CN112034580B - Out-of-band elimination optical filter structure for space camera focal plane detector - Google Patents
Out-of-band elimination optical filter structure for space camera focal plane detector Download PDFInfo
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Abstract
The invention relates to an out-of-band elimination optical filter structure for a space camera focal plane detector, which belongs to the technical field of space optical remote sensors, wherein the space camera focal plane photoelectric detector is a key element on a camera; the invention provides a novel non-packaged out-of-band elimination filter, which is designed on a focal plane photoelectric detector to solve the problem of out-of-band integral response out-of-band of a space camera detector. The invention solves the problem of out-of-band integral response over-tolerance of a detector band caused by large spectral response difference of a detector chip and incapability of fully inhibiting out-of-band response of the conventional packaged optical filter.
Description
Technical Field
The invention relates to an out-of-band elimination optical filter structure for a space camera focal plane detector, and belongs to the technical field of space optical remote sensors.
Background
With the development of space optical remote sensing technology, the detection of ground scenery by human beings is more and more required. The multi-band photoelectric detector can acquire various ground scenery information and is a key element on the space camera. At present, the multi-band detector mainly realizes the detection of different bands through a packaged multi-band optical filter. The packaged multi-spectral-band optical filter is coated with a light filter film aiming at each spectral band, and a black film is arranged between the adjacent light filter films for spacing. The out-of-band integral response of the detector spectral band is an important index for evaluating the detection performance of the detector spectral band, and the out-of-band integral response is out of tolerance, which means that the spectral band captures the spectrum of a non-target scene, and the accuracy of detection information is seriously influenced. The final spectral response of the detector is obtained after the response of the photosensitive chip of the detector is superposed with the spectral transmittance characteristic of the optical filter. Theoretically, a single layer packaged filter can fully achieve the purpose of out-of-band rejection as long as the out-of-band response of the packaged filter is sufficiently small. In fact, due to the large response difference of the photosensitive chip of the detector and the limitation of the current optical filter preparation process, the in-band transmittance of the spectral band in the low response area of the photosensitive chip is pulled down by the chip response, and the out-of-band tiny transmittance bulge is pulled up, so that the out-of-band integral response after the chip and the packaged optical filter are overlapped is finally caused to be out of tolerance. Therefore, the out-of-band response of the space camera detector is inhibited, the out-of-band integral response is controlled within an index range, and the method has important significance for ensuring the image quality of the camera.
At present, the prior art can only provide help for the design of a multi-spectral-band optical filter for packaging a space camera detector, and can not provide a solution for the situation that the optical filter for self packaging cannot inhibit out-of-band response for a detector with out-of-band tolerance after packaging, especially because the spectral band response difference of a photosensitive chip of the detector is large.
Disclosure of Invention
The technical problem solved by the invention is as follows: overcome above-mentioned prior art not enough, it is big to detector chip spectral response difference, current encapsulation light filter can't restrain the out-of-band response, the problem of the out-of-band integral response of detector bandeau that causes, an out-of-band light filter structure of eliminating for space camera focal plane detector is provided, reduce the out-of-band integral response of bandeau, improve the imaging quality of space camera, the problem of detector out-of-band integral response overproof under this condition has been solved, through setting up out-of-band light filter and corresponding switching structure, restrain the out-of-band response, make the detector satisfy the user demand.
The technical scheme of the invention is as follows: an out-of-band elimination filter structure for a spatial camera focal plane detector, comprising: the device comprises an outer filter (1) and a switching bracket (2);
the external filter (1) is arranged on the detector (3) through the switching bracket (2);
the outer filter (1) is made of sapphire or ultraviolet quartz and is in a rectangular sheet structure;
dividing the out-of-band integral response of a spectral band of a detector into an out-of-tolerance spectral band and a non-out-of-tolerance spectral band according to the use requirement; a filter film is plated at a corresponding position on the side, close to the detector (3), of the out-of-band filter (1) for out-of-band integral response out-of-band error bands, an anti-reflection film is plated at a corresponding position on the side, close to the detector (3), of the out-of-band filter (1) for out-of-band non-error bands, and black diffuse reflection films are plated in different film interface areas; the black diffuse reflection film is covered on two adjacent different films;
an antireflection film is plated on the surface of the external filter (1) far away from the detector (3);
alignment marks are engraved at four corners of one surface, close to the detector (3), of the outer elimination filter (1) and are used for accurately aligning with the detector (3).
Preferably, the detector (3) is a long-line multi-spectral-band photoelectric detector in the focal plane of the visible light space camera, and the photoelectric detector is provided with an encapsulation optical filter.
Preferably, the switching support (2) is made of a low linear expansion coefficient material, the switching support (2) is a hollow rectangular thick sheet, one surface, close to the detector (3), of the switching support is provided with a rectangular sinking groove (1) which is used as a mounting groove of the detector (3), and two ends of the long edge of the rectangular sinking groove (1) are provided with uniformly distributed rectangular notches which are used as glue overflow grooves;
a rectangular sinking groove 2 is arranged on one surface far away from the detector (3) and is used as an installation groove of the external optical filter (1), and rectangular notches which are uniformly distributed are arranged at two ends of the long edge of the rectangular sinking groove 2 and are used as glue overflow grooves;
the bottoms of the rectangular sinking grooves 1 and 2 are used as bonding surfaces; mechanically controlling the flatness and parallelism of the two bonding surfaces; the hollow part of the hollow rectangular thick sheet is a rectangle with thickness;
and four corners of the switching support (2) are provided with outward mounting interfaces, and adjustment allowance is reserved for the interfaces for splicing and adjusting the long linear array focal plane of the camera.
Preferably, the external filter (1) and the detector (3) are fixed on the adapter bracket (2) through optical structure glue.
Preferably, during assembly, the detector (3) is firstly adhered to the adapter bracket (2), and the external filter (1) is adhered after the glue of the detector (3) is solidified.
Preferably, when the out-of-band elimination filter (1) is pasted, the position relation between the out-of-band elimination filter and the detector (3) is positioned through an alignment mark on the out-of-band elimination filter (1).
Preferably, the assembling mode of the implementation structure of the elimination band-pass filter (1) is as follows: the detector (3) is adhered to the switching support (2) through optical structure glue, and glue overflows in the glue overflow groove on the adhering surface of the detector (3), so that enough adhesive strength is ensured. After the viscose glue of the detector (3) is solidified, the outer filter (1) is stuck, and the glue overflow groove is filled with the overflow glue to ensure enough bonding strength. The relative position relation between the photosensitive spectral bands of the out-band elimination filter (1) and the detector (3) is accurately positioned by the aid of the alignment marks in the pasting process, the alignment accuracy of the out-band elimination filter and the photosensitive spectral bands of the detector is constantly concerned in the viscose solidification process, and if the out-band elimination filter and the photosensitive spectral bands of the detector deviate, the alignment is timely adjusted until solidification is achieved.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention relates to an out-of-band elimination optical filter structure for a space camera focal plane detector, which is a non-packaging optical filter and is aligned and stuck with a photoelectric detector through a special adapter bracket to achieve the purpose of out-of-band inhibition.
(2) The invention solves the problem of out-of-band integral response out-of-band error of the space camera focal plane detector by adding a layer of non-encapsulation out-of-band elimination filter. The method is a solution under the conditions that the original packaging structure of the detector is not influenced and the splicing and registration of the focal plane are not influenced when the packaged optical filter cannot meet the technical index. The implementation structure of the external optical filter is simple and compact, and the external optical filter is easy to process and realize.
(3) The invention adopts sapphire or ultraviolet quartz as the substrate of the out-of-band elimination out-of-band optical filter, has strong radiation resistance and meets the use requirement of a space camera.
(4) The alignment mark is engraved on the out-of-band elimination filter, and is used for positioning the relative position relationship between the out-of-band elimination filter and the detector, so that the positioning precision is high.
(5) The switching bracket is prepared by adopting a material with a low linear expansion coefficient, so that the stability of the focal plane optical-mechanical structure is not influenced by the temperature fluctuation of the detector during working.
(6) The invention mechanically controls the flatness of the mounting surfaces of the detector and the external filter on the switching bracket and the parallelism between the two surfaces, thereby ensuring the imaging quality of an optical system and the stability of an optical-mechanical structure.
(7) The detector and the installation surface of the outer filter of the extinction band are both provided with glue overflow grooves, so that the bonding strength is improved.
(8) The space camera focal plane photoelectric detector is a key element on the camera. At present, due to the manufacturing technology of optical filters, large response difference of spectral bands of photosensitive chips of detectors and the like, the spectral bands in low response areas of the chips have the inevitable out-of-band integral response out-of-tolerance problem.
(9) The invention utilizes a novel non-packaging type out-of-band elimination filter, and the out-of-band elimination filter is fixedly connected with the detector through a specially-made switching support, so that the problem of out-of-band integral response out-of-band error of the space camera is solved.
(10) The invention solves the problem of out-of-band integral response out-of-band error of the detector under the condition, and inhibits out-of-band response of a spectral band by arranging a layer of out-of-band elimination filter and a corresponding switching structure, so that the detector meets the use requirement.
Drawings
FIG. 1 is a schematic view of a multi-band detector for a space camera according to the present invention;
FIG. 2 is a schematic diagram of the out-of-band integration response definition of the present invention;
FIG. 3 is a diagram showing out-of-band response over-tolerance of spectral bands caused by large spectral response differences of photosensitive chips of a detector, and (a) is a diagram showing a normalized response curve of a photosensitive chip of a detector and a normalized transmittance curve of a packaging optical filter; (b) the normalized curve is the superimposed curve;
FIG. 4 is a schematic diagram of an implementation structure of the anti-aliasing filter according to the invention;
FIG. 5 is a schematic diagram of an extinction outer filter according to the present invention;
FIG. 6 is a schematic diagram of the calculation of the boundary of a film layer in the present invention;
FIG. 7 is a schematic diagram of the design of an alignment mark for an out-of-band elimination filter in the present invention;
FIG. 8 is a schematic view of an adapter bracket of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
The invention relates to an out-of-band elimination optical filter structure for a space camera focal plane detector, which belongs to the technical field of space optical remote sensors, wherein the space camera focal plane photoelectric detector is a key element on a camera; the invention provides a novel non-packaged out-of-band elimination filter, which is designed on a focal plane photoelectric detector to solve the problem of out-of-band integral response out-of-band of a space camera detector. The invention solves the problem of out-of-band integral response over-tolerance of a detector band caused by large spectral response difference of a detector chip and incapability of fully inhibiting out-of-band response of the conventional packaged optical filter.
The structure of the invention is suitable for the space camera detector after being packaged, and is used for solving the problem of out-of-band integral response out-of-band of the detector. The spectral response difference of the photosensitive chip of the space camera detector is large, the current optical filter preparation technology is limited, and the single-layer packaged optical filter cannot solve the problem of out-of-band out-of-tolerance of a low-response spectral band. Aiming at the problem, the invention provides a solution, and solves the problem of out-of-band integral response out-of-band error of the existing packaged detector by adding a layer of non-packaged out-of-band elimination filter and a special switching structure. The invention has simple structure, easy realization, high structural stability and improved imaging quality, and does not influence the splicing integration of the detector on the focal plane of the camera.
Fig. 1 is a schematic diagram of a focal plane (multiband photoelectric) detector of a spatial camera according to the present invention. The detector, preferred scheme is: the device comprises a photosensitive chip, a photosensitive band, a packaging optical filter, a ceramic package and a pin. The main structure of the detector is ceramic package, the ceramic package is provided with an inner sunken groove, and the photosensitive chip is embedded in the sunken groove. Photosensitive bands B1, B2, B3 and B4 … … are distributed on the photosensitive chip, and the band photosensitive surface receives incident light to generate spectral response. The photosensitive chip is provided with a reserved mark which is usually a cross line or an L-shaped line, and the relative position precision between the reserved mark and the photosensitive spectral band is the photoetching precision and is used as the reference for positioning the spectral band position of the detector. The packaging optical filter is a transparent rectangular sheet, and a filter film is plated on the packaging optical filter at the corresponding projection position of the photosensitive band of the chip, so that the functions of filtering the band and sealing and protecting the photosensitive chip are achieved. The packaging optical filter is adhered to the detector ceramic package through the optical structure glue. The back of the ceramic package is provided with a metal pin.
Fig. 3 (a) and (b) are schematic diagrams illustrating out-of-band response over-differences of spectral bands caused by large differences of spectral responses of the photosensitive chips of the detectors, and fig. 3 (a) is a schematic diagram illustrating a normalized response curve of a photosensitive chip of a certain detector and a normalized transmittance curve of a packaged filter; fig. 3 (b) is a superimposed normalization curve;
the solid line in the middle is a normalized response curve of a photosensitive chip of a certain detector, and the dotted line is a normalized transmittance curve of a certain band B1 (preferably 400 nm-450 nm) of the packaging filter. The normalized curve obtained by superposing the two curves is shown in (B) of fig. 3, which is the normalized response curve of the packaged detector B1 spectral band
Each spectral band of the multi-spectral-band detector of the spatial camera has an out-of-band integral response index requirement, and preferably the out-of-band integral response is less than 5% to ensure the accuracy of detecting target scene information (in practical application, the information is slightly different according to different detection requirements). Fig. 2 shows the definition of the out-of-band integrated response, where the curve is a response curve of a certain spectral band of the detector, and the peak value is preferably Rp, and the ratio of the response integral value outside 0.05Rp to the response integral value within 0.5Rp is the out-of-band integrated response of the spectral band.
Fig. 3 (a) and (b) are schematic diagrams showing out-of-band response over-differences of spectral responses of photosensitive chips of the detector caused by large differences. In fig. 3 (a), the solid line is a normalized response curve of a certain detector photosensitive chip, and the dotted line is a normalized transmittance curve of a certain spectral band B1 (preferably 400 nm-450 nm) of the packaging filter. The normalized curve obtained by superposing the two curves is shown in (B), namely the normalized response curve of the packaged detector B1 spectral band. As shown in fig. 3 (B), due to the larger band difference of the response curve of the photosensitive chip itself, more out-of-band peaks inevitably exist in the band B1 in the low response region, and the out-of-band integrated response thereof reaches 12%, which is seriously out of tolerance. In view of the above situation, theoretically, only the filter film of the spectral band B1 of the packaged optical filter needs to be optimized to further suppress the out-of-band response (the peak value of the out-of-band peak transmittance is less than 1%, even 0.1%), which is a goal that the out-of-band integral response after packaging can be achieved to be less than 5%. However, the existing optical filter preparation process is difficult to realize, the number of coating layers of the optical filter is greatly increased due to excessive out-of-band inhibition, the in-band transmittance is reduced, the yield is greatly reduced, and the preparation cost of the multi-spectral-band optical filter is extremely high.
The invention relates to an out-of-band elimination optical filter structure for a space camera detector, which comprises two parts: the device comprises an external filter (1) and a switching bracket (2). The out-of-band elimination filter (1) is a layer of non-packaging filter customized according to the out-of-band integral response out-of-tolerance condition of the detector. The final out-of-band integral response meets the index requirement by further out-of-band inhibiting the out-of-band integral response over-error spectral band of the detector. The switching support (2) is an intermediate structure for connecting the out-of-band elimination filter (1) and the detector, plays a role in connecting and fixing the two, ensures the relative position precision and stability of the two, and provides an external mounting interface for the detector. Fig. 4 is a schematic diagram showing an implementation structure of the detector out-of-band elimination filter, the left part of fig. 4 is an assembly relation of the out-of-band elimination filter (1), the adapter bracket (2) and the detector (3), and the right part of fig. 4 is an assembled cross-sectional view.
The preferred scheme is as follows: fig. 5 is a schematic diagram of the band elimination filter. The extinction outer filter is preferably made of radiation-resistant materials such as sapphire or ultraviolet quartz, and is preferably in a rectangular sheet shape. The length, width and thickness of the extinction outer filter are respectively set to be L x 、W x 、T x Preferably, the following relationship is satisfied:
L x ＝k 1 ·(L f +k 2 )
W x ＝k 1 ·(W f +k 2 )
L f 、W f length and width of filter, k, for detector package 1 In order to adjust the coefficient, it is preferable to select 1.2 to 1.3, k 2 In order to encapsulate the glue overflow amount of the filter on the detector, 2 mm-3 mm is preferred.
The thickness Tx of the anti-aliasing filter preferably satisfies the constraint:
the intensity of the band elimination filter can be further improved, and the processing is easy, wherein k 3 The weighting coefficient is preferably 0.013 to 0.015.
The preferred scheme is as follows: as shown in FIG. 5, the external filter of the extinction band has A, B two surfaces, wherein the A surface is far away from the photosensitive surface of the detector, the whole surface is coated with an antireflection film, and the transmittance is preferably > 99%. The surface B is close to the photosensitive surface of the detector and is a sticking surface, and different filter coatings are plated on the surface B according to the out-of-band integral response out-of-tolerance condition of a detector spectral band. Taking the detector of fig. 1 as an example, the out-of-band integrated response of the detector B1 (preferably 400nm to 450nm) is out-of-band, and needs to be processed. Accordingly, a filter film is plated on the surface B of the extinction outer filter corresponding to the projection position of a B1 spectral band, the in-band transmittance of the filter film is preferably more than 97%, and the out-band response peak value is less than 5 per thousand; the transmittance is preferably more than 99% corresponding to the projection positions of B2, B3 and B4 bands by plating an antireflection film. And after the spectral characteristics of the film layer are determined, calculating the boundary position of the filter film and the antireflection film.
FIG. 6 is a schematic diagram illustrating the calculation of the boundary between the filter and the antireflection film layer, where the margin of the boundary between the filter and the band B1 is S 1 Preferably, the following components are used:
S 1 ＝D 1 tanθ 1 +T f tan(arcsin(sinθ 1 /N))+D 2 tanθ 1 +k 4
wherein D 1 In order to eliminate the gap between the external filter and the packaged filter, the thickness of the gap is preferably 0.3-0.5 mm 1 The edge of the convergent light cone is close to the side of B2 and is the edge of the photosensitive band of B1Angle of incidence of light, T f For the thickness of the package filter, N is the refractive index of the package filter, D 2 For encapsulating the distance between the filter and the photosensitive chip, k 4 The preferred range is 0.1 mm-0.15 mm for the adjustment allowance. Determining the margin S of the antireflection film boundary relative to the B2 band in the same manner 2 。S 1 And S 2 The middle area is the interface area of the two film layers, the interface area is plated with a black diffuse reflection film, and the reflectivity is lower than 1%. Determining the film layer boundary of the non-boundary region by the same calculation method, wherein the adjustment margin k is 4 Preferably 0.2mm to 0.25 mm.
The preferred scheme is as follows: the alignment mark is arranged on the light filter with the elimination band and corresponds to the reserved mark on the photosensitive chip of the detector in position one by one, and the alignment mark is used as an alignment reference when the light filter with the elimination band is pasted. Fig. 7 shows two design methods of common alignment marks, and the design method of the alignment mark on the upper side of the out-of-band elimination filter when the left part and the right part of fig. 7 respectively reserve marks for the photosensitive chip in a cross shape and an L shape. A0.01 mm gap is preferably arranged between the alignment mark and the reserved mark, so that the alignment can be observed under a microscope or an OGP conveniently.
FIG. 8 is a schematic view of an adaptor bracket, preferably a rectangular slab, preferably of low linear expansion coefficient material (preferably less than 1X 10 expansion coefficient) -6 and/K), the invar material is preferably adopted, and the invar material has low thermal expansion coefficient, high strength and easy processing.
The preferred scheme is as follows: the adaptor bracket preferably has four features: the device comprises through holes arranged at four corners of the device and arranged outwards, an outer filter eliminating bonding groove, a detector bonding groove and a rectangular through groove, wherein the outer filter eliminating bonding groove and the detector bonding groove are arranged on two side surfaces of the device, and the rectangular through groove is arranged in the center of the device. The external installation through hole is an installation interface of the detector on the camera focal plane assembly, and in order to meet the requirement of a space camera for large-amplitude wide detection of ground objects, the current camera focal plane mostly adopts an imaging mode of splicing and integrating a plurality of detectors. The through holes in the switching support play a role in assembling, adjusting and fixing in the splicing and integrating process of the detector.
The preferred scheme of the invention is as follows: the outer contour length, width and thickness of the adapting bracket are respectively L, W, T, and the length, width and depth of the stray light eliminating filter bonding groove are respectively L x ’、W x ’、T x ' the length, width and depth of the bonding groove of the detector are respectively L t ’、W t ’、T t ' the length and width of the central rectangular through groove are L ' and W ' respectively. Has the following preferred relationship:
L X '＝L X +0.4
W X '＝W X +0.4
T X '＝0.7T X
the length and width directions of the bonding groove of the stray light eliminating filter are preferably kept with 0.4mm of adjustment allowance, and the depth of the groove is preferably 0.7 of the thickness of the stray light eliminating filter.
L t '＝L t +0.2
W t '＝W t +0.2
T t '＝0.5T t
The length and width directions of the bonding groove of the detector are preferably kept with 0.2mm of adjustment allowance, and the groove depth is preferably 0.5 of the thickness of the detector.
L'＝L f +k 2
W'＝W f +k 2
k 2 The glue overflow amount of the filter on the detector is preferably 2 mm-3 mm.
L＝L t '+2d
W＝W t '+2
T＝T t '+T f +D 1 +T x '
d is the mounting hole diameter of the external fixing screw of the adapter bracket, and the mounting screw is preferably M3 or M4, so d is preferably 3.5 or 4.5 mm. D1 is the gap between the out-of-band elimination filter and the packaging filter, preferably 0.3 mm-0.5 mm.
The further preferred scheme is as follows: and (3) removing roots or reserving tool withdrawal grooves at four corners of the rectangular sinking groove without leaving round corners. And a plurality of glue overflow grooves with the length of 4mm, the width of 0.5mm and the round angle of 0.5mm are preferably arranged on the long edge of the sinking groove. The distance between adjacent glue overflowing grooves is 5mm, and the glue overflowing grooves are uniformly and symmetrically arranged along the long edge direction of the sinking groove. The glue overflow groove plays a role in fixing and strengthening after the outer filter and the detector are pasted, and further prevents the detector from loosening or separating during camera installation, adjustment, test and vibration to influence the imaging quality. The flatness of the bottom surfaces of the heavy grooves on the two sides of the switching support is controlled within 0.01, and the influence of flatness difference on the surface shape of the pasted external optical filter is avoided. The parallelism of the bottom surfaces of the sinking grooves on the two sides is preferably controlled within 0.02, and the influence of the parallelism difference on a camera system transfer function is further avoided.
The preferred scheme is as follows: the installation mode of the implementation structure of the elimination external filter is as follows: the detector is adhered to the detector adhering groove on the switching support through the optical structure adhesive, so that the adhesive overflow groove is ensured to have the adhesive overflow, and no excess adhesive overflow is caused. And after the detector adhesive is solidified, adhering the light filter with the elimination band in the light filter adhering groove on the adapter bracket. And aligning the alignment mark on the out-of-band elimination filter with the reserved mark of the detector by means of a microscope or an OGP (one glass solution) in the pasting process. The relative positional relationship between the two is ensured as shown in fig. 7. And in the glue curing process, monitoring the alignment relation of the two groups of marks, and if deviation exists, adjusting in time until the glue is completely cured.
In order that the objects, technical solutions and advantages of the present invention will be more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings.
The preferred scheme is as follows: the preferred multi-band photodetector for the space camera in the invention preferably has four bands of B1 (preferably 400-450nm), B2 (preferably 595-635nm), B3 (preferably 720-750nm) and B4 (preferably 850-980 nm). Because the spectral response difference of a photosensitive chip used by the detector is large, the B1 spectral band is just positioned in a low-response area of the chip, and the existing filter cannot enable the out-of-band integral response of the B1 spectral band to reach the index requirement of less than 5 percent. By utilizing the method provided by the invention, the out-of-band elimination processing is carried out on the spectrum of the detector B1.
The preferred scheme is as follows: the preferred scheme of the ceramic package of the detector is as follows: long L t 100mm wide W t 60mm thick T t 3.5mm, the self-contained multi-spectral band packaging filter is preferably as follows: long L f 75mm wide W f T40 mm thick f ＝1mm。
The preferred scheme is as follows: firstly, designing and preparing the extinction external filter. The elimination external filter adopts sapphire material, and the invention providesDesigning the external dimension of the external optical filter of the elimination band by a formula: long L x Width W of x Thick T x The preferred relationship is as follows:
L x ＝k 1 ·(L f +k 2 )＝1.23×(75+2)＝95mm
W x ＝k 1 ·(W f +k 2 )＝1.3×(40+2)＝55mm
The preferred scheme is as follows: the extinction external filter has A, B two sides, wherein A side is far away from the photosensitive side of the detector, the whole surface is plated with antireflection film, and the transmittance is more than 99%. The surface B is close to the photosensitive surface of the detector, a 400-450nm filter film is preferably plated at the projection position of the surface B corresponding to the spectral band of the detector B1, the in-band transmittance of the filter film is more than 97%, and the out-of-band response peak value is less than 5 per thousand; the transmittance is more than 99 percent corresponding to the projection positions of B2, B3 and B4 spectral bands after plating an antireflection film.
And after the spectral characteristics of the film layer are determined, calculating the boundary position of the filter film and the antireflection film.
Margin of filter film boundary to B1 band boundary:
S 1 ＝D 1 tanθ 1 +T f tan(arcsin(sinθ 1 /N))+D 2 tanθ 1 +k 4
＝0.5×tan(2.5)+1×tan(arcsin(sin(2.5)/1.75))+0.4×tan(2.5)+0.1
＝0.16mm
D 1 the gap between the outer filter and the packaging filter is preferably 0.5mm and theta 1 The incident angle of the ray of the light with the edge of the B1 photosensitive band close to the edge of the converging light cone on the side of B2 is preferably 2.5 degrees, N is the refractive index of the packaging filter is preferably 1.75 degrees, and D is 2 The distance between the packaged filter and the photosensitive chip is preferably 0.4mm, k 4 The preferred range of the adjustment allowance is 0.1 mm.
The margin S of the boundary of the antireflection film relative to the band B2 is calculated 2 0.15mm (in this case,. theta.) 1 Is B2Angle of incidence of converging cone edge rays 2 deg. near the side of B1 for the photosensitive band edge). And determining the coating area of the black diffuse reflection film according to S1 and S2.
Similarly, the boundary size of the rest non-boundary region films can be calculated according to a formula.
The preferred scheme is as follows: according to the scheme shown in fig. 7, an alignment mark is designed for the external optical filter, the reserved mark on the photosensitive chip of the detector is in a cross shape, the length of the cross mark is preferably 0.5mm, the thickness of the cross mark is preferably 0.03mm, the alignment mark shown in the left part of fig. 7 is designed, the thickness of the alignment mark line is preferably 0.03mm, and a gap of 0.01mm is formed between the alignment mark and the reserved mark.
The preferred scheme is as follows: designing and preparing the adapter bracket. The adapter bracket is made of invar steel material, and the linear expansion coefficient is preferably 0.5 multiplied by 10 -6 and/K. The length, width and thickness of the adapting bracket are respectively L, W, T, and the length, width and depth of the stray light eliminating filter bonding groove are respectively L x ’、W x ’、T x ' the length, width and depth of the bonding groove of the detector are respectively L t ’、W t ’、T t ' the length and width of the central rectangular through groove are L ' and W ' respectively. The adapter bracket is used for fixing the screw M3 to the outside, the external mounting aperture D of the screw is 3.5mm, and the gap D between the external filter and the packaging filter is eliminated 1 Is 0.5 mm. The adapter stent characteristic dimension is preferably determined according to the formula:
L X '＝L X +0.4＝95+0.4＝95.4mm
W X '＝W x +0.4＝55+0.4＝55.4mm
T X '＝0.7T X ＝0.7×1.5＝1.05mm
L t '＝L t +0.2＝100+0.2＝100.2mm
W t '＝W t +0.2＝60+0.2＝60.2mm
T t '＝0.5T t ＝0.5×3.5＝1.75mm
L'＝L f +k 2 ＝75+2＝77mm
W'＝W f +k 2 ＝40+2＝42mm
L＝L t '+2d＝100.2+2×3.5＝107.2mm
W＝W t '+2＝60.2+2＝62.2mm
T＝T t '+T f +D 1 +T x '＝1.75+1+0.5+1.05＝4.3mm
the preferred scheme is as follows: the stray light eliminating optical filter bonding groove and the detector bonding groove of the switching support are all back gouged at four corners of the two rectangular sinking grooves. On the long limit of heavy groove, have the overflow gluey groove of preferred 4mm of length, wide preferred 0.5mm, fillet preferred 0.5mm, adjacent overflow gluey groove interval preferred 5mm, overflow gluey groove along heavy groove long limit direction evenly symmetric distribution. The flatness of the bottom surfaces of the sink grooves on the two sides of the adapter bracket is preferably 0.01, and the parallelism is preferably 0.02.
The preferred scheme is as follows: after the preparation of the external optical filter elimination and the switching support is completed, assembling the external optical filter elimination, the detector and the switching support: the detector is adhered to the switching support through SE-14-80 optical structure adhesive, and the ceramic surface of the detector, which is adhered with the packaging optical filter, is adhered and bonded with the detector adhesive groove of the switching support. And the glue overflow amount is controlled in the bonding process, so that the glue overflow groove of the switching support is filled with the overflow glue, and the rest excessive overflow glue is removed in time. After the gel is solidified, the external filter is pasted. The surface B of the extinction outer filter (i.e. the surface plated with the filter film and the black film) is attached and bonded with the extinction outer filter bonding groove of the adapter bracket, and the excessive glue is ensured to be filled in the glue overflow groove of the adapter bracket and the rest excessive glue is removed in time. The position of the extinction external filter is displaced in the curing process of the optical structure adhesive, so that the position of the extinction external filter is observed and adjusted by means of a high power microscope or an OGP measuring instrument in the curing process, and the alignment mark is ensured to be overlapped and aligned with the reserved mark on the detector chip until the optical structure adhesive is completely solidified. And finishing the implementation of the external filter elimination of the detector.
The optimal solution for solving the problem that the packaged optical filter cannot reach the out-of-band integral response index of the spectral band due to the large spectral response difference of the photosensitive chip is provided by the invention, and the technical effect is obvious.
The invention has not been described in detail in part of the common general knowledge of those skilled in the art.
Claims (6)
1. An out-of-band elimination filter structure for a spatial camera focal plane detector, comprising: the device comprises an external optical filter (1) and a switching bracket (2);
the external filter (1) is arranged on the detector (3) through the switching bracket (2);
the outer filter (1) is made of sapphire or ultraviolet quartz and is in a rectangular sheet structure;
dividing the out-of-band integral response of a spectral band of a detector into an out-of-tolerance spectral band and a non-out-of-tolerance spectral band according to the use requirement; a filter film is plated at a corresponding position on the side, close to the detector (3), of the out-of-band filter (1) for out-of-band integral response out-of-band error bands, an anti-reflection film is plated at a corresponding position on the side, close to the detector (3), of the out-of-band filter (1) for out-of-band non-error bands, and black diffuse reflection films are plated in different film interface areas; the black diffuse reflection film is covered on two adjacent different films;
an antireflection film is plated on the surface of the external filter (1) far away from the detector (3);
alignment marks are engraved at four corners of one surface, close to the detector (3), of the outer extinction filter (1) and are used for accurately aligning with the detector (3);
the switching support (2) is made of a low linear expansion coefficient material, the switching support (2) is a hollow rectangular thick sheet, a first rectangular sinking groove is formed in one surface, close to the detector (3), and serves as a mounting groove of the detector (3), and rectangular notches which are uniformly distributed are formed in two ends of the long edge of the first rectangular sinking groove and serve as glue overflow grooves;
a second rectangular sinking groove is arranged on the surface far away from the detector (3) and is used as an installation groove of the external optical filter (1) to be eliminated, and rectangular notches which are uniformly distributed are arranged at two ends of the long edge of the second rectangular sinking groove and are used as glue overflow grooves;
the bottoms of the first rectangular sinking groove and the second rectangular sinking groove are used as bonding surfaces; mechanically controlling the flatness and parallelism of the two bonding surfaces; the hollow part of the hollow rectangular thick sheet is a rectangle with thickness;
four corners of the switching support (2) are provided with an outward mounting interface, and the interface is reserved with adjustment allowance for splicing and adjusting the long linear array focal plane of the camera.
2. The out-of-band elimination filter structure for a spatial camera focal plane detector of claim 1, wherein: and the detector (3) is a long linear array multi-spectral-band photoelectric detector in the focal plane of the visible light space camera, and the photoelectric detector is provided with a packaging optical filter.
3. The out-of-band elimination filter structure for a spatial camera focal plane detector of claim 1, wherein: the external optical filter (1) and the detector (3) are fixed on the adapter bracket (2) through optical structural adhesive.
4. The out-of-band elimination filter structure for a spatial camera focal plane detector of claim 1, wherein: during assembly, the detector (3) is firstly adhered to the adapter bracket (2), and the external optical filter (1) is adhered after the glue of the detector (3) is solidified.
5. The out-of-band elimination filter structure for a spatial camera focal plane detector of claim 1, wherein: when the out-of-band elimination filter (1) is pasted, the position relation between the out-of-band elimination filter and the detector (3) is positioned through the alignment mark on the out-of-band elimination filter (1).
6. The out-of-band elimination filter structure for a spatial camera focal plane detector of claim 1, wherein: the assembly mode of the implementation structure of the out-of-band elimination filter (1) is as follows: the detector (3) is adhered to the switching support (2) through optical structure glue, and glue overflows in a glue overflow groove on the adhering surface of the detector (3) so as to ensure enough adhesive strength; after the viscose glue of the detector (3) is solidified, the external filter (1) is stuck, and the glue overflow groove is filled with the overflow glue to ensure enough bonding strength; the relative position relation between the photosensitive spectral bands of the out-band elimination filter (1) and the detector (3) is accurately positioned by the aid of the alignment marks in the pasting process, the alignment accuracy of the out-band elimination filter and the photosensitive spectral bands of the detector is constantly concerned in the viscose solidification process, and if the out-band elimination filter and the photosensitive spectral bands of the detector deviate, the alignment is timely adjusted until solidification is achieved.
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