CN101512768B - Camera system and associated methods - Google Patents
Camera system and associated methods Download PDFInfo
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- CN101512768B CN101512768B CN2007800336275A CN200780033627A CN101512768B CN 101512768 B CN101512768 B CN 101512768B CN 2007800336275 A CN2007800336275 A CN 2007800336275A CN 200780033627 A CN200780033627 A CN 200780033627A CN 101512768 B CN101512768 B CN 101512768B
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Images
Classifications
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
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- G—PHYSICS
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- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
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- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- G—PHYSICS
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- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Cameras In General (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
A camera system may include an optics stack including two substrates, the optics stack forming an imaging system, each substrate having two surfaces that are parallel to each other and perpendicular to an optical axis of the imaging system, the optics stack including a securing region on opposing surfaces of the two substrates, the two substrates being secured together on a wafer level at their respective securing regions, at least one of the surfaces of the two substrates including a refractive surface of the imaging system, a detector substrate having an active area and a cover structure protecting at least the active area of the detector substrate, the optics stack being secured to an upper surface of the cover structure.
Description
Technical field
The method that execution mode of the present invention relates to camera system and makes camera system on a large scale.
Background technology
Along with camera system is applied on the more and more littler device more and more widely, to littler, gentlier, the demand of thinner, better also more cheap camera system also increases thereupon.Yet current solution may not be most desirably and/or is side by side satisfied all design parameters.
Summary of the invention
Therefore execution mode of the present invention relates to camera system and correlation technique, and it has generally overcome one or more problem that is caused by the restriction of prior art and shortcoming.
Therefore the characteristic of an embodiment of the invention provides camera system and correlation technique; The lens combination that in this camera system, is used for target imaging has formed vertical optical laminated (optics stack), this optical laminated singleization (singulated) of before being fixed to detector substrate, carrying out.
Another feature of an embodiment of the invention has provided has optical laminated camera system and the correlation technique that directly is fixed on the covered structure that is used for detector.
Another feature of an embodiment of the invention has provided a plurality of optical laminated camera system and correlation techniques that are fixed on the wafer that includes a plurality of detectors.
The covered structure that another feature of execution mode of the present invention has provided detector extends beyond optical laminated camera system and correlation technique.
Can realize at least one above-mentioned and further feature and advantage of the present invention through such camera system is provided; This camera system comprises: optical laminated; It comprises two substrates; Said optical laminated formation imaging system, each substrate all have and are parallel to each other and two surfaces vertical with the optical axis of said imaging system the said optical laminated FX that is positioned on said two substrate apparent surfaces that comprises; Said two substrates are in wafer scale (wafer level) in their FX separately and are fixed together, and at least one surface in the surface of said two substrates comprises the plane of refraction of said imaging system; Detector substrate, it has working region (active area); And covered structure, it protects the working region of said detector substrate at least, the said optical laminated upper surface that is fixed to said covered structure.
The diameter of said plane of refraction in optical laminated can less than with the diagonal of the corresponding said working region of said imaging system.
Camera system can comprise the conductive devices on the bottom surface of said detector substrate, and said conductive devices is suitable for said detector substrate is carried out mounted on surface.
The surface area of said at least one substrate in optical laminated is less than the upper surface area of said covered structure.
Can be in fixing said two substrates of wafer scale and covered structure.
Said two substrates can be with (co-extensive) that prolong.
Said covered structure can comprise final stage optical element (final optical element).
Camera system can comprise the final stage optical element between said optical laminated and said covered structure.
Can carry out wafer scale to said covered structure and said detector substrate fixes.
Can fix said covered structure and the said optical laminated wafer scale of carrying out.
Camera system can comprise a plurality of sub-cameras, and each sub-camera has corresponding plane of refraction on said optical laminated same surface.
Camera system can comprise the spacer structure between apparent surface's said FX.This spacer structure can be an adhesive.
Electrical interconnection can be from said working region to the reel edge of said detector substrate of said conductive devices.
Camera system can comprise that mounted on surface has the circuit board of said detector substrate, and said conductive devices is soldered on the said circuit board.
Said conductive devices can be a scolder.
Said two surfaces can comprise flat site.
Said FX can be smooth.
Can realize at least one above-mentioned and further feature and advantage of the present invention through such camera system is provided; This camera system comprises: optical laminated; It comprises first substrate with first refracting element; Second substrate with second refracting element, and first interval between adjacent substrate are in fixing said first substrate of wafer scale and second substrate; Detector substrate, it has the working region; And second at interval, it is between said optical laminated and said working region, and said second at interval less than said first interval.
Saidly optical laminatedly can comprise three substrate adjacent with said detector substrate.
Said first at interval can be between said first substrate and second substrate, perhaps between said second substrate and the 3rd substrate.
Near the diameter of the refracting element of said working region can greater than said optical laminated in the diameter of other refracting element.
Camera system can comprise the covered structure that covers said working region, said optical laminated directly being installed on the said covered structure.
Camera system can comprise a plurality of sub-cameras, and each sub-camera has corresponding first refracting element and on the first surface of said second substrate, having corresponding second refracting element on the first surface of said first substrate.
Can realize at least one above-mentioned and further feature and advantage of the present invention through such camera system is provided, this camera system comprises: have first substrate of first refracting element, said first refracting element has first diameter; First dividing plate with first dividing plate opening; Second substrate with second refracting element, said second refracting element has second diameter, and said second diameter is greater than said first diameter; Detector substrate with working region, said detector substrate is nearer at a distance of said first substrate at a distance of said second substrate ratio; At least two substrates in wafer scale fixing said first substrate, said second substrate and said detector substrate; And second partition, it is between said first dividing plate and said detector substrate, and said second partition has the second partition opening greater than the said first dividing plate opening.
Said first dividing plate can be on said first substrate.Said first dividing plate can be on the first surface of said detector substrate said first substrate far away.
Can realize at least one above-mentioned and further feature and advantage of the present invention through the method for making camera system is provided; This method may further comprise the steps: aim at the optical laminated wafer that comprises first wafer and second wafer, said optical laminated wafer forms a plurality of imaging systems; Said optical laminated wafer is fixed in zone on the facing surfaces of said first wafer and said second wafer, and said facing surfaces is parallel to each other and perpendicular to the optical axis of said imaging system; Pass said facing surfaces and separate said first wafer and said second wafer that is fixed, form thus a plurality of optical laminated, each optical laminated imaging system that includes; And with the optical laminated detector substrate with working region that is fixed to, the diameter of plane of refraction is less than the diagonal of said working region.
Fixing said optical laminated step can comprise when detector substrate is the part of detector wafer the said optical laminated said detector substrate that is fixed to.
This method can comprise the covered structure wafer is fixed to said detector wafer.
This method can may further comprise the steps: pass said facing surfaces and separate said covered structure, the detector wafer and optical laminated that is fixed, to form a plurality of camera systems, each camera system includes covered structure, detector and optical laminated.
The surface area of said at least one substrate in optical laminated is less than the surface area of the upper surface of said covered structure.
This method also comprise confirm optical laminated whether be qualified, confirm that whether said working region is qualified and only with the qualified optical laminated qualified working region that is fixed to.
This method can be included between the FX on the relative parallel surfaces spacer structure is set.
Said spacer structure can be an adhesive, and can form this spacer structure through forming light path in the layer of adhesive middle punch.
Can realize at least one above-mentioned and further feature and advantage of the present invention through the method for making camera system is provided; This method may further comprise the steps: aim at the optical laminated wafer that comprises first wafer and second wafer, said optical laminated wafer forms a plurality of imaging systems; Said optical laminated wafer is fixed in zone on the facing surfaces of said first wafer and said second wafer, and said facing surfaces is parallel to each other and perpendicular to the optical axis of said imaging system; Pass said facing surfaces and separate said first wafer and said second wafer that is fixed, form thus a plurality of optical laminated, each optical laminated imaging system that includes; With the optical laminated detector substrate that is fixed to working region; And on the bottom surface of said detector substrate, form the conductive devices be suitable for camera system is carried out mounted on surface.
This method can also comprise formation from said working region to the reel electrical interconnection at edge of said detector substrate of said conductive devices.
This method is included between the FX on the relative parallel surfaces spacer structure is set.
Said spacer structure can be an adhesive.This method can be included in the said adhesive middle punch of one deck and form light path.
This method can comprise and circuit board is set and carries out reflux solder with fixing said conductive devices and said circuit board.
Said conductive devices can be a scolder.
Description of drawings
Through describe execution mode of the present invention in detail with reference to accompanying drawing, above feature and advantage of the present invention will be easy to become obviously for those skilled in the art, wherein:
Figure 1A shows the schematic side elevation according to the camera system of an embodiment of the invention;
Figure 1B shows the schematic perspective view of the camera system of Figure 1A;
Fig. 1 C shows the profile of the camera system of Figure 1A;
Fig. 1 D shows the profile of the optical laminated camera system that comprises Fig. 1 C;
Fig. 1 E shows the top view of the camera system of Fig. 1 D;
Fig. 2 A and 2B show the profile according to each stage of the optical laminated method of the shop drawings 1D of an embodiment of the invention;
Fig. 3 A and 3B show the profile according to each stage of the method for the camera system of the shop drawings 1D of an embodiment of the invention;
Fig. 4 A and 4B show the profile according to each stage of the optical laminated method of the manufacturing of another embodiment of the present invention;
Fig. 5 shows the cutaway view of the optical substrate of the sensor base plate concave surface element fixing with being included in wafer scale;
Fig. 6 A and 6B show the profile in each stage of method of camera system that manufacturing according to another embodiment of the present invention has comprised the element of Fig. 4 B and Fig. 5;
Fig. 7 A shows the schematic perspective view according to the decomposition of the camera system of another embodiment of the present invention;
Fig. 7 B shows the figure that camera system among Fig. 7 A is merged in a kind of portable set;
Fig. 8 A and 8B show the profile according to each stage of the method for the manufacturing camera system of another embodiment of the present invention;
Fig. 9 A shows the schematic side elevation according to the camera system of another embodiment of the present invention;
Fig. 9 B shows the schematic cross sectional view of the camera system of Fig. 9 A;
Figure 10 shows the schematic side elevation according to the camera system of another embodiment of the present invention; With
Figure 11 shows the schematic side elevation according to the camera system of another embodiment of the present invention.
Embodiment
Now will with reference to accompanying drawing execution mode of the present invention be described in further detail hereinafter.Yet, can come practical implementation the present invention and should the present invention be interpreted as the execution mode that is limited to here to be set forth through different forms.More precisely, it is comprehensive and complete in order to expose that these execution modes are provided, and will pass on idea of the present invention to those skilled in the art all sidedly.
In the accompanying drawings, for clarity sake, exaggerated the thickness in layer and zone.It will also be appreciated that when one deck is described as being positioned at another the layer or substrate " on " time, this layer can be directly be positioned at other layer or substrate on, perhaps also can have the intermediate layer.In addition, it should be understood that when one deck is described as another the layer " under " time, this layer can be directly be positioned at another layer or substrate under, perhaps also can have one or more intermediate layer.In addition, it will also be appreciated that when one deck is described as two-layer " between " time, this layer can be two-layer between unique one deck, perhaps also can have one or more intermediate layers.From start to finish represent components identical with identical label.As in this use, be formed with any substrate of a plurality of parts on term " wafer " the expression flat surfaces above that, said parts will separated through this flat surfaces before final the use.In addition, as used herein, term " camera system " expression comprises any system that transmits the optical imaging system of light signal to the detector system of for example image capturing system, and this detector system is exported the for example information of image.
According to the embodiment of the present invention, use for example have diameter can comprise less than the camera system of cornerwise lens of the working region of detector optical laminated, these optical laminated at least two fixing substrates of wafer scale that are included in.This is optical laminated can to comprise optical imaging system.This optical laminated can being directly fixed on the covered structure of protecting detector, perhaps this covered structure can be an optical laminated part.This structure can extend beyond optical laminated.
In 1C, the camera system according to an embodiment of the invention has been shown at Figure 1A.In 1C, can single imaging system be used for all colours at Figure 1A, and can directly on detector array 24, color filter array be set.Certainly, be described below, this imaging system of any amount (for example, 3 or 4) can be set, form a plurality of sub-camera of each camera, and can change the design and/or the position of the colour filter of color filter array with suitable manner.
In Figure 1A and 1B, different light paths corresponds to different field points from object.Can in optical laminated 140, realize imaging system, this optical laminated 140 comprises first substrate 110, second substrate 120 and the 3rd substrate 130.
The first surface of first substrate 110 can have first plane of refraction 112, and this first plane of refraction helps wherein light of input is carried out to picture, for example, this first plane of refraction can influence imaging system focal length and/or can aberration correction.The second surface 114 of first substrate 110 can be smooth, and can comprise infrared colour filter 115 above that.Can change this layout with suitable manner, and infrared colour filter 115 can be arranged in any surface on these surfaces.
Can have diffraction element 123 on the first surface 122 of second substrate 120, this diffraction element 123 also helps light is carried out to picture.The second surface of second substrate 120 has second plane of refraction 124, and this second plane of refraction also helps light is carried out to picture.
The first surface of the 3rd substrate 130 can have third reflect face 132.This third reflect face 132 can be waited to be presented on the same plane 135 on the detector array 24 (shown in Figure 1B) thereby can all picture points be imaged on so that the image visual field becomes smooth.
Shown in Figure 1A and 1B, first plane of refraction 112 and second plane of refraction 124 can be convex surfaces, and the third reflect face can be a concave surface.Certainly,, can adopt the complicated more aspheric surface refracting surface that to discuss after a while, for example, comprise the plane of refraction of at least one recessed portion and at least one projection according to concrete design.
Different with the camera that uses film, use transducer can have the optical element that is provided with over against ground with the plane of delineation as the camera of image forming medium.Shown in Figure 1B and 1C, can final stage substrate (be the 3rd substrate 130, it comprises third reflect face 132) directly be fixed to detector array 24 here.Below with detailed discussion be used for fixing optical laminated 140 with the various structures of detector array.If detector array 24 comprises cover plate, then the 3rd substrate 130 can be incorporated on this cover plate.If detector array does not comprise cover plate, then the 3rd substrate 130 can be fixed to the covering lenticule relevant with detector array with encirclement, and can be used as cover plate so that detector array is come from environmental factor is isolated.
This structure can be eliminated the initiatively needs of focusing.Can use additional optical elements to compensate the focal length of expectation and/or departing from of aberration.
Like what in the profile of Fig. 1 C, illustrate in greater detail, substrate 110,120 and 130 can have the relative flat site perpendicular with the optical axis of imaging system, and optical element 112,115,123,124 and 132 forms above that.Owing to can control the inclination angle of all elements in the lens combination, thereby to use the substrate with this flat site can be favourable.Substrate with flat site also makes it possible to carry out piling up of element and combines with relative the direct of flat site, so, can come align optical components along whole three optical axises, and this can make things convenient for the wafer scale assembling and can cancel crust component.The flat site of substrate can be in the periphery of each optical element, and/or for example around the periphery of each optical element, forms flat site through the deposition of suitable material.Perhaps, for example,, can use adhesive to come the groove in the filling bearing (standoff), substrate fixed in the FX of non-flat forms as disclosed in the United States Patent (USP) 6,096,155 of co-assigned.These FX still can be positioned on the surface that is formed with optical element.
(for example, interval S12 and S23) can not accurately control initiatively focusing between the optical element with multiplying power (power) because camera is designed to.(for example interval S12) possibly expect the interval that approaches in some cases.(for example, interval S23) possibly need bigger interval in other cases.Under both of these case; Possibly expect such interval, that is, this provide at interval on the z direction (for example; Along optical axis direction) optics between the accurate control of distance, and with the optical element sealing to protect them not receive the for example influence of particle, fragment and other external factor.Also advantageously, from least two reasons interval S12 and S23 are arranged on outside the light path.At first, make light in air, propagate the total length that can help to shorten camera.Secondly, if the interval is arranged on outside the lens aperture, then can use opaque material, making also can be with being used as dividing plate at interval.
The amount of space that depends on expectation is through lithography technique or through using spacer wafer (separation wafer) can realize S12, S23 at interval.The lithography technique that can adopt for example comprises deposition and patterned material or optical element is etched in the flat substrate, so that extend the outer peak top that is trapped among this optical element of flat substrate.If deposited material and carried out composition, then can use opaque material or absorbing material (for example, metal or absorbable polymer).Can use can be patterned into controlled thickness (for example, about 50-100 micron) with the offset printing mode polymer (for example, SU-8).Yet,, therefore, can apply this polymer with opaque material and perhaps polymer dyeed so that himself becomes adsorbate in order in addition it to be used as dividing plate because this polymer is a transmissive.For example at the United States Patent (USP) 5,912,872 and 6,096 of co-assigned; Disclosed in 155, can form this bearing, perhaps for example at the United States Patent (USP) 6 of co-assigned; Disclosed in 669,803, can form this isolated wafer (spacer wafer) like this.In addition, layer that can be through adhesive phase for example is set in surface to be fixed and form suitable passage in this layer middle punch and realize bearing to provide from its required light path of passing through.
In addition, can the opaque material of metal and/or the initial gap S01 of absorbing material for example be set (for example, identical plane on) on optical laminated 140 the end face with first plane of refraction 112.This initial gap S01 can also fill the post of the major bore diaphragm.Can this initial gap S01 be formed on first substrate 110 with planography way.
Some microvoids (air gap) (its be small enough to and relative optical surface between (promptly; Between the summit and opposing substrates surface of plane of refraction or diffraction surfaces) some spaces suitable; For example, minimum magnitude) can help to guarantee that each optical element works orderly at about 5-10 micron.In addition, because light can be provided with bigger space to realize compacter design with than angle refraction bigger in substrate in air.In addition, mention, if the lens combination that the different optical effect is had different focal is set, then should different spaces be set to different lens combinations as above.
In the embodiment shown in Fig. 1 C; S23 is greater than interval S12 at interval; Make image be full of detector array 24; And S12 and S23 the two all greater than the interval between final stage substrate 130 and the detector array 24, between final stage substrate 130 and detector array 24, can not have any space.According to the embodiment of the present invention through between initial plane of refraction and final stage plane of refraction, bigger space being set; And any gap between minimize optical lamination 140 and the detector array 24; Compare with the traditional scheme that requires the interval between optical system and the transducer, can make camera thinner.Can be in a different manner, form S01, S12 and S23 at interval with material different.
Notice that Figure 1A maximum space in the 1C appears at before the final stage plane of refraction 132, but after initial plane of refraction 112.In the design of conventional camera, maximum space typically appears between final stage optical element and the transducer.This execution mode be not both several reasons aspect this.At first, in camera, exist big as far as possible space that the thickness of camera is minimized.Usually, therefore the angle that light is propagated in air just can reduce thickness than big in substrate when the space is bigger.Yet substrate also needs the space to come receiving element, and the existence in space can help thickness to be minimized and make maximizing performance.
In addition, the clear aperature of at least one plane of refraction (clear aperture) (the perhaps clear aperature of all planes of refraction) can be less than the working region of detector array 24.The clear aperature of dwindling each lens element makes it possible to reduce the SAG of each plane of refraction.Usually, the SAG of each plane of refraction is more little, then manufacture easier and cost lower, particularly in wafer, carry out etched situation.Usually, the diameter of plane of refraction is more little, and then SAG is more little.Through keeping beam diameter surperficial up to final stage, can realize keeping the plane of refraction diameter as much as possible little less than the work array of detector array 24.
This final stage surface can be used to increase the diameter of light beam and make the visual field planarization simultaneously.When using field flattener (field flattener) with this mode, field flattener can have such diameter, and promptly this diameter is between entrance pupil diameter and transducer diameter.In addition, in this embodiment, entrance pupil can be positioned on first refractive convex surface 112, so that the clear aperature of first refractive convex surface 112 equals the clear aperature of entrance pupil.Therefore, the clear aperature of field flattener can be between the working region of the clear aperature of first plane of refraction 112 and detector array 24.
Therefore, can be positioned at or near entrance pupil, and the clear aperature of all optical elements can be propagated and expands to the working region of detector array 24 from entrance pupil along with light than the plane of refraction of minor diameter.The final stage plane of refraction can have the diameter between the diameter of the working region of the diameter of first plane of refraction 112 and detector array 24.
When design during camera, for the diameter that keeps first plane of refraction 112 and second plane of refraction 124 very little and so make SAG keep very lowly, third reflect face 132 can be a concave surface to fill the post of field flattener and to increase the size of visual field.When having used such field flattener, possibly need bigger space in the front of third reflect face 132.
Mention as above, sensor chip (sensor dies) usually can be greater than optics chip (optics die).In the camera system design of the aforesaid lens that wherein used the little lens diameter of diagonal with ratio sensor working region, it is big that this difference in size can further become.In other words, lens have the pitch different with detector.For such design arbitrarily, along with yield becomes more crucial in making camera system, all elements that fixedly comprise the substrate that has detector on it in wafer scale possibly not be the economic way of making these camera systems.
Bearing 160 can optical laminated 140 and detector substrate 170 between accurate interval is provided.Cover plate 150 can seal operation zone 176 with bearing 160.
Although bearing 160 is shown as the element that is separated with detector substrate 170 and cover plate 150, bearing can all become one with any or the two among detector substrate 170 and the cover plate 150.In addition, although the sidewall of bearing 160 is illustrated as straight (for example, forming through cutting or composition), according to the mode (for example, by the etching angle of the certain material that is used for bearing 160) that forms bearing 160, the sidewall of bearing can be angled.In another implementation; For example be incorporated into the United States Patent (USP) 6 of this co-assigned with the mode of quoting as proof; Disclosed in 669,803, bearing 160 can be accurately to be arranged on detector substrate 170 and the cover plate 150 or to be arranged on the binding material on the two one of them.
Have hypotenuse although cover plate 150 is shown as, it possibly be the typical products and its that is used to make the technology of cover plate 150, and it can change according to different processes.For example, when being positioned at the element under the surface to be cut when needing protection (for example, not cutting the wafer that all are fixed), can use the cutting blade of band angle.In addition, cover plate 150 can be to will be by the optical transparency of camera system 100 record, and for example, this cover plate can be a glass.
As visible in Fig. 1 D and 1E, as above-mentioned result than minor diameter, optical laminated 140 can be less than detector substrate 170.In the concrete example shown in Fig. 1 E, optical laminated 140 is 1.3mm * 1.5mm, and working region 176 is 1.0mm * 1.5mm, and detector substrate 170 is 2.0mm * 3.0mm.It can also be seen that plane of refraction 112,124 and 132 diameter increase progressively, and all these diameters are all less than the diagonal of working region 176.
The difference of size means, the wafer of same size can form ratio sensor substrate more than 170 a lot of optical laminated 140.Therefore, through before being fixed to detector substrate 170, forming optical laminated 140 and make its singleization, can reduce manufacturing cost with optical laminated 140.Specifically and since only can will be qualified optical laminated 140 be fixed on the detector substrate 170, so optical laminated 140 yield does not need very high.In addition, compare with optical laminated and detector being carried out the fixing situation of wafer scale, identical materials can make more optical laminated 140.
A plurality of stages of optical laminated 140 the method made have been shown in Fig. 2 A and 2B.Can find out that therefrom optical laminated wafer 140 ' can comprise first wafer 110 ' of first substrate 110, this substrate has corresponding plane of refraction 112; Second wafer 120 ' of second substrate 120 has corresponding plane of refraction 124 on it; And the 3rd wafer 130 ' of the 3rd substrate 130, have corresponding plane of refraction 132 on it.First wafer 110 ' and second wafer 120 ' can be fixed through corresponding intervals S12, and second wafer 120 ' and the 3rd wafer 130 ' can be fixed through interval S23.
Shown in Fig. 2 A, after aiming at and having fixed first to the 3rd wafer 110 ', 120 ', 130 ', it is independent optical laminated 140 to form vertically to separate these wafers through for example modes such as cutting, etching, shown in Fig. 2 B.
Shown in Fig. 3 A and 3B, can each optical laminated 140 be aimed at and be fixed on the cover wafers 150 ', this cover wafers 150 ' and then can be fixed to detector wafer 170 ' via the bearing 160 of correspondence.Shown in Fig. 3 A, each optical laminated 140 is being aimed at and is being fixed to cover wafers 150 ' afterwards, can be for example through modes such as cutting, etching vertically separation detector wafer 170 ' and cover wafers 150 ' to form independent camera system 100.Shown in Fig. 3 B, can use different techniques to carry out this vertical separation for cover wafers 150 ' and detector wafer 170 '.In the concrete example shown in Fig. 3 B; For example be incorporated into the United States Patent (USP) 7 of this co-assigned with the mode of quoting as proof; 208; Described in 771, can separate cover wafers 150 ' through upper surface cutting from cover wafers 150 ', and can separation detector wafer 170 ' through the lower surface cutting from detector wafer 170 '.This separating step can expose contact pad 172.
In 6B, the camera system 200 according to another embodiment of the present invention has been shown at Fig. 4 A.In this embodiment, can use to have final stage plane of refraction 232 the covering optical substrate 230 of (for example, concave surface) replaces cover plate 150, remove an element thus.Yet using this covering optical substrate to replace simple cover plate as covered structure maybe stricter aiming between covering optical substrate 230 is with optical laminated 240.In addition, owing in optical system, lacked an element, possibly be difficult to will optical laminated 240 be fixed to detector substrate 170 measuring optical lamination 240 whether qualified before.
A plurality of stages of optical laminated 240 the method made have been illustrated in figures 4A and 4 B.Can find out that wherein optical laminated wafer 240 ' can comprise first wafer 110 ' of first substrate 110, it has corresponding lens 112 and second wafer 120 ' of second substrate 120, and it has corresponding lens 124.Can fix first wafer 110 ' and second wafer 120 ' through corresponding intervals S12.Corresponding intervals S23 can be set on the bottom surface of second wafer 120 '.
Shown in Fig. 4 A, aiming at and fixing first wafer 110 ' and second wafer 120 ' afterwards, can be for example vertically to separate these wafers through modes such as cutting, etchings independent optical laminated 240 to form, shown in Fig. 4 B.
Fig. 5 shows the profile that is fixed to the optics cover wafers 230 ' of detector wafer 170 ' via the bearing 260 of correspondence.Before or after optics cover wafers 230 ' and detector wafer 170 ' are fixed, can form recessed refractor.In addition, can substitute or replenish optical laminated 240 at optics cover wafers 230 ' the last S23 at interval that forms.
Shown in Fig. 6 A and 6B, can each optical laminated 240 be aimed at and be fixed to optics cover wafers 230 ', this optics cover wafers 230 ' and then be fixed to detector wafer 170 ' via the bearing 260 of correspondence.Shown in Fig. 6 A; Each optical laminated 240 is being aimed at and is being fixed to optics cover wafers 230 ' afterwards, can be for example through modes such as cutting, etching vertically separation detector wafer 170 ' and optics cover wafers 230 ' to form independent camera system 200.Shown in Fig. 6 B, can use different techniques or treatment step to carry out this vertical separation for optics cover wafers 230 ' and detector wafer 170 '.In the concrete example shown in Fig. 6 B; Upper surface cutting through from optics cover wafers 230 ' can separate into optics cover wafers 230 with optics cover wafers 230 ', and can detector wafer 170 ' be separated into detector substrate 170 through the lower surface cutting from detector wafer 170 '.The separating step of optics cover wafers 230 can influence bearing 260, for example, partly removes bearing 260.This separating step can expose bond pad 172.
Shown in Fig. 7 A, can comprise 4 sub-cameras according to the camera system 300 of another embodiment of the present invention.That this camera system 300 can comprise is optical laminated 340, cover plate 350 and detector substrate 370.
Optical laminated 340 can comprise filter substrate 302, first substrate 310, second substrate 320 and the 3rd substrate 330.Filter substrate 302 can comprise colour filter 306 arrays on the second surface of lens 304 arrays and this filter substrate 302 on the first surface of this filter substrate 302.First substrate 310 can have first plane of refraction, 312 arrays.Second substrate 320 can comprise second plane of refraction, 324 arrays.The 3rd substrate 330 can comprise third reflect face 332 arrays.
Each sub-camera can comprise that colour filter 306 and first is to third reflect face 312,314 and 323.Colour filter 306 can comprise red color filter, green color filter and blue color filter, and each colour filter is all corresponding to magazine one of three sons.The 4th colour filter can be that green maybe can be fully transparent, and sub-imager can provide and other three sub-camera different focal length.Perhaps; Thereby realize different optical effects; In the structure of four sub-cameras; Can be independent colour filter and the for example lens of the 4th lens be associated, Baeyer pattern (Bayer Pattern) can be provided so on the contrary and in ILA, have the lens with all the other lens combinations (for example, telephoto lens, wide-angle lens, pack-shot lens, fish-eye lens etc.) different focal.In addition, each lens combination can provide different focal length and get up to realize full color with the Baeyer pattern association.
And optical laminated 340 can be less than detector substrate 370, and can adopt above being used for to make any one of method of above-mentioned camera system 300.Here, the diameter of the lens of each sub-camera can provide the diagonal of the corresponding working region of image less than sub-camera above that.
In addition; Shown in Fig. 7 A; Cover plate 350 and detector substrate 370 can be with prolonging, and detector substrate 370 can comprise the coiling detector substrate the edge electrical interconnection 372 and the working region of detector substrate 370 is connected to the conductive structure 374 of circuit board.Perhaps, for example,, can connect the working region via the conductive through hole on the bottom surface of detector substrate 370 through conductive structure as disclosed to quote as proof in the United States Patent (USP) 7,224,856 of co-assigned that mode is incorporated into this.
Shown in Fig. 7 B, form to want to withstand conductive structure 374 is fixed to the required hot situation of circuit board 380 according to all elements of the imaging system of embodiment of the present invention.For example, when conductive structure 374 was scolder, all elements that form imaging system all wanted to withstand the situation of solder reflow.Therefore, for example the mode through reflow soldering can be surface mounted in optical laminated 340 the detector substrate 370 that has according to the embodiment of the present invention on the circuit board 380.Especially, owing to no longer need plastic casing and can all optical elements be formed on replica material (replication material) or on glass, so the situation that when the mounted on surface camera, runs into is littler to the influence of imaging system.
Shown in Fig. 7 B is further, can circuit board 380 be incorporated in the for example cellular portable set.Can find out that from the end view of Fig. 7 B camera system 300 possibly be the thickest parts in this portable set.
Another optional execution mode has been shown in Fig. 8 A and 8B.Shown in it; Although in this embodiment; Substrate with lens is expanded to having the size identical with optical cover base board 230, and this can combine it now with optical laminated in wafer scale, but optical laminated 440 can have and the identical structure of structure shown in Fig. 6 B.Notice that owing to will separate the whole stacked wafer module that is fixed, the optical cover base board can have straight edge.
Specifically, although lens diameter can keep with Fig. 6 B in lens diameter identical, optical laminated 440 can have the for example size of 1.8mm * 2.0mm.Therefore, although optical laminated 240 can approximately be detector substrate 170 area 1/3, even optical laminated size is increased 0.5mm, also only can make optical laminated 440 2/3 the levels that still remain on less than detector substrate 170 areas.Usually, if optical laminated area less than 20% of detector substrate area, then advantageously, is being fixed to before the detector wafer fixed optics lamination and is making its singleization optical laminated.Because have only qualified optical laminatedly can be fixed to qualified detector, this can also make yield increase.
Further illustrate like Fig. 8 A, can bearing 460 be formed with optical laminated 440 in wafer scale.Bearing 460 can be any one in the above-mentioned bearing modification.In addition; Although all substrates in optical laminated 440 all are illustrated as with prolonging; But the optical laminated lens substrate that can comprise among Fig. 6 B; This lens substrate with optical cover lath sheet by fixing in wafer scale and after separated, make the optical cover base board for example that kind shown in Fig. 6 B extend beyond other lens substrate and have straight flange or hypotenuse.
Shown in Fig. 8 B, with each optical laminated 440 aim at and be fixed to detector wafer 170 ' after, can vertically separate this structure to form independent camera system 400 through for example modes such as cutting, etching.In addition, because the working region 176 of detector substrate 170 of only needing protection, bearing 460 can be more near working region 176, thereby increases and for example be used for the available areas that expose such as combination, integrated additional circuit.Shown in Fig. 8 A and 8B, can bearing 460 be carried out the wafer scale manufacturing with optical laminated 440, but can alternatively these bearings 460 be arranged on the detector substrate 170.Can be to realize any one of above design through the mode that increases surface area (for example, the area of section of optical laminated or optical laminated at least final stage substrate) fully.
Another optical laminated example has been shown in Fig. 9 A and 9B.And can simple lens system be used for full color or this simple lens system can be of a plurality of lens combinations.
In Fig. 9 A, different light paths corresponds to different field points from object.Can have major bore diaphragm S05 on first substrate 550, this major bore diaphragm S05 can limit the light that is input to camera.Second substrate 560 can comprise first plane of refraction 562, and this first plane of refraction 562 can help the light that is input to this first plane of refraction 562 is carried out to picture.Second substrate 560 can comprise second plane of refraction 564, and this second plane of refraction 564 can further be assisted light is carried out to picture.Diffraction element 572 can be positioned on the 3rd substrate 570, this diffraction element 572 can correcting chromatic aberration with differ.The 3rd substrate 570 can also comprise third reflect face 574, and this third reflect face 574 can further be assisted light is carried out to picture.Can have fourth reflect face 582 in the final stage substrate 580.Fourth reflect face 582 can be concave surface and can make the visual field of image smooth, so that all images point is at the same planar imaging that will be imaged onto on the detector array 24.
Can be clear that from Fig. 9 B interval S56, S67 and the S78 between the opposing substrates can be different.Although in other embodiments, for example the largest interval of S67 can be positioned at other places at interval, and in the ad hoc structure shown in Fig. 9 A and the 9B, largest interval S56 is between the major bore diaphragm S05 and first plane of refraction 562.
Another illustrative embodiments of imaging system has been shown in Figure 10.Shown in figure, this imaging system can comprise lens stack, and this lens stack is formed by first substrate 650 and second substrate 660.Imaging system can be separated with the cover plate 670 of the working region 674 that covers detector and be attached on this cover plate 670.
Use the fixed area 656,666 on the facing surfaces of first substrate 650 and second substrate 660, can first substrate 650 and second substrate 660 be fixed together in wafer scale.Can use being used for of discussing that the various technology (for example, bearing, perforated adhesive (punched adhesive), spacer wafer etc.) at interval accurately are set between substrate in the above.As discussed above, can optical laminated being fixed to be covered 670 in wafer scale or chip-scale.Here; Even if using in the above-mentioned isolation technics any one will open with lid optical laminated in 670 minutes; Can be in the space between first substrate 650 and second substrate 660 greater than the space between optical laminated (being meant the second surface of second substrate 660 here) and the lid 670.
Another illustrative embodiments of imaging system has been shown in Figure 11.As shown in the figure, imaging system can comprise lens stack, and this lens stack is formed by first substrate 740, second substrate 750 and the 3rd substrate 760.Can imaging system directly be attached on the cover plate 770 of the working region 774 that covers detector.
Shown in figure 11, the radius of curvature at refracting element 752,762 places can change.For example, second refracting element 752 can comprise central convex domain with first curvature radius and the peripheral recessed zone with different curvature radius.The third reflect element can comprise central fovea zone with second curvature radius and the peripheral convex domain with the 3rd radius of curvature.
At first, utilize the FX 746,756 and 766 on the facing surfaces separately of first substrate 740, second substrate 750 and the 3rd substrate 760 first substrate 740, second substrate 750 and the 3rd substrate 760 to be fixed together in wafer scale.Can use being used for of discussing that the various technology (for example, bearing, perforated adhesive, spacer wafer etc.) at interval accurately are set between substrate in the above.As discussed above, can optical laminated being fixed to be covered 770 in wafer scale or chip-scale.
Therefore, according to the embodiment of the present invention, the optical element that is used in the wafer scale manufacturing can be realized camera system, can utilize the flat surfaces of this optical element that this optical element is fixed.Can use and be used between these optical elements, being provided with various mechanism at interval.In whole optical module, can use dividing plate, it can comprise these mechanism at interval.These machine-processed at interval optical elements that can also seal and protect optical module.Can the final stage flat surfaces of optical system directly be arranged on detector array and list (that is, being arranged on the top of detector microlens array or detector cover plate).Can use diffraction element and other correcting element to proofread and correct and the deviation of the optical function expected (for example, the deviation of focal length or differ).Can the lens with different focal be arranged in the array of camera system, thereby further optical function is provided.
Execution modes more of the present invention can use lens combination array to each camera system (for example, to will by the lens combination of each color of optical system imaging).Other execution mode of the present invention can use the simple lens system to each camera system.Using can be so that optimizes each lens to the specific wave-length coverage that is associated to the lens combination of each color, and each lens can be thinner, and can be so that colour filter is arranged on (that is, after end face and before the detector array) within the optical system.Yet, use a plurality of lens combinations to increase the terminal signal processing that is used to merge the image that is generated to each camera system.Use simple lens system can be suitable for more conventional mode, reduce post-processed, thin but it may not be made, and it possibly keep color filter array in detector array.
Like United States Patent (USP) 5 in co-assigned; 912; 872 and 6; Disclosed in 096,155, the manufacturing of the passive optical component of wafer form and in wafer scale or chip-scale these passive optical components and other passive optical component or photoelectric cell to be fixed together and to use the jointing material of wafer and/or fixed wafer be known with sealing element therebetween.As it is disclosed therein; Can substrate be fixed on the flat surfaces of substrate; And, perhaps can merge adjacent substrate through providing jointing material (for example, the adhesive that epoxy resin, scolder, UV solidify, the adhesive of hot curing etc.) to fix substrate.Also disclosed like these patents, form cooperation and the aligning that behavioral characteristics comes assisting base plate with planography way.If the surface (for example, the upper surface of first substrate 110, optics cover plate 230 or filter substrate 302) of after wafer scale is fixing, still exposing forms optical element, then can form these elements in fixing back.
Also disclosed like these patents; Can make passive optical component with the mode of offset printing; Perhaps for example can wait and make parent part through the method for forming, offset printing method, cutting method; And can duplicate passive optical component according to this parent part, can in this dual mode any one be called " offset printing (lithograph) " here.In addition, for example, the United States Patent (USP) 6,027,595 that is incorporated into this with the mode of quoting as proof is disclosed, can the offset printing of duplicating be transferred in the substrate.Method and the material of making these passive optical components can be decided by the design of passive optical component.For example, have the refraction optical element of big depression (sag) if desired, because etching period is directly proportional with depression, the direct flat plate printing technology possibly made such lens for a long time, then duplicates to have advantage.
Be applicable to the transparent material limited amount of direct flat plate print process, for example, glass (for example, vitreous silica (fused silica)).Unfortunately, the material that much is suitable for the direct flat plate print process has similar refraction coefficient and scattering coefficient.This makes and is difficult to design high-quality camera system (that is, having the high MTF that strides whole visual field, the camera system that uses the optics of wafer scale manufacturing).Specifically, aberration can be the specific root of the MTF that causes reducing.A solution of this problem is to use diffraction element to reduce aberration.In addition, the wave-length coverage of each lens combination is narrowed down (that is, each lens combination is used various colors, can further reduce aberration).Another possible solution is when the offset printing article that duplicate are the final stage element, uses the for example plastic material of polymer to some lens surfaces.These plastic materials are usually cheap and lighter than glass, but have the scattering property of higher thermal coefficient of expansion and Geng Gao than glass.
Yet, compare with a kind of material of independent use, through the material (for example, high scattering material and low scattering material) that use has different dispersion characteristics, can realize higher MTF.For example, the element that duplicates can be processed by polymer, and the offset printing element can be processed by glass.These materials can have different thermal coefficient of expansions, different refractive index and different dispersion characteristics.Compare with a kind of material of independent use, the two comes constructing system through using polymer optical element and glass optical component, can realize higher MTF.Therefore, the direct flat plate print process is used for for example can having minimum diameter first refractive surface some optical elements and the replica plate print process is used for other optical element, can make this system.Certainly, all elements can be duplicate or directly form.
Can carry out wafer scale manufacturing and fixing at least two in first substrate, second substrate, final stage substrate and the detector array; Promptly; A plurality of these elements can be made and are fixed on together, carry out singleization afterwards to form the for example lamination shown in Fig. 2 B, Fig. 6 B, Fig. 7 or Fig. 8 A.According to through to quote the United States Patent (USP) the 6th, 451,150 and 6,483,627 that mode is incorporated into this co-assigned as proof, can realize this wafer scale manufacturing.In addition, even only fix, also can make all optical elements by wafer scale with chip-scale.
Can be with the parts of camera system fixing and singleization, will be fixed afterwards and the parts of the parts of singleization also fixing and singleization before being fixed to other parts.Perhaps, replace, have the different optical effect camera system array of (for example, different focal length) can be provided by different camera systems singleization of camera system.For example, can form one two and take advantage of two camera system array, one of them has the lens configuration of standard, and one has that wide-angle lens, one have telephoto lens and another has pack-shot lens (macro lens).
As go through in the above, in the design camera system, it is favourable that some position between first lens and the transducer has big space.Yet, when the optical element that used based on wafer, equally advantageously on substrate, make optical element on entire wafer, to support these elements with enough big thickness.This has limited the position that big space wherein can be set.Promptly; If big space is arranged between two elements; Then under many circumstances, when all still that camera system is required substrates and element are installed in the very thin spatial constraints, possibly be only position that can be used for being provided with big space between these two elements.In other words, in the design camera system, only has a big space.Therefore, the position of big space between any two elements or maximum interspace is crucial design parameter.
In the camera system design of routine, usually the space with maximum is arranged between final lens surface and the transducer.Often do like this is because be difficult to lens element directly to be arranged on the sensor plane or near sensor plane.As stated, in the wafer scale camera system, eliminated this restriction.As stated, optical surface can be easily near the sensor plane setting.With field flattener be provided with near sensor plane can so that a large amount of camera optics elements (for example; Element 112,124 among Figure 1A) has less aperture; And therefore have less diameter and SAG, and these elements are carried out camera function with higher filed curvature (field curvature) and more demagnification rate (demagnification).Field flattener can and make smooth higher field curvature and the more convergent-divergent multiplying power revised in visual field through the expansion visual field.Therefore; And maximum interspace is arranged between final lens element surface and the transducer relatively, makes the maximum interspace between any two parts be set at the manufacturability design that can easily obtain being used for the wafer scale camera system between two optical element surfaces.For example, shown in Figure 1A and Fig. 6 B, can the maximal clearance be arranged between the field flattener final lens surface and field flattener before.
In addition; Be provided with according to the embodiment of the present invention extend beyond optical laminated covered structure can be so that this covered structure be filled the post of the bearing of other element of camera system; For example, can on covered structure, center on the optical laminated light screening material that is provided with to reduce stray light.
At last; Although shown the certain lenses system of camera system; But can above principle be used for any such lens system design, that is, optical substrate is little with respect to detector substrate; For the quantity of detector, this can increase the quantity that can be manufactured on the lens combination on the wafer fully.
Here disclose execution mode of the present invention,, should on wide in range and illustrative meaning rather than from the restriction purpose, use and explain these terms although used specific term.For example, although from start to finish show three conventional look parts, can adopt any three looks or multicolor unit more suitably of realizing the full color camera.In addition, although show the round lens of sub-imager design, can use any realization other shapes (for example, hexagon lens) than the high assembled density of high fill factor (fill factor).In addition, although described the different apertures that pictures different is provided in having the sub-camera of same color, can use other optical element that this difference is provided.For example, can mould the working region self of pixel to different sub-cameras differently.Can combine arbitrary execution mode to use electric arbitrarily I/O solution.Correspondingly, will be understood by those skilled in the art that, can under the situation that does not break away from spirit that accompanying claims sets forth and scope, make the modification on the various forms or on the particular content.
Claims (41)
1. camera system, this camera system comprises:
Optical laminated; It comprises two substrates; Said optical laminated formation imaging system, each substrate have and are parallel to each other and two surfaces vertical with the optical axis of said imaging system, the FX on the said optical laminated apparent surface who is included in said two substrates; Said two substrates are in wafer scale in their corresponding fixed areas and are fixed together, and at least one surface in the said surface of said two substrates comprises the refractive surface of said imaging system;
One adhesive phase between optical laminated FX, comprises the passage that is used for through light path in the layer of this adhesive phase;
Detector substrate, it has the working region; And
Covered structure; It protects the working region of said detector substrate at least; The said optical laminated upper surface that is fixed to said covered structure, the diameter of said said plane of refraction in optical laminated less than with the diagonal of the corresponding said working region of said imaging system.
2. camera system according to claim 1, the surface area of wherein said at least one substrate in optical laminated is less than the upper surface area of said covered structure.
3. camera system according to claim 1 is wherein fixed said two substrates and said covered structure in wafer scale.
4. camera system according to claim 1, wherein said two substrates are with prolonging.
5. camera system according to claim 1, wherein said covered structure comprises the final stage optical element.
6. camera system according to claim 1, said camera system also comprise the final stage optical element between said optical laminated and said covered structure.
7. camera system according to claim 1 is wherein fixed said covered structure and said detector substrate in wafer scale.
8. camera system according to claim 1, wherein in wafer scale to said covered structure and said optical laminated fixing.
9. camera system according to claim 1, wherein said camera system comprise a plurality of sub-cameras, and each sub-camera has corresponding plane of refraction on said optical laminated same surface.
10. camera system according to claim 1, said camera system also comprise the spacer structure between apparent surface's the said FX.
11. camera system according to claim 10, wherein said spacer structure is an adhesive.
12. camera system according to claim 1, said camera system also comprise the conductive devices on the bottom surface of said detector substrate, this conductive devices is suitable for carrying out mounted on surface to being fixed with said optical laminated said detector substrate.
13. camera system according to claim 12, said camera system also comprise from said working region to the reel electrical interconnection at edge of said detector substrate of said conductive devices.
14. camera system according to claim 12, said camera system also comprises circuit board, is equipped with at this circuit board upper surface and is fixed with said optical laminated said detector substrate, and said conductive devices is soldered to said circuit board.
15. camera system according to claim 12, wherein said conductive devices is a scolder.
16. camera system according to claim 1, wherein said two surfaces comprise flat site.
17. camera system according to claim 1, wherein said FX is smooth.
18. a camera system, this camera system comprises:
Optical laminated; It comprises two substrates; Said optical laminated formation imaging system, each substrate have and are parallel to each other and two surfaces vertical with the optical axis of said imaging system the said optical laminated lip-deep FX that is included in the opposing parallel of said two substrates; Said two substrates are in wafer scale in their corresponding fixed areas and are fixed together, and at least one surface in the said parallel surfaces of said two substrates comprises the plane of refraction of said imaging system;
One adhesive phase between optical laminated FX, comprises the passage that is used for through light path in the layer of this adhesive phase;
Detector substrate, it has the working region; And
Conductive devices on the bottom surface of said detector substrate, it is suitable for said detector substrate is carried out mounted on surface.
19. camera system according to claim 18, said camera system also comprise from said working region to the reel electrical interconnection at edge of said detector substrate of said conductive devices.
20. camera system according to claim 18, said camera system also comprises circuit board, is equipped with at this circuit board upper surface to have said optical laminated said detector substrate, and said conductive devices is soldered to said circuit board.
21. camera system according to claim 20, wherein said conductive devices is a scolder.
22. camera system according to claim 19, wherein said two surfaces comprise flat site.
23. a method of making camera system, this method may further comprise the steps:
Aligning comprises the optical laminated wafer of first wafer and second wafer, and said optical laminated wafer forms a plurality of imaging systems;
Said optical laminated wafer is fixed in zone on the apparent surface of said first wafer and said second wafer; Said apparent surface is parallel to each other and perpendicular to the optical axis of said imaging system, spacer structure is arranged between the FX on the relative parallel surfaces;
Pass said apparent surface and separate said first wafer and said second wafer that is fixed, form thus a plurality of optical laminated, each optical laminated imaging system that includes; And
With the optical laminated detector substrate with working region that is fixed to, the diameter of refractive surface is less than the diagonal of said working region.
24. method according to claim 23, wherein fixing said optical laminated step comprises when said detector substrate is the part of detector wafer the said optical laminated detector substrate that is fixed to.
25. method according to claim 24, said method also comprise the covered structure wafer is fixed to said detector wafer.
26. method according to claim 25; Said method comprises that also passing said apparent surface separates said covered structure wafer, the said detector wafer and said optical laminated that is fixed; To form a plurality of camera systems, each camera system includes covered structure, detector and optical laminated.
27. method according to claim 26, the surface area of wherein said at least one substrate in optical laminated is less than the upper surface area of said covered structure.
28. method according to claim 23, said method also comprise covered structure is fixed between the said optical laminated and said detector substrate.
29. method according to claim 23, said method is further comprising the steps of:
Whether confirm optical laminated qualified;
Confirm whether said working region is qualified; And
Only with the qualified optical laminated qualified working region that is fixed to.
30. method according to claim 23, wherein said spacer structure is an adhesive.
31. method according to claim 30, said method also are included in said adhesive middle punch and form light path.
32. method according to claim 30, said method also are included on the bottom surface of said detector substrate and form conductive devices, said conductive devices is suitable for said detector substrate is carried out mounted on surface.
33. method according to claim 32, said method also comprise formation from said working region to the reel electrical interconnection at edge of said detector substrate of said conductive devices.
34. method according to claim 32, said method is further comprising the steps of:
Circuit board is set; And
Fix said conductive devices and said circuit board through reflux solder.
35. method according to claim 34, wherein said conductive devices is a scolder.
36. a method of making camera system, this method may further comprise the steps:
Aligning comprises the optical laminated wafer of first wafer and second wafer, and said optical laminated wafer forms a plurality of imaging systems;
Said optical laminated wafer is fixed in zone on the apparent surface of said first wafer and said second wafer, and said apparent surface is parallel to each other and perpendicular to the optical axis of said imaging system;
Pass said parallel surfaces and separate said first wafer and said second wafer that is fixed, form thus a plurality of optical laminated, each optical laminated imaging system that includes;
With the optical laminated detector substrate that is fixed to working region; And
On the bottom surface of said detector substrate, form conductive devices, said conductive devices is suitable for said camera system is carried out mounted on surface; And
Circuit board is set, and wherein said conductive devices is fixed to said circuit board through reflux solder.
37. method according to claim 36, said method also comprise formation from said working region to the reel electrical interconnection at edge of said detector substrate of said conductive devices.
38. method according to claim 36, said method also is included between the FX on the relative parallel surfaces spacer structure is set.
39. according to the described method of claim 38, wherein said spacer structure is an adhesive.
40. according to the described method of claim 39, said method also is included in said adhesive middle punch and goes out light path.
41. method according to claim 36, wherein said conductive devices are said scolders.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/487,580 US8049806B2 (en) | 2004-09-27 | 2006-07-17 | Thin camera and associated methods |
| US11/487,580 | 2006-07-17 | ||
| US85536506P | 2006-10-31 | 2006-10-31 | |
| US60/855,365 | 2006-10-31 | ||
| PCT/US2007/016156 WO2008011003A2 (en) | 2006-07-17 | 2007-07-17 | Camera system and associated methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101512768A CN101512768A (en) | 2009-08-19 |
| CN101512768B true CN101512768B (en) | 2012-11-21 |
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|---|---|---|---|
| CN2007800336275A Expired - Fee Related CN101512768B (en) | 2006-07-17 | 2007-07-17 | Camera system and associated methods |
Country Status (5)
| Country | Link |
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| EP (1) | EP2044629A4 (en) |
| JP (2) | JP5292291B2 (en) |
| KR (1) | KR101185881B1 (en) |
| CN (1) | CN101512768B (en) |
| WO (1) | WO2008011003A2 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2009544226A (en) | 2009-12-10 |
| EP2044629A2 (en) | 2009-04-08 |
| CN101512768A (en) | 2009-08-19 |
| KR101185881B1 (en) | 2012-09-25 |
| JP5292291B2 (en) | 2013-09-18 |
| WO2008011003A2 (en) | 2008-01-24 |
| JP2013153537A (en) | 2013-08-08 |
| JP5372280B2 (en) | 2013-12-18 |
| KR20090034981A (en) | 2009-04-08 |
| WO2008011003A3 (en) | 2008-06-26 |
| EP2044629A4 (en) | 2012-08-01 |
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