CN110370476B - Processing technology of epoxy resin reinforced mica stone - Google Patents
Processing technology of epoxy resin reinforced mica stone Download PDFInfo
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- CN110370476B CN110370476B CN201910581897.4A CN201910581897A CN110370476B CN 110370476 B CN110370476 B CN 110370476B CN 201910581897 A CN201910581897 A CN 201910581897A CN 110370476 B CN110370476 B CN 110370476B
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- mica
- mica stone
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/06—Natural ornaments; Imitations thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/4853—Epoxides
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a processing technology of epoxy resin reinforced mica, which comprises the steps of screening mica raw materials in batches, then punching mica in a micron order, pouring epoxy resin into the mica after punching, and then curing to obtain the epoxy resin reinforced mica. On the other hand, the mica stone can change the overall color by injecting epoxy gum with color, so that the ornamental value is better.
Description
Technical Field
The invention relates to the field of mica stone processing, in particular to a processing technology of epoxy resin reinforced mica stone.
Background
Micanite, alternative name in chinese: green pillar rock. The product is silicate mineral, is extracted from granite and pegmatite, and mainly contains hydrous aluminum potassium silicate. The mica stone is a monoclinic system, usually in the form of a plate or a block, and has a hexagonal or rhombic appearance, and is generally of the type of muscovite, phlogopite, biotite, sericite, and the like. Mica has the characteristics of good electrical insulation, high temperature resistance, acid and alkali resistance, corrosion resistance and the like, and is often processed into powder for the electrical material industry. In addition, mica has the characteristics of colorless, light yellow, light green, light gray and the like, glass luster, pearl luster, transparency to slight transparency, and is increasingly applied to the industries of ornaments and artware for years. However, the mica stone is soft and fragile, and is difficult to process the raw stone, and when the mica stone is made into ornaments or artware, the operations of grinding, cutting, polishing, even carving and the like are needed to be carried out on the mica stone, and due to the fragile characteristic of the mica stone, the mica stone is often cracked in the processing process, the yield is low, the time of production and processing is wasted, and the production cost is increased.
Disclosure of Invention
In order to solve the problems, the invention provides a processing technology of epoxy resin reinforced mica.
The invention is realized by adopting the following scheme:
a processing technology of epoxy resin reinforced mica stone comprises the following steps:
the method comprises the following steps: selecting a mica stone raw material;
step two; removing small raw materials which do not meet the processing requirements in the mica stone raw materials;
screening the mica stone raw material without the small raw material, and dividing the mica stone raw material into a plurality of batches with different sizes according to the volume;
selecting one batch of mica stone raw material for processing;
step five, slicing the mica stone according to the design standard of the product;
step six, washing the sliced mica stone to remove powder and impurities attached to the mica stone;
step seven, drying the cleaned mica stone;
step eight, punching a plurality of micron-sized small holes on the surface of the dried mica stone;
step nine, pouring epoxy resin into the perforated mica stone;
heating and curing the epoxy resin-impregnated mica stone to obtain epoxy resin reinforced mica stone;
step eleven, deep processing is carried out on the epoxy resin reinforced mica stone;
step twelve, selecting another batch of mica stone raw material in the step three, and repeating the step four to the step eleven.
Further, the heating temperature in the step ten is 80-100 ℃, and the curing time in the step ten is 6-10 hours.
Furthermore, in the eighth step, a laser punching mode is adopted for punching micron-sized holes, or a needle punching mode is adopted for punching micron-sized holes.
Furthermore, in the ninth step, epoxy resin is poured into the pores of the mica stone in a vacuum pouring mode.
Furthermore, in the ninth step, epoxy resin is poured into the pores of the mica stone by means of high-pressure pouring.
Further, in the seventh step, the mica stones are dried by high-pressure airflow.
Further, the diameter of the small hole in the step eight is 0.1-5 microns.
Further, in the second step, the mica stone raw material is screened through a grid plate.
Further, in the seventh step, the mica stones are dried by hot air at the temperature of 40-70 ℃.
Further, the deep processing in the step ten comprises the following substeps:
s1, cutting the epoxy resin reinforced mica stone into a size according with the design size according to the design drawing of the product;
s2, drawing processing auxiliary lines on the epoxy resin reinforced mica stone cut in the S1 according to the design drawing of the product;
s3, further cutting the epoxy resin reinforced mica stone according to the processing auxiliary line;
s4, polishing the epoxy resin reinforced mica stone in the S3 until the size and the shape are consistent with the design drawing;
s5, polishing the polished epoxy resin reinforced mica stone;
and S6, cleaning the polished mica stones, and airing to obtain finished products.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, micron-sized holes are punched in the mica stone raw material, and the epoxy resin is poured into the mica stone after the holes are punched, so that the original soft and fragile characteristics of mica can be changed, the integral strength is higher, the processing such as cutting, grinding and polishing is convenient, the processability is better, meanwhile, the processing parameters can be conveniently adjusted in the processing process by batching according to different volumes, and the processing efficiency is improved. On the other hand, the mica stone can change the overall color by injecting epoxy gum with color, so that the ornamental value is better.
Detailed Description
The present invention will be described in further detail below with reference to specific examples in order to facilitate understanding of the invention by those skilled in the art.
Example 1
The invention provides a processing technology of epoxy resin reinforced mica, which comprises the following steps:
the method comprises the following steps: selecting a mica stone raw material;
step two; removing small raw materials which do not meet the processing requirements in the mica stone raw materials;
screening the mica stone raw material without the small raw material, and dividing the mica stone raw material into a plurality of batches with different sizes according to the volume;
selecting one batch of mica stone raw material for processing;
step five, slicing the mica stone according to the design standard of the product;
step six, washing the sliced mica stone to remove powder and impurities attached to the mica stone;
step seven, drying the cleaned mica stone;
step eight, punching a plurality of micron-sized small holes on the surface of the dried mica stone;
step nine, pouring epoxy resin into the perforated mica stone;
heating and curing the epoxy resin-impregnated mica stone to obtain epoxy resin reinforced mica stone;
step eleven, deep processing is carried out on the epoxy resin reinforced mica stone;
step twelve, selecting another batch of mica stone raw material in the step three, and repeating the step four to the step eleven.
And in the third step, the mica stone raw material is screened through the grid plates, and a plurality of grid plates with different sizes are adopted, so that the mica stone raw material is divided into a plurality of batches with different sizes, and the mica stone raw material can be specifically set according to the processing requirements. The heating temperature in the step ten is 80-100 ℃, the heating temperature in this embodiment is 90 ℃, and any value between 80-100, such as 80 ℃, 85 ℃, 95 ℃ and the like, can be selected in the specific implementation. The curing time in the step ten is 6-10 hours. The curing time in this embodiment is 8 hours, and any value between 6 and 10, such as 6 hours, 9 hours, 10 hours, etc., may be selected for practical use. And step nine, pouring the epoxy resin into the pores of the mica stone in a vacuum pouring mode. The diameter of the small hole in the step eight is 0.1-5 microns. The thickness of the film is 1 micron in the embodiment, and the film can be set according to the processing requirement in specific implementation. And in the seventh step, the mica stones are dried by adopting hot air at the temperature of 40-70 ℃. In the embodiment, 65 ℃ hot air is adopted to blow mica stone. And eighthly, drilling micron-sized holes by adopting a laser drilling mode, and specifically, drilling micron-sized holes by adopting a needle drilling mode. In the third step, the micaceous stones are batched according to the size, so that parameters can be conveniently adjusted in subsequent processing, and the processing efficiency is improved.
The deep processing in the step ten comprises the following substeps:
s1, cutting the epoxy resin reinforced mica stone into a size according with the design size according to the design drawing of the product; s2, drawing processing auxiliary lines on the epoxy resin reinforced mica stone cut in the S1 according to the design drawing of the product; s3, further cutting the epoxy resin reinforced mica stone according to the processing auxiliary line; s4, polishing the epoxy resin reinforced mica stone in the S3 until the size and the shape are consistent with the design drawing; s5, polishing the polished epoxy resin reinforced mica stone; and S6, cleaning the polished mica stones, and airing to obtain finished products.
The small-particle mica stone such as broken blocks generated in the processing process can be ground into powder and left for other purposes, such as manufacturing mica paper and the like.
Example 2
The invention provides a processing technology of epoxy resin reinforced mica, which comprises the following steps:
the method comprises the following steps: selecting a mica stone raw material;
step two; removing small raw materials which do not meet the processing requirements in the mica stone raw materials;
screening the mica stone raw material without the small raw material, and dividing the mica stone raw material into a plurality of batches with different sizes according to the volume;
selecting one batch of mica stone raw material for processing;
step five, slicing the mica stone according to the design standard of the product;
step six, washing the sliced mica stone to remove powder and impurities attached to the mica stone;
step seven, drying the cleaned mica stone;
step eight, punching a plurality of micron-sized small holes on the surface of the dried mica stone;
step nine, pouring epoxy resin into the perforated mica stone;
heating and curing the epoxy resin-impregnated mica stone to obtain epoxy resin reinforced mica stone;
step eleven, deep processing is carried out on the epoxy resin reinforced mica stone;
step twelve, selecting another batch of mica stone raw material in the step three, and repeating the step four to the step eleven.
The heating temperature in the step ten is 80-100 ℃, the heating temperature in this embodiment is 85 ℃, and any value between 80-100, such as 80 ℃, 90 ℃, 95 ℃ and the like, can be selected in the specific implementation.
The curing time in the step ten is 6-10 hours. The curing time in this embodiment is 9 hours, and any value between 6 and 10, such as 6 hours, 9 hours, 10 hours, etc., may be selected for practical use. And step nine, pouring epoxy resin into the pores of the mica stone in a high-pressure pouring mode. And in the seventh step, the mica stones are dried by high-pressure airflow, and the mica stones can be dried by hot air in specific implementation. The diameter of the small hole in the step eight is 0.1-5 microns. The thickness of the film is 1 micron in the embodiment, and the film can be set according to the processing requirement in specific implementation. And in the third step, the mica stone raw material is screened through the grid plates, and a plurality of grid plates with different sizes are adopted, so that the mica stone raw material is divided into a plurality of batches with different sizes, and the mica stone raw material can be specifically set according to the processing requirements. And eighthly, drilling micron-sized holes by adopting a laser drilling mode, and specifically, drilling the micron-sized holes by adopting a needle drilling mode. In the third step, the micaceous stones are batched according to the size, so that parameters can be conveniently adjusted in subsequent processing, and the processing efficiency is improved.
The deep processing in the step ten comprises the following substeps:
s1, cutting the epoxy resin reinforced mica stone into a size according with the design size according to the design drawing of the product; s2, drawing processing auxiliary lines on the epoxy resin reinforced mica stone cut in the S1 according to the design drawing of the product; s3, further cutting the epoxy resin reinforced mica stone according to the processing auxiliary line; s4, polishing the epoxy resin reinforced mica stone in the S3 until the size and the shape are consistent with the design drawing; s5, polishing the polished epoxy resin reinforced mica stone; and S6, cleaning the polished mica stones, and airing to obtain finished products.
Example 3
The invention provides a processing technology of epoxy resin reinforced mica, which comprises the following steps:
the method comprises the following steps: selecting a mica stone raw material;
step two; removing small raw materials which do not meet the processing requirements in the mica stone raw materials;
screening the mica stone raw material without the small raw material, and dividing the mica stone raw material into a plurality of batches with different sizes according to the volume;
selecting one batch of mica stone raw material for processing;
step five, slicing the mica stone according to the design standard of the product;
step six, washing the sliced mica stone to remove powder and impurities attached to the mica stone;
step seven, drying the cleaned mica stone;
step eight, punching a plurality of micron-sized small holes on the surface of the dried mica stone;
step nine, pouring epoxy resin into the perforated mica stone;
heating and curing the epoxy resin-impregnated mica stone to obtain epoxy resin reinforced mica stone;
step eleven, deep processing is carried out on the epoxy resin reinforced mica stone;
step twelve, selecting another batch of mica stone raw material in the step three, and repeating the step four to the step eleven.
And in the third step, the mica stone raw material is screened through the grid plates, and a plurality of grid plates with different sizes are adopted, so that the mica stone raw material is divided into a plurality of batches with different sizes, and the mica stone raw material can be specifically set according to the processing requirements. The heating temperature in the step ten is 80-100 ℃, the heating temperature in this embodiment is 100 ℃, and any value between 80-100, such as 80 ℃, 85 ℃, 95 ℃ and the like, can be selected in the specific implementation. The curing time in the step ten is 6-10 hours. The curing time in this example is 7 hours, and any value between 6 and 10, such as 6 hours, 9 hours, 10 hours, etc., may be selected for practical use.
In the ninth step, the epoxy resin is poured into the pores of the mica stones by adopting a vacuum pouring mode, and in addition, the epoxy resin can also be poured into the pores of the mica stones by adopting a high-pressure pouring mode. The diameter of the small hole in the step eight is 0.1-5 microns. The thickness of the film is 0.5 micron in the embodiment, and the film can be set according to the processing requirement in the specific implementation. And in the seventh step, the mica stones are dried by adopting hot air at the temperature of 40-70 ℃. In this embodiment, the mica stone is dried by hot air at 60 ℃. And eighthly, drilling micron-sized holes by adopting a laser drilling mode, and specifically, drilling micron-sized holes by adopting a needle drilling mode. In the third step, the micaceous stones are batched according to the size, so that parameters can be conveniently adjusted in subsequent processing, and the processing efficiency is improved.
The deep processing in the step ten comprises the following substeps:
s1, cutting the epoxy resin reinforced mica stone into a size according with the design size according to the design drawing of the product; s2, drawing processing auxiliary lines on the epoxy resin reinforced mica stone cut in the S1 according to the design drawing of the product; s3, further cutting the epoxy resin reinforced mica stone according to the processing auxiliary line; s4, polishing the epoxy resin reinforced mica stone in the S3 until the size and the shape are consistent with the design drawing; s5, polishing the polished epoxy resin reinforced mica stone; and S6, cleaning the polished mica stones, and airing to obtain finished products.
According to the invention, micron-sized holes are punched in the mica stone raw material, and the epoxy resin is poured into the mica stone after the holes are punched, so that the original soft and fragile characteristics of mica can be changed, the integral strength is higher, the processing such as cutting, grinding and polishing is convenient, the processability is better, meanwhile, the processing parameters can be conveniently adjusted in the processing process by batching according to different volumes, and the processing efficiency is improved. On the other hand, the mica stone can change the overall color by injecting epoxy gum with color, so that the ornamental value is better.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the description of the present invention, "plurality" or "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, e.g., as meaning permanently attached, removably attached, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims.
Claims (3)
1. A processing technology of epoxy resin reinforced mica stone is characterized by comprising the following steps:
the method comprises the following steps: selecting a mica stone raw material;
step two; removing small raw materials which do not meet the processing requirements in the mica stone raw materials;
screening the mica stone raw material without the small raw material, and dividing the mica stone raw material into a plurality of batches with different sizes according to the volume;
selecting one batch of mica stone raw material for processing;
step five, slicing the mica stone according to the design standard of the product;
step six, washing the sliced mica stone to remove powder and impurities attached to the mica stone;
step seven, drying the cleaned mica stone;
step eight, punching a plurality of micron-sized small holes on the surface of the dried mica stone;
step nine, pouring epoxy resin into the perforated mica stone;
heating and curing the epoxy resin-impregnated mica stone to obtain epoxy resin reinforced mica stone;
step eleven, deep processing is carried out on the epoxy resin reinforced mica stone;
step twelve, selecting another batch of mica stone raw material in the step three, and repeating the step four to the step eleven;
the heating temperature in the step ten is 80-100 ℃, and the curing time in the step ten is 6-10 hours;
in the eighth step, micron-sized holes are punched in a laser punching mode, or micron-sized holes are punched in a needle punching mode;
drying the mica stones by high-pressure airflow in the seventh step;
the diameter of the small hole in the step eight is 0.1-5 microns;
screening the mica stone raw material through a grid plate in the second step;
in the seventh step, the mica stones are dried by hot air at the temperature of 40-70 ℃;
the deep processing in the step ten comprises the following substeps:
s1, cutting the epoxy resin reinforced mica stone into a size according with the design size according to the design drawing of the product;
s2, drawing processing auxiliary lines on the epoxy resin reinforced mica stone cut in the S1 according to the design drawing of the product;
s3, further cutting the epoxy resin reinforced mica stone according to the processing auxiliary line;
s4, polishing the epoxy resin reinforced mica stone in the S3 until the size and the shape are consistent with the design drawing;
s5, polishing the polished epoxy resin reinforced mica stone;
and S6, cleaning the polished mica stones, and airing to obtain finished products.
2. The process of claim 1, wherein the epoxy resin is injected into the pores of the mica in a vacuum injection manner.
3. The process of claim 1, wherein the epoxy resin is injected into the pores of the mica in a high pressure injection manner.
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Effective date of registration: 20220114 Address after: 516000 factory building 104 on the first floor and 505 on the fifth floor of Building 1, No. 1 Park, Huasheng Industrial Park, Shuikou office, Huicheng District, Huizhou City, Guangdong Province Patentee after: Huizhou shengshida Technology Co.,Ltd. Address before: 516000 room 1402, Maikete international building, 61 Maidi Road, Huicheng District, Huizhou City, Guangdong Province Patentee before: HUIZHOU HONGHAI NEW MATERIAL TECHNOLOGY Co.,Ltd. |