CN110349860B - Welding strip processing device and welding strip processing method - Google Patents
Welding strip processing device and welding strip processing method Download PDFInfo
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- CN110349860B CN110349860B CN201810303679.XA CN201810303679A CN110349860B CN 110349860 B CN110349860 B CN 110349860B CN 201810303679 A CN201810303679 A CN 201810303679A CN 110349860 B CN110349860 B CN 110349860B
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- 238000003466 welding Methods 0.000 title claims abstract description 168
- 238000012545 processing Methods 0.000 title claims abstract description 51
- 238000003672 processing method Methods 0.000 title abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 238000005452 bending Methods 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims description 110
- 238000003825 pressing Methods 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 25
- 238000012546 transfer Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a welding strip processing device and a welding strip processing method, wherein the welding strip processing device comprises a traction mechanism, a cutter, a bending mechanism and a carrying mechanism; the traction mechanism is used for dragging a welding strip to be cut to a first station, the cutter cuts off the welding strip to obtain the welding strip located at the first station, the welding strip obtained by cutting is conveyed to a second station, the bending mechanism is used for bending the welding strip at the second station, and the carrying mechanism is used for carrying the welding strip after bending to a third station corresponding to the next procedure. The invention can effectively accelerate the production beat, thereby greatly improving the production efficiency.
Description
Technical Field
The present invention relates generally to a solder strip processing apparatus, and more particularly, to a solder strip processing apparatus and a solder strip processing method.
Background
At present, a circular welding strip is mainly used on a multi-main-grid serial welding machine, and is easy to roll and shake in the processes of traction, cutting, transferring and laying, so that the welding strip can not be accurately welded to a main grid line of a battery piece when the battery piece is welded into a string, and the quality of a produced photovoltaic cell string assembly is unqualified.
As shown in fig. 1, in a conventional strap conveying method, a strap 11 is pulled to a predetermined bending part 12 by a strap pulling mechanism 15, the bending part 12 presses the strap 11, a cutter 13 cuts the strap 11, the bending part 12 bends the strap 11, and a strap conveying device 14 moves to the bending part 12 to convey the strap 11 away. At present, in the traditional welding strip conveying mode, after a welding strip traction mechanism pulls a welding strip to a bending part, the welding strip traction mechanism needs to wait for bending the welding strip, and the welding strip conveying mechanism conveys the welding strip away from the bending part and then pulls the welding strip next time. The welding strip traction mode can enable the welding strip traction device to wait for a long time, delay the production beat and have lower efficiency.
Accordingly, there is a need for a mechanism and method that can provide bending or other processing of the solder strip while avoiding excessive waiting times for the solder strip pulling mechanism to solve the above-described problems.
The above information disclosed in the background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
It is therefore a primary object of the present invention to overcome at least one of the above-mentioned drawbacks of the prior art, and to provide a solder strip processing apparatus that can effectively improve the production efficiency.
Another main object of the present invention is to overcome at least one of the above-mentioned drawbacks of the prior art, and to provide a solder strip processing method that can effectively improve the production efficiency.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
according to an aspect of the present invention, there is provided a solder strip processing apparatus including a traction mechanism, a cutter, a bending mechanism, and a carrying mechanism;
the traction mechanism is used for dragging a welding strip to be cut to a first station, the cutter cuts off the welding strip to obtain the welding strip located at the first station, the welding strip obtained by cutting is conveyed to a second station, the bending mechanism is used for bending the welding strip at the second station, and the carrying mechanism is used for carrying the welding strip after bending to a third station corresponding to the next procedure.
According to an embodiment of the present invention, the solder strip processing device further includes a first carrier and a second carrier, the first carrier is disposed at the first station, the second carrier is disposed at the second station, and a conveying mechanism is disposed between the first carrier and the second carrier.
According to an embodiment of the present invention, the conveying mechanism is a transfer component, and the transfer component is configured to transfer the solder strip on the first carrier to the second carrier.
According to an embodiment of the present invention, the bending mechanism includes a pressing head, where the pressing head presses down on the second carrier to cooperate with the second carrier to bend the solder strip carried on the second carrier;
the second bearing piece is provided with a bearing surface for bearing the welding strip, a step surface arranged along the extending direction of the welding strip is formed on the bearing surface, a pressing surface corresponding to the step surface is formed on the pressing head, and the pressing surface are matched with each other to bend the welding strip.
According to an embodiment of the present invention, the solder strip processing apparatus includes a third carrier, where the third carrier includes a first carrier stage and a second carrier stage whose positions are configured to be switched to each other, the first carrier stage is located at the first station, the second carrier stage is located at the second station, and the second carrier stage is located at the first station when the first carrier stage is located at the second station.
According to an embodiment of the present invention, the third carrying member further includes a rotating member, and the rotating member drives the first carrying table and the second carrying table to rotationally switch between the first station and the second station.
According to an embodiment of the present invention, the third carrier further includes a first driving assembly driving the first carrying platform to lift and horizontally move, and a second driving assembly driving the second carrying platform to lift and horizontally move, where the first driving assembly and the second driving assembly cooperate to control the first carrying platform and the second carrying platform to perform position switching between the first station and the second station.
According to an embodiment of the present invention, the third carrier further includes a conveyor belt, where the first carrying table and the second carrying table are both disposed on the conveyor belt, and the conveyor belt is configured to drive the first carrying table and the second carrying table to switch positions on the first station and the second station.
According to an embodiment of the invention, the bending mechanism comprises a pressing head, and the pressing head is pressed down to be matched with a first bearing table or a second bearing table positioned on the second station so as to bend the welding strip;
the first bearing table and the second bearing table are respectively provided with a bearing surface for bearing the welding strip, step surfaces arranged along the extending direction of the welding strip are formed on the bearing surfaces, pressing surfaces corresponding to the step surfaces are formed on the pressing head, and the pressing surfaces and the bearing surfaces are matched with each other to bend the welding strip.
According to an embodiment of the present invention, the solder strip processing device includes a fourth carrier, the fourth carrier is disposed at the first station, and the bending mechanism carries the solder strip on the fourth carrier and bends the solder strip at the second station.
According to another aspect of the present invention, a solder strip processing method using the solder strip processing apparatus as described above, the method comprising:
drawing a welding strip to be cut to a first station, and cutting the welding strip to obtain an ith welding strip, wherein i is larger than 1;
transferring the ith assembly welding strip to a second station, bending the ith assembly welding strip at the second station, and transferring the ith assembly welding strip to a third station corresponding to the next procedure after bending is completed;
after the ith assembly welding strip is transferred to a second station, the welding strip to be cut is pulled to the first station, and the welding strip is cut to obtain an (i+1) th assembly welding strip;
transferring the i+1th assembly welding strip to the second station, bending the i+1th assembly welding strip at the second station, and carrying the i+1th assembly welding strip to the third station after bending is completed;
and setting i as i+2, and continuing to execute the steps of pulling the welding strip to be cut to the first station, cutting the welding strip and obtaining the ith assembly welding strip.
According to the technical scheme, the welding strip processing device and the welding strip processing method have the advantages that:
according to the invention, the first station and the second station are arranged, the welding strip is pulled on the first station, and the welding strip is bent on the second station, so that the two stations can work simultaneously and do not interfere with each other, the production beat can be effectively accelerated, and the production efficiency can be effectively improved. The invention has simple structure and is easy to use and maintain.
Drawings
Various objects, features and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the invention, when taken in conjunction with the accompanying drawings. The drawings are merely exemplary illustrations of the invention and are not necessarily drawn to scale. In the drawings, like reference numerals refer to the same or similar parts throughout. Wherein:
fig. 1 is a schematic diagram showing the overall structure of a prior art method for carrying and handling solder strips.
Fig. 2 is a schematic top view of a solder strip processing apparatus according to an example embodiment.
Fig. 3 is a schematic top view showing a partial structure of a solder strip processing apparatus according to an exemplary embodiment.
Fig. 4 is a schematic perspective view illustrating a second carrier of a solder strip processing apparatus mated with a bending mechanism according to an exemplary embodiment.
Fig. 5 is a schematic top view showing an overall structure of a solder ribbon processing apparatus according to another exemplary embodiment.
Fig. 6 is a schematic view showing the overall structure of a rotating member of a welding-ribbon processing apparatus according to an exemplary embodiment.
Fig. 7 is a side view of a solder strip processing apparatus showing a drive assembly according to an example embodiment.
Fig. 8 is a schematic top view of a solder strip processing apparatus showing a conveyor belt according to an example embodiment.
Fig. 9 is a schematic perspective view showing a first carrying stage and a second carrying stage of a solder strip processing apparatus in cooperation with a bending mechanism according to an exemplary embodiment.
Fig. 10 is a schematic top view of a solder strip processing apparatus showing a conveyor belt according to an example embodiment.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the inventive aspects may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
The following description of specific embodiments of the invention will be given by way of example with reference to the accompanying drawings:
fig. 2 is a schematic top view of a solder strip processing apparatus according to an example embodiment.
As shown in fig. 2, the welding strip processing device provided by the invention comprises a traction mechanism 2, a cutter 3, a bending mechanism (not shown in the figure) and a carrying mechanism 4; the traction mechanism 2 is used for traction of the welding strip 5 to be cut to the first station D1, the cutter 3 cuts off the welding strip 5 to obtain the welding strip 5 located in the first station D1, the welding strip 5 obtained through cutting is conveyed to the second station D2, the bending mechanism is used for bending the welding strip 5 of the second station D2, and the carrying mechanism 4 is used for carrying the welding strip 5 which is bent to the third station D3 corresponding to the next procedure. As shown in fig. 1, the cutter 3, the first station D1 and the traction mechanism 2 are sequentially arranged in parallel, and the second station D2 may be disposed above the first station D1, but it should be noted that the present invention is not limited to the specific position of the second station D2, and the position of the third station D3 may also be arbitrarily set according to the requirement, and those skilled in the art may automatically adjust the specific position according to the situation. The carrying mechanism 4 may be disposed at the second station D2, so as to carry the solder strip bent on the second station D2 to a third station D3 corresponding to the next process. In an embodiment of the invention, the carrying mechanism 4 may be disposed between the second station D2 and the third station D3, but the invention is not limited thereto.
In actual use, the traction mechanism 2 may draw the solder ribbon 5 from a solder ribbon discharging device (not shown in the drawings) to the first station D1, and the cutter 3 cuts the solder ribbon 5 so that the solder ribbon 5 may be placed on the first station D1, and the traction mechanism 2 may draw one or more solder ribbons at a time. After the solder strip 5 is cut off, the solder strip 5 may be conveyed to the second station D2, and the bending mechanism may perform bending operation on the solder strip 5 located on the second station D2, or perform other processing operations on the solder strip located on the second station D2, which is not limited in this invention. When the first station is empty, the traction mechanism 2 can then draw the solder strip 5 onto the first station D1 again, and then repeat the above-mentioned operation steps. After the bending mechanism finishes the bending operation of the welding strip 5, the moving mechanism 4 can move the bent welding strip to the third station D3 so as to be convenient for carrying out other operations on the welding strip. The invention effectively avoids the traction mechanism waiting for a long time and greatly quickens the production beat by arranging the stations, thereby effectively improving the production efficiency.
Fig. 3 is a schematic top view showing a partial structure of a solder strip processing apparatus according to an exemplary embodiment.
According to an embodiment of the present invention, the solder strip processing apparatus may further include a first carrier 61 and a second carrier 62, the first carrier 61 is disposed at the first station D1, the second carrier 62 is disposed at the second station D2, and the conveying mechanism 7 is disposed between the first carrier 61 and the second carrier 62. As shown in fig. 2, the first carrier 61 and the second carrier 62 are mainly made of the carrier tapes 5, and may be made of metal or plastic, which is not limited in the present invention. Specifically, the first carrier 61 may be fixedly disposed on the first station D1, the second carrier 62 may be fixedly disposed on the second station D2, and the conveying mechanism 7 may be disposed between the first carrier 61 and the second carrier 62, which may be used for conveying the solder strip 5 on the first carrier 61 to the second carrier 62. The installation position of the conveying mechanism 7 is not necessarily set between the two carriers, and it may be suspended above the two carriers as long as it can transport the solder strip 5.
According to one embodiment of the present invention, the conveying mechanism 7 is a transfer assembly for transferring the solder ribbon 5 on the first carrier 61 to the second carrier 62. The transfer assembly may be a manipulator, which may clamp one or more solder strips 5 from the first carrier 61 at a time and may move them to the second carrier 62, so the present invention is not limited to the specific structure of the transfer assembly, and those skilled in the art may choose to set them according to the actual situation.
Fig. 4 is a schematic perspective view illustrating a second carrier of a solder strip processing apparatus mated with a bending mechanism according to an exemplary embodiment.
According to one embodiment of the present invention, the bending mechanism 8 may include a pressing head 81, where the pressing head 81 presses down on the second carrier 62 to bend the solder strip 5 carried on the second carrier 62; the second carrier 62 has a carrying surface 621 for carrying the solder ribbon 5, a step surface 622 provided along the extending direction of the solder ribbon 5 is formed on the carrying surface 621, and a pressing surface corresponding to the step surface 622 is formed on the pressing head 81, which cooperate with each other to bend the solder ribbon 5. As shown in fig. 4, the upper surface of the second carrier 62 is a carrier surface 621, and the carrier surface 621 may cooperate with the lower surface of the ram 81 to bend the solder strip 5. Further, the bearing surface 621 may be formed with a step surface 622 extending along the length direction of the solder strip 5, and the lower surface of the ram 81 cooperates with the step surface 622 to bend the solder strip 5. By adopting the design, the traction mechanism 2 can be prevented from waiting for a long time, and the production beat is quickened; and because the welding belt is directly bent on the second bearing table, the welding belt bending device is simple in structure and convenient to use, and therefore the use and maintenance cost of the welding belt bending device can be effectively reduced.
In a specific embodiment of the invention, the first bearing piece and the second bearing piece are both provided with bearing surfaces for bearing the welding strip, and grooves extending along the length direction of the welding strip can be formed on the bearing surfaces for positioning the welding strip, so that the welding strip can be prevented from sliding off due to poor positioning. Particularly, the grooves on the second bearing piece can effectively prevent the welding strips from being offset to cause waste after the pressing head is pressed down, so that the yield of the invention can be effectively improved, and the production and manufacturing cost can be reduced. It should be noted, however, that the grooves described above are not necessarily included in all embodiments of the invention, and that other means of positioning the weld may be used by those skilled in the art.
Fig. 5 is a schematic top view showing an overall structure of a solder ribbon processing apparatus according to another exemplary embodiment.
As shown in fig. 5, according to an embodiment of the present invention, the solder strip processing apparatus may include a third carrier 63, and the third carrier 63 may include a first carrier 631 and a second carrier 632 positioned to be switched to each other, the first carrier 631 being positioned at the first station D1, the second carrier 632 being positioned at the second station D2, and the second carrier 632 being positioned at the first station D1 when the first carrier 631 is positioned at the second station D2. The present embodiment is different from the foregoing embodiment in that the first carrier, the second carrier, and the conveying mechanism do not need to be matched to perform transferring of the solder strip, and other portions of the transferring may be set with reference to the foregoing embodiment, which is not repeated herein. Specifically, the third carrier 63 may include a first carrier 631 and a second carrier 632, which may be capable of performing the transfer of the solder strip 5 by a position switching manner, but the specific switching manner may be implemented in a plurality of manners, which will be described in detail in other embodiments below. By adopting the design, the invention has simple structure, can save equipment cost and can save the operation space of the machine because a conveying mechanism is not required to be arranged independently.
In the actual use process, the traction mechanism 2 may draw the solder strip 5 from a solder strip discharging device (not shown in the figure) onto the first carrying table 631 located at the first station D1, and the cutter 3 cuts off the solder strip 5, so that the solder strip 5 may be placed on the first carrying table 631, after the solder strip 5 is cut off, the first carrying table 631 starts to carry the solder strip 5 to move onto the second station D2, and meanwhile, the second carrying table 632 may move onto the first station D1 in a synchronous or asynchronous manner. When the first carrying table 631 moves to the second station D2, the bending mechanism may perform a bending operation on the solder ribbon 5 located on the first carrying table 631 of the second station D2. Since the second carrying table 632 is moved to the first station D1, the traction mechanism 2 may again draw the solder ribbon 5 to the first station D1, and the solder ribbon 5 may be transferred to the second station D2 again by the movement of the second carrying table 632, and then the above operation steps may be repeated. After the bending mechanism finishes the bending operation of the welding strip 5, the moving mechanism 4 can move the bent welding strip from the second station D2 to the third station D3 so as to facilitate other operations of the welding strip. In the embodiment, the effect of accelerating the production beat can be achieved only by the action of the third bearing piece, and the device is simple in structure, convenient to install and use and capable of effectively reducing the use and maintenance cost.
Fig. 6 is a schematic view showing the overall structure of a rotating member of a welding-ribbon processing apparatus according to an exemplary embodiment.
According to an embodiment of the present invention, the third carrier 63 may further include a rotating member 633, where the rotating member 633 drives the first carrier 631 and the second carrier 632 to rotationally switch between the first station D1 and the second station D2. As shown in fig. 5, the rotating member 633 may specifically be a rotating shaft, which may be connected by a motor (not shown) in a driving manner, so as to drive the first bearing platform 631 and the second bearing platform 632 to rotate along a horizontal direction, thereby realizing the position switching between the two bearing platforms. The motor may specifically be a servo motor, but the invention is not limited to the type of motor. As shown, the number of the first bearing table 631 and the second bearing table 632 is one, and the first bearing table 631 and the second bearing table 632 are respectively disposed on two sides of the rotating shaft, and the rotating member 633 rotates 180 ° each time to switch the positions of the first bearing table and the second bearing table. It should be noted that, in other embodiments of the present invention, the specific number of the first bearing table and the second bearing table is not limited, for example, the number of the first bearing table and the second bearing table may be plural, and the first bearing table and the second bearing table may be equal in number, so that the production tact may be further increased and the production efficiency may be improved.
Fig. 7 is a side view of a solder strip processing apparatus showing a drive assembly according to an example embodiment.
According to an embodiment of the present invention, the third carrier 63 may further include a first driving assembly 634 driving the first stage 631 to move up and down and horizontally, and a second driving assembly 635 driving the second stage 632 to move up and down and horizontally, and the first driving assembly 634 and the second driving assembly 635 cooperate to control the first stage 631 and the second stage 632 to switch positions between the first station D1 and the second station D2. As shown in fig. 7, the first drive assembly 634 may include, in particular, a first slide rail 6341 and a first telescoping cylinder 6342. The first sliding rail 6341 may be disposed between the first station D1 and the second station D2, and may extend along a direction in which the first station D1 and the second station D2 are juxtaposed. The base of the first telescopic cylinder 6342 is slidably disposed on the first sliding rail 6341 and can slide the first sliding rail 6341 to move horizontally, and the telescopic rod top end of the first telescopic cylinder 6342 may be provided with the first bearing platform 631. The second driving assembly 635 may also include a second sliding rail 6351 and a second telescopic cylinder 6352, which are disposed in the same manner as the first driving assembly 634, and the two should be symmetrically designed, so that the description thereof will not be repeated.
In actual use, as shown in fig. 5, the traction mechanism 2 may draw the solder strip 5 from a solder strip discharging device (not shown) onto the first carrying table 631 located at the first station D1, and the cutter 3 cuts off the solder strip 5 so that the solder strip 5 may be placed on the first carrying table 631, at this time, the first carrying table 631 moves along the first sliding rail 6341 toward the second station D2, and the second carrying table 632 may move along the second sliding rail toward the first station D1, so that, to avoid collision between the second carrying table 632 and the first carrying table 631, the second carrying table 632 may be first lowered or raised to avoid the first carrying table 631, and then raised or lowered to the initial height after moving to the first station, so that the traction mechanism 2 draws the solder strip 5 onto the second carrying table 632 again. After the welding strip 5 is cut off, the second bearing platform 632 drives the welding strip to move towards the second station D2 along the second sliding rail, the welding strip on the first bearing platform 631 is processed and carried away, the first bearing platform 631 moves towards the first station D1, and in this step, the first bearing platform 631 ascends or descends to avoid the second bearing 632, and the welding strip is processed in a circulating way. In the present embodiment, the carrying table on which the solder ribbon has been carried does not perform the lifting action, but the carrying table on which the solder ribbon has not been carried performs the lifting action, so that the occurrence of the problem of the solder ribbon slipping can be avoided. In the embodiment, the positions of the first bearing table and the second bearing table are switched in a sliding rail and lifting mode, so that the structure is simple, and the production efficiency can be effectively improved.
Fig. 8 is a schematic top view of a solder strip processing apparatus showing a conveyor belt according to an example embodiment.
According to an embodiment of the present invention, the third carrier 63 may further include a conveying belt 636, where the first carrying table 631 and the second carrying table 632 are disposed on the conveying belt 636, and the conveying belt 636 is used to drive the first carrying table 631 and the second carrying table 632 to switch positions on the first station D1 and the second station D2. Referring to fig. 5 and 8, two ends of the conveyor 636 may be disposed on the first station D1 and the second station D2, respectively, and the first bearing platform 631 and the second bearing platform 632 are disposed on the conveyor 636, and in an initial state, the first bearing platform 631 is disposed on the first station D1, and the second bearing platform 632 is disposed on the second station D2. In actual use, the switching of the two carrier positions is achieved by the conveyance of the conveyance belt 636. It should be noted that, in the present embodiment, the specific number of the first bearing table and the second bearing table is not limited, and two bearing tables may be plural, but the number of the two bearing tables should be equal, so that a person skilled in the art may select the setting according to the actual situation.
Fig. 9 is a schematic perspective view showing a first carrying stage and a second carrying stage of a solder strip processing apparatus in cooperation with a bending mechanism according to an exemplary embodiment.
According to one embodiment of the present invention, the bending mechanism 8 may include a ram 81, where the ram 81 presses down on the first stage 631 or the second stage 632 located at the second station D2 to bend the solder strip 5; the first bearing table 631 and the second bearing table 632 are respectively provided with a bearing surface 637 for bearing the welding strip 5, the bearing surface 637 is provided with a step surface 638 arranged along the extending direction of the welding strip 5, the pressing head is provided with a pressing surface corresponding to the step surface 638, and the pressing surfaces are mutually matched to bend the welding strip 5. As shown in fig. 9, the upper surfaces of the first bearing platform 631 and the second bearing platform 632 are bearing surfaces 637, and the bearing surfaces 637 may cooperate with the lower surface of the pressing head 81 to bend the solder strip 5. Further, the bearing surface 637 may be further formed with a step surface 638 extending along the length direction of the solder strip 5, and the lower surface of the ram 81 and the step surface 622 cooperate to bend the solder strip 5. By adopting the design, the traction mechanism 2 can be prevented from waiting for a long time, and the production beat is quickened; and because the welding belt is directly bent on the second bearing table, the welding belt bending device is simple in structure and convenient to use, and therefore the use and maintenance cost of the welding belt bending device can be effectively reduced.
In a specific embodiment of the invention, the first bearing table and the second bearing table are both provided with bearing surfaces for bearing the welding strip, and grooves extending along the length direction of the welding strip can be formed on the bearing surfaces for positioning the welding strip, so that the welding strip can be prevented from sliding off due to poor positioning. Further, the waste caused by the deviation of the welding strip after the pressing head is pressed down can be effectively prevented, so that the yield of the invention can be effectively improved, and the production and manufacturing cost can be reduced. It should be noted, however, that the grooves described above are not necessarily included in all embodiments of the invention, and that other means of positioning the weld may be used by those skilled in the art.
Fig. 10 is a schematic top view of a solder strip processing apparatus showing a conveyor belt according to an example embodiment.
According to one embodiment of the present invention, the solder strip processing apparatus may include a fourth carrier 64, where the fourth carrier 64 is disposed at the first station D1, and the bending mechanism carries the solder strip 5 on the fourth carrier 64 and bends the solder strip 5 at the second station D2. As shown in fig. 10, the fourth carrier 64 is separately disposed on the first station D1, and the bending mechanism can carry the solder strip from the fourth carrier 64 to the second station D2, bend the solder strip, and then carry the solder strip to the third station D3. The invention is not limited to the specific type of bending mechanism, as long as the welding strip can be transported and bent.
In another embodiment of the present invention, the second station may not be provided, and the bending mechanism may perform bending operation on the solder strip during the process of carrying the solder strip, and carry the solder strip to the third station after completing the bending operation. Therefore, the second station and the bending time of the bending mechanism are not limited, and the bending mechanism can be set by a person skilled in the art according to actual situations.
According to another aspect of the present invention, there is also provided a solder strip processing method, which can use the solder strip processing apparatus in any of the above embodiments, the method may include:
drawing a welding strip to be cut to a first station, and cutting the welding strip to obtain an ith welding strip, wherein i is larger than 1;
transferring the ith assembly welding strip to a second station, bending the ith assembly welding strip at the second station, and carrying the ith assembly welding strip to a third station corresponding to the next procedure after bending is completed;
after the ith assembly welding strip is transferred to the second station, the welding strip to be cut is pulled to a first station D1, and the welding strip is cut to obtain an ith+1th assembly welding strip;
transferring the (i+1) th assembly welding strip to a second station, bending the (i+1) th assembly welding strip at the second station, and carrying the (i+1) th assembly welding strip to a third station after bending is completed;
and setting i as i+2, and continuing to execute the steps of pulling the welding strip to be cut to the first station, cutting the welding strip and obtaining the ith assembly welding strip.
Referring to fig. 2 to 10 in combination, in an embodiment of the present invention, the traction mechanism may draw the solder strip to be cut from the solder strip discharging device to the first station, and then the cutter may cut the solder strip to obtain the ith set of solder strips, i may be greater than or equal to 1, for example, it may be set 1, set 2, … …, etc. The number of the i-th set of solder strips may be determined according to practical situations, and may be one, two or more solder strips, so the present invention is not limited thereto.
The ith solder strip can be transferred to the second station, and the specific transfer mode can refer to the transfer mode of the solder strip processing device, which is not described herein. After bending or other processing is carried out on the ith assembly welding strip on the second station, the ith assembly welding strip is conveyed to a third station corresponding to the next working procedure, and the conveying mode of the welding strip can be realized by adopting a conveying mechanism.
And after the ith assembly welding strip is transferred to the second station, the welding strip to be cut is pulled to the first station, and the welding strip is cut to obtain the (i+1) th assembly welding strip. In an embodiment of the present invention, when the i-th solder strip leaves the first station, the traction mechanism may again traction the solder strip to be cut to the first station, and then cut by the cutter to obtain the i+1-th solder strip. The production beat can be further accelerated by adopting the design, so that the production efficiency of welding strip treatment is improved.
And then the (i+1) th welding strip can be transferred to a second station, and after the (i+1) th welding strip is bent or otherwise processed at the second station, the (i+1) th welding strip is conveyed to a third station corresponding to the next procedure by a conveyor mechanism. Further, i can be set as i+2, the steps of pulling the welding strip to be cut to the first station, cutting the welding strip to obtain the i-th welding strip can be continuously repeated, and then the processing work of the welding strip can be completed. According to the invention, the welding strip to be cut is pulled again when the bending operation is carried out on the welding strip, so that the production beat can be accelerated, and the production efficiency is greatly improved.
According to the technical scheme, the welding strip processing device and the welding strip processing method have the advantages that:
according to the invention, the first station and the second station are arranged, the welding strip is pulled on the first station, and the welding strip is bent on the second station, so that the two stations can work simultaneously and do not interfere with each other, the production beat can be effectively accelerated, and the production efficiency can be effectively improved. The invention has simple structure and is easy to use and maintain.
It should be appreciated that the various examples described above may be utilized in a variety of directions (e.g., tilted, inverted, horizontal, vertical, etc.) and in a variety of configurations without departing from the principles of the present invention. The embodiments shown in the drawings are shown and described merely as examples of useful applications of the principles of the invention, which are not limited to any specific details of these embodiments.
Exemplary embodiments are described and/or illustrated in detail herein. Embodiments of the invention are not limited to the specific embodiments described herein, but rather, components and/or steps of each embodiment may be utilized independently and separately from other components and/or steps described herein. Each component and/or each step of one embodiment may also be used in combination with other components and/or steps of other embodiments. When introducing elements/components/etc. that are described and/or illustrated herein, the terms "a," "an," "the," and "at least one" are intended to mean that there are one or more of the elements/components/etc. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements/components/etc., in addition to the listed elements/components/etc. Furthermore, the terms "first," "second," and "third," and the like in the claims are used merely as labels, and are not intended to limit the numerals of their objects.
While the invention has been described in terms of various specific embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the claims.
Claims (7)
1. The welding strip processing device is characterized by comprising a traction mechanism, a cutter, a bending mechanism and a carrying mechanism;
the traction mechanism is used for dragging the welding strip to be cut to a first station, the cutter cuts off the welding strip to obtain the welding strip positioned at the first station, the welding strip obtained by cutting is conveyed to a second station, the bending mechanism is used for bending the welding strip at the second station, and the conveying mechanism is used for conveying the welding strip after bending to a third station corresponding to the next process;
the welding strip processing device further comprises a first bearing piece and a second bearing piece, wherein the first bearing piece is arranged at the first station, the second bearing piece is arranged at the second station, and a conveying mechanism is arranged between the first bearing piece and the second bearing piece;
the conveying mechanism is a conveying component and is used for conveying the welding strip on the first bearing piece to the second bearing piece;
the bending mechanism comprises a pressure head, and the pressure head is pressed down to be matched with the second bearing piece so as to bend a welding strip borne on the second bearing piece;
the second bearing piece is provided with a bearing surface for bearing the welding strip, a step surface arranged along the extending direction of the welding strip is formed on the bearing surface, a pressing surface corresponding to the step surface is formed on the pressing head, and the pressing surface are matched with each other to bend the welding strip;
the welding strip processing device comprises a third bearing piece, wherein the third bearing piece comprises a first bearing table and a second bearing table, the positions of the first bearing table and the second bearing table are configured to be switched, the second bearing table is located at the second station when the first bearing table is located at the first station, and the second bearing table is located at the first station when the first bearing table is located at the second station.
2. The ribbon handling apparatus of claim 1, wherein the third carrier further comprises a rotating member that drives the first carrier and the second carrier to rotationally switch between the first station and the second station.
3. The ribbon handling device of claim 1, wherein the third carrier further comprises a first drive assembly that drives the first carrier to move up and down and horizontally, and a second drive assembly that drives the second carrier to move up and down and horizontally, the first drive assembly and the second drive assembly cooperating to control the first carrier and the second carrier to switch positions between the first station and the second station.
4. The solder strip processing apparatus of claim 1, wherein the third carrier further comprises a conveyor belt, the first carrier and the second carrier are disposed on the conveyor belt, and the conveyor belt is configured to drive the first carrier and the second carrier to switch positions on the first station and the second station.
5. The welding strip processing apparatus as defined in any one of claims 1 to 4, wherein said bending mechanism includes a press head that is pressed down to cooperate with a first carriage or a second carriage located at said second station to bend said welding strip;
the first bearing table and the second bearing table are respectively provided with a bearing surface for bearing the welding strip, step surfaces arranged along the extending direction of the welding strip are formed on the bearing surfaces, pressing surfaces corresponding to the step surfaces are formed on the pressing head, and the pressing surfaces and the bearing surfaces are matched with each other to bend the welding strip.
6. The solder strip processing apparatus of claim 1, wherein the solder strip processing apparatus comprises a fourth carrier member disposed at the first station, the bending mechanism carrying solder strips on the fourth carrier member and bending the solder strips at the second station.
7. A method of processing a solder ribbon, characterized in that the solder ribbon processing apparatus according to any one of claims 1 to 6 is used, the method comprising:
drawing a welding strip to be cut to a first station, and cutting the welding strip to obtain an ith welding strip, wherein i is larger than 1;
transferring the ith assembly welding strip to a second station, bending the ith assembly welding strip at the second station, and transferring the ith assembly welding strip to a third station corresponding to the next procedure after bending is completed;
after the ith assembly welding strip is transferred to a second station, the welding strip to be cut is pulled to the first station, and the welding strip is cut to obtain an (i+1) th assembly welding strip;
transferring the i+1th assembly welding strip to the second station, bending the i+1th assembly welding strip at the second station, and carrying the i+1th assembly welding strip to the third station after bending is completed;
and setting i as i+2, and continuing to execute the steps of pulling the welding strip to be cut to the first station, cutting the welding strip and obtaining the ith assembly welding strip.
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| CN201810303679.XA CN110349860B (en) | 2018-04-03 | 2018-04-03 | Welding strip processing device and welding strip processing method |
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| CN201810303679.XA CN110349860B (en) | 2018-04-03 | 2018-04-03 | Welding strip processing device and welding strip processing method |
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| JP3184983U (en) * | 2012-06-08 | 2013-07-25 | シーエスアイ セルズ カンパニー リミテッド | Back contact solar cell module |
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