CN110373080A - Thermosetting composition, cured film and colored filter - Google Patents

Thermosetting composition, cured film and colored filter Download PDF

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Publication number
CN110373080A
CN110373080A CN201910264727.3A CN201910264727A CN110373080A CN 110373080 A CN110373080 A CN 110373080A CN 201910264727 A CN201910264727 A CN 201910264727A CN 110373080 A CN110373080 A CN 110373080A
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methyl
compound
thermosetting composition
cured film
film
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CN110373080B (en
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木村佑希
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JNC Corp
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JNC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04—Anhydrides, e.g. cyclic anhydrides
    • C08F222/06—Maleic anhydride
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C08F222/402—Alkyl substituted imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133519—Overcoatings

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  • Crystallography & Structural Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Optical Filters (AREA)

Abstract

The present invention provides a kind of thermosetting composition, cured film and colored filter.Thermosetting composition; it includes copolymer (A), tools there are three the compound (B) of above epoxy group, with the compound (C) and solvent (D) of more than four (methyl) acryloyl groups, and the copolymer (A) is the reaction product of the monomer (b) other than monomer (a) and monomer (a) represented by following formula (1).Thermosetting composition through the invention and the excellent cured film of heat resistance, gas barrier property, inviscid, adhesion, flatness, the transparency can be formed.The cured film may be suitably used in electronic component.In formula (1), R1And R2It independently is the alkyl or phenyl of hydrogen, carbon number 1~3.

Description

Thermosetting composition, cured film and colored filter
Technical field
The present invention relates to the passivating films, slow in a kind of insulating materials that can be used to form in electronic component, semiconductor device Rush film, interlayer dielectric, planarization film, the interlayer dielectric in liquid crystal display element, colored filter (color Filter) with the thermosetting composition of protective film etc., the hyaline membrane formed by the thermosetting composition and with described The electronic component of film.
Background technique
In the manufacturing step of the elements such as liquid crystal display element, there is the step of the organic film of various functions including being formed Suddenly.For example, film forming/pattern of film forming/patterning/heat treatment step of black matrix" resist, colored filter resist Change/heat treatment step, film forming/patterning/heat treatment step of protective films of color filters, tin indium oxide (Indium Tin Oxide, ITO) film formation step of conductive film, ITO pattern photoresist film forming/patterning/wet etching/resist Strip step, ITO annealing steps, film forming/heat treatment/friction (polarisation exposure) step of alignment films etc..In these various steps In, for element, have an opportunity to be contacted with the various chemicals such as organic solvent, acid, aqueous slkali, in addition, by sputter come When forming electrode, there is also surfaces to be locally exposed to the situation under high temperature.Therefore, sometimes for the surface for preventing various elements Deterioration, damage, rotten purpose and surface protection film is set.Tolerable manufacture step as described above is required to these protective films Each characteristic of various processing in rapid.Specifically, it is desirable that the chemicals-resistants such as heat resistance, solvent resistance/acid resistance/alkali resistance Property, water resistance, the adhesion to underlay substrates such as glass, the transparency, scratch resistance, coating, flatness, light resistance etc..It is special It is not in recent years, in order to improve the display quality of display, and to require to expand colour gamut, the requirement characteristic to colored filter becomes It obtains strictly, is accompanied by this, lead to the problem of pigment/dye and dissolved out from colored filter, be strongly required to improve the choke of protective film Property.
So far, it in order to provide protective film, and proposes polyimide material being used as protective film (patent document 1).Separately Outside, it was also proposed that have protective film (patent document 2, patent using silicone compositions characterized by high heat resistance and the transparency Document 3).Alternatively, proposing the protective film or use acrylic resin or polyester that have using epoxy resin and melamine resin The protective film (patent document 4, patent document 5, patent document 6) of resin.In addition, it was also proposed that have in the composition comprising multifunctional The thermal sclerosing material (patent document 7, patent document 8, patent document 9) of acrylate.
However, using in the protective film of polyimide material, in order to prepare polyimides or polyimide precursor (polyamide Acid) solution, and need to have strong solvent so-called polyimides molten using N-Methyl pyrrolidone or gamma-butyrolacton etc. Matchmaker, and there are problems that the organic film of substrate can be dissolved.Especially in the case where being used as the protective film of colored filter, Described problem becomes big problem, and becomes the factor that gas barrier property reduces.In addition, in polyimides, due to mobile by charge Interaction (electric charge transfer (Charge Transfer, CT) interaction) and to cause the edge of optical absorption band to extend to visible Light region, therefore there is also colour.On the other hand, resistance to using silicone compositions (sol gel film) It is hot abundant with the transparency, but the temperature required for the reaction of silanol group finishes also becomes 300 DEG C or more, therefore there is also The problem of leading to the deterioration of the organic film of substrate or the problem of crack (cracking) in the film because of curing shrinkage.This Outside, there is also-the Si-O-Si- of silicone compositions keys is easy the difficult point hydrolyzed because of alkali.In addition, using epoxy resin and three In the case where the material of cymel, although there is no problem in terms of using solvent or heat treatment temperature, also generate yellow The problem of change.Using in the material of acrylic resin, although gas barrier property improves, with other characteristics and deposit aspect and be easy to produce Raw problem.In addition, although gas barrier property can be improved, making solvent dry after coating in the material containing polyfunctional acrylic ester Made of film there is viscosity, thus generate the dust from environment be attached to surface and the problems such as produced film defect.
According to the situation, seek a kind of to make other each characteristics especially viscosity, flatness, the contiguity to underlay substrate Property, the transparency is together with gas barrier property and the material deposited.
[existing technical literature]
[patent document]
[patent document 1] Japanese Patent Laid-Open No. Sho 62-163016
[patent document 2] Japanese Patent Laid-Open No. Sho 62-242918
[patent document 3] Japanese Patent Laid-Open 7-331178
[patent document 4] Japanese Patent Laid-Open No. Sho 63-131103
[patent document 5] Japanese Patent Laid-Open 8-50289
[patent document 6] Japanese Patent Laid-Open 2013-253263
[patent document 7] Japanese Patent Laid-Open 2009-203364
[patent document 8] Japanese Patent Laid-Open 2011-68779
[patent document 9] Japanese Patent Laid-Open 2012-41535
Summary of the invention
[problem to be solved by the invention]
Problem of the invention is that providing a kind of offer gas barrier property, inviscid (tackless), adhesion, flatness, thoroughly The thermosetting composition of the excellent cured film of bright property and the cured film formed by the thermosetting composition, and then provide one Kind has the electronic component of the cured film.
[technical means to solve problem]
The present inventor carried out in order to solve described problem make great efforts research, as a result by using thermosetting composition and The present invention is completed, the thermosetting composition includes by that will have the monomer of anhydride group and other monomers copolymerization to obtain Copolymer, at least have there are three the compound of above epoxy group, at least with more than four (methyl) acryloyl groups Compound and solvent.The present invention includes composition below.
[1] a kind of thermosetting composition, it includes copolymer (A), tool, there are three the compounds of above epoxy group (B), with the compound (C) and solvent (D) of more than four (methyl) acryloyl groups, the copolymer (A) is from following The reaction product of monomer (a) represented by formula (1) and the monomer (b) other than monomer (a):
In formula (1), R1And R2It independently is the alkyl or phenyl of hydrogen, carbon number 1~3.
[2] according to the thermosetting composition of [1] Xiang Suoshu, wherein the monomer (b) is represented selected from following formula (2) Compound and at least one of indenes (indene):
In formula (2), R1And R2It independently is the alkyl or phenyl of hydrogen, carbon number 1~3, R3For any monovalent organic radical.
[3] according to the thermosetting composition of [1] Xiang Suoshu, wherein the compound of the epoxy group with three or more It (B) is the compound with aromatic rings.
[4] a kind of cured film is formed as the thermosetting composition according to any one of [1] to [3].
[5] a kind of colored filter has according to the cured film of [4] Xiang Suoshu as transparent protective film.
[The effect of invention]
The thermosetting composition of the preferred embodiment of the present invention is that can form gas barrier property, inviscid, adhesion, flat Property, the transparency is excellent and the material of cured film especially excellent in terms of gas barrier property, in the coloured silk for being used as color liquid crystal display device In the case where colo(u)r filter protective film, display quality can be improved.It especially acts effectively as and utilizes decoration method, pigment dispersion method, electricity Sedimentation and print process and the protective film of colored filter manufactured.In addition, also be used as various optical materials protective film and Transparent insulating film.
Specific embodiment
1. thermosetting composition of the invention
Thermosetting composition of the invention is comprising the copolymer (A) containing compound represented by formula (1), has three The compound (B) of a above epoxy group, the compound (C) with more than four (methyl) acryloyl groups and solvent (D) Thermosetting composition.In thermosetting composition of the invention, preferably are as follows: relative to 100 parts by weight of copolymer (A), tool It is 10 parts by weight~500 parts by weight there are three the compound (B) of above epoxy group, there are more than four (methyl) acryloyls The compound (C) of base is 50 parts by weight~200 parts by weight.
1-1. copolymer (A)
Copolymer (A) be make must comprising compound represented by the formula (1) as monomer (a), as monomer (a) The raw material for being selected from compound represented by formula (2) and the compound in indenes of other monomers (b) in addition is in radical initiator In the presence of carry out free-radical polymerized and obtain.In addition, other monomers (b) also may include the compound other than the compound.
In other monomers (b), using compound represented by formula (2) and the compound other than indenes, just For the viewpoint of heat resistance, preferably with 0wt%~40wt% of the entirety of monomer used in free radical polymerization, more preferably The additive amount of 0wt%~20wt% is advisable.
In addition, at least needing solvent in the synthesis of copolymer (A).The solvent can be made directly to remain and consideration is made Liquid or gelatinous composition to operability etc., in addition, can also remove and be made in view of carrying property etc. by the solvent Solid-like composition.
Other compounds other than described in can also including in the range of not undermining the purpose of the present invention.As other raw materials Example, may include free radical polymerization monomer, chain-transferring agent.
1-1-1. monomer (a) and monomer (b)
In the present invention, include change represented by formula (1) as monomer (a) about the material to obtain copolymer (A) Close object.In addition, being selected from compound represented by formula (2) and the chemical combination in indenes containing more than one as other monomers (b) Object.The concrete example of formula (1) can enumerate maleic anhydride, citraconic anhydride (citraconic anhydride), 2,3- dimethyl Malaysia Acid anhydrides, phenylmaleic anhydride, 2,3- diphenyl maleic anhydride.The concrete example of compound represented by formula (2) can enumerate N- methyl Maleimide, n-ethylmaleimide, N- propylmaleimide, N- N-cyclohexylmaleimide, N- phenyl Malaysia acyl Imines, N- benzyl maleimide.In addition, can also include represented by formula (2) in the range of not undermining characteristic of the invention Monomer (b) other than compound and indenes.It as the concrete example in the situation, can enumerate: methacrylic acid, methyl methacrylate Ester, ethyl methacrylate, propyl methacrylate, butyl methacrylate, glycidyl methacrylate, metering system Acid -2- hydroxy methacrylate, benzyl methacrylate, methacrylic acid -2- phenoxy ethyl, methacrylic acid -2- phenyl chlorocarbonate, first Base isobornyl acrylate, methacrylic acid bicyclopentyl ester, 2,2,2-trifluoroethyl methacrylate.
Solvent used in the synthesis of 1-1-2. copolymer (A)
It as the concrete example of solvent used in the synthesis to obtain copolymer (A), can enumerate: ethyl acetate, second Acid butyl ester, propyl acetate, butyl propionate, ethyl lactate, methoxy menthyl acetate, ethyl methoxyacetate, methoxyacetic acid fourth Ester, ethoxy acetate, ethoxy ethyl acetate, 3- oxygroup methyl propionate, 3- hydroxypropionate, 3- methoxypropionic acid first Ester, 3- methoxypropionate, 3- ethoxypropanoate, 3- ethoxyl ethyl propionate, 2 hydroxy propanoic acid methyl esters, 2- hydroxyl third Propyl propionate, 2- methoxy methyl propionate, 2- methoxypropionate, 2- methoxy propyl propyl propionate, 2- ethoxypropanoate, 2- Ethoxyl ethyl propionate, 2- hydroxy-2-methyl methyl propionate, 2- hydroxy-2-methyl ethyl propionate, 2- methoxyl group -2- methyl-prop Sour methyl esters, 2- ethyoxyl -2 Methylpropionic acid ethyl ester, methyl pyruvate, ethyl pyruvate, Propyl pyruvate, methyl acetoacetate, Ethyl acetoacetate, 2-Oxobutyric acid methyl esters, 2-Oxobutyric acid ethyl ester, 4- hydroxy-4-methyl-2-pentanone, 1,4- butanediol, third Glycol monomethyl ether, propylene glycol methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetic acid esters, ethylene glycol list Butyl ether acetic acid esters, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetic acid esters, diethylene glycol monoethyl ether, Diethylene glycol monoethyl ether acetic acid esters, diethylene glycol monobutyl ether, butyl carbitol acetate, diethylene glycol dimethyl ether, diethyl Glycol diethyl ether and diethylene glycol methyl ethyl ether.Solvent can be one kind of these solvents, can also for two kinds of these solvents with On mixture.
Radical initiator used in the synthesis of 1-1-3. copolymer (A)
In the synthesis of copolymer (A), as the radical initiator for starting polymerization reaction, commercially available azo can be used The radical initiator of system or peroxide system.It as the concrete example of azo system radical initiator, such as can enumerate: 2,2'- Azo bis- (isobutyronitriles), 2,2'- azo bis- (2- methylbutyronitriles), 2,2'- azo bis- (2,4- dimethoxy valeronitriles), 2,2'- are even Nitrogen is bis- (4- dimethoxy -2,4- methyl pentane nitrile).The concrete example of radical initiator as peroxide system, such as can arrange It lifts: bis- (the 4- t-butylcyclohexyls of benzoyl peroxide, cumyl peroxide, peroxidized t-butyl perbenzoate, dicetyl peroxydicarbonate Base) ester.Radical initiator can be used alone, in addition, can also be used in mixed way two or more.
Molecular weight regulator used in the synthesis of 1-1-4. copolymer (A)
In the synthesis of copolymer (A), it can also also contain molecular weight regulator, to inhibit molecular weight to get higher, and show excellent Different storage stability.It as molecular weight regulator, can enumerate: thio-alcohol, xanthan acids, quinones, hydroquinones and 2,4- hexichol Base -4-methyl-1-pentene etc..
It as the concrete example of molecular weight regulator, can enumerate: 2-hydroxy-1,4-naphthoquinone, benzoquinones, 1,4-naphthoquinone, Isosorbide-5-Nitrae-two Hydroxyl naphthalene, 2,5- di-t-butyl quinhydrones, quinhydrones, methylnaphthohydroquinone, tert-butyl hydroquinone, first quinone (methoquinone), 1,4-benzoquinone, Methyl -1,4-benzoquinone, tert-butyl-p-benzo-quinone, anthraquinone, n-hexyl mercaptan, n octylmercaptan, positive dodecylmercaptan, tertiary dodecyl sulphur Alcohol, thioglycolic acid, dimethyl yellow ortho acid thioether, diisopropyl xanthic acid disulfide, 2,4- diphenyl -4-methyl-1-pentene.
Molecular weight regulator can be used alone, and also can be used in combination two or more.
The synthetic method of 1-1-5. copolymer (A)
About copolymer used in the present invention (A), makes compound represented by the formula (1) and be selected from formula (2) institute The compound of expression and the monomer in indenes polymerize in the solvent and in the presence of thermal free radical initiator.
In the synthesis of copolymer (A), the monomer copolymerization of formula (1), formula (2), therefore its heat of polymerization (heat of Polymerization) big.In the case where being difficult to carry out polymerization control because of heat of polymerization, can be subtracted by using chain-transferring agent Oligomerization heat.Chain-transferring agent is not particularly limited, and can properly use 2,4- diphenyl -4-methyl-1-pentene.
If reacting and swimmingly carrying out using reaction dissolvents more than 80 parts by weight relative to 100 parts by weight of solute, because This is preferably.Reaction is reacted 0.2 hour~20 hours at 40 DEG C~200 DEG C.
Free radical polymerization is preferably 40 DEG C~120 DEG C of reaction temperature, more preferably 60 DEG C~80 DEG C of reaction temperature.
The weight average molecular weight of copolymer obtained is preferably 1,000~1,000,000, more preferably 3,000~ 500,000.If being in these ranges, coating, flatness are good.
Weight average molecular weight in this specification is to utilize gel permeation chromatography (Gel Permeation Chromatography, GPC) (tubing string temperature: 35 DEG C, flow velocity: 1ml/min) and the value of polystyrene conversion that finds out.Standard Polystyrene using molecular weight be 645~132,900 polystyrene (for example, Agilent Technologies (Agilent Technologies) polystyrene calibration set group (calibration kit) PL2010-0102 of limited liability company), tubing string (PLgel MIXED)-D (Agilent Technologies (Agilent Technologies) limited liability company) is mixed using PL gel, Tetrahydrofuran (Tetrahydrofuran, THF) can be used to be measured as mobile phase.Commercially available product in this specification Weight average molecular weight is catalogue (catalogue) record value.
There are three the compounds (B) of above epoxy group for 1-2. tool
Epoxide used in the present invention is that there are three the compounds of above epoxy group for each molecule tool.Epoxy Compound (B) can be one kind, can also be two or more.
There are three the examples of the compound (B) of above epoxy group for 1-2-1. tool
As tool there are three the example of the compound (B) of above epoxy group, can enumerate: Te Kemo (TECHMORE) VG3101L (trade name, Pu Lintaike (Printec) limited liability company)；EHPE3150 (trade name, Daicel (Daicel) Limited liability company)；EPPN-501H, EPPN-502H (being trade name, NIPPON PHARMACEUTICAL CO., LTD)；jER 1032H60 (trade name, limited liability company, Mitsubishi Chemical)；Pellet receives Cauer (Denacol) EX-313, pellet and receives Cauer (Denacol) EX-314, pellet receive Cauer (Denacol) EX-321, pellet and receive Cauer (Denacol) EX-411, pellet and receive Cauer (Denacol) EX-421, pellet receive Cauer (Denacol) EX-512, pellet and receive Cauer (Denacol) EX-521, pellet and receive Cauer (Denacol) EX-612, pellet receive Cauer (Denacol) EX-614, pellet and receive Cauer (Denacol) EX-614B, pellet and receive Cauer (Denacol) DLC-302, pellet receive Cauer (Denacol) DLC-402 (trade name, long rapids chemical conversion (Nagase chemteX) share Co., Ltd)；NC-3000, NC-3000-L, NC-3000-H, NC-3100 (it is trade name, the Japanese limited public affairs of chemical drug share Department)；EPPN-201 (trade name, NIPPON PHARMACEUTICAL CO., LTD)；JER 152, jER 154 (are trade name, Mitsubishi Chemical Limited liability company)；EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1020 (it is trade name, Japanese chemical drug share Co., Ltd)；JER 157S65, jER 157S70 (being trade name, limited liability company, Mitsubishi Chemical)；1,3- it is bis- [2- (3, 4- epoxycyclohexyl) ethyl] tetramethyl disiloxane (trade name, prompt Leicester limited liability company (Gelest Incorporated))；(trade name, step figure new high-tech material (Momentive Performance Materials) has TSL9906 Limit responsible company)；Examine special Olso (COATOSIL) MP200 (trade name, Japan figure new high-tech material (Momentive advanced in years Performance Materials Japan) Co., Ltd)；Empty Po Sailang (Conpoceran) SQ506 (trade name, famine River chemistry limited liability company)；ES-1023 (trade name, Shin-Estu Chemical Co., Ltd).
Furthermore Te Kemo (TECHMORE) VG3101L (trade name, Pu Lintaike (Printec) limited liability company) is 2- [4- (2,3- glycidoxy) phenyl] -2- [4- [bis- [4- (2,3- glycidoxy) phenyl] ethyls of 1,1-] phenyl] propane And bis- [4- [1- [4- (2,3- glycidoxy) phenyl] -1- [4- [1- [4- (2,3- glycidoxy) phenyl] -1- first of 1,3- Base ethyl] phenyl] ethyl] phenoxy group] -2- propyl alcohol mixture；(trade name, Daicel (Daicel) share have EHPE3150 Limit company) be bis- (the hydroxymethyl)-n-butyl alcohols of 2,2- 1,2- epoxy group -4- (2- oxiranyl) hexamethylene addition product, examine Special Olso (COATOSIL) MP200 (trade name, Japan figure new high-tech material (Momentive Performance advanced in years Materials Japan) Co., Ltd) it is using 3- glycidoxypropyltrimewasxysilane as the poly- of material composition Close object.
Ratio of the 1-2-2. tool there are three the compound (B) of above epoxy group relative to copolymer (A)
Tool in thermosetting composition of the invention there are three the total amount of the compound (B) of above epoxy group relative to The ratio of 100 parts by weight of copolymer (A) is 10 parts by weight~500 parts by weight.If there are three the compounds of above epoxy group for tool (B) ratio of total amount is the range, then flatness, heat resistance, chemical-resistant, the balance of substrate adhesion are good.Tool Total amount there are three the compound (B) of above epoxy group is preferably 50 parts by weight~300 parts by weight range, but is adjusted together Polymers, epoxy curing agent molar ratio determine the total amount.
1-3. has the compound (C) of more than four (methyl) acryloyl groups
Compound with (methyl) acryloyl group used in the present invention is that each molecule has more than four (first Base) acryloyl group compound.Compound (C) can be one kind, can also be two or more.
1-3-1. has the example of the compound of more than four (methyl) acryloyl groups
The concrete example of compound (C) in the present invention can be enumerated: pentaerythrite three (methyl) acrylate, pentaerythrite four (methyl) acrylate, dipentaerythritol five (methyl) acrylate, alkyl-modified dipentaerythritol five (methyl) acrylate, Alkyl-modified dipentaerythritol four (methyl) acrylate, dipentaerythritol six (methyl) acrylate, two season of caprolactone modification Penta tetrol six (methyl) acrylate, modified by polyacid (methyl) acryloyl group oligomer, polyester tetra acrylate, polyester 5 third Olefin(e) acid ester, polyester hexaacrylate, polyfunctional carbamate acrylate oligomer etc..
Can be used alone the compound, can also be used in mixed way two or more.In addition, in addition to these compounds, it can also The compound with trifunctional (methyl) acryloyl group below is used in the range of not undermining characteristic of the invention.
In compound with more than four (methyl) acryloyl groups, with regard to the heat resistance of cured film, chemical-resistant For viewpoint, it is preferable to use pentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, six acrylic acid of dipentaerythritol The mixture of ester, modified by polyacid (methyl) acryloyl group oligomer or these compounds.
As pentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol hexaacrylate, polynary The mixture of modified (methyl) the acryloyl group oligomer of acid or these compounds, can be used following commercially available products.
The concrete example of pentaerythritol tetraacrylate is M-450 (trade name；East Asia synthesizes limited liability company, tripolymer < 10%).The concrete example of the mixture of Dipentaerythritol Pentaacrylate and dipentaerythritol hexaacrylate is Aronix (Aronix) M-403 (the 50 weight % of weight %~60 of pentamer), Aronix (Aronix) M-400 (40 weight % of pentamer ~50 weight %), Aronix (Aronix) M-402 (the 30 weight % of weight %~40 of pentamer), Aronix (Aronix) M-404 (the 30 weight % of weight %~40 of pentamer), Aronix (Aronix) M-406 (25 weight of weight %~35 of pentamer Measure %) and Aronix (Aronix) M-405 (the 10 weight % of weight %~20 of pentamer) (be trade name；East Asia synthesizes stock Part Co., Ltd, numerical value are catalogue record value).Concrete example as modified by polyacid (methyl) acryloyl group oligomer is sub- sieve Nice (Aronix) M-510 and Aronix (Aronix) M-520 (is trade name；East Asia synthesizes limited liability company).
1-3-2. has ratio of the compound (C) of more than four (methyl) acryloyl groups relative to copolymer (A)
The compound (C) with more than four (methyl) acryloyl groups in thermosetting composition of the invention it is total Measuring relative to the ratio of 100 parts by weight of copolymer (A) is 50 parts by weight~300 parts by weight.If having more than four (methyl) The ratio of the total amount of the compound (C) of acryloyl group is the range, then flatness, heat resistance, chemical-resistant, substrate contiguity The balance of property is good.The total amount of compound (C) with more than four (methyl) acryloyl groups is preferably 50 parts by weight~200 The range of parts by weight, but adjust with the molar ratio of copolymer, epoxy curing agent and determine the total amount.
1-4. solvent (D)
In thermosetting composition of the invention, solvent can be added.Added solvent (D) in composition of the invention Copolymer (A), tool preferably be can dissolve there are three the compound (B) of above epoxy group and there are more than four (methyl) third The solvent of the compound (C) of enoyl-.The concrete example of the solvent is ethyl acetate, butyl acetate, propyl acetate, propionic acid fourth Ester, ethyl lactate, methoxy menthyl acetate, ethyl methoxyacetate, methoxyacetic acid butyl ester, ethoxy acetate, ethoxy Ethyl, acetic acid -3- methoxybutyl, 3- oxygroup methyl propionate, 3- hydroxypropionate, 3- methoxy methyl propionate, 3- methoxypropionate, 3- ethoxypropanoate, 3- ethoxyl ethyl propionate, 2 hydroxy propanoic acid methyl esters, 2 hydroxy propanoic acid Propyl ester, 2- methoxy methyl propionate, 2- methoxypropionate, 2- methoxy propyl propyl propionate, 2- ethoxypropanoate, 2- second Oxygroup ethyl propionate, 2- hydroxy-2-methyl methyl propionate, 2- hydroxy-2-methyl ethyl propionate, 2- methoxyl group -2 Methylpropionic acid Methyl esters, 2- ethyoxyl -2 Methylpropionic acid ethyl ester, methyl pyruvate, ethyl pyruvate, Propyl pyruvate, methyl acetoacetate, second Ethyl acetoacetic acid ethyl ester, 2-Oxobutyric acid methyl esters, 2-Oxobutyric acid ethyl ester, 4- hydroxy-4-methyl-2-pentanone, 1,4- butanediol, the third two Alcohol monomethyl ether, propylene glycol methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetic acid esters, ethylene glycol only son Ether acetic acid ester, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetic acid esters, diethylene glycol monoethyl ether, two Ethylene glycol monoethylether acetate, diethylene glycol monobutyl ether, butyl carbitol acetate, diethylene glycol dimethyl ether, diethyl two Diethylene glycol diethyl ether and diethylene glycol methyl ethyl ether.Solvent can be one kind of these solvents, can also be the two or more of these solvents Mixture.
Common change can be used in solvent used in the synthesis of the solvent (D) and copolymer (A) disclosed above Close object.Therefore, used reaction dissolvent is directly used as solvent (D) when can be by the synthesis of copolymer (A), can also in post synthesis, Reaction dissolvent is evaporated under reduced pressure and is removed, then residue is dissolved in other solvent (D) and for thermosetting of the invention In composition.
1-5. other compositions
In thermosetting composition of the invention, various additives can be added, with improve coating homogeneity, cementability, The transparency, flatness and chemical-resistant.Additive can mainly be enumerated: solvent；Anionic system, cationic system, nonionic system, fluorine Leveling agent/surfactant of system or silicon systems；The adhesions enhancer such as silane coupling agent；Hindered phenolic, amine system of being obstructed, phosphorus system, The antioxidants such as chalcogenide compound；Molecular weight regulator；Epoxy curing agent.
1-5-1. surfactant
In thermosetting composition of the invention, surfactant can also be added, to improve coating homogeneity.Surface is living The concrete example of property agent can be enumerated: Pohle not Lip river (Polyflow) No.75, Pohle not Lip river (Polyflow) No.90, Pohle not Lip river (Polyflow) No.95 (being trade name, chemistry limited liability company, common prosperity society), Di Sipabike (Disperbyk) -161, Di Sipabike (Disperbyk) -162, Di Sipabike (Disperbyk) -163, Di Sipabike (Disperbyk) - 164, Di Sipabike (Disperbyk) -166, Di Sipabike (Disperbyk) -170, Di Sipabike (Disperbyk) -180, Di Sipabike (Disperbyk) -181, Di Sipabike (Disperbyk) -182, BYK-300, BYK-306、BYK-310、BYK-320、BYK-330、BYK-342、BYK-346、BYK-361N、BYK-UV3500、BYK- UV3570 (being trade name, chemical (the BYK Chemie Japan) limited liability company of Japanese Bi Ke), KP-341, KP-368, KF-96-50CS, KF-50-100CS (being trade name, Shin-Estu Chemical Co., Ltd), Sha Fulong (Surflon)- S611 (trade name, AGC beautify clearly (AGC Seimi Chemical) limited liability company), Fu Jite (Ftergent) 222F, Fu Jite (Ftergent) 208G, Fu Jite (Ftergent) 251, Fu Jite (Ftergent) 710FL, Fu Jite (Ftergent) 710FM, Fu Jite (Ftergent) 710FS, Fu Jite (Ftergent) 601AD, Fu Jite (Ftergent) 602A, Fu Jite (Ftergent) 650A, FTX-218 (being trade name, Ni Aosi (Neos) limited liability company), Mei Jiafa (Megafac) F-410, Mei Jiafa (Megafac) F-430, Mei Jiafa (Megafac) F-444, Mei Jiafa (Megafac) F- 472SF, Mei Jiafa (Megafac) F-475, Mei Jiafa (Megafac) F-477, Mei Jiafa (Megafac) F-552, Mei Jiafa (Megafac) F-553, Mei Jiafa (Megafac) F-554, Mei Jiafa (Megafac) F-555, Mei Jiafa (Megafac) F- 556, Mei Jiafa (Megafac) F-558, Mei Jiafa (Megafac) F-559, Mei Jiafa (Megafac) R-94, Mei Jiafa (Megafac) RS-75, Mei Jiafa (Megafac) RS-72-K, Mei Jiafa (Megafac) RS-76-NS, Mei Jiafa (Megafac) DS-21 (being trade name, DIC (DIC) limited liability company), Digao village (TEGO Twin) 4000, Digao collect (TEGO Twin) 4100, Digao not Lip river (TEGO Flow) 370, Digao Ge Laide (TEGO Glide) 440, Digao Ge Laide (TEGO Glide) 450, Digao ladd (TEGO Rad) 2200N (is trade name, Japan wins the wound limited public affairs of (Evonik Japan) share Department), fluoroalkyl benzene sulfonate, fl muoroalkyl's salt, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl glycine betaine, fluorine Alkylsulfonate, two glycerol four (fluoroalkyl polyoxyethylene ether), fluoroalkyl leptodactyline, fluoroalkyl sulfamate, polyoxy Ethylene nonylplenyl ether, NONIN HS 240, polyoxyethylene alkyl ether, polyoxyethylene lauryl ether, polyoxyethylene oil Alkene ether, polyoxyethylene tridecyl ether, polyoxyethylene cetyl base ether, polyoxyethylene stearyl base ether, polyoxyethylene laurate, Polyoxyethylene oleate, Myrj 45, polyoxyethylene laural base amine, sorbitol anhydride laurate, sorbitol anhydride palm fibre Glycerin monostearate, sorbitan tristearate, sorbitan oleate, sorbitan carboxylic esters, polyoxyethylene sorbitol acid anhydride laurel Acid esters, polyoxyethylene sorbitol acid anhydride palmitate, polyoxyethylene sorbitol acid anhydride stearate, polyoxyethylene sorbitol acid anhydride oleic acid Ester, polyoxyethylene naphthyl ether, alkylbenzene sulfonate and alkyl diphenyl base ether disulfonate.Preferably using living selected from these surfaces At least one of property agent.
In these surfactants, if selected from BYK-306, BYK-342, BYK-346, KP-341, KP-368, Sha Fulong (Surflon)-S611, Fu Jite (Ftergent) 710FL, Fu Jite (Ftergent) 710FM, Fu Jite (Ftergent) 710FS, Fu Jite (Ftergent) 601AD, Fu Jite (Ftergent) 650A, Mei Jiafa (Megafac) F-477, Mei Jiafa (Megafac) F-556, Mei Jiafa (Megafac) F-559, Mei Jiafa (Megafac) RS-72-K, Mei Jiafa (Megafac) DS- 21, Digao collects (TEGO Twin) 4000, fluoroalkyl benzene sulfonate, fl muoroalkyl's salt, fluoroalkyl polyoxyethylene ether, fluoroalkyl At least one of sulfonate, fluoroalkyl leptodactyline and fluoroalkyl sulfamate, the then coating of thermosetting composition Uniformity is got higher, therefore preferably.
Relative to thermosetting total composition, the content of the surfactant in thermosetting composition of the invention is excellent It is selected as 0.01 parts by weight~10 parts by weight.
1-5-2. coupling agent
For further increasing the viewpoint for the adhesion for being formed by cured film and substrate, thermosetting group of the invention Coupling agent can also also be contained by closing object.
As such coupling agent, such as the coupling agent of silane system, aluminium system or titanate esters system can be used.Specifically, can arrange It lifts: 3- glycidoxypropyl dimethylethoxysilane, 3- glycidoxypropyl diethoxy silane, 3- contracting Water glycerol oxygroup propyl trimethoxy silicane is (for example, trade name；Sa Laaisi (Sila-Ace) S510, prompt grace intelligence (JNC) share Co., Ltd), 2- (3,4- epoxycyclohexyl) ethyl trimethoxy silane is (for example, trade name；Sa Laaisi (Sila-Ace) S530, prompt grace intelligence (JNC) limited liability company), 3-mercaptopropyi trimethoxy silane is (for example, trade name；Sa Laaisi (Sila-Ace) S810, prompt grace intelligence (JNC) limited liability company), the copolymerization of 3- glycidoxypropyltrimewasxysilane Object is (for example, trade name；Examine special Olso (COATOSIL) MP200, Japan figure new high-tech material (Momentive advanced in years Performance Materials Japan) Co., Ltd) etc. silane series coupling agents；Acetyl alkoxy aluminum-diisopropoxide Etc. aluminium system coupling agents；And the titanate esters system coupling agent such as bis- (dioctyl phosphito ester) titanate esters of tetra isopropyl.
In these coupling agents, the effect of the raising adhesion of 3- glycidoxypropyltrimewasxysilane is big, therefore It is preferred that.
It is total relative to thermosetting composition for the aspect that adhesion with regard to being formed by cured film and substrate improves Amount, the content of coupling agent is preferably 0.01 parts by weight or more and 10 parts by weight or less.
1-5-3. antioxidant
For the viewpoint of xanthochromia when improving the transparency, preventing cured film from exposing at high temperature, thermmohardening of the invention Property composition can also also contain antioxidant.
In thermosetting composition of the invention, hindered phenolic, amine system of being obstructed, phosphorus system, chalcogenide compound can also be added Equal antioxidants.Wherein, for the viewpoint of weatherability, preferred hindered phenolic.It as concrete example, can enumerate: Yi Lu Jia Nuosi (Irganox) 1010, Yi Lu Jia Nuosi (Irganox) 1010FF, Yi Lu Jia Nuosi (Irganox) 1035, Yi Lu Jia Nuosi (Irganox) 1035FF, Yi Lu Jia Nuosi (Irganox) 1076, Yi Lu Jia Nuosi (Irganox) 1076FD, Yi Lu Jia Nuosi (Irganox) 1098, Yi Lu Jia Nuosi (Irganox) 1135, Yi Lu Jia Nuosi (Irganox) 1330, Yi Lu Jia Nuosi (Irganox) 1726, Yi Lu Jia Nuosi (Irganox) 1425WL, Yi Lu Jia Nuosi (Irganox) 1520L, Yi Lu Jia Nuosi (Irganox) 245, Yi Lu Jia Nuosi (Irganox) 245FF, Yi Lu Jia Nuosi (Irganox) 259, Yi Lu Jia Nuosi (Irganox) 3114, Yi Lu Jia Nuosi (Irganox) 565, Yi Lu Jia Nuosi (Irganox) 565DD (be trade name, Japan BASF (BASF Japan) limited liability company)；Ai Di Coase tower wave (ADK STAB) AO-20, Ai Di Coase tower wave (ADK STAB) AO-30, Ai Di Coase tower wave (ADK STAB) AO-50, Ai Di Coase tower wave (ADK STAB) AO-60, Ai Di Coase tower Wave (ADK STAB) AO-80 (being trade name, Ai Dike (ADEKA) limited liability company).Wherein, more preferably Yi Lujia promise This (Irganox) 1010, Ai Di Coase tower wave (ADK STAB) AO-60.
Relative to thermosetting total composition, adds 0.1 parts by weight~10 parts by weight antioxidant and use.
1-5-4. epoxy curing agent
In order to improve flatness, chemical-resistant, composition of the invention can also also contain epoxy curing agent.As epoxy Curing agent, there are acid anhydrides system curing agent, amine system curing agent, phenol system curing agent, imidazoles system curing agent, DBU salt system curing agents, pyrrole The sensible heat of azoles system curing agent, triazole system curing agent and sulfonium salt (sulfonium salt), benzothiazolium salt, ammonium salt, phosphonium salt etc. Property acid producing agent etc., it is avoided that for the viewpoint of the reliability of the coloring and cured film of cured film, preferably acid anhydrides system curing agent Or imidazoles system curing agent or and with acid anhydrides system curing agent and imidazoles system curing agent.
The concrete example of acid anhydrides system curing agent be maleic anhydride, tetrabydrophthalic anhydride, hexahydrophthalic anhydride, The aliphatic dicarboxylic acids acid anhydrides such as methylhexahydrophthalic anhydride, hexahydro trimellitic anhydride；Phthalic anhydride, trimellitic anhydride etc. Aromatic polycarboxylic acid acid anhydride；And styrene-maleic anhydride copolymer.In these acid anhydrides system curing agents, preferably heat resistance with To the good trimellitic anhydride of deliquescent balance and hexahydro trimellitic anhydride of solvent.
The concrete example of imidazoles system curing agent is 2- undecyl imidazole, 2- heptadecyl imidazole, 2- phenylimidazole, 2- Phenyl -4-methylimidazole, 2,3- dihydro -1H- pyrrolo- [1,2-a] benzimidazole, 1- cyano ethyl -2- undecyl imidazole Trimellitic acid salt, 1 benzyl 2 methyl imidazole and 1- benzyl -2- phenylimidazole.In these imidazoles system curing agents, preferably harden Property with to the good 2- undecyl imidazole of the deliquescent balance of solvent and 2- phenyl -4-methylimidazole and 1- benzyl -2- benzene Base imidazoles.
Using epoxy curing agent, there are three the compounds of above epoxy group relative to tool for epoxy curing agent (B) ratio of 100 parts by weight is 0.1 parts by weight~60 parts by weight.About epoxy curing agent be acid anhydrides system curing agent when addition Amount, more specifically, preferably with relative to epoxy group and in epoxy curing agent acid anhydride or carboxyl become 0.1 times of equivalent The mode of~1.5 times of equivalents is added.At this point, acid anhydride is calculated with divalent.If to become 0.15 times of equivalent~0.8 The mode of times equivalent adds acid anhydride or carboxyl, then chemical-resistant further increases, therefore more preferably.
1-5-5. ultraviolet absorbing agent
For further increasing the viewpoint for the degradation inhibiting ability for being formed by hyaline membrane, thermosetting group of the invention Ultraviolet absorbing agent can also be contained by closing object.
The concrete example of ultraviolet absorbing agent is refined (TINUVIN) P of Supreme Being slave, refined (TINUVIN) 120 of Supreme Being slave, Supreme Being slave are refined (TINUVIN) 144, refined (TINUVIN) 213 of Supreme Being slave, refined (TINUVIN) 234 of Supreme Being slave, refined (TINUVIN) 326 of Supreme Being slave, Supreme Being slave are refined (TINUVIN) 571, Supreme Being slave refined (TINUVIN) 765 (be trade name, the limited public affairs of Japanese BASF (BASF Japan) share Department).
Relative to thermosetting total composition, adds 0.01 parts by weight~10 parts by weight ultraviolet absorbing agent and make With.
The anti-flocculating agent of 1-5-6.
For merging solid component with solvent, preventing the viewpoint of cohesion, composition of the invention can also be containing anti- Flocculating agent.
The concrete example of anti-flocculating agent is Di Sipabike (Disperbyk) -145, Di Sipabike (Disperbyk) - 161, Di Sipabike (Disperbyk) -162, Di Sipabike (Disperbyk) -163, Di Sipabike (Disperbyk) -164, Di Sipabike (Disperbyk) -182, Di Sipabike (Disperbyk) -184, Di Sipabi Gram (Disperbyk) -185, Di Sipabike (Disperbyk) -2163, Di Sipabike (Disperbyk) -2164, BYK- 220S, Di Sipabike (Disperbyk) -191, Di Sipabike (Disperbyk) -199, Di Sipabike (Disperbyk) -2015 (be trade name；Chemical (BYK Chemie Japan) limited liability company of Japanese Bi Ke)；FTX- 218, Fu Jite (Ftergent) 710FM, Fu Jite (Ftergent) 710FS (is trade name, Ni Aosi (Neos) share has Limit company)；Not long-range navigation (Flowlen) G-600, Fu Luolun (Flowlen) G-700 (is trade name, common prosperity society chemistry share has Limit company).
Relative to thermosetting total composition, adds the anti-flocculating agent of 0.01 parts by weight~10 parts by weight and use.
1-5-7. thermal cross-linking agent
Just further increase heat resistance, chemical-resistant, film inner evenness, flexibility, flexibility, the viewpoint of elasticity and Speech, composition of the invention can also contain thermal cross-linking agent.
The concrete example of thermal cross-linking agent be Ni Kalake (Nikalac) MW-30HM, Ni Kalake (Nikalac) MW-100LM, Ni Kalake (Nikalac) MX-270, Ni Kalake (Nikalac) MX-280, Ni Kalake (Nikalac) MX-290, Buddhist nun's card Clarke (Nikalac) MW-390, Ni Kalake (Nikalac) MW-750LM (be trade name, three and chemical (stock)).
Relative to total composition, adds 0.1 parts by weight~10 parts by weight thermal cross-linking agent and use.
The preservation of 1-6. thermosetting composition
If thermosetting composition of the invention saves in the range of -30 DEG C~25 DEG C, composition through Shi Wending Property become good.If storage temperature is -20 DEG C~10 DEG C, precipitate is also not present and more preferable.
2. the cured film of thermosetting composition
Thermosetting composition of the invention be by copolymer (A), tool there are three above epoxy group compound (B), Compound (C) with more than four (methyl) acryloyl groups and solvent (D) mixing and prepare, but according to target property, depending on It needs that addition epoxy curing agent, surfactant, adhesion enhancer, antioxidant and other additives can be selected in turn.
If by as described above and prepare thermosetting composition be coated on matrix surface, for example, by heating etc. and incite somebody to action Solvent removes, then can form film.Spin-coating method, rolling method, leaching can be utilized to the coating of the thermosetting composition of matrix surface The conventionally known method such as stain method and slot coated method forms film.Then, using heating plate or baking oven etc. that the film is temporary When calcine.Temporary calcination condition regards the type and allotment ratio and difference of each ingredient, usually at 70 DEG C~150 DEG C, if using Baking oven is then 5 minutes~15 minutes, is 1 minute~5 minutes if using heating plate.Thereafter, it is carried out to harden film Formal calcining.Formal calcination condition regards the type and allotment ratio and difference of each ingredient, usually 180 DEG C~250 DEG C, preferably It is 30 minutes~90 minutes if using baking oven at 200 DEG C~250 DEG C, it, can if the use of heating plate being 5 minutes~30 minutes Cured film is obtained and being heated.
When heated, there are three the chemical combination of above epoxy group for copolymer (A) and tool for the cured film obtained in this way Object (B) has compound (C) thermal response of more than four (methyl) acryloyl groups and forms three-dimensional network, therefore very strong It is tough, and the transparency, heat resistance, chemical-resistant, flatness, adhesion are excellent.In addition, being also contemplated that for identical reason Light resistance, resistant sputtering, scratch resistance, coating are excellent.Therefore, if cured film of the invention is used as the guarantor of colored filter Then effectively the colored filter can be used to manufacture liquid crystal display element or solid-state imager in cuticula.In addition, in addition to coloured silk Other than the protective film of colo(u)r filter, if cured film of the invention, which is used as, is formed in thin film transistor (TFT) (Thin Film Transistor, TFT) and transparent electrode between transparent insulating film or the transparent insulation that is formed between transparent electrode and alignment films Film, then also effectively.In turn, even if cured film of the invention is sent out as light emitting diode (Light Emitting Diode, LED) The protective film of body of light, also effectively.
[embodiment]
Then, the present invention is specifically described by synthesis example, Examples and Comparative Examples, but the present invention is not by these Any restriction of embodiment.
For every kind of ingredient, compound used in synthesis example, Examples and Comparative Examples is recorded.
The synthesis of [synthesis example 1] copolymer (A1) solution
In the four-hole boiling flask with blender, 3- methoxy methyl propionate (MMP), N- cyclohexyl are packed into following weight Maleimide, maleic anhydride, radical initiator V-65 (and Wako Pure Chemical Industries Manufacturing), α-methylstyrenedimer, Heating stirring 2 hours under drying nitrogen air-flow and at 80 DEG C, thus the base co-polymer that gains freedom.
Polymeric solution is cooled to room temperature, to obtain 30 weight % solution of the copolymer (A1) of pale yellow transparent.It is right A part of solution is sampled, and measures weight average molecular weight using gpc analysis (polystyrene standard).As a result, being obtained The weight average molecular weight Mw of the copolymer (A1) obtained is 13,000.
The synthesis of [2~synthesis example of synthesis example 5] copolymer (A2)~copolymer (A5) solution
According to the method for synthesis example 1, listed in Table 1 temperature, time and ratio (unit: g) react each ingredient, from And obtain copolymer (A2)~copolymer (A5) solution.
The synthesis of [comparing synthesis example 1] polymethacrylates (R1) solution
Listed in Table 1 temperature, time and ratio make logical without specific structure contained in the claims The normal polymethacrylates reaction containing epoxy group, to obtain (R1) solution.Wherein, reaction temperature is 80 DEG C and carries out 2 hours.
Table 1
The unit of charge weight: gram
Recorded in table 1 with abbreviation, synthesis example and to compare compound used in synthesis example respectively as described below.
MMP:3- methoxy methyl propionate
CHMI:N- N-cyclohexylmaleimide
NPM:N- phenyl maleimide
IN: indenes
MAH: maleic anhydride
V-65:2,2'- azo is bis- (2,4- methyl pentane nitrile)；It is manufactured with Wako Pure Chemical Industries (stock)
α-MSD: α-methylstyrenedimer
GMA: glycidyl methacrylate
MMA: methyl methacrylate
[embodiment 1]
With the ratio (parts by weight) recorded in table 2 by 30 weight % solution of copolymer obtained in synthesis example 1 (A1), VG3101L as trifunctional epoxide, the trimellitic anhydride as curing agent (TMA), as silane coupling agent S510, the F-556 as surfactant and the propylene glycol methyl ether acetate as retarder thinner (PGMEA) mixed dissolution, It is filtered using membrane filter (0.2 μm of aperture), to obtain thermosetting composition.
[2~embodiment of embodiment 7 and comparative example 1]
According to the method for embodiment 1, with the ratio (parts by weight) recorded in table 2 by each ingredient mixed dissolution, to obtain Thermosetting composition.Gas barrier property, viscosity, flat rate, substrate adhesion, heat resistance are measured according to the method for embodiment 1, And it shows the results of the evaluation in table 3.
Table 2
Unit: parts by weight (except surfactant)
Using each thermosetting composition obtained, and evaluate using the method for following record heat resistance, flat Rate, substrate adhesion.The evaluation result of the cured film of 1~embodiment of embodiment 7 is summarized and is recorded in table 3.In addition, about Comparative example 1, it is common containing the resistance to of the cured film formed whether there is or not the thermosetting composition of the linear polyester of branched structure to using Hot, flat rate, substrate adhesion are evaluated.Evaluation result is recorded in together in table 3.
[evaluation method of gas barrier property]
Have under UV, visible light near infrared spectrometer (trade name: V-670, light splitting limited liability company, Japan) On the substrate of the colored filter of rgb pixel, 10 seconds spin coating thermosetting compositions are lasted with 600rpm, in 90 DEG C of heating plate Upper prebake conditions 2 minutes.Then, in an oven to toast 30 minutes after 230 DEG C, so that the average film thickness for obtaining protective film is 1.5 μ The colored filter substrate with cured film of m.
Then, a certain amount of 1-Methyl-2-Pyrrolidone is added dropwise in the colorized optical filtering on piece for having cured film, will be covered 60% coverslip of the area of the colored filter substrate with cured film is statically placed in the colorized optical filtering chip base with cured film On plate, heated 5 minutes using heating plate with 160 DEG C.After heating, coverslip is removed, a certain amount of 1- methyl -2- pyrrole is utilized Colored filter substrate of the pyrrolidone to coverslip and with cured film cleans, and cleaning solution is set as with cured film The dissolution fluid of colored filter substrate.
Thereafter, using 1-Methyl-2-Pyrrolidone as reference sample, the UV, visible light near infrared spectrometer is utilized To measure the transmitance of dissolution fluid.According to it is being measured as a result, by the transmitance of 560nm be 90% or more situation be set as zero, The case where by less than 90% is set as ×.
[sticky evaluation method]
It lasts 10 seconds with 600rpm thermosetting composition is spun on glass substrate, the preliminary drying in 90 DEG C of heating plate It is 2 minutes roasting.The case where touching film coated surface using finger, the trace of finger is not remained on surface is set as zero, is liquid by surface The trace of shape and finger remain the case where be set as ×.
[evaluation method of flatness]
Scale/surface roughness/fine shape measurement device (trade name is being used in advance；P-17, KLA Ke Lei (KLA TENCOR) limited liability company) determine concave-convex base plate (100 μm of the line, 50 μ of space comprising resist pattern of surface scale M, 1 μm of film thickness of pattern substrate) on, the thermosetting composition obtained of spin coating in 10 seconds is lasted with 650rpm, in 80 DEG C add Prebake conditions 2 minutes on hot plate.Then, in an oven to toast 30 minutes after 230 DEG C, so that the average film thickness for obtaining protective film is 1.5 μm of the colored filter substrate with cured film.Thereafter, the colored filter substrate to obtained with cured film is surveyed Determine surface scale.According to the colored filter substrate of no cured film and the surface scale of the colored filter substrate with cured film Maximum value (being slightly denoted as " maximum scale " below), and calculate flat rate using following calculating formulas, show the result in table 3 In.About flatness as a result, be evaluated as ◎ for 100%~80%, it is evaluated as zero by 79%~60%, less than 60% is evaluated For ×.
Flat rate (%)=((the maximum scale of concave-convex base plate of the maximum scale-of concave-convex base plate with cured film)/it is recessed The maximum scale of convex substrate) × 100
[evaluation method of adhesion]
With 650rpm last 10 seconds by thermosetting composition obtained be spun on concave-convex base plate (line: 100 μm, space: 50 μm, film thickness: 1.0 μm) on, prebake conditions 2 minutes in 80 DEG C of heating plate.Then, in an oven to toast 30 points after 230 DEG C Clock, to obtain the concave-convex base plate for having cured film.It is made in the same manner as the concave-convex base plate obtained with cured film Obtained by have cured film both glass substrates, carry out cross-cut test (Japanese Industrial Standards (Japanese Industrial Standards, JIS) K 5400, stripping tape: using 3M manufacture No.361), according to it is below classification 0~ Classification 5 is evaluated, and classification 0~classification 1 is set as zero, and classification 2~classification 3 is set as △, classification 4~classification 5 is set as ×.The adhesion evaluation of concave-convex base plate with cured film is set as " adhesion 1 ", by the close of the glass substrate with cured film The evaluation of connecing property is set as " adhesion 2 ".
The edge of < 0 > ... cutting of classification is completely smooth, and without peeling in the grid of any grid.
The small peeling of the film of the intersection of < 1 > ... cutting of classification.It is affected in cross-cut part Part will not clearly exceed 5%.
2 > ... film of < classification is peeled off along the edge of cutting and/or in intersection.In cross-cut part, by shadow Loud part clearly more than 5% but not exceeds 15%.
3 > ... films of < classification along the edge of cutting and part or entire surface generate big peeling and/or grid Peel off to mass part part or entire surface.In cross-cut part, affected part is clearly more than 15% but not super Out 35%.
4 > ... films of < classification along the edge of cutting and part or entire surface generate big peeling and/or many places Peel off to grid part or entire surface.In cross-cut part, affected part will not clearly exceed 35%.
Even if < classify 5 > ... be classification 4, the peeling degree that can not also classify any one.
[evaluation method of heat resistance]
It lasts 10 seconds with 600rpm thermosetting composition is spun on glass substrate, the preliminary drying in 90 DEG C of heating plate It is 2 minutes roasting.Then, it in an oven to toast 30 minutes after 230 DEG C, (is set to obtain the glass substrate with cured film For film thickness after PB).For the glass substrate obtained with cured film, measured using scale/surface roughness/fine shape Device (trade name；P-17, KLA Ke Lei (KLA TENCOR) limited liability company) film thickness is measured, and it is set as initial stage film thickness.Its Afterwards, the glass substrate with cured film is toasted after sixty minutes with 230 DEG C in an oven, and similarly measuring film thickness (will It is set as film thickness after EB).Residual film ratio is calculated using following formula, 98% or more the person of residual film ratio between PB-EB is set as zero, it will not Full 98% be set as ×.
Residual film ratio (%)=(film thickness after film thickness/PB after EB) × 100
[transparent evaluation method]
It lasts 10 seconds with 650rpm thermosetting composition obtained is spun on glass substrate, in 80 DEG C of heating Prebake conditions 2 minutes on plate.Then, it is heat-treated 30 minutes with 230 DEG C in an oven, so that obtaining film thickness is 1.5 μm with hard Change the glass substrate of film.For the glass substrate obtained with cured film, UV, visible light near infrared spectrometer is utilized (trade name；V-670, light splitting limited liability company, Japan) light transmittance under 400nm to measure cured film.In the situation Under, glass substrate is used only as reference, and the light transmittance for calculating cured film monomer (in said case, does not consider by multiple The caused interference of reflection).The situation that light transmittance is 98% or more is evaluated as the transparency zero, will transmit through the feelings of rate less than 95% Condition be evaluated as the transparency ×, △ will be evaluated as between it.
Clearly learnt according to result shown in table 3: the thermosetting composition of 1~embodiment of embodiment 7 meet heat resistance, Flatness, adhesion.On the other hand, in comparative example 1, all characteristics are unable to satisfy.
Table 3
[industrial availability]
Heat resistance, flatness, substrate adhesion by the cured film of thermosetting composition acquisition of the invention is good, And the protective film of the various optical materials etc. such as can be used as colored filter, LED light-emitting component and light receiving element and it is formed in TFT Insulating film between transparent electrode and between transparent electrode and alignment films.

Claims (5)

1. a kind of thermosetting composition, it includes copolymer (A), tools there are three the compound (B) of above epoxy group, has The compound (C) and solvent (D) of more than four (methyl) acryloyl groups, the copolymer (A) is from following formula (1) institute table The reaction product of monomer (b) other than the monomer (a) shown and the monomer (a):
In formula (1), R1And R2It independently is the alkyl or phenyl of hydrogen, carbon number 1~3.
2. thermosetting composition according to claim 1, wherein the monomer (b) is represented selected from following formula (2) Compound and at least one of indenes:
In formula (2), R1And R2It independently is the alkyl or phenyl of hydrogen, carbon number 1~3, R3For any monovalent organic radical.
3. thermosetting composition according to claim 1, wherein the compound of the epoxy group with three or more It (B) is the compound with aromatic rings.
4. a kind of cured film is formed by thermosetting composition as claimed any one in claims 1 to 3.
5. a kind of colored filter, with cured film as claimed in claim 4 as transparent protective film.
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