CN108834319A - A kind of 3D printing method of ceramic substrate multilayer circuit - Google Patents
A kind of 3D printing method of ceramic substrate multilayer circuit Download PDFInfo
- Publication number
- CN108834319A CN108834319A CN201810853545.5A CN201810853545A CN108834319A CN 108834319 A CN108834319 A CN 108834319A CN 201810853545 A CN201810853545 A CN 201810853545A CN 108834319 A CN108834319 A CN 108834319A
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- China
- Prior art keywords
- ceramic substrate
- ceramic
- printing
- bed
- multilayer circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Led Device Packages (AREA)
Abstract
A kind of 3D printing method of ceramic substrate multilayer circuit, includes the following steps, draws model with three-dimensional mapping software according to design requirement, is converted into the file format that 3D printing equipment can identify；The smooth ceramic slurry bed of material that one layer of preset thickness is printed on copper-based bottom forms ceramic substrate, to support the required route printed in next step；According still further to the mobile printing head of printing path, one layer of conductive paste bed of material is ejected on ceramic substrate, to conductive paste bed of material irradiating ultraviolet light, makes conductive paste bed of material curing molding route；It ejects ceramic slurry on the line again and prints one layer of ceramic thin bed of material, which covers entire route；According to preset requirement, chip bonding pad, the external pad of power supply and connection line are set on the ceramic thin bed of material；Bowl is set on the ceramic thin bed of material, then sprays one layer of reflector material in bowl periphery of inner wall；Ceramic substrate is removed from 3D printing equipment.High production efficiency of the present invention can be realized the processing of multilayer circuit.
Description
Technical field
The present invention relates to aluminium nitride, the field of aluminium oxide ceramic substrate manufacturing technology, more particularly to ceramic substrate multilayer
The 3D printing method of circuit.
Background technique
The appearance of ceramic substrate product opens the development of cooling application industry.Due to ceramic substrate heat dissipation characteristic, in addition
Ceramic substrate has many advantages, such as high heat dissipation, low thermal resistance, service life length, proof voltage, be widely used in LED encapsulation, power electronic device,
The every field such as multi-chip module.With the improvement of production technology, equipment, product price accelerates to rationalize, and then expands LED and produce
The application field of industry, such as indicator light, automobile lamp, street lamp and the outdoor large billboard of household appliances.The exploitation of ceramic substrate
Success, will more become room lighting and outdoor brightening product provides service, keep the market segment in LED industry future broader.
Ceramic metallization is to adhere to one layer of metallic film securely in ceramic surface, is allowed to realize ceramic and intermetallic
Welding, existing molybdenum manganese method, gold-plated method, copper-plating method, tin plating method, nickel plating method, LAP method（Metal-plated after laser）Equal various metals chemical industry
Skill.However existing current ceramic metalizing process can only be only limitted to do circuit on positive and negative two surface of ceramics（This two-tier circuit connection side
Formula is to be connected using laser boring by modes such as plating, chemical platings）, i.e., can only at most do two-tier circuit.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of 3D printing method of ceramic substrate multilayer circuit, production efficiencys
Height, the available mutually disjoint circuit of multilayer.
In order to solve the above-mentioned technical problem, the present invention takes following technical scheme：
A kind of 3D printing method of ceramic substrate multilayer circuit, includes the following steps：
Model is drawn with three-dimensional mapping software according to design requirement, is converted into the file format that 3D printing equipment can identify；
Ceramic substrate is formed by the smooth ceramic slurry bed of material for printing one layer of preset thickness that imposes a condition on copper-based bottom, under support
The route printed required for one step, or do not need copper-based bottom and directly print generation ceramic substrate；
According still further to the mobile printing head of printing path, one layer of conductive paste bed of material is ejected on ceramic substrate, to the conductive paste bed of material
Irradiating ultraviolet light makes conductive paste bed of material curing molding route；
It ejects ceramic slurry on the line again and prints one layer of ceramic thin bed of material, which covers entire route；
Chip bonding pad, the external pad of power supply and connection line is arranged according to preset requirement in encapsulation process on the ceramic thin bed of material；
Bowl is set on the ceramic thin bed of material, then sprays one layer of reflector material in bowl periphery of inner wall；
Ceramic substrate is removed from 3D printing equipment, completes print procedure.
The material at the copper-based bottom is metallic copper, aluminium, silver, steel or metallic compound.
The material of the ceramic substrate is one or both of aluminium nitride, aluminium oxide, silicon carbide, mullite and beryllium oxide
Or two or more combined material.
The material of the route be metal material, alloy material or composite conducting metal, wherein metal material include
Silver, copper, gold, aluminium, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin or lead, alloy material include silver-bearing copper, cadmium copper, al-mg-si or magnalium.
The route setting is at least one layer of, and the layout of route is regular arrangement or irregular arrangement.
Chip bonding pad material in the encapsulation process is silver, copper, gold or NiPdAu, the chip bonding pad pass through 3D printing or
Person's plating, chemical plating mode generate.
The bowl is 3D printing or is obtained by machining.
Installing chip on the chip bonding pad, the chip are flip-chip or positive cartridge chip.
High production efficiency of the present invention realizes that multilayer is not reported to the leadship after accomplishing a task the layout of circuit as needed in ceramic substrate, so as to
To obtain multilayer line ceramic substrate.
Detailed description of the invention
Attached drawing 1 is one structural schematic diagram of the embodiment of the present invention；
Attached drawing 2 is two structural schematic diagram of the embodiment of the present invention；
Attached drawing 3 is three structural schematic diagram of the embodiment of the present invention.
Specific embodiment
To further understand the features of the present invention, technological means and specific purposes achieved, function, below with reference to
Present invention is further described in detail with specific embodiment for attached drawing.
Embodiment one
As shown in Fig. 1, a kind of 3D printing method of ceramic substrate multilayer circuit, includes the following steps：
S1 draws model with three-dimensional mapping software according to design requirement first, is converted to the tray that 3D printer can identify
Formula.
S2, on copper base 1,3D printer spray certain thickness ceramic slurry formed ceramic substrate 2, to its solidification.
S3, then replacement 3D printer spray head print one layer of conductive paste in ceramic base plate surface by circuit design requirements
Material forms the route 3 with certain thickness and one fixed width.
S4, one layer of smooth ceramic slurry formation ceramic thin bed of material is then printed on the line, its is made to cover route.
S5, replacement printing head, by LED encapsulated circuit design requirement, ceramic thin bed of material printout surface chip bonding pad 4,
The external pad 6 of power supply and other connection lines.LED chip is installed on chip bonding pad, then settable corresponding fluorescence rubber powder
8。
S6, printing head is replaced again, print bowl 5, then print one layer of very thin reflecting layer in 5 periphery of inner wall of bowl
Material, until printing finishes.
S7, the ceramic substrate of curing molding is removed from 3D printer, with technical requirements on drawing, to ceramic substrate into
The work of row subsequent processing, for example optical lens 9 is loaded onto, and coat corresponding insulating materials, the chip on chip bonding pad
7, ultimately form the ceramic circuit board of complete qualification.
Embodiment two
As shown in Fig. 2, the preparation of the present embodiment is basically the same as the first embodiment, the difference is that, print route 3 when
It waits, prints two layers of disjoint route altogether, meet the needs of different.
Embodiment three
As shown in Fig. 3, the present embodiment is directly to print generation ceramic base without using copper-based bottom compared with embodiment one
Plate specifically includes following steps：
S1 draws model with three-dimensional mapping software according to design requirement first, is converted to the tray that 3D printer can identify
Formula.
S2,3D printer spray certain thickness ceramic slurry form ceramic substrate 2, to its solidification.
S3, then replacement 3D printer spray head print one layer of circuit slurry in ceramic base plate surface by circuit design requirements
Material forms the route 3 with certain thickness and one fixed width.
S4, one layer of smooth ceramic slurry formation ceramic thin bed of material is then printed on the line, its is made to cover route.
S5, replacement printing head, by LED encapsulated circuit design requirement, ceramic thin bed of material printout surface chip bonding pad 4,
The external pad 6 of power supply and other connection lines.
S6, printing head is replaced again, print bowl 5, then print one layer of very thin reflecting layer in 5 periphery of inner wall of bowl
Material, until printing finishes.
S7, the ceramic substrate of curing molding is removed from 3D printer, with technical requirements on drawing, to ceramic substrate into
The work of row subsequent processing, for example optical lens 9 is loaded onto, and coat corresponding insulating materials, the chip on chip bonding pad
7, ultimately form the ceramic circuit board of complete qualification.
It should be noted that these are only the preferred embodiment of the present invention, it is not intended to restrict the invention, although ginseng
According to embodiment, invention is explained in detail, for those skilled in the art, still can be to aforementioned reality
Technical solution documented by example is applied to modify or equivalent replacement of some of the technical features, but it is all in this hair
Within bright spirit and principle, any modification, equivalent replacement, improvement and so on should be included in protection scope of the present invention
Within.
Claims (8)
1. a kind of 3D printing method of ceramic substrate multilayer circuit, includes the following steps：
Model is drawn with three-dimensional mapping software according to design requirement, is converted into the file format that 3D printing equipment can identify；
Ceramic substrate is formed by the smooth ceramic slurry bed of material for printing one layer of preset thickness that imposes a condition on copper-based bottom, under support
The route printed required for one step, or do not need copper-based bottom and directly print generation ceramic substrate；
According still further to the mobile printing head of printing path, one layer of conductive paste bed of material is ejected on ceramic substrate, to the conductive paste bed of material
Irradiating ultraviolet light makes conductive paste bed of material curing molding route；
It ejects ceramic slurry on the line again and prints one layer of ceramic thin bed of material, which covers entire route；
Chip bonding pad, the external pad of power supply and connection line is arranged according to preset requirement in encapsulation process on the ceramic thin bed of material；
Bowl is set on the ceramic thin bed of material, then sprays one layer of reflector material in bowl periphery of inner wall；
Ceramic substrate is removed from 3D printing equipment, completes print procedure.
2. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, which is characterized in that the copper-based bottom
Material is metallic copper, aluminium, silver, steel or metallic compound.
3. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, it is characterised in that：The ceramic base
The material of plate is one or both of aluminium nitride, aluminium oxide, silicon carbide, mullite and beryllium oxide or two or more combination materials
Material.
4. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, it is characterised in that：The route
Material be metal material, alloy material or composite conducting metal, wherein metal material include silver, copper, gold, aluminium, sodium, molybdenum,
Tungsten, zinc, nickel, iron, platinum, tin or lead, alloy material include silver-bearing copper, cadmium copper, al-mg-si or magnalium.
5. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, it is characterised in that：The route is set
At least one layer is set, the layout of route is regular arrangement or irregular arrangement.
6. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, it is characterised in that：At the encapsulation
Chip bonding pad material in reason is silver, copper, gold or NiPdAu, which passes through 3D printing or plating, chemical plating mode
It generates.
7. the 3D printing method of ceramic substrate multilayer circuit according to claim 1, it is characterised in that：The bowl is
3D printing is obtained by machining.
8. the 3D printing method of ceramic substrate multilayer circuit according to claim 7, feature are that：The chip
Installing chip on pad, the chip are flip-chip or positive cartridge chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853545.5A CN108834319A (en) | 2018-07-30 | 2018-07-30 | A kind of 3D printing method of ceramic substrate multilayer circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853545.5A CN108834319A (en) | 2018-07-30 | 2018-07-30 | A kind of 3D printing method of ceramic substrate multilayer circuit |
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| Publication Number | Publication Date |
|---|---|
| CN108834319A true CN108834319A (en) | 2018-11-16 |
Family
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| CN201810853545.5A Pending CN108834319A (en) | 2018-07-30 | 2018-07-30 | A kind of 3D printing method of ceramic substrate multilayer circuit |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364300A (en) * | 2019-07-30 | 2019-10-22 | 深圳供电局有限公司 | A kind of 3D printing Bi system high-temperature superconducting circuit and preparation method thereof |
| CN111065211A (en) * | 2019-12-24 | 2020-04-24 | 贵州航天计量测试技术研究所 | 3D printing manufacturing method of microstrip filter |
| CN113733294A (en) * | 2021-08-25 | 2021-12-03 | 杭州正向增材制造技术有限公司 | Three-dimensional circuit construction method and three-dimensional printer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472881A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | 3D printed graphene circuit board |
| CN106410011A (en) * | 2015-07-27 | 2017-02-15 | 广东德力光电有限公司 | 3D printing packaging method of flip chip |
| CN108269775A (en) * | 2018-01-24 | 2018-07-10 | 中国科学院地质与地球物理研究所 | A kind of system-in-a-package method and package system based on 3D printing |
-
2018
- 2018-07-30 CN CN201810853545.5A patent/CN108834319A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410011A (en) * | 2015-07-27 | 2017-02-15 | 广东德力光电有限公司 | 3D printing packaging method of flip chip |
| CN105472881A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | 3D printed graphene circuit board |
| CN108269775A (en) * | 2018-01-24 | 2018-07-10 | 中国科学院地质与地球物理研究所 | A kind of system-in-a-package method and package system based on 3D printing |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364300A (en) * | 2019-07-30 | 2019-10-22 | 深圳供电局有限公司 | A kind of 3D printing Bi system high-temperature superconducting circuit and preparation method thereof |
| CN111065211A (en) * | 2019-12-24 | 2020-04-24 | 贵州航天计量测试技术研究所 | 3D printing manufacturing method of microstrip filter |
| CN113733294A (en) * | 2021-08-25 | 2021-12-03 | 杭州正向增材制造技术有限公司 | Three-dimensional circuit construction method and three-dimensional printer |
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Application publication date: 20181116 |
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