CN112882175B - Wafer level lens module array assembly structure, lens module and production method thereof - Google Patents
Wafer level lens module array assembly structure, lens module and production method thereof Download PDFInfo
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- CN112882175B CN112882175B CN202110072223.9A CN202110072223A CN112882175B CN 112882175 B CN112882175 B CN 112882175B CN 202110072223 A CN202110072223 A CN 202110072223A CN 112882175 B CN112882175 B CN 112882175B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Lens Barrels (AREA)
Abstract
The invention discloses a wafer-level lens module array assembly structure, a lens module and a production method thereof, wherein the assembly structure comprises a plurality of stacked wafer-level lens arrays, each wafer-level lens array comprises a wafer substrate and lens units which are arranged on the wafer substrate in an array mode, two adjacent layers of wafer-level lens arrays are fixedly bonded through glue or are respectively fixedly bonded through glue on two sides of a same wafer spacer, a plurality of glue dispensing grooves are arranged around the lens units, the adjacent glue dispensing grooves are communicated through glue containing guide grooves, the glue dispensing grooves and the glue containing guide grooves form a closed glue containing space which surrounds the lens units, and glue is filled in the closed glue containing space to bond the two layers of wafer-level lens arrays or respectively bond the two layers of wafer-level lens arrays on two sides of the wafer spacer. The assembly structure can prevent the occurrence of bubble cavities on the glue joint surface when the wafer-level lens arrays are fixed by glue, thereby improving the production yield of the lens assembly.
Description
Technical Field
The invention relates to a Wafer Level optical element (WLO) manufacturing technology, in particular to a Wafer Level lens module array assembly structure and a Wafer Level lens module production method, which are used for realizing the glue joint fixation among a plurality of Wafer Level lens module arrays and the production of Wafer Level lens modules.
Background
WLO refers to a micro-nano structure optical element manufactured by generating a micro-nano structure on a substrate wafer by using a semiconductor process. Different from the traditional processing technology of optical elements, the WLO process is used for copying and processing lens arrays in batches by using a semiconductor process on a whole wafer substrate to form a wafer-level lens module array, then a plurality of wafer-level lens module arrays are pressed together and then cut into single lenses, and the WLO process has the characteristics of small size, low height, good consistency and the like. The position precision of the wafer-level optical lens reaches the nm level, and the method is the best choice for future standardized optical lens combinations.
Can adopt to splice fixedly when equipment wafer level camera lens module array, when splicing, owing to lack on the wafer base plate and hold gluey space, the state after the difficult control glue coating, bubble cavity appears after the glue solidification easily, influences the production yield of camera lens subassembly.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a wafer-level lens array assembly structure matched with glue dispensing, which avoids the occurrence of bubble cavities on glue joint surfaces when the wafer-level lens arrays are fixed by glue. The invention also provides a wafer-level lens module and a production method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a wafer level lens module array package assembly, includes the multilayer wafer level lens array of piling up together, and wafer level lens array includes the wafer base plate and is the lens unit of array arrangement on the wafer base plate which characterized in that: the two adjacent wafer-level lens arrays are fixedly bonded through glue or are respectively fixedly bonded through glue on two sides of the same wafer spacer, a plurality of glue dispensing grooves are arranged around the lens unit, the adjacent glue dispensing grooves are communicated through glue containing guide grooves, the glue dispensing grooves and the glue containing guide grooves form a closed glue containing space surrounding the lens unit, and glue is filled in the closed glue containing space to bond the two wafer-level lens arrays or respectively bond the two wafer-level lens arrays on two sides of the wafer spacer.
Further, under the condition that the two adjacent wafer-level lens arrays are fixedly bonded through glue, the glue dispensing groove is arranged on the surface of the lower wafer substrate, and the glue containing diversion groove is arranged on the surface of the lower wafer substrate or/and the surface of the upper wafer substrate.
Further, bond through glue respectively at adjacent two-layer wafer level camera lens array and be fixed in under the condition of the both sides of same wafer spacer, the point is glued the groove and is arranged in the wafer substrate surface of lower floor, hold and glue the guiding gutter and arrange in the wafer substrate surface of lower floor or/and the downside of wafer spacer.
Furthermore, the diameter of the circumcircle of the outline of the glue dispensing grooved wheel is not less than the width of the cross section of the glue containing diversion trench.
The utility model provides a wafer level camera lens module, cut by wafer level camera lens module array and form, including the multilayer wafer base plate of piling up together and arrange the camera lens unit on the wafer base plate, it is fixed or be fixed in the both sides of same wafer spacer through glue bonding respectively to bond through glue between the adjacent two-layer wafer base plate, encircle around arranging a plurality of some glue mixing groove around the camera lens unit, through holding gluey guiding gutter intercommunication between the adjacent glue mixing groove, glue mixing groove and holding gluey guiding gutter constitution enclose camera lens unit's closed glue mixing space, fill glue and bond two-layer wafer base plate or bond two-layer wafer base plate in the both sides of wafer spacer respectively in this closed glue mixing space.
A method for producing a wafer-level lens module comprises the following steps:
processing lens units arranged in an array manner and a closed glue accommodating space surrounding the lens units on a wafer substrate by an ultraviolet light injection molding and curing molding process;
dripping glue for bonding the wafer-level lens array into the glue dispensing groove;
in the process of stacking the multiple wafer-level lens arrays together, glue in the glue dispensing groove diffuses along the glue containing guide grooves and is gradually filled to fill the whole closed glue containing space, and adjacent wafer-level lens arrays are bonded and fixed through the glue filled in the closed glue containing space;
the bonded and fixed multi-layer wafer-level lens array forms a wafer-level lens module array, and the wafer-level lens module array is cut into a plurality of wafer-level lens modules.
Has the advantages that: the closed glue containing space is arranged around the lens unit, glue for bonding the two wafer-level lens module arrays is filled in the closed glue containing space, the glue coating state is controllable, a bubble cavity is prevented from being formed after the glue is solidified, and the production yield of the lens assembly is ensured.
Drawings
Fig. 1 is a schematic structural view of a glue dispensing groove and a glue containing diversion groove.
Fig. 2 is a first schematic view illustrating the assembly of two wafer level lens module arrays.
FIG. 3 is a second schematic view illustrating the assembly of two wafer level lens module arrays.
FIG. 4 is a schematic view of a wafer spacer.
FIG. 5 is a schematic view of a single wafer level lens module;
in the figure: 1-a wafer substrate; 2-a lens unit; 3-glue dispensing groove; 4-glue containing diversion trenches; 5-glue; 6-wafer spacer.
The specific implementation mode is as follows:
the invention is further explained below with reference to the drawings.
The invention discloses a wafer-level lens module array assembly structure, which comprises a plurality of stacked wafer-level lens arrays, as shown in figure 1, each wafer-level lens array comprises a wafer substrate 1 and lens units 2 arranged on the wafer substrate 1 in an array manner, two adjacent layers of wafer-level lens arrays are fixedly bonded through glue 5 or are respectively fixedly bonded through the glue 5 on two sides of a same wafer spacer 6, a plurality of glue dispensing grooves 3 are arranged around the lens units 2, the adjacent glue dispensing grooves 3 are communicated through glue-containing guide grooves 4, and the diameter of a circle circumscribed by the outline of each glue dispensing groove 3 is not less than the width of the cross section of each glue-containing guide groove 4. The glue dispensing groove 3 and the glue containing diversion groove 4 form a closed glue containing space surrounding the lens unit 2, and glue 5 is filled in the closed glue containing space to bond two wafer-level lens arrays or bond two wafer-level lens arrays on two sides of the wafer spacer 6 respectively. Therefore, the coating state of the glue 5 can be well controlled through the closed glue containing space, and the glue is prevented from generating a bubble cavity.
For the short condition of the lens unit 2, the two adjacent wafer level lens arrays are bonded and fixed by glue 5. In this case, the dispensing slot 3 may be disposed on the surface of the lower wafer substrate 1, and the glue-accommodating guiding slot 4 may be disposed on the surface of the lower wafer substrate 1 or/and the bottom surface of the upper wafer substrate 1.
As shown in fig. 2, the dispensing slot 3 is disposed on the surface of the lower wafer substrate 1, the glue-accommodating flow-guiding slot 4 is disposed on the surface of the lower wafer substrate 1, and the dispensing slot 3 and the glue-accommodating flow-guiding slot 4 on the surface of the lower wafer substrate 1 form a closed glue-accommodating space surrounding the lens unit 2.
As shown in fig. 3, the dispensing groove 3 is disposed on the surface of the lower wafer substrate 1, the glue-accommodating flow-guiding groove 4 is disposed on the bottom surface of the upper wafer substrate 1, and the dispensing groove 3 on the surface of the lower wafer substrate 1 and the glue-accommodating flow-guiding groove 4 on the bottom surface of the upper wafer substrate 1 form a closed glue-accommodating space surrounding the lens unit 2.
Under the condition that the dispensing grooves 3 are arranged on the surface of the lower wafer substrate 1, the glue containing guide grooves 4 can also be arranged on the surface of the lower wafer substrate 1 and the bottom surface of the upper wafer substrate 1, and the dispensing grooves 3 on the surface of the lower wafer substrate 1, the surface of the lower wafer substrate 1 and the glue containing guide grooves 4 on the bottom surface of the upper wafer substrate 1 form a closed glue containing space surrounding the lens unit 2.
For the case that the lens unit 2 is high, two adjacent wafer level lens arrays are respectively bonded and fixed on two sides of the same wafer spacer 6 through glue 5. In this case, the dispensing grooves 3 may be disposed on the surface of the lower wafer substrate 1, and the glue-accommodating grooves 4 may be disposed on the surface of the lower wafer substrate 1 or/and the lower side of the spacer wafer 6.
As shown in fig. 4, the dispensing slot 3 is disposed on the surface of the lower wafer substrate 1, and the glue-accommodating guiding slot 4 is disposed on the surface of the lower wafer substrate 1. The glue dispensing groove 3 and the glue containing diversion groove 4 on the surface of the lower layer wafer substrate 1 form a closed glue containing space surrounding the lens unit 2.
Under the condition that the dispensing groove 3 is arranged on the surface of the lower layer wafer substrate 1, the glue containing diversion groove 4 can also be arranged on the lower side surface of the wafer spacer 6, and the dispensing groove 3 on the surface of the lower layer wafer substrate 1 and the glue containing diversion groove 4 on the lower side surface of the wafer spacer 6 form a closed glue containing space surrounding the lens unit 2.
Under the condition that the dispensing groove 3 is arranged on the surface of the lower layer wafer substrate 1, the glue containing diversion groove 4 can be arranged on the lower side surfaces of the lower layer wafer substrate 1 and the wafer spacer 6, and the dispensing groove 3 on the surface of the lower layer wafer substrate 1, the surface of the lower layer wafer substrate 1 and the glue containing diversion groove 4 on the lower side surface of the wafer spacer 6 form a closed glue containing space surrounding the lens unit 2.
For the condition that two layers of wafer-level lens arrays are bonded through the spacer, the back surface of the upper layer of the wafer substrate 1 is directly bonded with the upper end surface of the spacer because the upper layer of the wafer substrate 1 and the spacer can be exhausted in the bonding process, and a closed glue accommodating space is not required to be additionally arranged.
As shown in fig. 5, the wafer level lens module of the present invention is formed by dividing and cutting a wafer level lens module array, and includes a plurality of stacked wafer substrates 1 and lens units 2 disposed on the wafer substrates 1, two adjacent wafer substrates 1 are bonded and fixed by glue 5 or are bonded and fixed on two sides of a same wafer spacer 6 by glue 5, a plurality of dispensing slots 3 are disposed around the lens unit 2, adjacent dispensing slots 3 are communicated by glue-containing guiding slots 4, the dispensing slots 3 and the glue-containing guiding slots 4 form a closed glue-containing space surrounding the lens unit 2, and glue 5 is filled in the closed glue-containing space to bond two wafer substrates 1 or bond two wafer substrates 1 on two sides of the wafer spacer 6.
The invention relates to a method for producing a wafer-level lens module, which comprises the following steps:
processing lens units arranged in an array manner and a closed glue containing space surrounding the lens units on a wafer substrate by an ultraviolet light injection curing molding process, wherein the closed glue containing space is composed of glue dispensing grooves and glue containing guide grooves, a plurality of glue dispensing grooves are arranged around the lens units, and adjacent glue dispensing grooves are communicated through the glue containing guide grooves;
dripping glue for bonding the wafer-level lens array into the glue dispensing groove;
in the process of stacking a plurality of wafer-level lens module arrays together, glue in the glue dispensing groove diffuses along the glue containing diversion groove and is gradually filled to fill the whole closed glue containing space, and adjacent wafer-level lens arrays are bonded and fixed through the glue filled in the closed glue containing space;
and adhering and fixing the multilayer wafer-level lens arrays to form a wafer-level lens module array, and cutting the wafer-level lens module array into a plurality of wafer-level lens modules.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (3)
1. The utility model provides a wafer level lens module array package assembly, includes the multilayer wafer level lens array of piling up together, and wafer level lens array includes the wafer base plate and is the lens unit of array arrangement on the wafer base plate which characterized in that: the two adjacent wafer-level lens arrays are fixedly bonded through glue or are respectively fixedly bonded through glue on two sides of the same wafer spacer, a plurality of glue dispensing grooves are arranged around the lens unit, the adjacent glue dispensing grooves are communicated through glue containing guide grooves, the diameter of a circumcircle of the outline of each glue dispensing groove is not smaller than the width of the cross section of each glue containing guide groove, the glue dispensing grooves and the glue containing guide grooves form a closed glue containing space surrounding the lens unit, and glue is filled in the closed glue containing space to bond the two wafer-level lens arrays or the two wafer-level lens arrays are respectively bonded on two sides of the wafer spacer;
under the condition that two adjacent wafer-level lens arrays are fixedly bonded through glue, the glue dispensing groove is arranged on the surface of the lower wafer substrate, and the glue containing diversion groove is arranged on the surface of the lower wafer substrate or/and the bottom surface of the upper wafer substrate;
under the condition that adjacent two-layer wafer level camera lens array is fixed in the both sides of same wafer spacer through the glue bonding respectively, the point is glued the groove and is arranged in the wafer substrate surface of lower floor, hold gluey guiding gutter and arrange in the wafer substrate surface of lower floor or/and the downside of wafer spacer.
2. A wafer-level lens module is formed by cutting a wafer-level lens module array and comprises a plurality of stacked wafer substrates and lens units arranged on the wafer substrates, and is characterized in that two adjacent layers of wafer substrates are fixedly bonded through glue or are respectively fixedly bonded through glue on two sides of a same wafer spacer, a plurality of glue dispensing grooves are arranged around the lens units, the adjacent glue dispensing grooves are communicated through glue containing guide grooves, the diameter of a circle circumscribing the outline of each glue dispensing groove is not smaller than the width of the cross section of each glue containing guide groove, a closed glue containing space surrounding the lens units is formed by the glue dispensing grooves and the glue containing guide grooves, and glue is filled in the closed glue containing space to bond the two layers of wafer substrates or respectively bond the two layers of wafer substrates on two sides of the wafer spacer.
3. A method for producing a wafer-level lens module is characterized by comprising the following steps:
processing lens units arranged in an array manner and a closed glue containing space surrounding the lens units on a wafer substrate by an ultraviolet light injection curing molding process, wherein the closed glue containing space is composed of glue dispensing grooves and glue containing guide grooves, a plurality of glue dispensing grooves are arranged around the lens units, adjacent glue dispensing grooves are communicated through the glue containing guide grooves, and the diameter of a circumcircle of the outline of each glue dispensing groove is not less than the width of the cross section of each glue containing guide groove;
dripping glue for bonding the wafer-level lens array into the glue dispensing groove;
in the process of stacking the multiple wafer-level lens arrays together, glue in the glue dispensing groove diffuses along the glue containing guide grooves and is gradually filled to fill the whole closed glue containing space, and adjacent wafer-level lens arrays are bonded and fixed through the glue filled in the closed glue containing space;
the bonded and fixed multi-layer wafer-level lens array forms a wafer-level lens module array, and the wafer-level lens module array is cut into a plurality of wafer-level lens modules.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110072223.9A CN112882175B (en) | 2021-01-20 | 2021-01-20 | Wafer level lens module array assembly structure, lens module and production method thereof |
| PCT/CN2021/075198 WO2022156003A1 (en) | 2021-01-20 | 2021-02-04 | Wafer-level lens module array assembly structure, lens module, and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110072223.9A CN112882175B (en) | 2021-01-20 | 2021-01-20 | Wafer level lens module array assembly structure, lens module and production method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112882175A CN112882175A (en) | 2021-06-01 |
| CN112882175B true CN112882175B (en) | 2022-04-29 |
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| CN202110072223.9A Active CN112882175B (en) | 2021-01-20 | 2021-01-20 | Wafer level lens module array assembly structure, lens module and production method thereof |
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| CN (1) | CN112882175B (en) |
| WO (1) | WO2022156003A1 (en) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090159200A1 (en) * | 2007-12-19 | 2009-06-25 | Heptagon Oy | Spacer element and method for manufacturing a spacer element |
| CN101852908B (en) * | 2009-03-30 | 2013-03-27 | 鸿富锦精密工业（深圳）有限公司 | Wafer-level lens module array |
| US20100284089A1 (en) * | 2009-05-07 | 2010-11-11 | San-Woei Shyu | Stacked optical glass lens array, stacked lens module and manufacturing method thereof |
| TWM364865U (en) * | 2009-05-07 | 2009-09-11 | E Pin Optical Industry Co Ltd | Miniature stacked glass lens module |
| TW201109164A (en) * | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked lens module and their method of manufacturing thereof |
| TW201109165A (en) * | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof |
| JP2011186306A (en) * | 2010-03-10 | 2011-09-22 | Fujifilm Corp | Wafer lens unit and method for manufacturing the same |
| CN103620468A (en) * | 2011-06-17 | 2014-03-05 | 柯尼卡美能达株式会社 | Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit |
| US20170219793A1 (en) * | 2016-01-28 | 2017-08-03 | AAC Technologies Pte. Ltd. | Sealed module with glue guiding features and method for making same |
| CN206339767U (en) * | 2016-12-10 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Camera lens module |
| CN108873119B (en) * | 2018-06-12 | 2022-05-10 | 华天慧创科技（西安）有限公司 | Wafer-level optical element and preparation method thereof |
| US10636829B1 (en) * | 2018-10-24 | 2020-04-28 | Himax Technologies Limited | Wafer-level optical structure |
| CN112014941B (en) * | 2019-05-28 | 2022-11-25 | 宁波舜宇车载光学技术有限公司 | Lens assembly, optical lens and assembling method of optical lens |
| CN211651855U (en) * | 2020-04-21 | 2020-10-09 | 拾斛科技(苏州)有限公司 | Infrared sensor |
-
2021
- 2021-01-20 CN CN202110072223.9A patent/CN112882175B/en active Active
- 2021-02-04 WO PCT/CN2021/075198 patent/WO2022156003A1/en active Application Filing
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| Publication number | Publication date |
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| WO2022156003A1 (en) | 2022-07-28 |
| CN112882175A (en) | 2021-06-01 |
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