CN110351959A - Improve method and control structure that asymmetric pressing wiring board plate is stuck up - Google Patents
Improve method and control structure that asymmetric pressing wiring board plate is stuck up Download PDFInfo
- Publication number
- CN110351959A CN110351959A CN201910646778.2A CN201910646778A CN110351959A CN 110351959 A CN110351959 A CN 110351959A CN 201910646778 A CN201910646778 A CN 201910646778A CN 110351959 A CN110351959 A CN 110351959A
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- China
- Prior art keywords
- ink
- conductive layer
- shaping area
- area
- wiring board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention proposes improve the asymmetric control structure for pressing wiring board plate and sticking up, including the first conductive layer, the first adhesive layer, internal layer circuit plate and the second adhesive layer, the 4th conductive layer successively pressed, first conductive layer includes the first shaping area and component welding section, 4th conductive layer includes the second shaping area and welding ink area, first shaping area is coated with anti-solder ink, and the second shaping area is covered with copper foil.Before assist side molding of the present invention, anti-solder ink is coated by the shaping area to the surface without welding ink, copper foil is covered to the forming area on the surface for needing to coat anti-solder ink simultaneously, mill off forming area again after drying ink, due to reducing the ink content difference on two surfaces before drying ink, so that in ink drying, the stress difference on two surfaces is reduced, to solve the problems, such as that stress concentration causes plate to stick up on one face.
Description
Technical field
The present invention relates to the manufacturing fields of wiring board, press the control that wiring board plate is stuck up more particularly, to asymmetry is improved
Structure processed, and improve the method that asymmetric pressing wiring board plate is stuck up.
Background technique
With the demand of application, electronic product produces asymmetric design, if ink is not stamped in welding component region,
And another side is that welding region is stamped ink, asymmetric ink design is so that the ink content difference on wiring board two sides is more than
100%, covering ink on base material in the curing process and generating shrinkage stress leads to sheet deformation, finally makes finished product
It is more than 0.75% that the plate of wiring board, which sticks up rate, is more than defined standard in industry, causes scrapping for plate, lead to production cost liter
Height, production efficiency reduce.
In general, to solve the problems, such as that wiring board plate is stuck up, it will usually add a pressing plate process after ink toasts processing procedure
By wiring board straightening, wiring board is subjected to pressurization baking straight panel operation, although can be with rectification plate prying, in assembling process
When, it needs with wiring board to connect component by high-temperature soldering, high temperature is cooling rapidly also to make plate generation deformation lead to plate
Prying.
Summary of the invention
To solve the above problems, the invention proposes the control structures stuck up for improving asymmetric pressing wiring board plate, together
When also proposed and improve the method that asymmetric pressing wiring board plate is stuck up.
Main contents of the invention are as follows:
Improve the control structure that asymmetric pressing wiring board plate is stuck up, including successively press the first conductive layer, the first bonding
Layer, internal layer circuit plate and the second adhesive layer and the 4th conductive layer, first conductive layer far from first adhesive layer one
Face is provided with component welding section and the first shaping area, and the 4th conductive layer is arranged far from the one side of second adhesive layer
There is welding ink area and the second shaping area, wherein first shaping area is correspondingly arranged with second shaping area, and described the
One shaping area is covered with anti-solder ink, and second shaping area is covered with copper foil.
Preferably, the area ratio of first shaping area and the component welding section is 2:3；Second shaping area
Area ratio with the welding ink area is 2:3.
Preferably, the internal layer circuit plate includes core plate, the second conductive layer and third conductive layer, and second conductive layer is set
It sets between the core plate and first adhesive layer；The third conductive layer is arranged in the core plate and second adhesive layer
Between.
Preferably, first adhesive layer and second adhesive layer are prepreg.
Preferably, the thickness of the anti-solder ink of first shaping area is in 20~25um；The welding of the welding ink area
Ink thickness is in 20~25um.
Improve the method that asymmetric pressing wiring board plate is stuck up, includes the following steps:
S1. the production of internal layer circuit plate: making the second conductive layer and third conductive layer in the upper and lower surface of core plate respectively, system
Obtain double-sided copper-clad wiring board；
S2. according to the first conductive layer, the first adhesive layer, internal layer circuit plate, the second adhesive layer, the 4th conductive layer sequence into
Row pressing；Wherein, pressing pressure is 70~350Psi, and pressing-in temp is 140~205 DEG C, and pressing time is 5~115min；
S3. the table of the surface to the first conductive layer far from the first adhesive layer, the 4th conductive layer far from second adhesive layer
Face is handled, and the control structure that the asymmetric pressing wiring board plate of above-mentioned improvement is stuck up is obtained；
S4, the obtained control structure of step S3 is toasted, to dry the first shaping area and weld the ink of ink area；
S5. the wiring board after baking is surface-treated, using the first shaping area of milling cutter mill off and the second shaping area；
S6. electrical measurement and visual inspection are carried out to the semi-finished product that step S5 is obtained.
Preferably, step S3 includes following sub-step:
The processing carried out to the first conductive layer far from the surface of first adhesive layer: the surface is divided into the first shaping area
It with component welding section, is drilled to component welding section, copper facing and etching, anti-solder paste then is coated to the first shaping area
Ink；
The processing carried out to the 4th conductive layer far from the surface of second adhesive layer: the surface is divided into the second shaping area
With welding ink area, copper foil is covered in the second shaping area, anti-solder ink then is coated to ink welding section.
The beneficial effects of the present invention are: the invention proposes improvement asymmetry to press the control structure that wiring board plate is stuck up,
Anti-solder ink is coated to the shaping area on the surface without welding ink before to route sheet metal forming, while to needing to coat anti-solder paste
The forming area on the surface of ink covers copper foil, mill off forming area again after drying ink, due to reducing before drying ink
The ink content difference on two surfaces, so that the stress difference on two surfaces is reduced, to solve stress collection in ink drying
In the problem of causing plate to stick up on one face.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is the floor map of the first conductive layer of the invention；
Fig. 3 is the floor map of the 4th conductive layer of the invention.
Specific embodiment
The technical solution protected below in conjunction with attached drawing to the present invention illustrates.
The invention proposes the asymmetric control structure for pressing wiring board plate and sticking up is improved, which is that production is asymmetric
Press an intermediate state of wiring board, content in order to better understand the present invention, below in conjunction with Fig. 1, Fig. 2 and Fig. 3 couple
The method that the asymmetric pressing wiring board plate of improvement proposed by the present invention is stuck up is illustrated, can be to the control structure in elaborate process
It is described.
Firstly, the production of internal layer circuit plate: making the second conductive layer 4 respectively in the upper and lower surface of core plate 3 and third is conductive
Double-sided copper-clad wiring board is made in layer 5；Specifically production method is manufactured according to the manufacture craft of existing double face copper；
Then, according to the first conductive layer 1, the first adhesive layer 2, internal layer circuit plate, second adhesive layer 6, the 4th conductive layer 7
Sequence is pressed, and selections pressing pressure is 70~350Psi, and pressing-in temp is 140~205 DEG C, pressing time for 5~
115min；
Wherein, first adhesive layer 2 and second adhesive layer 6 are prepreg.
Then, the structure after pressing is further processed, obtains improving the control that asymmetric pressing wiring board plate is stuck up
Structure, incorporated by reference to Fig. 2 and Fig. 3, as shown in Fig. 2, surface of first conductive layer 1 far from first adhesive layer 2 includes the
One shaping area 10 and component welding section 11 drill to component welding section 11, copper facing and etching, then form to first
Area 10 coats anti-solder ink；
As shown in figure 3, surface of the 4th conductive layer 7 far from second adhesive layer 6 includes the second shaping area 70 and welding
Ink area 71 covers copper foil 9 in the second shaping area 70, and coats anti-solder ink to ink welding section 71, and to ink welding section
After 71 the step of carrying out coating anti-solder ink, covered copper foil in the second shaping area 70, can by the halftone that is printed to ink and
Exposure film is designed, and the layout of the 4th conductive layer in control structure is obtained after printing and exposure, i.e., in the second molding
Area is covered with copper foil, while being coated with welding ink in welding ink area.
The welding ink of first shaping area and weld the welding ink of ink area in one of the embodiments,
With a thickness of 20~25um.
After obtaining above-mentioned control structure, then ink drying, surface treatment, molding, electrical measurement and visual inspection are carried out, can be obtained
Final molded product, wherein as follows to the process of ink drying: CMO-8WS will sage's oven is used, baking temperature is selected as 155
DEG C, baking time 70min；
And surface treatment is carried out to wiring board and is referred to: PCB surface handled using chemical gilding, wherein gold-plated to include
Nickel coating and Gold plated Layer, and between 4 microns to 9 microns of nickel layer thickness, layer gold thickness increases between 0.05 micron to 0.15 micron
The strong anti-oxidant and wear-resisting property of wiring board.
After handling PCB surface, using milling cutter mill off the first shaping area 10 and the second shaping area 70, the first one-tenth
Type area 10 and the second shaping area 70 are to be correspondingly arranged, as shown in Fig. 2, the first shaping area 10 is in approximate half-circular, and are located at first device
The both ends of part welding section, it is corresponding, as shown in figure 3, second shaping area 70 also semicircular in shape, and it is located at welding ink area
Both ends, on the thickness direction of assist side, the first shaping area 10 and the second shaping area 70 are completely coincident；And mill off first forms
Area and the second shaping area namely the first shaping area of mill off and the second shaping area are in the first conductive layer, the first adhesive layer, internal layer circuit
Corresponding region on plate, the second adhesive layer and the 4th conductive layer, i.e., wiring board after molding are formed in the first shaping area and second
The corresponding region in area is engraved structure.
Finally, carrying out electrical measurement and visual inspection to wiring board after molding, the warpage of wiring board is measured, using this hair
Bright method can control warpage below 0.75%.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (7)
1. improving the control structure that asymmetric pressing wiring board plate is stuck up, which is characterized in that including successively press the first conductive layer,
First adhesive layer, internal layer circuit plate and the second adhesive layer and the 4th conductive layer, first conductive layer are viscous far from described first
Knot layer is provided with component welding section and the first shaping area on one side, and the 4th conductive layer is far from second adhesive layer
It is provided with welding ink area and the second shaping area on one side, wherein first shaping area is corresponding with second shaping area to be set
It sets, first shaping area is covered with anti-solder ink, and second shaping area is covered with copper foil.
2. the control structure according to claim 1 for improving asymmetric pressing wiring board plate and sticking up, which is characterized in that described the
The area ratio of one shaping area and the component welding section is 2:3；The face of second shaping area and the welding ink area
The ratio between product is 2:3.
3. the control structure according to claim 1 for improving asymmetric pressing wiring board plate and sticking up, which is characterized in that in described
Sandwich circuit board includes core plate, the second conductive layer and third conductive layer, and the second conductive layer setting is in the core plate and described the
Between one adhesive layer；The third conductive layer is arranged between the core plate and second adhesive layer.
4. the control structure according to any one of claims 1 to 3 for improving asymmetric pressing wiring board plate and sticking up, feature exist
In first adhesive layer and second adhesive layer are prepreg.
5. the control structure according to any one of claims 1 to 3 for improving asymmetric pressing wiring board plate and sticking up, feature exist
In the thickness of the anti-solder ink of first shaping area is in 20~25um；The welding ink thickness of the welding ink area is 20
~25um.
6. improving the method that asymmetric pressing wiring board plate is stuck up, which comprises the steps of:
S1. the production of internal layer circuit plate: making the second conductive layer and third conductive layer in the upper and lower surface of core plate respectively, is made double
Face copper coating board；
S2. it is pressed according to the sequence of the first conductive layer, the first adhesive layer, internal layer circuit plate, the second adhesive layer, the 4th conductive layer
It closes；Wherein, pressing pressure is 70~350Psi, and pressing-in temp is 140~205 DEG C, and pressing time is 5~115min；
S3. the surface to the first conductive layer far from the first adhesive layer, surface of the 4th conductive layer far from second adhesive layer into
Row processing obtains the control structure as claimed in claim 1 to 5 for improving asymmetric pressing wiring board plate and sticking up；
S4, the obtained control structure of step S3 is toasted, to dry the first shaping area and weld the ink of ink area；
S5. golden handle, using the first shaping area of milling cutter mill off and the second shaping area of coming to the surface is carried out to the wiring board after baking；
S6. electrical measurement and visual inspection are carried out to the semi-finished product that step S5 is obtained.
7. the method according to claim 6 for improving asymmetric pressing wiring board plate and sticking up, which is characterized in that step S3 includes
Following sub-step:
The processing carried out to the first conductive layer far from the surface of first adhesive layer: the surface is divided into the first shaping area and member
Device welding section drills to component welding section, copper facing and etching, then coats anti-solder ink to the first shaping area；
The processing carried out to the 4th conductive layer far from the surface of second adhesive layer: the surface is divided into the second shaping area and weldering
Ink area is connect, copper foil is covered to the second shaping area, anti-solder ink then is coated to ink welding section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910646778.2A CN110351959A (en) | 2019-07-17 | 2019-07-17 | Improve method and control structure that asymmetric pressing wiring board plate is stuck up |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910646778.2A CN110351959A (en) | 2019-07-17 | 2019-07-17 | Improve method and control structure that asymmetric pressing wiring board plate is stuck up |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110351959A true CN110351959A (en) | 2019-10-18 |
Family
ID=68175646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910646778.2A Pending CN110351959A (en) | 2019-07-17 | 2019-07-17 | Improve method and control structure that asymmetric pressing wiring board plate is stuck up |
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| CN (1) | CN110351959A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752406A (en) * | 2020-11-24 | 2021-05-04 | 广州广合科技股份有限公司 | Drilling and forming method for carbon-hydrogen material in printed circuit board |
-
2019
- 2019-07-17 CN CN201910646778.2A patent/CN110351959A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752406A (en) * | 2020-11-24 | 2021-05-04 | 广州广合科技股份有限公司 | Drilling and forming method for carbon-hydrogen material in printed circuit board |
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