CN103620468A - Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit - Google Patents
Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit Download PDFInfo
- Publication number
- CN103620468A CN103620468A CN201280029403.8A CN201280029403A CN103620468A CN 103620468 A CN103620468 A CN 103620468A CN 201280029403 A CN201280029403 A CN 201280029403A CN 103620468 A CN103620468 A CN 103620468A
- Authority
- CN
- China
- Prior art keywords
- lens
- dividing plate
- wafer
- substrate
- wafer lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
Abstract
The purpose of the present invention is to provide a method for manufacturing wafer lenses, wherein even if the outer diameters of lens sections are not uniform, interference between the outer circumferential portions of the lens sections and spacers can be eliminated with a small space. An adhesive (106) is hardened in a state wherein a constant interval (X) is kept between a substrate (101) and a spacer (105) without having the substrate and the spacer abut on each other, thereby preventing a second lens element (12) and the spacer (105) from interfering with each other when the wafer lenses are laminated, even if the outer diameters of the second lens elements (12) on the first and the second wafer lenses (100, 200) are not uniform. Consequently, a trouble of having the spacer (105) in contact with and placed over the outer circumferential portion (12b) of the second lens element (12) can be eliminated. Furthermore, pitches between the lenses can be reduced compared with the case where buffer regions are provided in first and second molding dies (41, 42), i.e., transfer molding dies for forming the first and the second lens elements (11, 12), and cost of the first and the second molding dies (41, 42) can be reduced.
Description
Technical field
The present invention relates to the manufacture method of wafer lens, particularly for the manufacture method of the manufacture method of the wafer lens in uses such as imaging lens systems and the wafer lens of manufacturing by this manufacture method and the lens unit that obtains from wafer lens and the lens unit of manufacturing by this manufacture method.
Background technology
As the manufacture method of wafer lens, for example make hardening resin, between substrate (, glass plate) and shaping mould and make this hardening resin harden to make the method (for example,, with reference to patent documentation 1) of lens section moulding.Now, lens section is arranged independently on substrate.In the situation that stacked multiple such wafer lens, according to compatibly determining interval each other of wafer lens, keeping the reasons such as bond strength, have and between wafer lens, sandwich dividing plate bonding structure.Now, if due to for lens section being carried out to the deviation etc. of adjustment amount (sendout) of the resin of moulding, on substrate, the external diameter of the lens section of moulding produces deviation, has the peripheral part of lens section and the danger that dividing plate disturbs when bonding.
On the other hand, the external diameter that has to control lens section is object, has the method (for example,, with reference to patent documentation 2) that absorbs the such buffer area of the spill-out of resin in the transfer mold for lens section being carried out to moulding on substrate.
But, in the method for patent documentation 2, result from buffer area after moulding and after stacked, not have the region of function remaining, so exist, be difficult to make between lens spacing such problem that narrows down.Therefore, between the lens of adjacent lens section, spacing broadens and the quantity of the lens section that can configure in 1 wafer reduces, and is difficult to obtain being suitable for the mass-produced wafer lens of lens.In addition, if also there is the structure of the expansion be provided for suppressing resin in the buffer area of transfer mold, the shape of transfer mold becomes complicated, the such problem of difficulty that processing cost improves, processing becomes.
Patent documentation 1: TOHKEMY 2009-226631 communique
Patent documentation 2: Japanese Unexamined Patent Application Publication 2009-530135 communique
Summary of the invention
The object of the invention is to, a kind of manufacture method of wafer lens is provided, even if the external diameter of lens section produces deviation, also can save space and prevent the interference of peripheral part and the dividing plate of lens section.
In addition, the object of the present invention is to provide a kind of wafer lens, even if the external diameter of lens section produces deviation, by saving space and preventing the interference of peripheral part and the dividing plate of lens section, improve reliability.
In addition, the object of the present invention is to provide a kind of manufacture method of the lens unit obtaining from above-mentioned wafer lens and the lens unit of manufacturing by this manufacture method.
In order to solve above-mentioned problem, the invention provides a kind of manufacture method of wafer lens, this wafer lens possesses: substrate; A plurality of lens sections, moulding and comprise optical surface at least one party's of described substrate real estate; And dividing plate, being arranged at the substrate surface side of one and thering is the opening corresponding with described lens section, described manufacture method is characterised in that and comprises: molding procedure, to supplying with resin on a side real estate and between shaping mould, makes lens section moulding; Apply operation, at least a portion of at least one party in the composition surface of real estate and composition surface dividing plate an and dividing plate and real estate side of the side, apply bonding agent; Keep operation, separate real estate and dividing plate that certain interval keeps a side; And hardening process, make adhesive hardens being situated between between a side real estate and dividing plate to have under the state of bonding agent.Herein, separate certain interval and refer to: the state of be not spaced apart zero, not a side's of substrate real estate and dividing plate being close to, and separate the state in small gap.In addition, the position relationship of substrate and dividing plate (for example end face) of can take is benchmark, carries out for separating the adjustment at this certain interval.In addition, when stacked multiple wafer lens for example, the position relationship of substrate and substrate of can also take is adjusted interval as benchmark.In this case, no matter in situation devious or in the situation that have error in the size of dividing plate, can both carry out accurately stacked in the thickness of the resin of wafer lens.
According to the manufacture method of above-mentioned wafer lens, by making substrate and dividing plate keep making adhesive hardens under the state at certain interval, even if the external diameter of the lens section on wafer lens produces deviation and a part for lens section is disposed between substrate and dividing plate, also can when stacked, make lens section and dividing plate not disturb.Thus, can prevent that dividing plate from touching the peripheral part of lens section and touching such defect.In addition, than the situation that buffer area is set in the transfer mold lens section being carried out to moulding, can make between lens spacing narrower.
In concrete pattern or viewpoint of the present invention, in the molding procedure of the manufacture method of above-mentioned wafer lens, for each position corresponding with lens section on a side real estate and between shaping mould, supply with independently resin.In this case, can be on real estate with the state being separated from each other, form a plurality of lens sections.
In different viewpoint of the present invention, after applying operation, keep operation.In this case, applied bonding agent in substrate and/or dividing plate after, make substrate and dividing plate separate certain interval and subtend.
In further different viewpoint of the present invention, after keeping operation, apply operation.In this case, making substrate and dividing plate separate certain interval, under the state of subtend, in the gap of substrate and dividing plate, fill bonding agent.
In further different viewpoint of the present invention, the distance of the outer rim of optical surface of the lens section at least one direction parallel with real estate and the outer rim of the peripheral part of lens section is greater than the distance of the outer rim of optical surface of the lens section in corresponding direction and the edge of the opening of dividing plate.Herein, the edge of the opening of dividing plate is edge or the angle with the end face of the dividing plate of real estate subtend.In this case, the peripheral part of lens section is formed between substrate and dividing plate, but owing to being provided with certain interval between substrate and dividing plate, so can prevent that dividing plate from touching the peripheral part of lens section.
In further different viewpoint of the present invention, maximal value in the peripheral part of the lens section at least one direction parallel with real estate and the thickness overlapping position of dividing plate is thinner than certain interval of a side real estate and dividing plate.In this case, can not make reliably the peripheral part of lens section touch and receive dividing plate.In addition, the real estate while being made as with the engaging of dividing plate means the surface of substrate, in the situation that formed other films of aperture in the surface of substrate, about the thickness of the peripheral part of lens section, is made as to add the thickness of upper film and the value that obtains is benchmark.
In further different viewpoint of the present invention, the substrate with lens section is folded more than 2 layers across carrier ring.In this case, even if the external diameter of the lens section of each layer produces deviation, can when stacked, not make lens section and dividing plate disturb yet.
In the further different viewpoint of the present invention, lens section is arranged independently with the state being separated from each other.Herein, if lens section is independent on real estate, the situation that the ladder being formed by the peripheral part of real estate and lens section is connected than lens section is larger.By making substrate and dividing plate mutually not touch and connect the state that becomes the interval that has kept certain, even if the ladder of the lens section on wafer lens becomes large or produces deviation, can when stacked, not make lens section and dividing plate disturb yet.
In further different viewpoint of the present invention, in molding procedure, lens section is by having the transfer mold moulding of the forming surface of lens section being carried out to the transfer surface of transfer printing, and transfer surface has hydrophobicity.In this case, by transfer surface, there is hydrophobicity, can make the demoulding of wafer lens become easy.
In further different viewpoint of the present invention, at a side real estate, carry out hydrophilicity-imparting treatment.In this case, particularly, by carrying out such as coupling processing, Cement Composite Treated by Plasma etc. at real estate as hydrophilicity-imparting treatment, can make the cementability of real estate and resin become good.In addition, by carrying out above-mentioned processing, the peripheral part of lens section is than expansion significantly, but owing to being provided with certain interval between substrate and dividing plate, so can prevent that the peripheral part of lens section from touching, receives dividing plate.
In order to solve above-mentioned problem, the invention provides a kind of wafer lens, possess: substrate; A plurality of lens sections, moulding and comprise optical surface at least one party's of substrate real estate; And dividing plate, be arranged at a side substrate surface side and there is the opening corresponding with lens section, in the edge of the opening of dividing plate, the thickness of the peripheral part of lens section is thinner than the interval of a side real estate and dividing plate.
According to above-mentioned wafer lens, by substrate and dividing plate, via bonding agent, there is certain interval, the peripheral part that can prevent lens section touches receives dividing plate.Thus, even if the external diameter of the lens section on wafer lens produces deviation, a part for lens section is disposed between substrate and dividing plate, also can when stacked, not make lens section and dividing plate disturb.In addition, the situation than buffer part is set in the transfer mold lens section being carried out to moulding, can make spacing between lens narrow down, and can cut down for wafer lens being carried out to the cost of the transfer mold of moulding.
In concrete pattern or viewpoint of the present invention, in above-mentioned wafer lens, at least one of lens section with from other lenses part from state independent.In this case, wafer lens become the lens section interconnective fly's-eye lens of the structure that has been separated from each other such as each lens section, stated number separated each other structure etc.
In different viewpoint of the present invention, there is the vestige cutting off in the parallel direction of the optical axis with lens section, the section of the vestige having cut off have comprise dividing plate at least carrier ring, comprise the adhesive linkage of bonding agent and the resin bed that comprises the peripheral part of lens section.In this case, in the cut-out of wafer lens the section of vestige in, resin bed and carrier ring become and sandwich betwixt adhesive linkage, the state that the peripheral part of lens section does not disturb with dividing plate.
In order to solve above-mentioned problem, the manufacture method of lens unit of the present invention possesses the cutting action that cuts out above-mentioned wafer lens.Herein, lens unit is not limited to the example cutting out from multiple stacked wafer lens, and also comprises the example having cut out from 1 wafer lens.
According to the manufacture method of said lens unit, cut out above-mentioned wafer lens, so can make the dimensional accuracy of lens unit become good.In addition, can use the narrow wafer lens of spacing between lens, so can manufacture in a large number lens unit.
In concrete pattern or viewpoint of the present invention, in the manufacture method of said lens unit, possessed before cutting action the stacked operation of stacked wafer lens and at least 1 other wafer lens under the state across dividing plate.In this case, even in the situation that stacked more than 2 wafer lens, also can the good lens unit of manufacturing dimension precision.
In order to solve above-mentioned problem, the invention provides a kind of the 1st lens unit, possess: substrate; At least one compound lens, moulding and there is the lens section that comprises optical surface at least one party's of substrate real estate; And dividing plate, be arranged at a side substrate surface side and there is the opening corresponding with lens section, in the edge of the opening of dividing plate, Thickness Ratio one side's real estate and the interval of dividing plate of the peripheral part of lens section are thinner.
According to above-mentioned the 1st lens unit, in the edge of the opening of dividing plate, the thickness of the peripheral part of lens section is thinner than the interval of a side real estate and dividing plate, so lens section and dividing plate can not disturb, it is good that the dimensional accuracy of lens unit becomes.
In order to solve above-mentioned problem, by the manufacture method of said lens unit, manufacture the 2nd lens unit of the present invention.
According to above-mentioned the 2nd lens unit, cut out above-mentioned wafer lens, so can make the dimensional accuracy of lens unit become good.
Accompanying drawing explanation
Figure 1A is the vertical view of the wafer lens after stacked, and Figure 1B is the AA arrow sectional view of the wafer lens after stacked shown in Figure 1A.
Fig. 2 is the part enlarged drawing of the wafer lens of Figure 1A.
Fig. 3 A～3E is for the figure of the manufacturing process of wafer lens is described.
Fig. 4 is the concept map of the stacked laminator that uses in the manufacture method of the wafer lens of the 1st embodiment of explanation.
Fig. 5 is the process flow diagram of molding procedure in the manufacturing process of explanation wafer lens.
Fig. 6 is the process flow diagram of dividing plate installation procedure in the manufacturing process of explanation wafer lens.
Fig. 7 is the process flow diagram of the stacked operation of wafer lens in the manufacturing process of explanation wafer lens.
Fig. 8 A is the sectional view of lens unit, and Fig. 8 B is the concept map when wafer lens after stacked is cut.
Fig. 9 is the concept map of the stacked laminator that uses in the manufacture method of wafer lens of explanation the 2nd embodiment.
Figure 10 is the sectional view of wafer lens after explanation the 3rd embodiment stacked.
Figure 11 is the sectional view of wafer lens after explanation the 4th embodiment stacked.
Figure 12 is the sectional view of the wafer lens of explanation the 5th embodiment.
Figure 13 A is the process flow diagram of the dividing plate installation procedure in the manufacturing process of wafer lens of explanation the 6th embodiment, and Figure 13 B is the process flow diagram of the stacked operation of explanation wafer lens.
Figure 14 is the figure of the variation of the wafer lens shown in explanation Figure 1A waits.
Figure 15 is the figure of variation of the lens unit of key diagram 8A.
Embodiment
(the 1st embodiment)
A) wafer lens
With reference to accompanying drawing, the wafer lens of the 1st embodiment of the present invention is described.
As shown in Figure 1A and 1B, lit-par-lit structure body 1000 is structures of 2 wafer lens extending abreast with xy face of the 2nd wafer lens 200 of stacked the 1st wafer lens 100 and other wafer lens in Z-direction.By utilization cutting, cut out lit-par-lit structure body 1000, the lens unit 2000(that can access 2 compound lenses 10 stacked is with reference to Fig. 8 A).In addition, lit-par-lit structure body 1000 is also the wafer lens of broad sense.
The 1st wafer lens 100 in lit-par-lit structure body 1000 is the wafer lens with dividing plate.The 1st wafer lens 100 is for example discoid, has substrate 101, the 1st resin bed the 102, the 2nd resin bed 103, aperture 104 and dividing plate 105.Herein, the 1st and the 2nd resin bed 102,103 is mutually aimed at and is engaged with substrate 101 about the translation in the xy face vertical with axle AX and around the rotation of axle AX.In the 1st wafer lens 100, as forming its optical element, form a plurality of compound lenses 10 and arrange two-dimensionally along xy face.Each compound lens 10 has at the upper stacked structure of optical axis OA direction (paper above-below direction), has around optical axis and forms the lens body 10a of optical surface and the flange part 10b existing at the periphery of lens body 10a.
The 1st resin bed 102 is resins, on a side's of substrate 101 face 101a, forms.The 1st resin bed 102 has a plurality of the 1st lens key elements 11.Each the 1st lens key element 11 is independent with the state being separated from each other, and forms the top of the lens body 10a of compound lens 10.In each the 1st lens key element 11 xy face on substrate 101, arrange two-dimensionally.The 1st lens key element 11 is lens sections of the aspheric surface type of for example convex form, has the 1st optical surface 11a.The 1st optical surface 11a of each the 1st lens key element 11 becomes the 1st forming surface 102a by transfer printing in the lump moulding.In the 1st resin bed 102,, be formed with peripheral part 11b at the 1st optical surface 11a of each the 1st lens key element 11 around.Peripheral part 11b is when moulding, by the 1st optical surface 11a is carried out to the resin that the transfer surface of moulding overflows form from transfer mold.In addition, peripheral part 11b does not have the specific functions such as optical function.
The 1st resin bed 102 is formed by ray hardening resin.In ray hardening resin, comprise the Photoepolymerizationinitiater initiater that the polymerization of ray hardening resin is started.As ray hardening resin, can use acryl resin, allyl ester resin, epoxy is resin, vinylite etc.In the situation that using acryl resin, allyl ester resin and vinylite, can make by the free radical polymerization of Photoepolymerizationinitiater initiater reaction sclerosis, in the situation that using epoxy to be resin, can make by the cationic polymerization of Photoepolymerizationinitiater initiater reaction sclerosis.
The 2nd resin bed 103 and the 1st resin bed 102 similarly, are resins, on the opposing party's of substrate 101 face 101b, form.The 2nd resin bed 103 has a plurality of the 2nd lens key elements 12.Each the 2nd lens key element 12 is independent with the state being separated from each other, and forms the bottom of the lens body 10a of compound lens 10.In each the 2nd lens key element 12 xy face on substrate 101, arrange two-dimensionally.The position of each the 2nd lens key element 12 is corresponding to the position of each the 1st lens key element 11 of the opposition side of substrate 101.The 2nd lens key element 12 is lens sections of the aspheric surface type of for example convex form, has the 2nd optical surface 12a.The 2nd optical surface 12a of each the 2nd lens key element 12 becomes the 2nd forming surface 103a by transfer printing in the lump moulding.In the 2nd resin bed 103,, be formed with peripheral part 12b at the 2nd optical surface 12a of each the 2nd lens key element 12 around.Peripheral part 12b is when moulding, by the 2nd optical surface 12a is carried out to the resin that the transfer surface of moulding overflows form from transfer mold.In addition, peripheral part 12b also can not have the specific functions such as optical function.
The ray hardening resin using in the 2nd resin bed 103 is identical with the ray hardening resin of the 1st resin bed 102.But, without forming two resin beds 102,103 with same ray hardening resin, and can form by different ray hardening resins.
Herein, shown in amplifying just like Fig. 2, between the opposing party's the face 101b and the end face of dividing plate 105 of substrate 101, the situation (dotted line in figure) that the peripheral part 12b of the 2nd lens key element 12 extends.Such state due to the big or small deviation of the diameter of the opening 105b of dividing plate 105, the surperficial wettability of the skew of the position of the dividing plate 105 of relative the 1st wafer lens 100 or the deviation of adjustment amount, substrate 101 produce.In this case, xy face, with the outer rim of the 2nd optical surface 12a of the 2nd lens key element 12 at least one parallel direction of the opposing party's of substrate 101 face 101b and the distance L 1 that the distance L 2 of the outer rim of the peripheral part 12b of the 2nd lens key element 12 is greater than the outer rim of the 2nd optical surface 12a of the 2nd lens key element 12 in corresponding direction and the edge 105e of the opening 105b of dividing plate 105.Herein, the edge 105e of opening 105b is a side edge or the angle of end face 105c of the dividing plate 105 of face 101b subtend substrate 101 and the opposing party.The 1st wafer lens 100 is in situation as described above, and in the edge 105e of opening 105b, the thickness of peripheral part 12b is also thinner than the interval X of a side's of the opposing party's of substrate 101 face 101b and dividing plate 105 end face 105c.; because the maximal value t of the thickness (thickness of optical axis direction) of in the 1st wafer lens 100 at least one direction (AB direction) and the peripheral part 12b overlapping position of dividing plate 105 is thinner than above-mentioned certain interval X; in other words; interval X is greater than maximal value t, so the peripheral part 12b of the 2nd lens key element 12 can not touch the end face 105c that receives dividing plate body 105a.Herein, maximal value t is the thickness of the peripheral part 12b in the optical axis OA direction of edge 105e of opening 105b of common dividing plate 105.The maximum discharge-amount determining according to the deviation of the discharge-amount of both having known by resin or surperficial wettability, the shape of the shaping mould of both having known, substrate 101 or dividing plate 105, predict the maximal value t of thickness of the peripheral part 12b of the 2nd lens key element 12.According to the maximal value t of this prediction, determine interval X.In addition, the thickness of also considering aperture 104 decides interval X.Particularly, in the situation that be provided with aperture 104 on the opposing party's of substrate 101 face 101b, for the maximal value t that the height from surperficial 401a to as aperture 104 is predicted adds the thickness t 2 of aperture 104 for example and the correction maximal value t'=t+t2 that obtains determines interval X as benchmark, aperture 104 and dividing plate 105 are not close to.In addition, above, the relation of maximal value t and interval X has only been described with regard to AB direction, but just the CD direction vertical with AB direction, they third side to, be also desirably between maximal value t and interval X, set up with above-mentioned same relation.
The 2nd wafer lens 200 is the wafer lens without dividing plate.The 2nd wafer lens 200 and the 1st wafer lens 100 similarly, are for example discoid, have substrate 101, the 1st resin bed 102 and the 2nd resin bed 103.In the 2nd wafer lens 200, also with the 1st wafer lens 100 similarly, in at least one direction with the maximal value t of the thickness of the peripheral part 11b of the overlapping position of the dividing plate 105 arranging in the 1st wafer lens 100 than above-mentioned certain interval X(particularly, the interval X of a side's of substrate 101 face (real estate) 101b and the opposing party's of dividing plate 105 end face 105d) thinner.In the situation that be provided with aperture 104 on a side's of substrate 101 face 101a, consider that the thickness t 2 of aperture 104 decides interval X herein.In addition, about the structure of the 2nd wafer lens 200, except dividing plate 105, identical with the structure of the 1st wafer lens 100, so description thereof is omitted.
B) lens manufacturing installation
Below, with reference to Fig. 3 A～3E and Fig. 4, an example of the lens manufacturing installation of the wafer lens 100,200 shown in waiting for the manufacture of Figure 1A is described.
Lens manufacturing installation possesses the shaped device (being only depicted as pattern 40) shown in Fig. 3 C etc. and the stacked laminator 50 shown in Fig. 4.
B-1) shaped device
Shaped device flow on shaping mould 40 or substrate 101 for the resin that makes liquid shape and sclerosis and carry out the moulding of the 1st and the 2nd wafer lens 100,200.Until the state (following, to be made as not stacked wafer lens 110) of installing before dividing plate 105 can be made the 1st wafer lens 100.Below, not stacked wafer lens 110 and the 2nd wafer lens 200 are same structures, for the purpose of simplifying the description, the front not stacked wafer lens 110 that completes of the 1st wafer lens 100 are mainly described.
Although the diagram of omission, but shaped device is except main parts are shaping mould 40, also possess for make shaping mould 40 move, carry out on-off action etc. shaping mould jacking gear, for by resin-coating to the resin coating apparatus of substrate 101, for making the UV light generating apparatus of hardening of resin, for taking out the stripper apparatus of the 1st after moulding and the 2nd wafer lens 100,200, for driving accessory drive of these devices etc.In addition, possesses the device (camera and axle) of mutually aiming at wafer lens, dividing plate.In addition, also can be used as with shaped device and independently install, resin coating apparatus, stripper apparatus are set.
As shown in Fig. 3 C etc., shaping mould 40 possesses the 1st shaping mould 41 and the 2nd shaping mould 42.The 1st resin bed 102 and the moulding successively in the two sides of substrate 101 101a, 101b of the 2nd resin bed 103, when the demoulding, the state that the side's that a side the 1st shaping mould 41 becomes at substrate 101 face 101a side and the 1st resin bed 102 configure closely.The state that the opposing party's that the opposing party's the 2nd shaping mould 42 becomes at substrate 101 face 101b side and the 2nd resin bed 103 configure closely.
The 1st shaping mould 41 carries out moulding for the 1st forming surface 102a to not stacked wafer lens 110.The 1st shaping mould 41 is glass systems of transmitance, has the profile on the plectane of wall thickness.The 1st shaping mould 41, on the end face 41a of substrate 101 sides, has the 1st transfer surface 41b corresponding with the 1st forming surface 102a of the 1st resin bed 102.The 1st transfer surface 41b has the 1st optical surface transfer surface 41c of each the 1st optical surface 11a that is used to form the 1st forming surface 102a.Dispose to the 1st optical surface transfer surface 41c array-like a plurality ofly, form accordingly the roughly concave shape of hemisphere with the shape of the 1st optical surface 11a.In addition, the 1st shaping mould 41 is transparent materials, can be also for example resin, on glass substrate, with resin, form the example of mould.
The 2nd shaping mould 42 carries out moulding for the 2nd forming surface 103a to not stacked wafer lens 110.The 2nd shaping mould 42 also with the 1st shaping mould 41 similarly, be the glass system of transmitance, there is the discoideus profile of wall thickness.The 2nd shaping mould 42, on the end face 42a of substrate 101 sides, has the 2nd transfer surface 42b corresponding with the 2nd forming surface 103a of the 2nd resin bed 103.The 2nd transfer surface 42b has the 2nd optical surface transfer surface 42c of each the 2nd optical surface 12a that is used to form the 2nd forming surface 103a.Configured to the 2nd optical surface transfer surface 42c array-like a plurality ofly, formed accordingly the roughly concave shape of hemisphere with the shape of the 2nd optical surface 12a.
Above, to the 1st and the 2nd transfer surface 41b, 42b, implemented hydrophobic processing.Thus, can make the demoulding of not stacked wafer lens 110 become easy.
B-2) stacked laminator
The stacked laminator 50 of Fig. 4 is for forming the installation of the dividing plate 105 of the 1st wafer lens 100.In addition, stacked laminator 50 is for stacked the 1st wafer lens 100 and the 2nd wafer lens 200 that dividing plate 105 has been installed.
The 1st supporting mass 51 is for supported diaphragm 105.The 1st supporting mass 51 be arranged at not stacked wafer lens 110 grades the downside that is mounted object, be the downside of stacked laminator 50.The 1st supporting mass 51 is smooth flat boards, and XY face keeps dividing plate 105 abreast relatively.In the installation surface of the dividing plate 105 of the 1st supporting mass 51, be formed with for adsorbing the end face 105d(of dividing plate 105 with reference to the enlarged drawing of Figure 1B) a plurality of adsorption hole 51a.Each adsorption hole 51a is communicated with adsorbent equipment 56.When the absorption of dividing plate 105, the end face 51b of the 1st supporting mass 51 becomes the state of being close to the end face of dividing plate 105.
The 2nd supporting mass 52 is for the not stacked wafer lens 110 of supporting.The 2nd supporting mass 52 is arranged at upside that not stacked wafer lens 110 grades are mounted object, is the upside of stacked laminator 50.The 2nd supporting mass 52 is smooth flat boards, and XY face keeps not stacked wafer lens 110 abreast relatively.In the 2nd supporting mass 52, in the position corresponding with the 1st lens key element 11 of not stacked wafer lens 110, be formed with lens protection hole 52a.The diameter of lens protection hole 52a is greater than the outer rim of the 1st optical surface 11a of the 1st lens key element 11.The degree of depth of lens protection hole 52a becomes the discontiguous degree of the 1st optical surface 11a of the 1st lens key element 11.Substantial middle at each lens protection hole 52a, is formed with for adsorbing the adsorption hole 52b of not stacked wafer lens 110.Each adsorption hole 52b is communicated with adsorbent equipment 56.When the absorption of not stacked wafer lens 110, the end face 52c of the 2nd supporting mass 52 becomes the state that the face 101a with a side of the substrate 101 of not stacked wafer lens 110 is close to.In addition, the 52d of position finding portion in the periphery of the 2nd supporting mass 52, be provided with downwards, the 1st supporting mass 51 sides being extended.The 52d of position finding portion is the detected object portion of aftermentioned position transducer portion 55.
Z axis control part 54 is for adjusting the position of the Z-direction of the 2nd supporting mass 52.Z axis control part 54 has holding plate 54a and Z axis is controlled drive division 54b.Holding plate 54a in Z axis control part 54 keeps the 2nd supporting mass 52 via inclination control portion 53.Z axis is controlled the opposition side that drive division 54b is arranged at the 2nd supporting mass 52.In Z axis control part 54, use such as servo motor etc.By making 54 actions of Z axis control part, can adjust via holding plate 54a the position of the Z-direction of the 2nd supporting mass 52.
Position transducer portion 55 is for detection of the position of not stacked wafer lens 110.In position transducer portion 55, in the mode of the 52d of the position finding portion subtend with the 2nd supporting mass 52, be provided with test section 55a.Test section 55a detects the detection information from the 52d of position finding portion of the 2nd supporting mass 52.According to detected detection information, measure the position of the 2nd supporting mass 52, the particularly position of Z-direction and inclination etc.Take dividing plate 105 absorption stationary plane the position of the end face 51b of the 1st supporting mass 51 (or extending plane) C1 be benchmark, the absorption stationary plane of the not stacked wafer lens 110 of the position C1 by the opposing end surface 51b i.e. position of the end face 52c of the 2nd supporting mass 52 (or extending plane) C2 is obtained the position of the 2nd supporting mass 52.For example, the in the situation that dividing plate 105 being installed in not stacked wafer lens 110, take the substrate 101 of not stacked wafer lens 110 and the position relationship of dividing plate 105 carries out the adjustment of interval X as benchmark.In addition, the in the situation that of the stacked the 1st and the 2nd wafer lens 100,200, the position relationship of substrate 101 of two wafer lens 100,200 of take carries out the adjustment of interval X as benchmark.The in the situation that of being provided with aperture 104 on substrate 101, can take the surface of substrate 101 bodies is benchmark, but can also take the surface of aperture 104, is benchmark.In position transducer portion 55, use such as optical encoder, laser extensometer, electrostatic capacitance sensor etc.
C) manufacture method of wafer lens
With reference to Fig. 3 A～3E, Fig. 4, Fig. 5 and Fig. 6, the manufacturing process of the 1st wafer lens 100 that the above-mentioned shaped device of use, stacked laminator 50 carry out is described.In addition, below, the moulding of the 1st wafer lens 100 etc. is described, but also carries out same operation about the 2nd wafer lens 200.
(molding procedure)
By using the 1st and the 2nd shaping mould 41,42 shown in Fig. 3 C, make not shown jacking gear, resin coating apparatus and the action of UV light generating apparatus, carry out molding procedure.Molding procedure as shown in Figure 5, possesses aperture and forms operation (step S11), processing substrate operation (step S12), the 1st resin bed molding procedure (step S13), the 2nd resin bed molding procedure (step S14) and stripping process (step S15).
First, as shown in Figure 3A, on the two sides of substrate 101 101a, 101b, form aperture 104(step S11).By utilizing evaporation, sputter etc. to carry out film forming to opaque metal film on two sides 101a, 101b such as substrate 101, be used to form afterwards the composition of opening, form aperture 104.In addition, can also carry out film forming by the photoresist to dark-coloured, the composition that is used to form afterwards opening forms aperture 104.
Next, two sides 101a, the 101b of substrate 101 are implemented to the hydrophilicity-imparting treatment (step S12) such as silane coupling processing or Cement Composite Treated by Plasma.Thus, the wettability for resin of substrate 101 improves, and can make the bonding of resin become better.
Next, the 1st resin bed 102 is carried out to moulding (step S13).As shown in Figure 3 B, make not shown resin coating apparatus action, on each the 1st optical surface transfer surface 41c of the 1st shaping mould 41, supply with respectively independently the resin of ormal weight.Herein, ormal weight refers to: in the part corresponding with the 1st lens key element 11 of pressing past form die with shaping mould completely by resin filling, and the amount of overflowing a little from the part corresponding with the 1st lens key element 11.In addition, not overflow be best to resin in the ideal situation, but deliberately make it overflow a little according to the deviation of adjustment amount.Its result, in the 1st transfer surface 41b of the 1st shaping mould 41, resin mutually leave and point-like arrange.Make not shown jacking gear action, from the top of the 1st shaping mould 41, substrate 101 is pressed a side face 101a towards the 1st shaping mould 41.Between the end face 41a of the 1st shaping mould 41 and a side's of substrate 101 face 101a, form small gap.Now, resin exposes a little from the 1st optical surface transfer surface 41c.Under the state of having pressed substrate 101, make the action of not shown UV light generating apparatus and irradiation ultraviolet radiation makes the hardening of resin sandwiching between the 1st shaping mould 41 and substrate 101.Now, the 1st transfer surface 41b of transfer printing the 1st shaping mould 41 on resin.
Next, on the opposing party's of substrate 101 face 101b, the 2nd resin bed 103 is carried out to moulding (step S14).Make jacking gear action, as shown in Figure 3 C, make substrate 101 and the 1st shaping mould 41 with across the 1st resin bed 102 integrated state reversion, make the opposing party's of substrate 101 face 101b become downside.Make resin coating apparatus action, on each the 2nd optical surface transfer surface 42c of the 2nd shaping mould 42, supply with the resin of ormal weight.Its result, in the 2nd transfer surface 42b of the 2nd shaping mould 42, resin mutually leave and point-like arrange.Under the state that the 2nd shaping mould 42 relative the 1st shaping mould 41 grades have been aimed at, make jacking gear action, from the top of the 2nd shaping mould 42, substrate 101 is pressed the opposing party's face 101b towards the 2nd shaping mould 42.Between the end face 42a of the 2nd shaping mould 42 and the opposing party's of substrate 101 face 101b, form small gap.Now, resin exposes a little from the 2nd optical surface transfer surface 42c.Under the state of having pressed substrate 101, make the action of not shown UV light generating apparatus and irradiation ultraviolet radiation makes the hardening of resin sandwiching between the 2nd shaping mould 42 and substrate 101.Now, the 2nd transfer surface 42b of transfer printing the 2nd shaping mould 41 on resin.
Finally, make not shown stripper apparatus action, as shown in Figure 3 D, from 41,42 pairs of not stacked wafer lens 110 of the 1st and the 2nd shaping mould, carry out the demoulding (step S15).
(dividing plate installation procedure)
Next, the dividing plate installation procedure that dividing plate 105 is installed in the 1st wafer lens 100 after moulding is described.Dividing plate installation procedure as shown in Figure 6, possesses coating operation (step S21), keeps operation (step S22) and hardening process (step S23).
First, make the 2nd resin bed 103 towards downside, will by the not stacked wafer lens 110 of step S11～S15 moulding, be adsorbed onto in advance the 2nd supporting mass 52 of stacked laminator 50.In addition, make the dividing plate 105 of installation in not stacked wafer lens 110 be adsorbed onto the 1st supporting mass 51.
Next, in a side's of dividing plate 105 end face 105c, apply bonding agent 106(step S21).In the coating of the bonding agent 106 to dividing plate 105, use serigraphy or adjustment etc.Afterwards, make 54 actions of Z axis control part, not stacked wafer lens 110 is declined.Now, by position transducer portion 55, measure the position of the 2nd supporting mass 52.Therefore, when the decline of not stacked wafer lens 110, not stacked wafer lens 110 also tilts by the action correction of inclination control portion 53, and the end face 51b of relative the 1st supporting mass 51 of end face 52c of the 2nd supporting mass 52 becomes parallel.
Next, as shown in Figure 4, make not stacked wafer lens 110 and dividing plate 105 approach and keep.That is, separate certain interval X and keep substrate 101 and dividing plate 105(step S22).Herein, certain interval X refers to: although approach zero and non-zero, peripheral part 11b, the 12b of the 1st or the 2nd lens key element 11,12 can not touch the sufficient interval of the end face 105c that receives dividing plate 105.Particularly, the interval X that is equivalent to Fig. 2.According to the measurement result of position transducer portion 55, Z axis control part 54 keeps so that substrate 101 and dividing plate 105 maintain certain interval X.
Next, substrate 101 and dividing plate 105 are remained under the state of certain interval X, make not shown UV light generating apparatus action, by the UV light across the 1st supporting mass 51 or the 2nd supporting mass 52 irradiations, make bonding agent 106 sclerosis become cured layer (step S23).Thus, as shown in Fig. 3 E, in not stacked wafer lens 110, dividing plate 105 is installed, thereby is made the 1st wafer lens 100.
In addition, also can be as shown in Figure 3 B, in a side's of substrate 101 face 101a, use shaping mould 40 demoulding after the 1st resin bed 102 moulding, make the 1st lens key element 11 and dividing plate 105 subtends and carry out dividing plate installation procedure.In this case, dividing plate 105 becomes platform, so have the warpage that can prevent substrate 101, than as shown in Figure 4, to have protected the situation of the state absorption of the 1st lens key element 11, can simplify the advantages such as suction jig structure.
(the stacked operation of wafer lens)
Next, with reference to Fig. 7, illustrate and make the 1st wafer lens 100 and the stacked stacked operation of wafer lens of the 2nd wafer lens 200 of making as described above.The stacked operation of wafer lens possesses coating operation (step S31), stacked operation (step S32) and hardening process (step S33).In addition, in the stacked operation of wafer lens, in the stacked laminator 50 of Fig. 4, expectation use have the depression corresponding with the 1st or the 2nd lens key element 11,12 of the 1st or the 2nd wafer lens 100,200 supporting fixture so that the 1st or the 2nd lens key element 11,12 of the 1st or the 2nd wafer lens 100,200 do not damage.
First, make the 1st resin bed 102 towards downside, will by the 2nd wafer lens 200 of step S11～S15 moulding, be adsorbed onto in advance the 2nd supporting mass 52 of stacked laminator 50.In addition, making dividing plate 105 become upside, is that the 1st wafer lens 100 is adsorbed onto the 1st supporting mass 51 by the object of installing in the 2nd wafer lens 200.
Next, in the opposing party's of dividing plate 105 end face 105d, apply bonding agent 106(step S31).Afterwards, make 54 actions of Z axis control part, the 2nd wafer lens 200 is declined.
Next, separate substrate 101 and dividing plate 105 that certain interval X keeps the 2nd wafer lens 200, the stacked the 1st and the 2nd wafer lens 100,200(step S32).
Next, stacked, under the state of the 1st and the 2nd wafer lens 100,200, make not shown UV light generating apparatus action, make bonding agent 106 sclerosis (step S33).Thus, make the lit-par-lit structure body 1000 shown in Figure 1B etc.
According to the manufacture method of wafer lens described above, substrate 101 and dividing plate 105 are not touched under the state that ground connection kept certain interval X mutually, make bonding agent 106 sclerosis, even if thereby the external diameter of the 2nd lens key element 12 on the 1st and the 2nd wafer lens 100,200 produces deviation, when the making of the 1st wafer lens 100 with dividing plate, also can make the 2nd lens key element 12 and dividing plate 105 can not disturb, and, when the 1st and the 2nd wafer lens 100,200 stacked, can make the 1st lens key element 11 and dividing plate 105 not disturb.Thus, can prevent that dividing plate 105 from touching peripheral part 11b, the 12b of the 1st and the 2nd lens key element 11,12 upper and the such defect of touching occurs.In addition, than the transfer mold the 1st and the 2nd lens key element 11,12 being carried out to moulding, the situation of buffer area is set in the 1st and the 2nd shaping mould 41,42, can makes between lens spacing narrower.In addition, by take the 1st and the position relationship of the substrate 101 of the 2nd wafer lens carry out the adjustment of interval X as benchmark, no matter situation devious or in the situation that have error in the size of dividing plate 105 in the thickness of peripheral part 11b, the 12b of the 1st and the 2nd lens key element 11,12, can both high precision carry out the stacked of the 1st and the 2nd wafer lens 100,200.And then, also without the structure that is provided for suppressing the expansion of resin in the buffer area of shaping mould, so can cut down the cost of the 1st and the 2nd shaping mould 41,42.
In addition, by using stacked laminator 50, not relying on the deviation of the thickness of substrate 101, dividing plate 105, is the value of expectation and Jie who consists of the 1st and the 2nd wafer lens 100,200 can be had to the gross thickness management of the lit-par-lit structure body 1000 of dividing plate 105.And then, for example, with reference field (the real estate 101b of the 2nd wafer lens 200) deviation to focal position that arranges of the caused lit-par-lit structure body 1000 of form variations of the 1st after moulding and the 2nd optical surface 11a, 12a also can be remained necessarily.
D) compound lens
Lens unit 2000 shown in Fig. 8 A possesses the 1st compound lens 80 and the 2nd compound lens 90.Lens unit 2000 is parts of quadrangular prism shape for example, has tetragonal profile when optical axis OA direction is observed.In addition, lens unit 2000 is accommodated in the retainer of for example preparing in addition, as imaging lens system, bonds to imaging circuit substrate.
The 1st compound lens 80(is equivalent to the compound lens 10 of Figure 1A shown in waiting) possess the 1st lens key element the 11, the 2nd lens key element 12 having illustrated and the flat part 13 sandwiching between them.Flat part 13 is the parts that cut out substrate 101.In the 1st compound lens 80, the shape of the 1st and the 2nd lens key element 11,12 can be both identical shape, can be also different shapes.
The 2nd compound lens 90(is equivalent to the compound lens 10 shown in Figure 1A etc.) and the 1st compound lens 80 is similarly, the flat part 13 that possesses the 1st lens key element the 11, the 2nd lens key element 12 and sandwich between them.
E) manufacture method of compound lens
For the lens unit 2000 shown in construction drawing 8A, use the 1st and the 2nd wafer lens 100,200.The the 1st and the 2nd wafer lens 100,200 is via the stacked operation of wafer lens, with across dividing plate 105 stacked state fixing by bonding agent 106.The the 1st and the 2nd stacked wafer lens 100,200, be that lit-par-lit structure body 1000 is cut out according to the dotted portion DX shown in Fig. 8 B by cutting action, become lens unit 2000.In addition, in the present embodiment, the 1st and the 2nd lens key element 11,12 forms independently of each other on substrate 101, so when cutting action, substrate 101(comprises aperture), dividing plate 105 and bonding agent 106 be cut off.
(embodiment)
Below, embodiments of the invention are described.
By carrying out the molding procedure of the step S11～S15 shown in Fig. 5, make not stacked wafer lens 110 moulding.
In the situation that substrate 101 has been carried out to silane coupling processing or Cement Composite Treated by Plasma, with the resin that the 1st and the 2nd shaping mould 41,42 has been pressed, become the hydrophobic angle smaller value (for example, approximately 10 °) of the part that outer rim on substrate 101 and peripheral part 11b, 12b the 1st and the 2nd lens key element 11,12 is suitable.Now, about the suitable resin of peripheral part 11b, 12b with the 1st and the 2nd lens key element 11,12, with thickness expansion thinly on substrate 101 of for example 10 μ m～20 μ m degree.By irradiate light under such state, hardening of resin, make the 1st wafer lens 100 from the 1st and the 2nd shaping mould 41,42 demouldings, thereby moulding completes.
Next, carry out the dividing plate installation procedure of the step S21～S23 shown in Fig. 6, thereby in not stacked wafer lens 110, dividing plate 105 is installed.
In keeping operation (step S22), for example, with certain interval X, 50 μ m, keep substrate 101 and dividing plate 105.The interval X of substrate 101 and dividing plate 105 is set to the thickness (aperture 104) of the peripheral part 11b, the 12b that are greater than the 1st and the 2nd lens key element 11,12,20 μ m for example.Like this, the interval X by management substrate 101 with dividing plate 105, can imbed the peripheral part 11b, the 12b that optical function are not made contributions between substrate 101 and dividing plate 105.Its result, can further reduce spacing between the lens of the 1st wafer lens 100.
Next, by with dividing plate installation procedure similarly, carry out the stacked operation of wafer lens of the step S31～S33 shown in Fig. 7, the stacked the 1st and the 2nd wafer lens 100,200.Even in the stacked operation (step S32) of the stacked operation of wafer lens, also for example, with certain interval X, 50 μ m keep substrate 101 and dividing plates 105.Thus, obtain having the lit-par-lit structure body 1000 of the structure shown in Figure 1B etc.
(the 2nd embodiment)
The manufacture method etc. of the wafer lens of the 2nd embodiment is described below.In addition, the manufacture method of the wafer lens of the 2nd embodiment etc. is the method for the distortion such as manufacture method that makes the wafer lens of the 1st embodiment, and not specified part is identical with the 1st embodiment.
As shown in Figure 9, the stacked laminator 150 using in the manufacture method of the wafer lens of present embodiment possesses the 1st supporting mass the 51, the 2nd supporting mass 52, adsorbent equipment 56 and holding member 58.
Holding member 58, to surround the mode of the supporting abutting part of the 1st supporting mass 51 and the supporting abutting part of the 2nd supporting mass 52, is arranged between the base portion 51h of the 1st supporting mass 51 and the base portion 52h of the 2nd supporting mass 52.Holding member 58 keeps the 1st supporting mass 51 etc. so that the substrate 101 of not stacked wafer lens 110 and dividing plate 105 have the mode of certain interval X.Substrate 101 and dividing plate 105 that the height of holding member 58 is adjusted into not stacked wafer lens 110 in advance become certain interval X.In addition, holding member 58 is so that the inclination of substrate 101 mode parallel with XY face keeps the 1st supporting mass 51 etc.In the manufacture method of the wafer lens of present embodiment, than the 1st embodiment, can make the structure for interval adjustment in stacked laminator 50 more simplify.In addition, by changing the shape etc. of the supporting abutting part of the 1st supporting mass 51, when stacked the 1st wafer lens 100 after bonding dividing plate 105 and the 2nd wafer lens 200, also can use this stacked laminator 150.
(the 3rd embodiment)
The manufacture method etc. of the wafer lens of the 3rd embodiment is described below.In addition, the manufacture method of the wafer lens of the 3rd embodiment etc. is the method for the distortion such as manufacture method that makes the wafer lens of the 1st embodiment, and not specified part is identical with the 1st embodiment.
As shown in figure 10, in the 1st wafer lens 300, the 1st resin bed 102 has the 1st and touches the portion of connecing 14.The 1st surrounding of touching the portion of connecing 14 and the 2nd lens key element 12 forms circular adjacently.The 1st touches the portion of connecing 14 has to taper surface 14a, the 14b of substrate 101 side expansions and inclination.By taper surface 14a, 14b, sandwiched with the 2nd wafer lens 400 subtends touch that the 2nd of contact surface 14c and aftermentioned the 2nd wafer lens 400 touch the portion of connecing 24 touch contact surface 24c butt.
In the 2nd wafer lens 400, the 2nd resin bed 103 has the 2nd and touches the portion of connecing 24.The 2nd surrounding of touching the portion of connecing 24 and the 1st lens key element 12 forms circular adjacently.The 2nd, touch in the portion of connecing 24, have to substrate 101 sides and broaden and the taper surface 24a, the 24b that tilt.By taper surface 24a, 24b, sandwiched with the 1st wafer lens 300 subtends touch contact surface 24c as illustrated, touch contact surface 14c butt with the 1st of the 1st wafer lens 300 touches the portion of connecing 14.In addition, both ends of the surface 14c, 24c are close to, and are not situated between and have bonding agent etc.
Herein, substrate 101 touches the portion's of connecing 14,24 regulations with the interval X of dividing plate 105 by the 1st and the 2nd.The height H 2 that the 1st height H 1 and the 2nd of touching the portion of connecing 14 is touched to the portion of connecing 24 overall height (H1+H2) is altogether higher than the height H 3 of dividing plate 105.From the distance H 4 between the substrate 101,101 of the 1st and the 2nd wafer lens 300,400 deduct the height H 3 of dividing plate 105 and the result that obtains 1/2 become interval X.By making the 1st contact surface 24c that touches that contact surface 14c and the 2nd touches the portion of connecing 24 that touches that touches the portion of connecing 14 touch and connect, substrate 101 and dividing plate 105 can keep interval X.
Like this, by moulding, arranging the resinous the 1st and the 2nd touch the portion of connecing 14,24 in the situation that, even if the 1st and the 2nd position of touching the outer rim of the portion of connecing 14,24 produces deviation, also can prevent the interference of the 1st and the 2nd lens key element 11,12 and dividing plate 105, can prevent that the distance between the 1st and the 2nd adjacent lens key element 11,12 from becoming large.
(the 4th embodiment)
The manufacture method etc. of the wafer lens of the 4th embodiment is described below.In addition, the manufacture method of the wafer lens of the 4th embodiment etc. is the method for the distortion such as manufacture method that makes the wafer lens of the 1st embodiment, and not specified part is identical with the 1st embodiment.
As shown in figure 11, in the 1st and the 2nd resin bed 102,103 of the 1st and the 2nd wafer lens 100,200 of present embodiment, the the 1st and the 2nd lens key element 11,12 becomes and is not separated from each other, and by transfer printing the state that connects of the resin of the 1st and the 2nd lens key element 11,12 of adjacency.
Like this, even under the state having connected by resin in the 1st and the 2nd lens key element 11,12, the present invention is also effective.; no matter in the thickness of resin in situation devious; or in the situation that have error in the thickness of dividing plate 105, opening footpath equidimension; owing to having Jie between the substrate 101 of resin part and dividing plate 105, there is certain interval X, so can both carry out accurately installation, the 1st and the 2nd wafer lens 100,200 stacked of dividing plate 105.
(the 5th embodiment)
The manufacture method etc. of the wafer lens of the 5th embodiment is described below.In addition, the manufacture method of the wafer lens of the 5th embodiment etc. is the method for the distortion such as manufacture method that makes the wafer lens of the 1st embodiment, and not specified part is identical with the 1st embodiment.
As shown in figure 12, in wafer lens 500, the 1st and the 2nd lens key element 11,12 of specified quantity interconnects, and has formed fly's-eye lens ML.Fly's-eye lens ML has the 1st and the 2nd optical surface 11a, the 12a of specified quantity.The in the situation that of present embodiment, fly's-eye lens ML has for example 4 the 1st and the 2nd lens key element 11,12(the 1st and the 2nd optical surface 11a, 12a).Peripheral part 11b be arranged at the the plurality of the 1st and the 2nd optical surface 11a, 12a surrounding, be the periphery of fly's-eye lens ML.At least one of the 1st and the 2nd lens key element 11,12 with the 1st and the 2nd lens key element 11,12 separation of the different fly's-eye lens ML from adjacency state independent.
(the 6th embodiment)
The manufacture method etc. of the wafer lens of the 6th embodiment is described below.In addition, the manufacture method of the wafer lens of the 6th embodiment etc. is the method for the distortion such as manufacture method that makes the wafer lens of the 1st embodiment, and not specified part is identical with the 1st embodiment.
In the present embodiment, as shown in FIG. 13A, in dividing plate installation procedure, keeping operation (step S22) afterwards, apply operation (step S21).In addition, as shown in Figure 13 B, in the stacked operation of wafer lens, in stacked operation (step S32) afterwards, apply operation (step S31).
In this case, in applying operation (step S21, S31), substrate 101 and dividing plate 105 are separated under the state of certain interval X subtend, so that bonding agent 106 soaks into substrate 101, entering and fill with the mode in the gap of dividing plate 105.
Above, the manufacture method etc. of the wafer lens of present embodiment has been described, but that the manufacture method of wafer lens of the present invention is not limited to is above-mentioned.For example, in the above-described embodiment, the shape of the 1st and the 2nd optical surface 11a, 12a, size can be according to purposes, Function fitness changes.For example, also can make the 1st optical surface 11a of the 1st lens key element 11 become convex form as shown in figure 14, make the 2nd optical surface 12a of the 2nd lens key element 12 become concave shape.In this case, the 1st and the 2nd transfer surface 41b of the 1st shown in Fig. 3 C and the 2nd shaping mould 41,42,42b the becomes structure corresponding with the shape of each the 1st and the 2nd lens key element 11,12.
In addition, in the above-described embodiment, in the quantity of the 1st and the 2nd lens key element 11,12 of the 1st and the 2nd wafer lens 100,200 interior formation, be also not limited to illustrated 9, also can become 2 above a plurality of.Now, the configuration of the 1st and the 2nd lens key element 11,12, the situation according to cutting, is preferably in grid point.And then the interval of the lens key element 11,12 of adjacency is also not limited to diagram, can consider processability etc. and suitable setting.
In addition, in the above-described embodiment, in the mode of dripping or spuing, supply with resin on the 1st and the 2nd shaping mould 41,42, but also can supply with resin to a side's of substrate 101 face 101a and the opposing party's face 101b.
In addition, in the above-described embodiment, although conditions of molding such as material based on resin bed 102,103 still can not carry out the hydrophilicity-imparting treatment such as silane coupling processing or Cement Composite Treated by Plasma to substrate 101.In addition, can the 1st and the 2nd shaping mould 41,42 not implemented to hydrophobic processing yet.
In addition, in the above-described embodiment, the the 1st and the 2nd lens key element 11,12 is formed independently on substrate 101, but also can make peripheral part 11b, the 12b of each the 1st and the 2nd lens key element 11,12 interconnect in the scope of thickness with the space that is no more than substrate 101 and dividing plate 105.
In addition, in the above-described embodiment, when not stacked wafer lens 110 and dividing plate 105 are engaged, bonding agent 106 is coated to the end face 105c of dividing plate 105, but also can in the corresponding end face of the substrate 101 of not stacked wafer lens 110, applies bonding agent 106.In this case, by such as adjusting etc., to the corresponding face of substrate 101, apply bonding agent 106.In addition, also can be coated to end face 105c and substrate 101 these both sides of dividing plate 105.
In addition, in the above-described embodiment, stacked the 1st wafer lens 100 and the 2nd wafer lens 200, but be not limited to this.Also can cut for example the 1st wafer lens 100 with dividing plate.Thus, can access the lens unit 2100 with the 1st compound lens 80 as shown in Figure 15.Also this lens unit 2100 can be bonded to the sensor base plate with imaging apparatus.The section of the vestige having cut off in the parallel direction of the optical axis OA with the 1st and the 2nd lens key element 11,12 as shown in figure 15, has and comprises the carrier ring 105x of dividing plate 105, the 1st and the 2nd resin bed 102,103 that comprises the adhesive linkage 106x of bonding agent 106 and comprise peripheral part 11b, the 12b of the 1st and the 2nd lens key element 11,12.The the 1st and the 2nd resin bed 102,103 and carrier ring 105x sandwich adhesive linkage 106x betwixt, the state that peripheral part 11b, the 12b that becomes the 1st and the 2nd lens key element 11,12 do not disturb dividing plate 105.
In addition, in the above-described embodiment, be not limited to the 1st and the 2nd wafer lens 100,200 these 2, also can stacked 3 above wafer lens.
In addition, in the above-described embodiment, by for plate material, to have not with the 1st resin bed 102 or the 2nd resin bed 103, opticpath, disturb the mode in such hole to implement etching and processing, spray processing etc., can form dividing plate 105.Dividing plate 105 can also form by moulding.No matter in which situation, when the 1st wafer lens 100 and the 2nd wafer lens 200 stacked, can both apply aforementioned barriers installation procedure.
In addition, in the above-described embodiment, in the 2nd lens key element 12 sides, dividing plate 105 has been installed, but also can dividing plate 105 be installed in the 1st lens key element 11 sides.
In addition, in the above-described embodiment, in the 1st supporting mass 51 of stacked laminator 50,150, configure dividing plate 105, but also can in the 2nd supporting mass 52, configure dividing plate 105.Particularly, make dividing plate 105 or not stacked wafer lens 110 be adsorbed onto the 2nd supporting mass 52.
In addition, in the above-described embodiment, in not stacked wafer lens 110 and the 2nd wafer lens 200, separate certain interval X and be provided with dividing plate 105, but also can only separate certain interval X in one party, dividing plate 105 is set.That is, the one party in not stacked wafer lens 110 and the 2nd wafer lens 200 also can be installed dividing plate 105 across for example thin bonding agent, does not have certain interval X between substrate 101 and dividing plate 105.
In addition, end face 105c, the 105d of dividing plate 105 are not limited to tabular surface and can become asperities, can also form recess etc. with the pattern being applicable to.
Claims (21)
1. a manufacture method for wafer lens, this wafer lens possesses: substrate; A plurality of lens sections, moulding and comprise optical surface at least one party's of described substrate real estate; And dividing plate, being arranged at the substrate surface side of one and thering is the opening corresponding with described lens section, described manufacture method is characterised in that and comprises:
Molding procedure, to supplying with resin on the real estate of one and between shaping mould, makes described lens section moulding;
Apply operation, at least a portion of at least one party in the composition surface of real estate and composition surface described dividing plate and described dividing plate and real estate one of one, apply bonding agent;
Keep operation, separate real estate and described dividing plate that certain interval keeps one; And
Hardening process, makes described adhesive hardens being situated between between the real estate of one and described dividing plate to have under the state of described bonding agent.
2. the manufacture method of wafer lens according to claim 1, is characterized in that: in described molding procedure, for each position corresponding with described lens section on the real estate of one and between described shaping mould, supply with independently resin.
3. according to the manufacture method of the wafer lens described in claim 1 or 2, it is characterized in that: after described coating operation, carry out described maintenance operation.
4. according to the manufacture method of the wafer lens described in claim 1 or 2, it is characterized in that: after described maintenance operation, carry out described coating operation.
5. according to the manufacture method of the wafer lens described in any one in claim 1 to 4, it is characterized in that: the distance of the outer rim of described optical surface of the described lens section at least one direction parallel with described real estate and the outer rim of the peripheral part of described lens section is greater than the distance of the outer rim of described optical surface of the described lens section in corresponding direction and the edge of the described opening of described dividing plate.
6. according to the manufacture method of the wafer lens described in any one in claim 1 to 5, it is characterized in that: maximal value in the peripheral part of the described lens section at least one direction parallel with described real estate and the thickness overlapping position of described dividing plate is thinner than described certain interval of real estate and the described dividing plate of one.
7. according to the manufacture method of the wafer lens described in any one in claim 1 to 6, it is characterized in that: the described substrate with described lens section is stacked more than 2 layers across described dividing plate.
8. according to the manufacture method of the wafer lens described in any one in claim 1 to 7, it is characterized in that: described lens section is arranged independently with the state being separated from each other.
9. according to the manufacture method of the wafer lens described in any one in claim 1 to 8, it is characterized in that:
In described molding procedure, described lens section is by having the transfer mold moulding of the forming surface of described lens section being carried out to the transfer surface of transfer printing,
Described transfer surface has hydrophobicity.
10. according to the manufacture method of the wafer lens described in any one in claim 1 to 9, it is characterized in that: the real estate of one is carried out to hydrophilicity-imparting treatment.
11. 1 kinds of wafer lens, possess: substrate; A plurality of lens sections, moulding and comprise optical surface at least one party's of described substrate real estate; And dividing plate, being arranged at the substrate surface side of one and thering is the opening corresponding with described lens section, described wafer lens is characterised in that:
In the edge of the described opening of described dividing plate, the thickness of the peripheral part of described lens section is thinner than the interval of real estate and the described dividing plate of one.
12. wafer lens according to claim 11, is characterized in that: at least one of described lens section with from other lenses part from state independent.
13. according to the wafer lens described in claim 11 or 12, it is characterized in that: described lens section is arranged independently with the state being separated from each other.
14. according to claim 11 to the wafer lens described in any one in 13, it is characterized in that: the distance of the outer rim of described optical surface of the described lens section at least one direction parallel with described real estate and the outer rim of the peripheral part of described lens section is greater than the distance of the outer rim of described optical surface of the described lens section in corresponding direction and the edge of the described opening of described dividing plate.
15. according to claim 11 to the wafer lens described in any one in 14, it is characterized in that: maximal value in the peripheral part of the described lens section at least one direction parallel with described real estate and the thickness overlapping position of described dividing plate is thinner than certain interval of real estate and the described dividing plate of one.
16. according to claim 11 to the wafer lens described in any one in 15, it is characterized in that:
There is the vestige having cut off in the parallel direction of the optical axis with described lens section,
The section of the described vestige having cut off at least have comprise described dividing plate carrier ring, comprise the adhesive linkage of bonding agent and the resin bed that comprises the peripheral part of described lens section.
17. according to claim 11 to the wafer lens described in any one in 16, it is characterized in that: the described substrate with described lens section is stacked more than 2 layers across described dividing plate.
The manufacture method of 18. 1 kinds of lens units, is characterized in that comprising:
Cutting action, cuts out the wafer lens described in any one in claim 11 to 17.
The manufacture method of 19. lens units according to claim 18, is characterized in that comprising:
Stacked operation, before described cutting action, with the stacked described wafer lens of the state across dividing plate and at least 1 other wafer lens.
20. 1 kinds of lens units, possess: substrate; At least one compound lens, moulding and there is the lens section that comprises optical surface at least one party's of described substrate real estate; And dividing plate, being arranged at the substrate surface side of one and thering is the opening corresponding with described lens section, described lens unit is characterised in that:
In the edge of the described opening of described dividing plate, the thickness of the peripheral part of described lens section is thinner than the interval of real estate and the described dividing plate of one.
21. 1 kinds of lens units, is characterized in that:
Right to use requires the manufacture method of the lens unit described in 18 or 19 to manufacture.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011135459 | 2011-06-17 | ||
| JP2011-135459 | 2011-06-17 | ||
| PCT/JP2012/065421 WO2012173252A1 (en) | 2011-06-17 | 2012-06-15 | Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103620468A true CN103620468A (en) | 2014-03-05 |
Family
ID=47357230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280029403.8A Pending CN103620468A (en) | 2011-06-17 | 2012-06-15 | Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2012173252A1 (en) |
| CN (1) | CN103620468A (en) |
| WO (1) | WO2012173252A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107850759A (en) * | 2015-08-06 | 2018-03-27 | 高通股份有限公司 | Sub-micron wafer aligned |
| CN110830684A (en) * | 2018-08-14 | 2020-02-21 | 三星电机株式会社 | Lens assembly and portable electronic device |
| CN111090135A (en) * | 2018-10-24 | 2020-05-01 | 奇景光电股份有限公司 | Wafer level optical structures and methods of forming the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014148291A1 (en) * | 2013-03-19 | 2014-09-25 | コニカミノルタ株式会社 | Lens array unit, imaging device, method for manufacturing lens array unit, and method for manufacturing imaging device |
| JP2018180232A (en) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | Optical component array with adhesive layer |
| JP7287014B2 (en) * | 2019-03-13 | 2023-06-06 | コニカミノルタ株式会社 | Optical writing device and image forming device |
| CN112882175B (en) * | 2021-01-20 | 2022-04-29 | 拾斛科技(南京)有限公司 | Wafer level lens module array assembly structure, lens module and production method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1682377A (en) * | 2002-09-17 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | Camera device, method of manufacturing a camera device, wafer scale package |
| CN101512768A (en) * | 2006-07-17 | 2009-08-19 | 德萨拉北美公司 | Camera system and associated methods |
| CN101738708A (en) * | 2008-11-12 | 2010-06-16 | 采钰科技股份有限公司 | Image capture lens |
| JP2010211082A (en) * | 2009-03-12 | 2010-09-24 | Ricoh Co Ltd | Stereoscopic image forming apparatus and stereoscopic image forming method |
| CN101971341A (en) * | 2007-12-19 | 2011-02-09 | 赫普塔冈有限公司 | Wafer stack, integrated optical device and method for fabricating the same |
| JP2011059678A (en) * | 2009-08-13 | 2011-03-24 | Fujifilm Corp | Wafer-level lens and imaging unit |
-
2012
- 2012-06-15 WO PCT/JP2012/065421 patent/WO2012173252A1/en active Application Filing
- 2012-06-15 JP JP2013520609A patent/JPWO2012173252A1/en active Pending
- 2012-06-15 CN CN201280029403.8A patent/CN103620468A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1682377A (en) * | 2002-09-17 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | Camera device, method of manufacturing a camera device, wafer scale package |
| CN101512768A (en) * | 2006-07-17 | 2009-08-19 | 德萨拉北美公司 | Camera system and associated methods |
| CN101971341A (en) * | 2007-12-19 | 2011-02-09 | 赫普塔冈有限公司 | Wafer stack, integrated optical device and method for fabricating the same |
| CN101738708A (en) * | 2008-11-12 | 2010-06-16 | 采钰科技股份有限公司 | Image capture lens |
| JP2010211082A (en) * | 2009-03-12 | 2010-09-24 | Ricoh Co Ltd | Stereoscopic image forming apparatus and stereoscopic image forming method |
| JP2011059678A (en) * | 2009-08-13 | 2011-03-24 | Fujifilm Corp | Wafer-level lens and imaging unit |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107850759A (en) * | 2015-08-06 | 2018-03-27 | 高通股份有限公司 | Sub-micron wafer aligned |
| CN110830684A (en) * | 2018-08-14 | 2020-02-21 | 三星电机株式会社 | Lens assembly and portable electronic device |
| US10914869B2 (en) | 2018-08-14 | 2021-02-09 | Samsung Electro-Mechanics Co., Ltd. | Lens assembly and portable electronic device |
| CN110830684B (en) * | 2018-08-14 | 2021-12-03 | 三星电机株式会社 | Lens assembly, blocking member for lens assembly, and portable electronic device |
| US11391868B2 (en) | 2018-08-14 | 2022-07-19 | Samsung Electro-Mechanics Co., Ltd. | Lens assembly and portable electronic device |
| US11609361B2 (en) | 2018-08-14 | 2023-03-21 | Samsung Electro-Mechanics Co., Ltd. | Lens assembly and portable electronic device |
| CN111090135A (en) * | 2018-10-24 | 2020-05-01 | 奇景光电股份有限公司 | Wafer level optical structures and methods of forming the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012173252A1 (en) | 2012-12-20 |
| JPWO2012173252A1 (en) | 2015-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103620468A (en) | Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit | |
| CN103135341B (en) | Imprinting apparatus, the article manufacturing method using this imprinting apparatus and method for stamping | |
| US8120858B2 (en) | Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens | |
| US10386616B2 (en) | Method of fabricating a wafer level optical lens assembly | |
| AU2013202052B2 (en) | Lens plate for wafer-level camera and method of manufacturing same | |
| CN103323893A (en) | Method for producing wafer lens assembly and method for producing wafer lens | |
| US9649788B2 (en) | Method of fabricating an array of optical lens elements | |
| TWI626149B (en) | Die tool, device and method for producing a lens wafer | |
| WO2008062836A1 (en) | Optical waveguide module and method for manufacturing the same | |
| TWI495559B (en) | Method and device for producing a lens wafer | |
| JP6022044B2 (en) | Method and apparatus for manufacturing a plurality of microlenses | |
| WO2017034402A1 (en) | A method of fabricating an array of optical lens elements | |
| CN113557126B (en) | Method for manufacturing a plurality of optical elements and products thereof | |
| US20220168978A1 (en) | Wafer alignment features | |
| CN110954980A (en) | Diffractive optical device with protective cover plate and method for producing the same | |
| JP2011242478A (en) | Manufacturing method of optical element and manufacturing device of optical element | |
| US9266203B2 (en) | Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly | |
| KR100983043B1 (en) | Master for micro lens and fabrication method of micro lens | |
| US20220040941A1 (en) | Yard control | |
| KR20100010466U (en) | Rectangular stacked glass lens module | |
| JP2016063109A (en) | Optical sensor and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |