CN118131382A - Monolithically integrated filter device and manufacturing equipment system thereof - Google Patents
Monolithically integrated filter device and manufacturing equipment system thereof Download PDFInfo
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- 238000000427 thin-film deposition Methods 0.000 claims description 14
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- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
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- 238000004544 sputter deposition Methods 0.000 claims description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/285—Interference filters comprising deposited thin solid films
- G02B5/288—Interference filters comprising deposited thin solid films comprising at least one thin film resonant cavity, e.g. in bandpass filters
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Abstract
The application relates to a monolithically integrated filter device and a manufacturing equipment system thereof, wherein the monolithically integrated filter device comprises: a transparent substrate, and a micromirror array disposed on the transparent substrate; the transparent substrate is designed into a monolithic integrated filter structure; the micro-lens array comprises a plurality of micro-lenses arranged on the transparent substrate, each micro-lens corresponds to a pixel block of data points on the optical filter and comprises a hard transparent substrate and a multilayer film system deposited on the hard transparent substrate, wherein the multilayer film system forms a Fabry-Perot resonant cavity; the micro-lenses in the micro-lens array are arranged according to the transmission peak wavelength sequence; one side of a hard transparent substrate of the micro-lens array is fixedly assembled on the transparent substrate to form a monolithic integrated optical filter array; according to the technical scheme, the large-scale production of the monolithic integrated optical filter device is facilitated, the manufacturing difficulty and cost are reduced, the thickness of the interference layer can be accurately controlled, and the accuracy of hyperspectral detection is improved.
Description
Technical Field
The application relates to the technical field of optical elements, in particular to a monolithically integrated optical filter device and a manufacturing equipment system thereof.
Background
The conventional integrated optical filter is usually formed by adopting a combined etching method and a splicing method, wherein the combined etching method adopts semiconductor etching to be matched with a vacuum coating process, and optical filters with different center wavelengths are formed by changing the thickness of an optical filter spacing layer; the splicing method is to plate the optical filters of each channel on different substrates respectively, cut the optical filters into optical filters with specific size, and glue the optical filters on a carrier substrate to obtain an integrated optical filter; these integrated filters rely on etching and film formation on the substrate, and are inefficient in production and have inadequate accuracy.
The monolithic integrated filter array is a key element of portable hyperspectral detection equipment, and the filter based on Fabry-Perot (Chinese translation into Fabry-Perot) has the advantage of high quality factor; the Fabry-Perot type optical filter realizes spectral filtering by forming interference through the middle interference layer and the upper surface and the lower surface of the middle interference layer, and the resonant wavelength can be adjusted by changing the thickness of different interference layers.
Currently, a Fabry-Perot based optical filter is generally structured by processing pixel blocks with different interference layer thicknesses on a substrate through a photolithography device, so as to obtain optical filter devices with different parameters. The monolithic integrated optical filter device with the structure is difficult to process, so that the product cost is high, the device is prepared by adopting photoetching equipment, mass production is not facilitated, the thickness precision of interference layers of different points is difficult to control, and the requirements of high-spectrum accurate detection are difficult to meet.
Disclosure of Invention
The application aims to solve one of the technical defects, and provides a monolithically integrated optical filter device and a manufacturing equipment system thereof, so as to reduce the manufacturing cost of the monolithically integrated optical filter device and improve the accuracy of hyperspectral detection.
A monolithically integrated filter device comprising: a transparent substrate, and a micromirror array disposed on the transparent substrate;
the transparent substrate is designed into a monolithic integrated filter structure;
the micro-lens array comprises a plurality of micro-lenses arranged on the transparent substrate, each micro-lens corresponds to a pixel block of data points on the optical filter and comprises a hard transparent substrate and a multilayer film system deposited on the hard transparent substrate, wherein the multilayer film system forms a Fabry-Perot resonant cavity;
The micro-lenses in the micro-lens array are arranged according to the transmission peak wavelength corresponding to the preset data point arrangement information;
One side of the hard transparent substrate of the micro-lens array is fixedly assembled on the transparent substrate to form the monolithic integrated optical filter array.
In one embodiment, the multilayer film system is formed by thin film deposition; the multilayer film systems include multilayer film systems corresponding to different transmission peak wavelengths lambda 1、λ2,…、λN.
In one embodiment, the multilayer film system includes a bottom reflective layer, an interference layer, and a top reflective layer;
wherein the interference layer has a thickness value that matches different transmission peak wavelengths.
In one embodiment, the micromirror is cut from discrete filters corresponding to different transmission peak wavelengths λ 1、λ2,…、λN;
Wherein the discrete optical filter is formed by thin film deposition of a multi-layer film system on a hard transparent substrate.
In one embodiment, the transparent substrate comprises a plurality of assembled transparent sub-substrates: wherein, a plurality of micro-lenses are placed on each lens sub-substrate, and each micro-lens is arranged according to the transmission peak wavelength coding information of each data point on the optical filter array.
In one embodiment, the length L of the micromirror is multiplied by the pixel period d of the hyperspectral detection device, and the length L error is less than 1/10 of the pixel period d, and the error of the total length and the total width of the monolithically integrated filter array is less than 1/5d.
In one embodiment, the interference layer of the multilayer film system is deposited using a SiO 2 material or a lossless metal oxide, nitride dielectric material.
A system of manufacturing equipment for monolithically integrated filter devices, comprising:
The thin film deposition equipment is used for depositing Fabry-Perot multi-layer film systems with different transmission peak wavelengths on the hard transparent substrate to form a discrete optical filter;
A cutting tool for cutting out micro-lenses of a set shape from the discrete optical filters of different transmission peak wavelengths;
The micro-lens transfer device is used for extracting micro-lenses from the discrete optical filters, transferring the micro-lenses onto the transparent substrate and arranging the micro-lenses according to the sequence of different transmission peak wavelengths;
And
The micro-lens assembling device is used for fixedly assembling the micro-lenses on the transparent substrate to form the monolithic integrated optical filter.
In one embodiment, the manufacturing equipment system of the monolithically integrated filter device further includes:
The transfer carrier is used for loading and arranging a plurality of micro-lenses corresponding to different transmission peak wavelengths extracted from the discrete optical filters in batches and transferring the micro-lenses to corresponding positions on the transparent substrate.
In one embodiment, the thin film deposition apparatus includes: ion beam sputtering apparatus, measurement and control sputtering apparatus, thermal evaporation apparatus, electron beam evaporation apparatus, or ion beam assisted deposition apparatus.
In one embodiment, the cutting tool comprises: grinding wheel scribing equipment, laser ablation cutting, laser hidden cutting equipment or plasma cutting equipment.
In one embodiment, the micromirror transfer device comprises: a sucker machine.
In one embodiment, the micromirror assembling apparatus includes: an optical adhesive bonder or a wafer bonder.
According to the technical scheme of the embodiment, the monolithic integrated optical filter device comprises a transparent substrate of a monolithic integrated optical filter structure and a micro-lens array, wherein the micro-lens array comprises a plurality of micro-lenses arranged on the transparent substrate, each micro-lens corresponds to a pixel block of a data point on an optical filter and comprises a hard transparent substrate and a multilayer film system deposited on the hard transparent substrate, and the micro-lenses in the micro-lens array are arranged according to a transmission peak wavelength sequence; one side of a hard transparent substrate of the micro-lens array is fixedly assembled on the transparent substrate to form a monolithic integrated optical filter array; according to the technical scheme, the monolithic integrated optical filter device with the brand new structure is provided, the effect of forming pixel blocks with different interference layer thicknesses on the optical filter through the transparent substrate and the micro-lens array is more beneficial to mass production, so that the manufacturing difficulty and cost are reduced.
Furthermore, the micro-lens can be obtained by cutting after a multi-layer film system is deposited on a hard transparent substrate, and the thickness of an interference layer can be precisely controlled, so that the prepared monolithic integrated optical filter can improve the precision of hyperspectral detection.
Furthermore, the transfer carrier of the manufacturing equipment system transfers the micro-lenses in batches, so that the manufacturing cost is reduced during mass production and manufacturing.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a monolithically integrated filter device according to one embodiment;
FIG. 2 is a schematic illustration of an exemplary multilayer film system;
FIG. 3 is a schematic diagram of an exemplary monolithically integrated filter device fabrication process;
FIG. 4 is a schematic diagram of an exemplary monolithically integrated filter device;
FIG. 5 is a block diagram of a system architecture of a fabrication facility for monolithically integrated filter devices according to one embodiment;
FIG. 6 is a schematic diagram of an exemplary transfer-by-transfer micromirror;
FIG. 7 is a schematic diagram of an exemplary batch transfer micromirror.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, but do not preclude the presence or addition of one or more other features, integers, steps, operations.
Manufacturing a conventional monolithic integrated filter array, namely processing pixel blocks of a plurality of interference layers with transmission peak wavelengths on the same substrate, wherein each pixel block of the monolithic integrated filter corresponds to one data point, and the interference layer of each data point corresponds to the thickness of a specific wavelength, so as to obtain a Fabry-Perot type hyperspectral filter array; because the thickness dimension precision of the interference layer processing in the photoetching and derivative method thereof is limited, and the processing efficiency of the moving micro hollow window deposition method is low, the large-scale production cannot be realized and the precision requirement of hyperspectral detection can not be met.
Accordingly, the present application provides a monolithically integrated optical filter device, as shown in fig. 1, fig. 1 is a schematic structural diagram of a monolithically integrated optical filter device according to an embodiment, which is a cross-sectional view, and includes a transparent substrate 11 and a micro-lens array 02 disposed on the transparent substrate 11, wherein the transparent substrate 11 is designed as a monolithically integrated optical filter structure, the micro-lens array 02 includes a plurality of micro-lenses 20 arranged on the transparent substrate 11, each micro-lens 20 corresponds to a pixel block corresponding to a data point on the optical filter, the micro-lenses 20 structurally includes a hard transparent substrate 21 and a multi-layer film system 22 deposited on the hard transparent substrate 21, and the multi-layer film system 22 forms a Fabry-Perot resonator; the micro-lenses 20 in the micro-lens array 02 are arranged according to the transmission peak wavelength sequence to form pixel blocks with different thicknesses of the interference layer 222, and each micro-lens 20 is mutually attached, or a certain gap can be formed between each two micro-lenses, and after the micro-lenses are spliced, the gap is filled with a specific material; the hard transparent substrate 21 side of the micro lens array 02 is fixedly assembled on the transparent base 11 to form a monolithically integrated filter array.
According to the technical scheme of the embodiment, the effect of forming the pixel blocks with different thicknesses of the interference layer 222 through the transparent substrate 11 and the micro-lens array 02 is more beneficial to mass production, and the manufacturing difficulty and cost are reduced; since the micromirror array 02 can be built up of micromirrors 20 with different transmission peak wavelengths, the micromirrors 20 can be freely organized to form monolithically integrated filters of different parameters.
In one embodiment, the multilayer film system 22 is formed by thin film deposition, including the multilayer film system 22 corresponding to different transmission peak wavelengths λ 1、λ2,…、λN, structurally, the multilayer film system 22 includes a bottom reflective layer 221, an interference layer 222, and a top reflective layer 223 from bottom to top, wherein the interference layer 222 has a thickness matching the transmission peak wavelengths λ 1, the transmission peak wavelengths λ 2, …, the transmission peak wavelengths λ N; the micro-lens 20 is obtained by cutting discrete optical filters corresponding to different transmission peak wavelengths lambda 1、λ2,…、λN, wherein lambda is the wavelength, N is the number of the wavelengths, and N is more than or equal to 2; the discrete filter is formed on the hard transparent substrate 21 by depositing a multilayer film system 22 on the hard transparent substrate 21; for example, N discrete filters are formed by depositing a Fabry-Perot multilayer film system 22 having a transmission peak wavelength of λ 1、λ2,…、λN on N hard transparent substrates 21 by thin film deposition, and a micromirror 20 of a set shape is cut from the N discrete filters having different transmission peak wavelengths.
As shown in fig. 2, fig. 2 is a schematic diagram of an exemplary multilayer film system, where the thicknesses of the interference layers 222 corresponding to the transmission peak wavelengths λ 1、λ2,…、λN are t 1、t2、…、tN, respectively, and the thicknesses of the interference layers 222 can be precisely controlled during film deposition, so that the thickness t 1、t2、…、tN of the interference layers 222 can be obtained, for example, when the thicknesses of the interference layers corresponding to n=100 wavelengths need to be formed, film deposition is performed on 100 hard transparent substrates, each wavelength corresponds to a whole discrete optical filter, the thickness of the film system can be precisely controlled by using the characteristics of film deposition, the thickness of the interference layer precisely matched with each wavelength can be obtained, and large-scale manufacturing of the discrete optical filters is facilitated by using the film deposition method, thereby improving the production efficiency.
In one embodiment, as shown in fig. 3, fig. 3 is a schematic diagram illustrating an exemplary process for manufacturing a monolithically integrated optical filter device, where thin film deposition is performed on a plurality of hard transparent substrates 21 to obtain discrete optical filters of Fabry-Perot type multi-layer film systems 22 of respective wavelengths, and each discrete optical filter is switched into a micromirror 20 by a dicing process; then, the micro-lenses 20 corresponding to different wavelengths are respectively extracted and transferred to the transparent substrate 11, and the micro-lenses 20 and the transparent substrate 11 are assembled by using an assembling process to form a monolithic integrated filter array. For example, the micro-lenses 20 are extracted from the cut discrete filters, and the extracted micro-lenses 20 are transferred onto the transparent substrate 11 and arranged in the order of different transmission peak wavelengths designed in advance, and each micro-lens 20 is assembled onto the transparent substrate 11 to form a monolithically integrated hyperspectral filter array.
In the solution of the foregoing embodiment, the micro-lens 20 is obtained by cutting after depositing the multi-layer film system 22 on the hard transparent substrate 21, so that the thickness of the interference layer 222 can be precisely controlled, and the prepared monolithic integrated optical filter can improve the precision of hyperspectral detection.
In this embodiment, based on the micro-lenses of pixel level cut out from the discrete optical filters, each monolithically integrated optical filter is designed with transmission peak wavelength coding information corresponding to each data point in advance, when the micro-lenses 20 are arranged, the micro-lenses 20 of corresponding transmission peak wavelengths are respectively extracted from the discrete optical filters according to the transmission peak wavelength coding information and placed on the designated positions on the transparent substrate 11, the micro-lenses 20 of pixel level are utilized, and the micro-lenses 20 of each transmission peak wavelength are extracted and arranged according to the pre-designed transmission peak wavelength coding information and are assembled into pixel blocks of the monolithically integrated optical filter; when the monolithic integrated filter device is used subsequently, the distribution information of the transmission peak wavelength of the monolithic integrated filter device can be determined directly according to the designed transmission peak wavelength coding information, and the monolithic integrated filter device is obtained without performing related tests, so that the use cost is greatly reduced.
Referring to fig. 4, fig. 4 is a schematic diagram of an exemplary monolithically integrated filter device, which is a partial structure diagram, where, in the example of 4 wavelengths λ, λ 1、λ2、λ3、λ4 is respectively corresponding to each of the wavelengths λ, and each of the different thicknesses of the interference layers corresponds to a corresponding transmission peak wavelength, such as the micro-lenses 20 of 4 positions in the figure, which are sequentially arranged, each of the micro-lenses 20 has an interference layer with a precise thickness, for example, the micro-lenses 20 transferred by the discrete filter corresponding to the wavelength λ 1 may better pass the spectrum of the wavelength λ 1, the micro-lenses 20 transferred by the discrete filter corresponding to the wavelength λ 2 may better pass the spectrum of the wavelength λ 2, the micro-lenses 20 transferred by the discrete filter corresponding to the wavelength λ 3 may better pass the spectrum of the wavelength λ 3, and the micro-lenses 20 transferred by the discrete filter corresponding to the wavelength λ 4 may better pass the spectrum of the wavelength λ 4.
As the solution of the foregoing embodiment, a manufacturing process of a monolithic integrated optical filter device with a brand new structure is provided, the thickness of the interference layer 222 can be precisely controlled by performing thin film deposition on the hard transparent substrate 21, and mass production can be performed through cutting and assembling processes, so that the manufacturing difficulty and cost of the hyperspectral optical filter array are reduced, and the precision of hyperspectral detection is improved.
In one embodiment, the transparent substrate 11 includes a plurality of assembled lens sub-substrates, each having a plurality of micro-lenses 20 disposed thereon, the micro-lenses 20 being arranged in a pre-designed order of different transmission peak wavelengths. Specifically, the extracted multiple micro-lenses 20 can be transferred onto the corresponding transparent sub-substrates according to the design requirement of the hyperspectral filter array, and each micro-lens 20 is transferred onto the transparent sub-substrates and arranged according to the sequence of different transmission peak wavelengths lambda 1、λ2,…、λN; and assembling the transparent sub-substrates according to the set positions, and fixedly assembling the transparent sub-substrates and the micro-lenses 20 placed on the transparent sub-substrates to obtain the monolithically integrated hyperspectral filter array.
As the solution of the above embodiment, a solution is designed in which a plurality of transparent sub-substrates are assembled into a transparent substrate 11, and the micro-lenses 20 are placed and arranged on the plurality of transparent sub-substrates, and then each transparent sub-substrate is assembled into a monolithically integrated optical filter device, so that the monolithically integrated optical filter device with different production requirements can be satisfied, and the production efficiency can be further improved.
In one embodiment, the monolithically integrated filter device of the present application may employ 100 spectral wavelength sampling points implemented in the optical spectral range (380 nm-780 nm), a spectral separation of 4nm by one point, and in the multilayer film system 22 of the discrete filter, the interference layer 222 may employ SiO 2 (silicon dioxide) or other lossless metal oxide, nitride dielectric, etc., and the two sides are spaced apart by a distributed Bragg reflective multilayer film (e.g., a 5.5 period high and low refractive index dielectric film designed according to a λ/4 optical thickness).
For example, a discrete filter with a transmission peak of λ=400 nm, then the interference layer 222 thickness t is a filter that can be expressed as t=λ/2n (λ); where n (λ) is the refractive index at λ wavelength.
The length L of the side of the micromirror 20 is multiplied by the pixel period d of the hyperspectral detection device, and the error of the length L is less than 1/10 of the pixel period d, so that the subsequent alignment process with the photodetector of the hyperspectral detection device has enough tolerance, and the error of the total length and the total width of the monolithically integrated filter array is less than 1/5d when the final assembly is performed.
Embodiments of a manufacturing facility system for monolithically integrated filter devices are described below.
As shown in fig. 5, fig. 5 is a system architecture block diagram of a manufacturing apparatus of a monolithically integrated filter device according to one embodiment, including: film deposition equipment 51, cutting tools 52, micro-lens transfer equipment 53, micro-lens assembly equipment 54 and other components.
Wherein, the thin film deposition device 51 is used for depositing Fabry-Perot multi-layer film systems corresponding to different transmission peak wavelengths lambda 1、λ2,…、λN on the hard transparent substrate to form discrete optical filters; the cutting tool 52 is used for cutting the micromirror 20 with a set shape from the discrete filters with different transmission peak wavelengths; the micromirror transfer device 53 is used to extract the micromirrors 20 from the discrete filters and transfer them onto the transparent substrate 11, and arrange them in order of different transmission peak wavelengths; the micromirror assembly device 54 is used to fixedly assemble the micromirror 20 to the transparent substrate 11 to form a monolithically integrated filter.
The scheme of the embodiment can be used for processing the single-chip integrated optical filter device, the manufacturing equipment system is beneficial to mass production, so that the manufacturing difficulty and cost of the single-chip integrated optical filter device are reduced, and the prepared single-chip integrated optical filter can have higher high spectrum detection accuracy.
In order to further clarify the technical solution of the manufacturing equipment system of the monolithically integrated filter device according to the present application, further embodiments are described below.
In one embodiment, for the thin film deposition apparatus 51, it may be an ion beam sputtering apparatus, a measure sputtering apparatus, a thermal evaporation apparatus, an electron beam evaporation apparatus, an ion beam assisted deposition apparatus, or the like. In practical application, different deposition modes can be selected according to different spectrum quality requirements to perform film deposition, data points to be collected are determined according to a target wave band range, and a discrete optical filter is obtained by controlling optical coating control parameters of the film deposition equipment 51 to deposit Fabry-Perot type multilayer film systems with transmission peak wavelength lambda 1、λ2,…、λN on different hard transparent substrates.
In one embodiment, for the cutting tool 52, it may be a sand wheel dicing apparatus, a laser ablation dicing, a laser dicing apparatus, a plasma cutting apparatus, or the like. The discrete filter may be cut into a plurality of micro-lenses 20 of a specific shape at the time of cutting, and in general, the micro-lenses 20 are uniformly cut into squares having a side length L.
In one embodiment, for the micromirror transfer device 53, a suction cup machine may be used to extract the micromirrors 20 from different discrete filters according to the assembly requirements, transfer the micromirrors 20 onto a clear transparent substrate, and arrange the different transmission peak wavelengths in order according to the design requirements of the monolithically integrated hyperspectral filter array.
For example, the transfer mode of the micromirror 20 may be a batch transfer mode or a transfer mode one by one.
Referring to fig. 6, fig. 6 is a schematic diagram of an exemplary transfer micromirror, in which one micromirror 20 is sequentially extracted from a discrete filter with different transmission peak wavelengths, and then transferred to a transparent substrate 11 for alignment according to the design requirements of a hyperspectral filter array, which has the advantage of simplicity in use.
Referring to fig. 7, fig. 7 is a schematic view of an exemplary batch transfer micromirror, and a transfer carrier 531 may be designed to store the micromirrors corresponding to the different transmission peak wavelengths batch-extracted from the discrete filters, and transfer the micromirrors to corresponding positions on the transparent substrate 11. Specifically, according to the design requirement of the hyperspectral filter array, firstly determining the micro-lenses 20 with different wavelengths corresponding to each position point on the hyperspectral filter array, then extracting the micro-lenses 20 from the discrete filter, then placing each micro-lens 20 on a designated position on a transparent substrate according to different transmission peak wavelength sequences for arrangement, and after the micro-lenses 20 reach a certain number, transferring the micro-lenses 20 on a transfer carrier 531 to the transparent substrate 11; the transfer method can greatly improve the efficiency of transferring the micro-lenses 20, and can further improve the manufacturing efficiency, particularly reduce the manufacturing cost greatly when the micro-lenses 20 are transferred in advance and arranged, and then the micro-lenses are placed on the transparent substrate 11 in batches to manufacture the monolithically integrated optical filter.
In one embodiment, for the micromirror assembling device 54, an optical adhesive bonding machine or a wafer bonding machine is used to assemble the micromirror by optical adhesive or wafer bonding; such as optical bonding, wafer bonding, laser bonding, and the like. The individual micro-lenses 20 are integrated with the transparent substrate 11 by the micro-lens assembling device 54 to obtain a monolithically integrated filter device, which is convenient for mass production and manufacture.
According to the scheme of each embodiment, the manufacturing equipment system of the embodiment can manufacture the single-chip integrated optical filter device based on Fabry-Perot with accurate interference layer thickness, is convenient for industrial mass production, has lower manufacturing difficulty and cost, and is suitable for being widely popularized and applied in industry.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.
Claims (10)
1. A monolithically integrated filter device, comprising: a transparent substrate, and a micromirror array disposed on the transparent substrate;
the transparent substrate is designed into a monolithic integrated filter structure;
the micro-lens array comprises a plurality of micro-lenses arranged on the transparent substrate, each micro-lens corresponds to a pixel block of data points on the optical filter and comprises a hard transparent substrate and a multilayer film system deposited on the hard transparent substrate, wherein the multilayer film system forms a Fabry-Perot resonant cavity;
The micro-lenses in the micro-lens array are arranged according to the transmission peak wavelength corresponding to the preset data point arrangement information;
One side of the hard transparent substrate of the micro-lens array is fixedly assembled on the transparent substrate to form the monolithic integrated optical filter array.
2. The monolithically integrated filter device of claim 1, wherein the multilayer film is formed by thin film deposition; the multilayer film systems include multilayer film systems corresponding to different transmission peak wavelengths lambda 1、λ2,…、λN.
3. The monolithically integrated filter device of claim 2, wherein the multi-layer film system comprises a bottom reflective layer, an interference layer, and a top reflective layer;
wherein the interference layer has a thickness value that matches different transmission peak wavelengths.
4. The monolithically integrated filter device of claim 3, wherein the micro-lenses are cut from discrete filters corresponding to different transmission peak wavelengths λ 1、λ2,…、λN;
Wherein the discrete optical filter is formed by thin film deposition of a multi-layer film system on a hard transparent substrate.
5. The monolithically integrated filter device of any of claims 1-4, wherein the transparent substrate comprises a plurality of tiled transparent sub-substrates: wherein, a plurality of micro-lenses are placed on each lens sub-substrate, and each micro-lens is arranged according to the transmission peak wavelength coding information of each data point on the optical filter array.
6. The monolithically integrated filter device according to claim 1, wherein the length L of the micromirror is multiplied by the pixel period d of the hyperspectral detection device and the length L error is less than 1/10 of the pixel period d and the error of the total length and the total width of the monolithically integrated filter array is less than 1/5d.
7. The monolithically integrated filter device of claim 1, wherein the interference layer of the multilayer film system is deposited using SiO 2 material or a lossless metal oxide, nitride dielectric material.
8. A system of manufacturing equipment for monolithically integrated filter devices, comprising:
The thin film deposition equipment is used for depositing Fabry-Perot multi-layer film systems with different transmission peak wavelengths on the hard transparent substrate to form a discrete optical filter;
A cutting tool for cutting out micro-lenses of a set shape from the discrete optical filters of different transmission peak wavelengths;
The micro-lens transfer device is used for extracting micro-lenses from the discrete optical filters, transferring the micro-lenses onto the transparent substrate and arranging the micro-lenses according to the sequence of different transmission peak wavelengths;
And
The micro-lens assembling device is used for fixedly assembling the micro-lenses on the transparent substrate to form the monolithic integrated optical filter.
9. The monolithically integrated filter device manufacturing apparatus system of claim 8, further comprising:
The transfer carrier is used for loading and arranging a plurality of micro-lenses corresponding to different transmission peak wavelengths extracted from the discrete optical filters in batches and transferring the micro-lenses to corresponding positions on the transparent substrate.
10. The system of manufacturing equipment for monolithically integrated filter devices according to claim 8, wherein the thin film deposition apparatus comprises: ion beam sputtering equipment, measurement and control sputtering equipment, thermal evaporation equipment, electron beam evaporation equipment or ion beam auxiliary deposition equipment;
The cutting tool includes: grinding wheel scribing equipment, laser ablation cutting equipment, laser hidden cutting equipment or plasma cutting equipment;
the micromirror transfer device includes: a suction cup machine;
Or alternatively
The micromirror assembly device includes: an optical adhesive bonder or a wafer bonder.
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