CN110370476A - A kind of processing technology of epoxy resin enhancing micarex - Google Patents
A kind of processing technology of epoxy resin enhancing micarex Download PDFInfo
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- CN110370476A CN110370476A CN201910581897.4A CN201910581897A CN110370476A CN 110370476 A CN110370476 A CN 110370476A CN 201910581897 A CN201910581897 A CN 201910581897A CN 110370476 A CN110370476 A CN 110370476A
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- CN
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- micarex
- epoxy resin
- raw material
- enhancing
- resin enhancing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/06—Natural ornaments; Imitations thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/4853—Epoxides
Abstract
The present invention relates to a kind of processing technologys of epoxy resin enhancing micarex, micarex raw material is screened in batches in the present invention, micron-sized punching then is carried out to the micarex after in batches, after punching in micarex infusion epoxy resin, it then passes through solidification and obtains epoxy resin enhancing micarex, change mica soft frangible characteristic originally, whole intensity is higher, facilitate cut, the processing such as grinding and buffing, machinability is more preferable, it is carried out in batches by different volumes simultaneously, it is convenient to adjust machined parameters in process, improve processing efficiency.On the other hand, micarex can also change whole color, so that ornamental value is more preferable by injection with coloured epoxy natural gum.
Description
Technical field
The present invention relates to micarex manufacture fields, and in particular to a kind of processing technology of epoxy resin enhancing micarex.
Background technique
Micarex, Chinese nickname: green column rock.This product is silicates mineral, is to adopt from granite and pegmatite, main
Potassium containing hydrated aluminium silicate.Micarex is monoclinic system, usually plate-like or blocky, makees hexagon or diamond shape in appearance, generally has
The types such as muscovite, phlogopite, biotite, sericite.Micarex has electrical insulating property good, the spies such as high temperature resistant, acid and alkali-resistance, anti-corrosion
Property, electrical material industry is often used for powderization processing.In addition to this, micarex also has colourless, pale yellow, light green, light gray etc.
Color has glassy lustre and pearly luster, is clear to sub-translucent characteristic, is in the past few years also increasingly being applied to may be used also
For ornaments and craftwork industry.But mica rock land is soft, and it is frangible, it is difficult to process former stone, and it is fabricated to ornaments
Or when craftwork, need to polish to micarex, cut, polishing the even operation such as engraving, due to its frangible characteristic, often
Often can fragmentation in process, yields is not high, wastes the time of production and processing, increases the cost of production.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of processing technologys of epoxy resin enhancing micarex.
The present invention is realized using following scheme:
A kind of processing technology of epoxy resin enhancing micarex, comprising the following steps:
Step 1: micarex raw material is chosen；
Step 2；Small raw material of process requirements is unsatisfactory in removal micarex raw material；
Step 3 will remove the micarex raw material after small raw material and screen, micarex raw material is divided into size not by volume
Same several batches；
Step 4, the micarex raw material for choosing one of batch are processed；
Step 5 is sliced micarex according to the design standard of product；
Step 6 cleans the micarex after slice, the powder and impurity of removal micarex attachment；
Step 7 dries up the micarex after cleaning；
Several micron-sized apertures are got on step 8, the micarex surface after drying；
Step 9, the micarex after epoxy resin to be filled into hole；
Step 10 is heating and curing to the micarex that epoxy resin has been perfused, and obtains epoxy resin enhancing micarex；
Step 11 carries out deep processing to epoxy resin enhancing micarex；
Step 12, the other micarex raw material of batch in selecting step three, repeats step 4 to step 11.
Further, the heating temperature in the step 10 is 80-100 DEG C, and the curing time in the step 10 is 6-
10 hours.
Further, micron order hole, or the side using pin type punching are beaten in the step 8 by the way of laser boring
Formula beats micron order hole.
Further, epoxy resin is filled by the way of priming by vacuum the aperture of micarex in the step 9
In.
Further, epoxy resin is filled by the way of high pressure pouring the aperture of micarex in the step 9
In.
Further, micarex is dried up using high pressure draught in the step 7.
Further, the diameter of aperture is 0.1-5 microns in the step 8.
Further, micarex raw material is screened by waffle slab in the step 2.
Further, micarex is dried up using 40-70 DEG C of hot wind in the step 7.
Further, the deep processing in the step 10 includes following sub-step:
Epoxy resin enhancing micarex is cut to conform to the size of design size according to the design drawing of product by S1；
S2, according to the design drawing of product, the epoxy resin enhancing micarex after cutting in S1 draws processing auxiliary line；
S3 further cuts epoxy resin enhancing micarex according to processing auxiliary line；
S4 polishes to the epoxy resin enhancing micarex in S3, until size shape is consistent with design drawing；
S5 polishes the epoxy resin enhancing micarex after polishing；
S6 dries after cleaning to the micarex after polishing, obtains finished product.
The prior art is compared, the invention has the following advantages:
Micron-sized punching is carried out to micarex raw material in the present invention, after punching in micarex infusion epoxy resin, Ke Yigai
Become mica soft frangible characteristic originally, whole intensity is higher, facilitate cut, the processing such as grinding and buffing, can be processed
Property it is more preferable, while being carried out in batches by different volumes, it is convenient to adjust machined parameters in process, improve processing efficiency.It is another
Aspect, micarex can also change whole color, so that ornamental value is more preferable by injection with coloured epoxy natural gum.
Specific embodiment
For convenient for those skilled in the art understand that the present invention, makees the present invention below in conjunction with specific embodiment further detailed
Thin description.
Embodiment 1
A kind of processing technology of epoxy resin enhancing micarex provided by the invention, a kind of processing of epoxy resin enhancing micarex
Technique, comprising the following steps:
Step 1: micarex raw material is chosen；
Step 2；Small raw material of process requirements is unsatisfactory in removal micarex raw material；
Step 3 will remove the micarex raw material after small raw material and screen, micarex raw material is divided into size not by volume
Same several batches；
Step 4, the micarex raw material for choosing one of batch are processed；
Step 5 is sliced micarex according to the design standard of product；
Step 6 cleans the micarex after slice, the powder and impurity of removal micarex attachment；
Step 7 dries up the micarex after cleaning；
Several micron-sized apertures are got on step 8, the micarex surface after drying；
Step 9, the micarex after epoxy resin to be filled into hole；
Step 10 is heating and curing to the micarex that epoxy resin has been perfused, and obtains epoxy resin enhancing micarex；
Step 11 carries out deep processing to epoxy resin enhancing micarex；
Step 12, the other micarex raw material of batch in selecting step three, repeats step 4 to step 11.
Micarex raw material is screened by waffle slab in step 3, using the different waffle slab of multiple sizes, so as to
It is divided into the different multiple batches of size, can be specifically arranged according to process requirements.Heating temperature in the step 10 is 80-100
DEG C, heating temperature is 90 DEG C in the present embodiment, and when specific implementation also can choose any number between 80-100, such as 80 DEG C,
85 DEG C, 95 DEG C etc..Curing time in the step 10 is 6-10 hours.Curing time in the present embodiment is 8 hours, specifically
Also any number between 6-10, such as 6 hours, 9 hours, 10 hours be can choose when implementation.Using true in the step 9
Epoxy resin is filled into the aperture of micarex by the mode of sky perfusion.The diameter of aperture is 0.1-5 microns in the step 8.
It is 1 micron in the present embodiment, when specific implementation can be arranged according to process requirements.40-70 DEG C of hot wind is used in the step 7
Micarex is dried up.Micarex is dried up using 65 DEG C of hot wind in the present embodiment.It is used in the step 8
The mode of laser boring beats micron order hole, and the mode that pin type punching can also be used in when specific implementation beats micron order hole.In step 3
Micarex is carried out in batches by size, is to improve processing efficiency, such as in perfusion ring to facilitate adjusting parameter in following process
During oxygen resin, the parameters such as time involved by the different micarex of volume are different.
Deep processing in step 10 includes following sub-step:
Epoxy resin enhancing micarex is cut to conform to the size of design size according to the design drawing of product by S1；S2, according to
The design drawing of product, the epoxy resin enhancing micarex after cutting in S1 draw processing auxiliary line；S3, according to processing auxiliary line
Epoxy resin enhancing micarex is further cut；S4 polishes to the epoxy resin enhancing micarex in S3, directly
It is consistent with design drawing to size shape；S5 polishes the epoxy resin enhancing micarex after polishing；S6, after polishing
Micarex dries after being cleaned, and obtains finished product.
For little particles micarexes such as the fragments that is generated in process, reserve for other use after powder can be ground into, such as
Make mica paper etc..
Embodiment 2
A kind of processing technology of epoxy resin enhancing micarex provided by the invention, a kind of processing of epoxy resin enhancing micarex
Technique, comprising the following steps:
Step 1: micarex raw material is chosen；
Step 2；Small raw material of process requirements is unsatisfactory in removal micarex raw material；
Step 3 will remove the micarex raw material after small raw material and screen, micarex raw material is divided into size not by volume
Same several batches；
Step 4, the micarex raw material for choosing one of batch are processed；
Step 5 is sliced micarex according to the design standard of product；
Step 6 cleans the micarex after slice, the powder and impurity of removal micarex attachment；
Step 7 dries up the micarex after cleaning；
Several micron-sized apertures are got on step 8, the micarex surface after drying；
Step 9, the micarex after epoxy resin to be filled into hole；
Step 10 is heating and curing to the micarex that epoxy resin has been perfused, and obtains epoxy resin enhancing micarex；
Step 11 carries out deep processing to epoxy resin enhancing micarex；
Step 12, the other micarex raw material of batch in selecting step three, repeats step 4 to step 11.
Heating temperature in the step 10 is 80-100 DEG C, and heating temperature is 85 DEG C in the present embodiment, when specific implementation
Also any number between 80-100, such as 80 DEG C, 90 DEG C, 95 DEG C be can choose.
Curing time in the step 10 is 6-10 hours.Curing time in the present embodiment is 9 hours, specific implementation
When also can choose any number between 6-10, such as 6 hours, 9 hours, 10 hours.It is filled in the step 9 using high pressure
Epoxy resin is filled into the aperture of micarex by the mode of note.Micarex is blown using high pressure draught in the step 7
Dry, when specific implementation, can also be dried up with hot wind.The diameter of aperture is 0.1-5 microns in the step 8.The present embodiment
In be 1 micron, when specific implementation, can be arranged according to process requirements.Micarex raw material is sieved by waffle slab in step 3
Choosing, can specifically be set using the different waffle slab of multiple sizes to be divided into the different multiple batches of size according to process requirements
It sets.Beat micron order hole in the step 8 by the way of laser boring, when specific implementation can also be using the side of pin type punching
Formula beats micron order hole.Micarex is carried out in batches by size in step 3, is improved to facilitate adjusting parameter in following process
Processing efficiency, for example during infusion epoxy resin, the parameters such as time involved by the different micarex of volume are
It is different.
Deep processing in step 10 includes following sub-step:
Epoxy resin enhancing micarex is cut to conform to the size of design size according to the design drawing of product by S1；S2, according to
The design drawing of product, the epoxy resin enhancing micarex after cutting in S1 draw processing auxiliary line；S3, according to processing auxiliary line
Epoxy resin enhancing micarex is further cut；S4 polishes to the epoxy resin enhancing micarex in S3, directly
It is consistent with design drawing to size shape；S5 polishes the epoxy resin enhancing micarex after polishing；S6, after polishing
Micarex dries after being cleaned, and obtains finished product.
Embodiment 3
A kind of processing technology of epoxy resin enhancing micarex provided by the invention, a kind of processing of epoxy resin enhancing micarex
Technique, comprising the following steps:
Step 1: micarex raw material is chosen；
Step 2；Small raw material of process requirements is unsatisfactory in removal micarex raw material；
Step 3 will remove the micarex raw material after small raw material and screen, micarex raw material is divided into size not by volume
Same several batches；
Step 4, the micarex raw material for choosing one of batch are processed；
Step 5 is sliced micarex according to the design standard of product；
Step 6 cleans the micarex after slice, the powder and impurity of removal micarex attachment；
Step 7 dries up the micarex after cleaning；
Several micron-sized apertures are got on step 8, the micarex surface after drying；
Step 9, the micarex after epoxy resin to be filled into hole；
Step 10 is heating and curing to the micarex that epoxy resin has been perfused, and obtains epoxy resin enhancing micarex；
Step 11 carries out deep processing to epoxy resin enhancing micarex；
Step 12, the other micarex raw material of batch in selecting step three, repeats step 4 to step 11.
Micarex raw material is screened by waffle slab in step 3, using the different waffle slab of multiple sizes, so as to
It is divided into the different multiple batches of size, can be specifically arranged according to process requirements.Heating temperature in the step 10 is 80-100
DEG C, heating temperature is 100 DEG C in the present embodiment, and when specific implementation also can choose any number between 80-100, such as 80 DEG C,
85 DEG C, 95 DEG C etc..Curing time in the step 10 is 6-10 hours.Curing time in the present embodiment is 7 hours, specifically
Also any number between 6-10, such as 6 hours, 9 hours, 10 hours be can choose when implementation.
Epoxy resin is filled into the aperture of micarex by the way of priming by vacuum in the step 9, in addition to this
Epoxy resin can also be filled into the aperture of micarex by the way of high pressure pouring.The diameter of aperture in the step 8
It is 0.1-5 microns.It is 0.5 micron in the present embodiment, when specific implementation can be arranged according to process requirements.It is used in the step 7
40-70 DEG C of hot wind dries up micarex.Micarex is dried up using 60 DEG C of hot wind in the present embodiment.Step
Beat micron order hole in eight by the way of laser boring, when specific implementation can also beat micron order by the way of pin type punching
Hole.Micarex is carried out in batches by size in step 3, is to improve processing efficiency to facilitate adjusting parameter in following process,
Such as during infusion epoxy resin, the parameters such as time involved by the different micarex of volume are different.
Deep processing in step 10 includes following sub-step:
Epoxy resin enhancing micarex is cut to conform to the size of design size according to the design drawing of product by S1；S2, according to
The design drawing of product, the epoxy resin enhancing micarex after cutting in S1 draw processing auxiliary line；S3, according to processing auxiliary line
Epoxy resin enhancing micarex is further cut；S4 polishes to the epoxy resin enhancing micarex in S3, directly
It is consistent with design drawing to size shape；S5 polishes the epoxy resin enhancing micarex after polishing；S6, after polishing
Micarex dries after being cleaned, and obtains finished product.
Micron-sized punching is carried out to micarex raw material in the present invention, after punching in micarex infusion epoxy resin, can
To change mica soft frangible characteristic originally, whole intensity is higher, facilitate cut, the processing such as grinding and buffing, can
Processability is more preferable, while carrying out in batches by different volumes, convenient to adjust machined parameters in process, improves processing efficiency.
On the other hand, micarex can also change whole color, so that ornamental value is more preferable by injection with coloured epoxy natural gum.
In the description of the present invention, it is to be understood that, the orientation or positional relationship of instruction is merely for convenience of description originally
Invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific side
Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, " multiple ", " several " are meant that two or more, unless otherwise clearly having
The restriction of body.
In the present invention unless specifically defined or limited otherwise, the terms such as term " connection ", " fixation " should do broad sense reason
Solution, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connection, be also possible to electricity
Connection；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary
The interaction relationship of element.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning in the present invention.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements, modifications and variations based on the above contents, be obvious.Therefore, all such substitutions,
Improvements and changes are included in scope of the appended claims.
Claims (10)
1. a kind of processing technology of epoxy resin enhancing micarex, which comprises the following steps:
Step 1: micarex raw material is chosen；
Step 2；Small raw material of process requirements is unsatisfactory in removal micarex raw material；
Step 3 will remove the micarex raw material after small raw material and screen, micarex raw material is divided into size not by volume
Same several batches；
Step 4, the micarex raw material for choosing one of batch are processed；
Step 5 is sliced micarex according to the design standard of product；
Step 6 cleans the micarex after slice, the powder and impurity of removal micarex attachment；
Step 7 dries up the micarex after cleaning；
Several micron-sized apertures are got on step 8, the micarex surface after drying；
Step 9, the micarex after epoxy resin to be filled into hole；
Step 10 is heating and curing to the micarex that epoxy resin has been perfused, and obtains epoxy resin enhancing micarex；
Step 11 carries out deep processing to epoxy resin enhancing micarex；
Step 12, the other micarex raw material of batch in selecting step three, repeats step 4 to step 11.
2. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Heating temperature in ten is 80-100 DEG C, and the curing time in the step 10 is 6-10 hours.
3. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Micron order hole is beaten in eight by the way of laser boring, or beats micron order hole by the way of pin type punching.
4. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Epoxy resin is filled into the aperture of micarex by the way of priming by vacuum in nine.
5. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Epoxy resin is filled into the aperture of micarex by the way of high pressure pouring in nine.
6. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Micarex is dried up using high pressure draught in seven.
7. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
The diameter of aperture is 0.1-5 microns in eight.
8. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Micarex raw material is screened by waffle slab in two.
9. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Micarex is dried up using 40-70 DEG C of hot wind in seven.
10. a kind of processing technology of epoxy resin enhancing micarex according to claim 1, which is characterized in that the step
Deep processing in rapid ten includes following sub-step:
Epoxy resin enhancing micarex is cut to conform to the size of design size according to the design drawing of product by S1；
S2, according to the design drawing of product, the epoxy resin enhancing micarex after cutting in S1 draws processing auxiliary line；
S3 further cuts epoxy resin enhancing micarex according to processing auxiliary line；
S4 polishes to the epoxy resin enhancing micarex in S3, until size shape is consistent with design drawing；
S5 polishes the epoxy resin enhancing micarex after polishing；
S6 dries after cleaning to the micarex after polishing, obtains finished product.
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|---|---|---|---|
| CN201910581897.4A CN110370476B (en) | 2019-06-30 | 2019-06-30 | Processing technology of epoxy resin reinforced mica stone |
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| CN201910581897.4A CN110370476B (en) | 2019-06-30 | 2019-06-30 | Processing technology of epoxy resin reinforced mica stone |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007197543A (en) * | 2006-01-26 | 2007-08-09 | Alpha Kaken Kk | Epoxy resin adhesive for ceramic and ceramic accessory |
| KR20100097477A (en) * | 2009-02-26 | 2010-09-03 | 김진규 | Method for manufacturing accessories chain and chain manufactured thereby |
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN102514207A (en) * | 2011-12-14 | 2012-06-27 | 奇瑞汽车股份有限公司 | Production method of composite material automobile parts |
| CN102990942A (en) * | 2012-12-24 | 2013-03-27 | 烟台泰和新材料股份有限公司 | Vacuum perfusion forming method of p-aramid fiber composite material workpiece |
| CN103144207A (en) * | 2013-03-21 | 2013-06-12 | 任全明 | Crystal stone machining method |
| CN104212124A (en) * | 2013-06-05 | 2014-12-17 | 中国石油天然气股份有限公司 | Cementing agent for preparation of geological rock slice |
| CN105619619A (en) * | 2016-01-19 | 2016-06-01 | 曹颖 | Stone repairing method |
| CN107207749A (en) * | 2014-11-03 | 2017-09-26 | 塞特工业公司 | The combination of composite |
| CN107568855A (en) * | 2017-10-10 | 2018-01-12 | 中国地质大学（武汉） | A kind of jet is combined the method for making jewellery with metal |
| WO2018137024A1 (en) * | 2017-01-25 | 2018-08-02 | Palladino Luigi | Cladding panel |
| CN109567331A (en) * | 2018-11-16 | 2019-04-05 | 东海县至善坊水晶文化发展有限公司 | A kind of processing method of jewels and jade |
-
2019
- 2019-06-30 CN CN201910581897.4A patent/CN110370476B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007197543A (en) * | 2006-01-26 | 2007-08-09 | Alpha Kaken Kk | Epoxy resin adhesive for ceramic and ceramic accessory |
| KR20100097477A (en) * | 2009-02-26 | 2010-09-03 | 김진규 | Method for manufacturing accessories chain and chain manufactured thereby |
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN102514207A (en) * | 2011-12-14 | 2012-06-27 | 奇瑞汽车股份有限公司 | Production method of composite material automobile parts |
| CN102990942A (en) * | 2012-12-24 | 2013-03-27 | 烟台泰和新材料股份有限公司 | Vacuum perfusion forming method of p-aramid fiber composite material workpiece |
| CN103144207A (en) * | 2013-03-21 | 2013-06-12 | 任全明 | Crystal stone machining method |
| CN104212124A (en) * | 2013-06-05 | 2014-12-17 | 中国石油天然气股份有限公司 | Cementing agent for preparation of geological rock slice |
| CN107207749A (en) * | 2014-11-03 | 2017-09-26 | 塞特工业公司 | The combination of composite |
| CN105619619A (en) * | 2016-01-19 | 2016-06-01 | 曹颖 | Stone repairing method |
| WO2018137024A1 (en) * | 2017-01-25 | 2018-08-02 | Palladino Luigi | Cladding panel |
| CN107568855A (en) * | 2017-10-10 | 2018-01-12 | 中国地质大学（武汉） | A kind of jet is combined the method for making jewellery with metal |
| CN109567331A (en) * | 2018-11-16 | 2019-04-05 | 东海县至善坊水晶文化发展有限公司 | A kind of processing method of jewels and jade |
Non-Patent Citations (1)
| Title |
|---|
| 杨孚: "《异物志辑佚校注》", 30 June 2010 * |
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| CN110370476B (en) | 2021-04-06 |
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