holes, 103- window, 2- planar array detector, 3- multi-ribbon
Micro- narrow-band-filter spectrum groupware, the micro- narrow band filter of 301-, 302- are bonded motherboard, 303- positioning cross silk, 4- microlens array
Component, 401- lenticule, 402- spacer, 5- epoxide-resin glue.
Specific embodiment
Below in conjunction with drawings and the specific embodiments, the present invention will be further described.
The basic principle of on piece light spectrum image-forming chip is to be directly integrated micro optical filter on the surface of imaging sensor, thus real
The function of existing piece polishing wax separation.Since it is directly produced on the surface of imaging sensor, thus integrated level is very high.
Referring to Fig.1, the light spectrum image-forming chip, including invar pinboard 1 and planar array detector 2, invar pinboard 1 have recessed
The position of slot structure, planar array detector 2 corresponds to groove；
The micro- narrow-band-filter spectrum groupware 3 of microlens array component 4, multi-ribbon and face battle array are set gradually in groove from the bottom to top
Detector 2；The lower surface bonds microlens array 4 of the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon；The micro- narrow-band-filter light splitting of multi-ribbon
The upper surface of component 3 is bonded planar array detector 2；
At micro- 3 lateral surface of narrow-band-filter spectrum groupware of the groove inner wall and multi-ribbon of invar pinboard 1 and invar pinboard 1
Groove floor and the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon lower surface at gap in fill epoxide-resin glue 5；
Referring to Fig. 2, the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon includes bonding motherboard 302 and covers on bonding motherboard 302
The micro- narrow-band filter array of multi-ribbon；The micro- narrow-band filter array of multi-ribbon includes 32 different-wavebands successively spliced side by side
Micro- narrow band filter 301；32 wave bands are denoted as λ 1, λ 2 ... λ 32 respectively.
Microlens array component 4 includes spacer 2 and the multiple lenticules 401 for being bonded in 2 upper surface of spacer side by side；It is micro-
The quantity of lens 401 is identical as the quantity of micro- narrow band filter 301；The thickness of spacer 2 is equal to the focal length of lenticule 401；
Gap width between the lower surface of the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon and the groove floor of invar pinboard 1
Equal to the thickness of spacer 2；
The coated surface of the focal plane of each lenticule and corresponding micro- narrow band filter 301 is overlapped, and alignment precision is ± 3 μ
m；
Referring to Figure 1 and Figure 3, the bottom portion of groove of invar pinboard 1 opens up window compatible with the shape of microlens array 4
101；The radial dimension of window 1 is greater than the radial dimension of microlens array 4；Setting note is equipped on the side wall of invar pinboard 1
Glue hole 101.
Hole for injecting glue 101 is threaded hole in the present embodiment, and its axis is vertical with the axis of invar pinboard 1.For the ease of
Fine tuning, the present embodiment further include 1 outer of invar pinboard being arranged in and along two height adjustments axially through invar pinboard 1
Hole 102；Two height adjusting holes 102 be located at invar pinboard 1 it is diagonal on.
The quantity of micro- narrow band filter 301 is 32 in the present embodiment, and the base material of bonding motherboard 302 is K9, interval
402 material of device can choose the materials such as the lower glass of thermal expansion coefficient, and lens 401 are cylindrical lenses.
Meanwhile the present invention also provides a kind of micro- narrow-band filter array light spectrum image-forming chip implementing method of multi-ribbon, packets
Include following steps:
1) planar array detector 2 is chosen:
It requires L, spatial resolution R, response cutoff frequency λ and quantum efficiency to choose face battle array according to observed object object distance to visit
Survey device 2；The target surface size 1024 × 1024 of planar array detector 2 in the present embodiment, 6.5 μm of Pixel size, i.e. v=1024, u=
1024, S=6.5.
2) optical filter is chosen
According to the coating single side narrow-band-filter of the service band of planar array detector 2 and the number of segment selection different-waveband needed
Piece；Coating single side narrow band filter in the present embodiment is 32, and wave band is denoted as 1~λ of λ 32 respectively；
3) the thinned coating single side narrow band filter of different-waveband is obtained
3.1) the coating single side narrow band filter of one of wave band is coated with being adhered on one side with a thickness of 3- of filter coating
In the glass substrate that 10mm and surface figure accuracy are ± 5 μm；
3.2) the coating single side narrow band filter of bonding on a glass substrate is fixed to the grinding of optical glass grinder
It on head, is ground and is polished, until with a thickness of 98 μm；
3.3) the thinned single side that the coating single side narrow band filter disk stripping in step 3.2) obtains one of wave band is plated
Film narrow band filter；
4) step 3 is repeated until obtaining the thinned coating single side narrow band filter of other wave bands；
5) size of micro- narrow band filter 301 to be cut is calculated；
5.1) the width B of micro- narrow band filter 301 to be cut is calculated according to formula 1；
B=(v/n) × S formula 1
Wherein, v indicates planar array detector target surface longitudinal direction phase member number；
N indicates that spectrum gates port number；
S indicates the size of single phase member, unit um；
V=1024, n=32, S=6.5um
B=(1024/32) × 6.5=208um
5.2) the length L of micro- narrow band filter to be cut is calculated according to formula 2；
L=u × S formula 2
Wherein, u indicates planar array detector target surface transverse direction phase member number；
U=1024
L=1024 × 6.5=6656 μm
6) cutting obtains micro- narrow band filter 301
6.1) according to the numerical value of the width B and length L that are calculated in step 4, using laser cutting machine to all in step 4
The thinned coating single side narrow band filter of wave band is cut, obtain band be thinned optical filter, band be thinned optical filter width B and
The tolerance of length L is ± 5 μm；Cutting process need to guarantee that the band of all wave bands is thinned optical filter and can spell according to design sequence
On the target surface for connecing and being bonded in planar array detector, and optical filter is thinned for each band and the alignment precision of pixel is met the requirements, often
The smoothness that optical filter cut edge is thinned in a band reaches the magnitude of half of Pixel size of planar array detector；
The line direction keeping parallelism of micro- narrow band filter length direction and planar array detector pixel, parallelism precision φ is by following formula
It provides:
φ=arctg (s/L1) formula 3
Wherein, L1 is the length of planar array detector target surface line direction.
6.2) it chooses each satisfactory band of wave band and each one of optical filter is thinned；
6.3) optical filter is thinned in band to heat, until bonding agent softening, band are thinned optical filter and are detached from glass base
Piece obtains micro- narrow band filter 301 of different-waveband；
6.4) micro- narrow band filter 301 of each wave band is cleaned；
7) splice the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon；
7.1) according to the response curve of planar array detector 2 and cutoff frequency scope of application computing system transmitance；
7.2) the satisfactory bonding motherboard 302 of base material is selected according to system transmitance, and on bonding motherboard 302
Six positioning cross silks of graduation；
7.3) using dedicated micro- universal tool microscope splicing instrument and splice tooling for each micro- narrow-band-filter according to waveband selection sequence
Piece 301 is bonded on bonding motherboard 302, is guaranteed that the splicing precision of three coordinate directions is ± 3 μm, is obtained the micro- narrowband of multi-ribbon
Optical filtering spectrum groupware 3.
8) narrow-band-filter spectrum groupware 3 and invar pinboard 1 are bonded；
1 opening upwards of invar pinboard are placed, tooling is recycled to support narrow-band-filter spectrum groupware 3 to default height
Degree may also act as the adjustment hole in length or width direction since hole for injecting glue 101 is threaded hole, and narrowband can be realized in cooperation jackscrew
The fine tuning of 3 three coordinate directions of optical filtering spectrum groupware after accurate positionin, then from 101 injecting glue of hole for injecting glue, the micro- narrowband of multi-ribbon is filtered
Light spectrum groupware 3 is bonded in the predeterminated position in invar pinboard 1, and tooling is removed after epoxide-resin glue solidifies substantially, and
The splicing precision for guaranteeing three coordinate directions is ± 3 μm；The radial dimension of tooling is greater than the radial ruler for connecing microlens array 4
It is very little, guarantee that epoxide-resin glue will not influence the installation of microlens array 4；
9) it is bonded planar array detector 2；
Planar array detector 2 is bonded in the upper surface of narrow-band-filter spectrum groupware 3, guarantees four angles of bonding motherboard 302
Positioning graduation crosshair be overlapped with four angle pixels of planar array detector 2；
10) it is bonded microlens array 4
The planar array detector 2 being mutually bonded in step 9), invar pinboard 1 and bonding motherboard 302 are inverted, from window
101 are put into microlens array component 4, and microlens array component 4 is then bonded in the micro- narrow-band-filter spectrum groupware 3 of multi-ribbon
Lower surface guarantees that each lenticule 401 in microlens array component 4 is aligned with corresponding micro- narrow band filter 301, and every
The quasi- precision of the center line of a lenticule and corresponding micro- narrow band filter 301 is ± 3 μm；402 material of spacer can choose heat
The materials such as the lower glass of the coefficient of expansion, thickness are equal to the focal length of lenticule.
11) window glass is installed.
The embodiment integrated level is high, since micro- narrow-band filter array is directly integrated in the pixel surface of planar array detector,
Movement-less part between the two, therefore the stability of system and reliability are greatlyd improve；And by changing micro- narrowband filter
The bandwidth of mating plate can neatly change the spectral coverage number through spectrum, therefore be applied to EO-1 hyperion even ultraphotic with can be convenient
Compose the occasion of imaging；The last micro- narrow-band filter array precision splicing of high-precision, detector pixel and narrow band filter battle array
Column and microlens array fine registration integrated technology, further increase the light collecting light ability of system.
The above description is only an embodiment of the present invention, and it is not intended to limit the protection scope of the present invention, all to utilize the present invention
Equivalent structure transformation made by specification and accompanying drawing content, is applied directly or indirectly in other relevant technical fields, and wraps
It includes in scope of patent protection of the invention.
Claims (9)
1. a kind of micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon, it is characterised in that:
Including invar pinboard (1) and planar array detector (2), invar pinboard (1) has groove structure, planar array detector (2)
Position correspond to the groove；
The micro- narrow-band-filter spectrum groupware (3) of microlens array component (4), multi-ribbon and face battle array are set gradually in groove from the bottom to top
Detector (2)；Microlens array (4) described in the lower surface bonds of the micro- narrow-band-filter spectrum groupware (3) of multi-ribbon；It is described more
The upper surface of the micro- narrow-band-filter spectrum groupware (3) of band is bonded the planar array detector (2)；
At micro- narrow-band-filter spectrum groupware (3) lateral surface of groove inner wall and the multi-ribbon of the invar pinboard (1) and institute
It states in the gap at the groove floor of invar pinboard (1) and the lower surface of the micro- narrow-band-filter spectrum groupware (3) of the multi-ribbon
It fills epoxide-resin glue (5)；
The micro- narrow-band-filter spectrum groupware (3) of multi-ribbon includes bonding motherboard (302) and covers in the bonding motherboard (302)
On the micro- narrow-band filter array of multi-ribbon；The micro- narrow-band filter array of multi-ribbon include successively splice side by side it is multiple not
With micro- narrow band filter (301) of wave band；
The microlens array component (4) includes spacer (2) and is bonded in the multiple micro- of the spacer (2) upper surface side by side
Lens (401)；The quantity of the lenticule (401) is identical as the quantity of micro- narrow band filter (301)；The spacer
(2) thickness is equal to the focal length of the lenticule (401)；
Between the lower surface of the micro- narrow-band-filter spectrum groupware (3) of multi-ribbon and the groove floor of the invar pinboard (1)
Gap width be equal to the spacer (2) thickness；
The focal plane of each lenticule and the coated surface of corresponding micro- narrow band filter (301) are overlapped, and alignment precision
It is ± 3 μm；
The bottom portion of groove of the invar pinboard (1) opens up window compatible with the shape of the microlens array (4)
(101)；The radial dimension of the window (1) is greater than the radial dimension of the microlens array (4)；The invar pinboard (1)
Side wall on be respectively provided with hole for injecting glue (101).
2. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 1, it is characterised in that: the note
Glue hole (101) is threaded hole, and its axis is vertical with the axis of the invar pinboard (1).
3. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 2, it is characterised in that: further include
It is arranged in invar pinboard (1) outer and along two height adjusting holes axially through the invar pinboard (1)
(102)；Two height adjusting holes (102) be located at the invar pinboard (1) it is diagonal on.
4. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 3, it is characterised in that: described micro-
The quantity of narrow band filter (301) is 32.
5. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 4, it is characterised in that: described viscous
The base material for connecing motherboard (302) is K9.
6. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 5, it is characterised in that: described viscous
The base material of motherboard (302) is connect as quartz.
7. the micro- narrow-band filter array light spectrum image-forming chip of multi-ribbon according to claim 6, it is characterised in that: described micro-
Lens (401) are cylindrical lenses.
8. a kind of micro- narrow-band filter array light spectrum image-forming chip implementing method of multi-ribbon, which comprises the following steps:
1) planar array detector (2) are chosen:
L, spatial resolution R, response cutoff frequency λ and quantum efficiency is required to choose planar array detector according to observed object object distance
(2)；
2) optical filter is chosen:
According to the coating single side narrowband filter of the service band of the planar array detector (2) and the number of segment selection different-waveband needed
Mating plate；
3) the thinned coating single side narrow band filter of different-waveband is obtained:
3.1) the coating single side narrow band filter of one of wave band is coated with being adhered on one side with a thickness of 3-10mm of filter coating
And surface figure accuracy is in ± 5 μm of glass substrate；
3.2) the coating single side narrow band filter of bonding on a glass substrate is fixed to the grinding of optical glass grinder
It on head, is ground and is polished, until thickness deviation is ± 5 μm with a thickness of 100 μm；
3.3) the thinned coating single side for the coating single side narrow band filter disk stripping in step 3.2) being obtained one of wave band is narrow
Band optical filter；
4) step 3 is repeated until obtaining the thinned coating single side narrow band filter of other wave bands；
5) size of micro- narrow band filter (301) to be cut is calculated:
6) cutting obtains micro- narrow band filter (301):
6.1) according to the size calculated in the step 5, using laser cutting machine being thinned to all wave bands in the step 4
Coating single side narrow band filter is cut, and obtains band and optical filter is thinned；Guarantee that optical filter cut edge is thinned in each band
Smoothness reach the magnitude of half of Pixel size of planar array detector；And optical filter length direction and planar array detector picture is thinned in band
The line direction keeping parallelism of member, parallelism precision are given by:
φ=arctg (s/L1)
Wherein, L1 is the length of planar array detector target surface line direction；
6.2) it chooses each satisfactory band of wave band and each one of optical filter is thinned；
6.3) optical filter is thinned in the band to heat, until bonding agent softening, band are thinned optical filter and are detached from glass base
Piece obtains micro- narrow band filter (301) of different-waveband；
6.4) micro- narrow band filter (301) of each wave band is cleaned；
7) splice the micro- narrow-band-filter spectrum groupware (3) of multi-ribbon；
7.1) according to the response curve of planar array detector (2) and cutoff frequency scope of application computing system transmitance；
7.2) the satisfactory bonding motherboard (302) of base material is selected according to system transmitance, and in bonding motherboard (302)
Six positioning cross silks (303) of graduation；
7.3) using dedicated micro- universal tool microscope splicing instrument and splice tooling for each micro- narrow band filter according to waveband selection sequence
(301) it is bonded on the bonding motherboard (302), guarantees that the splicing precision of three coordinate directions is ± 3 μm, obtain multi-ribbon
Micro- narrow-band-filter spectrum groupware (3)；
8) narrow-band-filter spectrum groupware (3) and invar pinboard (1) are bonded:
Invar pinboard (1) opening upwards are placed, tooling is recycled to support the narrow-band-filter spectrum groupware (3) extremely
Preset height, then from the hole for injecting glue (101) injecting glue, the micro- narrow-band-filter spectrum groupware (3) of multi-ribbon is bonded in invar switching
In plate (1), and guarantee that the splicing precision of three coordinate directions is ± 3 μm；
9) planar array detector (2) are bonded:
Planar array detector (2) and invar pinboard (1) are fastened, and planar array detector (2) is bonded in invar pinboard (1)
In substrate frame, guarantee the positioning graduation crosshair at four angles of bonding motherboard (302) and four angle pixels of planar array detector (2)
It is overlapped；
10) microlens array (4) are bonded:
The planar array detector being mutually bonded in step 9) (2), invar pinboard (1) and bonding motherboard (302) are inverted, from window
(101) microlens array component (4) are put into, microlens array component (4) is then bonded in the micro- narrow-band-filter of multi-ribbon and is divided
On component (3), guarantee microlens array component (4) in each lenticule (401) with corresponding micro- narrow band filter (301)
Alignment, and the quasi- precision of the center line of each lenticule and corresponding micro- narrow band filter (301) is ± 3 μm；
11) window glass is installed.
9. the micro- narrow-band filter array light spectrum image-forming chip implementing method of a kind of multi-ribbon according to claim 8, special
Sign is, the step 5) the following steps are included:
5.1) the width B of micro- narrow band filter (301) to be cut is calculated according to formula 1；
B=(v/n) × S formula 1
Wherein, v indicates planar array detector target surface longitudinal direction phase member number；
N indicates that spectrum gates port number；
S indicates the size of single phase member, unit um；
5.2) the length L of micro- narrow band filter to be cut is calculated according to formula 2；
L=u × S formula 2
Wherein, u indicates planar array detector target surface transverse direction phase member number.
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