CN110364300A - A kind of 3D printing Bi system high-temperature superconducting circuit and preparation method thereof - Google Patents
A kind of 3D printing Bi system high-temperature superconducting circuit and preparation method thereof Download PDFInfo
- Publication number
- CN110364300A CN110364300A CN201910695433.6A CN201910695433A CN110364300A CN 110364300 A CN110364300 A CN 110364300A CN 201910695433 A CN201910695433 A CN 201910695433A CN 110364300 A CN110364300 A CN 110364300A
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- Prior art keywords
- temperature superconducting
- printing
- system high
- temperature
- protective layer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
Abstract
The invention patent provides a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit, prepares protective layer and the Bi system high-temperature superconducting material layer in protective layer by 3D printing.Compared with prior art, advantage of the invention includes: and is not limited by the high-temperature superconductor band of machined forming or wire rod mechanical property, can the more diversified circuit structure of flexible design according to demand；Since direct 3D printing high temperature superconducting materia forms required pattern, avoids that fixed-size high-temperature superconductor band or wire rod are carried out patterning caused waste of material, saved cost；Superconducting circuit is really embedded in position needed for device, improves the reliability of installation, and can realize compact Layout, saves space.The invention patent additionally provides a kind of 3D printing Bi system high-temperature superconducting circuit.
Description
Technical field
The present invention relates to a kind of 3D printing Bi system high-temperature superconducting circuits and preparation method thereof, can be used for high-temperature superconducting device
Manufacture, the especially manufacture of the electric device based on Bi system high-temperature superconducting circuit or coil.
Background technique
High temperature superconducting materia because its non-resistance high-energy density ability to transmit electricity, and relative to low temperature superconducting material need it is low
Relatively low demand for warm environment has given the reverie that people are unlimited, therefore since the 1980s, it was found, people
For its be applied to production exploration and practice never stop.By the effort in more than ten years, Bi system high-temperature superconducting material is in 20
The end of the century takes the lead in being made into industrialization product, and most representative is Bi-2223 band and Bi-2212 wire rod, be born so that
The conception of all kinds of high-temperature superconducting devices moves towards real, in 20 years hereafter, around the physical characteristic of high-temperature superconductor band or wire rod
To design and manufacture high-temperature superconducting device as a kind of convention.However, one side Bi system high-temperature superconducting material is ceramic quality, separately
On the one hand, the standard size of high-temperature superconductor band or wire rod is relatively single, therefore, in actual R&D process, design and system
The person of making receives many constraints.
Summary of the invention
The purpose of the present invention is to propose to a kind of 3D printing Bi system high-temperature superconducting circuits and preparation method thereof, can overcome Bi system
The problem of high-temperature superconductor band/wire rod mechanical property limiting hts device design and production.
According to an embodiment of the invention, 3D printing Bi system high-temperature superconducting circuit includes high-temperature insulation substrate and guarantor thereon
Sheath, and the Bi system high-temperature superconducting material layer in protective layer.
Preferably, protective layer is fine silver protective layer.
Preferably, protective layer overall thickness is not less than 50 microns.
Preferably, high-temperature insulation substrate is using exhausted same or similar with superconductor of high temperature resistant, low temperature resistant, thermal strain
Edge material is process.
Preferably, high-temperature insulation baseplate material can be ceramic material, epoxy material or glass-reinforced plastic material.
Preferably, the one side of high-temperature insulation substrate is homogeneous, surface is smooth, is easy to the attachment of silver.
The embodiment of the present invention also proposed a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit, including following step
It is rapid:
1) high-temperature insulation substrate is provided；
2) a part of protective layer is prepared by 3D printing on high-temperature insulation substrate；
3) Bi system high-temperature superconducting material layer is prepared by 3D printing in a part of protective layer；
4) rest part of protective layer is prepared by 3D printing in Bi system high-temperature superconducting material layer, so that Bi system high temperature is super
Material layer is led to be located in protective layer.
Preferably, Bi system high-temperature superconducting material layer the preparation method comprises the following steps: during 3D printing, Bi system high-temperature superconducting is former
Feed powder end is directly over high-temperature heat treatment in print position and is converted into Bi system high-temperature superconducting material layer.
Preferably, Bi system high-temperature superconducting material layer the preparation method comprises the following steps: during 3D printing that Bi system high-temperature superconducting is former
The form of feed powder end as required arranges, but wouldn't carry out superconduction conversion to it, to Bi system high-temperature superconducting circuit all at
After shape, entire circuit is heat-treated, completes superconductionization conversion.
Preferably, Bi system high-temperature superconducting material layer the preparation method comprises the following steps: during 3D printing that Bi system high-temperature superconducting is former
Feed powder end print position carry out first time heat treatment, so that it is converted into ceramic quality, to Bi system high-temperature superconducting circuit all at
After shape, entire circuit is heat-treated again, completes superconductionization conversion.
The beneficial effect of the embodiment of the present invention is: of the invention compared with the circuit part of conventional high-temperature superconducting device
Advantage includes: by 3D printing formation and high temperature superconducting materia layer similar in traditional high-temperature superconductor band or wire rod function, no
High-temperature superconductor band or wire rod mechanical property by machined forming are limited, can according to demand flexible design it is more diversified
Circuit structure；Since direct 3D printing high temperature superconducting materia forms required pattern, avoid to fixed-size hts band
Material or wire rod carry out patterning caused waste of material, have saved cost；Needed for superconducting circuit is really embedded in device
Position, improve the reliability of installation, and can realize compact Layout, save space.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the cross-sectional view of 3D printing Bi system high-temperature superconducting circuit of the invention.
Specific embodiment
The explanation of following embodiment be with reference to attached drawing, can be to the specific embodiment implemented to the example present invention.
With the fast development of 3D printing technique, the production of high-temperature superconductor band/wire rod and high-temperature superconducting device manufacture this
Two separated processes of script have the feasibility being combined into one, in order to overcome Bi based high-temperature superconductive strip/wire rod mechanical property
Limiting hts device designs and produces this problem, inventors herein propose a kind of 3D printing Bi system high-temperature superconducting circuit and its
Preparation method.
As shown in Figure 1,3D printing Bi system high-temperature superconducting circuit of the invention specifically includes that high-temperature insulation substrate 1, protection
Layer 2, Bi system high-temperature superconducting material layer 3.The construction and working principle of each section are summarized as follows:
High-temperature insulation substrate 1: its major function is to provide the surface that can adhere to and mechanical support for fine silver protective layer, should
Component is using high temperature resistant, low temperature resistant, the thermal strain insulating materials same or similar with superconductor (such as ceramic material, epoxy
Material, glass-reinforced plastic material etc.) it is process, the one side for carrying 3D printing is homogeneous, surface is smooth, is easy to the attached of silver
?.
Protective layer 2: protective layer coats Bi system high-temperature superconducting material layer wherein, provides for Bi system high-temperature superconducting material layer
Sealing, and run in superconductor and flow and quench protection with offer electric current when quenching critical state, which uses fine silver system
At being formed by 3D printing, the overall thickness of fine silver protective layer is not less than 50 microns.
Bi system high-temperature superconducting material layer 3: its major function is to provide transfer passage for various forms of high currents, with tradition
High-temperature superconductor band or wire rod function it is close.
Further, the invention also provides a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit, including it is following
Step:
1) high-temperature insulation substrate is provided；
2) a part of protective layer is prepared by 3D printing on high-temperature insulation substrate；
3) Bi system high-temperature superconducting material layer is prepared by 3D printing in a part of protective layer；
4) rest part of protective layer is prepared by 3D printing in Bi system high-temperature superconducting material layer, so that Bi system high temperature is super
Material layer is led to be located in protective layer.
Wherein, the process of Bi system high-temperature superconducting material layer can be using one of following three kinds of modes.Mode first is that
During 3D printing, by Bi system high-temperature superconducting raw material powder print position be directly over high-temperature heat treatment (such as laser heating,
Electric heating etc.) it is converted into Bi system high-temperature superconducting finished-product material, Bi system high-temperature superconducting circuit can be with one-pass molding, nothing under this mode
Need subsequent processing；Mode second is that the form of Bi system high-temperature superconducting raw material powder as required is arranged during 3D printing,
But (the still non-finished product of Bi system high-temperature superconducting layer i.e. at this time, do not have superconducting characteristic) wouldn't be heat-treated to it, to Bi system height
Temperature superconductive circuit all after forming, is heat-treated (such as heating in electric furnace) to entire circuit, is implemented as in the process
Product (Bi system high-temperature superconducting material completes superconductionization conversion)；Mode is third is that by Bi system high-temperature superconducting raw material during 3D printing
Powder carries out first time heat treatment, and processing mode is similar to mode one, but realistic not show complete conversion of the raw material to finished product,
Raw material are converted into ceramic quality, after Bi system high-temperature superconducting circuit all forming, are heat-treated again to entire circuit,
Bi system high-temperature superconducting material superconduction conversion ratio is constantly promoted in the process, promotes the performance of high-temperature superconductor route.
The present invention forms the Bi system high-temperature superconducting material layer in protective layer, Neng Gouke by using the mode of 3D printing
The problem of taking Bi based high-temperature superconductive strip/wire rod mechanical property limiting hts device design and production, is not had been processed into
The high-temperature superconductor band or wire rod mechanical property of shape limit, can the more diversified circuit structure of flexible design according to demand；
Since direct 3D printing high temperature superconducting materia forms required pattern, avoid to fixed-size high-temperature superconductor band or wire rod into
Waste of material caused by row patterning, has saved cost；Superconducting circuit is really embedded in position needed for device, is promoted
The reliability of installation, and can realize compact Layout, save space.
Although the embodiment of the present invention has been described in detail above, it should be understood that, it is as described herein
The many changes and modifications of basic inventive concept will be fallen into the spirit and scope of the present invention defined in the appended claims.
Claims (10)
1. a kind of 3D printing Bi system high-temperature superconducting circuit, which is characterized in that protective layer including high-temperature insulation substrate and thereon,
And the Bi system high-temperature superconducting material layer in protective layer.
2. 3D printing Bi system high-temperature superconducting circuit according to claim 1, which is characterized in that protective layer is fine silver protection
Layer.
3. 3D printing Bi system high-temperature superconducting circuit according to claim 1, which is characterized in that protective layer overall thickness is not less than
50 microns.
4. 3D printing Bi system high-temperature superconducting circuit according to claim 1, which is characterized in that high-temperature insulation substrate uses
High temperature resistant, low temperature resistant, the thermal strain insulating materials same or similar with superconductor are process.
5. 3D printing Bi system high-temperature superconducting circuit according to claim 4, which is characterized in that high-temperature insulation baseplate material
It can be ceramic material, epoxy material or glass-reinforced plastic material.
6. 3D printing Bi system high-temperature superconducting circuit according to claim 1, which is characterized in that the one of high-temperature insulation substrate
Face is homogeneous, surface is smooth, is easy to the attachment of silver.
7. a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit, which comprises the following steps:
1) high-temperature insulation substrate is provided；
2) a part of protective layer is prepared by 3D printing on high-temperature insulation substrate；
3) Bi system high-temperature superconducting material layer is prepared by 3D printing in a part of protective layer；
4) rest part of protective layer is prepared by 3D printing in Bi system high-temperature superconducting material layer, so that Bi system high-temperature superconducting material
The bed of material is located in protective layer.
8. a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit according to claim 7, which is characterized in that Bi system
High temperature superconducting materia layer the preparation method comprises the following steps: during 3D printing, Bi system high-temperature superconducting raw material powder is straight in print position
It connects and is converted into Bi system high-temperature superconducting material layer by high-temperature heat treatment.
9. a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit according to claim 7, which is characterized in that Bi system
High temperature superconducting materia layer the preparation method comprises the following steps: form during 3D printing by Bi system high-temperature superconducting raw material powder as required
It arranges, but superconduction conversion wouldn't be carried out to it, after Bi system high-temperature superconducting circuit all forming, heat is carried out to entire circuit
Superconductionization conversion is completed in processing.
10. a kind of preparation method of 3D printing Bi system high-temperature superconducting circuit according to claim 7, which is characterized in that Bi
System high-temperature superconducting material layer the preparation method comprises the following steps: during 3D printing by Bi system high-temperature superconducting raw material powder print position into
Row is heat-treated for the first time, it is made to be converted into ceramic quality, after Bi system high-temperature superconducting circuit all forming, to entire circuit again into
Superconductionization conversion is completed in row heat treatment.
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| CN201910695433.6A CN110364300A (en) | 2019-07-30 | 2019-07-30 | A kind of 3D printing Bi system high-temperature superconducting circuit and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151221A (en) * | 2020-09-27 | 2020-12-29 | 合肥工业大学 | System and method for preparing high-temperature superconducting blocks in batches |
| CN113130202A (en) * | 2021-03-19 | 2021-07-16 | 中国科学院精密测量科学与技术创新研究院 | Superconducting coil processing method and superconducting coil |
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| JPH04231325A (en) * | 1990-12-28 | 1992-08-20 | Fujitsu Ltd | Production of bi-pb-sr-ca-cu-o superconducting film |
| CN105623215A (en) * | 2016-02-02 | 2016-06-01 | 北京化工大学 | Flexible circuit conductive composition and 3D (three dimensional) printing based flexible circuit construction method |
| CN106206683A (en) * | 2016-08-31 | 2016-12-07 | 湖南航天新材料技术研究院有限公司 | A kind of graphene-based field-effect transistor and preparation method thereof |
| CN108834319A (en) * | 2018-07-30 | 2018-11-16 | 北京大学东莞光电研究院 | A kind of 3D printing method of ceramic substrate multilayer circuit |
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| CN1033336A (en) * | 1987-10-16 | 1989-06-07 | 古河电气工业株式会社 | Oxide superconductor shaped body and manufacture method thereof |
| JPH04231325A (en) * | 1990-12-28 | 1992-08-20 | Fujitsu Ltd | Production of bi-pb-sr-ca-cu-o superconducting film |
| CN105623215A (en) * | 2016-02-02 | 2016-06-01 | 北京化工大学 | Flexible circuit conductive composition and 3D (three dimensional) printing based flexible circuit construction method |
| CN106206683A (en) * | 2016-08-31 | 2016-12-07 | 湖南航天新材料技术研究院有限公司 | A kind of graphene-based field-effect transistor and preparation method thereof |
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| CN112151221A (en) * | 2020-09-27 | 2020-12-29 | 合肥工业大学 | System and method for preparing high-temperature superconducting blocks in batches |
| CN113130202A (en) * | 2021-03-19 | 2021-07-16 | 中国科学院精密测量科学与技术创新研究院 | Superconducting coil processing method and superconducting coil |
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Application publication date: 20191022 |
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