CN110323201B - 柔性线路板与覆晶薄膜封装结构 - Google Patents

柔性线路板与覆晶薄膜封装结构 Download PDF

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CN110323201B
CN110323201B CN201910388005.9A CN201910388005A CN110323201B CN 110323201 B CN110323201 B CN 110323201B CN 201910388005 A CN201910388005 A CN 201910388005A CN 110323201 B CN110323201 B CN 110323201B
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蔡文娟
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Chipmore Technology Corp Ltd
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract

本发明提供了一种柔性线路板与覆晶薄膜封装结构，所述柔性线路板包括基板、形成于所述基板表面的金属线路层。所述金属线路层包括位于所述基板一侧表面的线路主体、位于所述基板另一侧表面且用以连接相应芯片的若干内引脚，所述基板开设有对应于所述内引脚的通孔，所述内引脚贯穿所述通孔以与所述线路主体相连通。所述覆晶薄膜封装结构包括连接设置在所述柔性线路板上的芯片，所述芯片具有若干与所述内引脚相接合的金属凸块。本发明柔性线路板将连接芯片的内引脚设置在所述基板相对所述线路主体的另一侧，减小内引脚与外物接触造成电性短路及外观不良的风险，并且减少芯片封装体积，利于器件的集成化与小型化。

Description

柔性线路板与覆晶薄膜封装结构
技术领域
本发明涉及电子封装技术领域，尤其涉及一种柔性线路板与覆晶薄膜封装结构。
背景技术
覆晶薄膜封装(Chip On Film，COF)是将柔性线路板作为芯片载体,并将将芯片的凸块(Bump)与柔性线路板的上的内引脚进行接合(Bonding)的技术。其具有结构紧凑、性能高、引线短等优点，能够更好地满足芯片封装结构小型化需求，提高芯片集成度；还具有轻薄、可挠曲(Flexible)的特点，是封装方式所无法达成的。随着半导体业的迅速发展，覆晶薄膜封装技术也得到业内越来越多的重视。
现有的柔性线路板多包括基板、设置在基板上并与芯片电性连接的金属线路层。实际制作过程中，上述金属线路层多通过化学药剂蚀刻或电镀等方法成型在所述基板的一侧表面，且所述金属线路层背离基板的一侧还会覆盖设置保护层，以避免裸露的金属线路层氧化及断裂。所述保护层需开设对应于金属线路层的内引脚、外引脚位置的开窗区域，以与相应的芯片及外部电路相连接。然受限于工艺精度与制程能力，上述内引脚位置对应的开窗面积远远大于内引脚与芯片的Bump实际结合区域的面积。这使得后续封装制程中内引脚与外物接触的风险大大增加，经常发生电性功能异常和外观不良导致产品报废。一般地，完成芯片Bonding后，均采用绝缘填充物(Resin)将裸露的内引脚进行包覆与填充，开窗区域越大，所需的填充物越多，固化的区域面积越大，芯片的整体封装尺寸随之也就越大。
鉴于此，有必要提供一种新的柔性线路板与覆晶薄膜封装结构。
发明内容
本发明的目的在于提供一种柔性线路板与覆晶薄膜封装结构，能够降低金属线路层的内引脚与外物接触造成电性短路及外观不良的风险，且利于减小芯片的封装体积。
为实现上述发明目的，本发明提供了一种柔性线路板，包括基板、形成于所述基板表面的金属线路层，所述金属线路层包括位于所述基板一侧表面的线路主体、位于所述基板另一侧表面且用以连接相应芯片的若干内引脚，所述基板开设有对应于所述内引脚的通孔，所述内引脚贯穿所述通孔以与所述线路主体相连通。
作为本发明的进一步改进，所述柔性线路板还包括设置在所述线路主体背离所述基板一侧的保护层。
作为本发明的进一步改进，所述线路主体还具有向外延伸超出所述保护层的若干外引脚。
作为本发明的进一步改进，所述基板另一侧表面还设有至少一处对位标记。
作为本发明的进一步改进，所述金属线路层主要由金属铜或铜合金制得。
本发明还提供一种覆晶薄膜封装结构，包括芯片及如前所述的柔性线路板，所述芯片具有若干与所述内引脚相接合的金属凸块。
作为本发明的进一步改进，所述金属凸块设置在所述芯片朝向所述基板的一侧表面，且所述金属凸块沿垂直于所述基板的方向延伸并与所述内引脚相接。
作为本发明的进一步改进，所述金属凸块在与该金属凸块的延伸方向相垂直的平面上的投影呈圆形、椭圆形或长条形。
作为本发明的进一步改进，所述覆晶薄膜封装结构还包括密封层，所述密封层填充在所述金属凸块与内引脚的周围，以将所述金属凸块与内引脚与外部隔绝。
本发明的有益效果是：采用本发明柔性线路板与覆晶薄膜封装结构，通过在基板上开设通孔，并将所述内引脚设置在线路主体的另一侧，能够减小内引脚向外暴露的尺寸，降低其与外物接触造成电性短路及外观不良的风险。覆晶薄膜封装结构中的芯片封装体积亦得以缩减，有利于芯片的小型化与集成化的设计封装。
附图说明
图1是现有覆晶薄膜封装结构的结构示意图；
图2是本发明柔性线路板的结构示意图；
图3是本发明覆晶薄膜封装结构的结构示意图。
具体实施方式
以下将结合附图所示的实施方式对本发明进行详细描述。但该实施方式并不限制本发明，本领域的普通技术人员根据该实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
参图1所示，现有的柔性线路板通常包括基板101、设置在基板101一侧表面的金属线路层102及覆设于该金属线路层102背离所述基板101一侧的保护层103。相应的覆晶薄膜封装结构还包括安装在该柔性线路板既定区域的芯片104，所述保护层103形成有开窗区域，所述金属线路层102具有延伸设置在所述开窗区域并与所述芯片104相连接的内引脚。上述覆晶薄膜封装结构还包括密封层105，所述密封层105填设在所述芯片104的周侧并完全覆盖所述开窗区域。
限于工艺水准与加工精度，上述开窗区域会超出所述芯片104的实际安装尺寸，在将芯片连接至柔性线路板上之后，需要在所述芯片104与柔性线路板之间及所述芯片104的周边填设密封层105，上述密封层105设置区域较大，增加芯片104的封装尺寸，还增加密封层105材料需求的增加。
参图2与图3所示，本发明提供的一种柔性线路板100及采用该柔性线路板100的覆晶薄膜封装结构200。
所述柔性线路板100包括基板10、形成于所述基板10表面的金属线路层20，所述金属线路层20包括位于所述基板10一侧表面的线路主体21、位于所述基板10另一侧表面的若干内引脚22。
所述基板10设置为挠性绝缘薄膜，此处可采用聚酰亚胺(PI)薄膜；所述金属线路层20主要由金属铜或铜合金制得，具体可通过化学蚀刻、电镀等方式进行制备。当然，根据实际产品设计需求，所述金属线路层20也可以采用金或其它导电性能良好的金属制得。所述基板10的具体形状可根据产品与制程需求进行设计，如可将所述基板10设置呈矩形。所述基板10开设有若干对应于所述内引脚22的通孔11，所述内引脚22贯穿所述通孔11以与所述线路主体21相连通。优选地，所述通孔11与相应的内引脚22一一对应，所述通孔11可采用激光或其它方式予以加工得到。
所述柔性线路板100还包括设置在所述线路主体21背离所述基板10一侧的保护层30。所述保护层30一般由防水、耐腐蚀的防潮漆制得，以保护所述线路主体21免受侵蚀，提高该柔性线路板100的可靠性和电气稳定性，所述防潮漆的颜色还可根据不同的产品规格进行选取。此处，由于将金属线路层20的内引脚22设置在基板10的另一侧，所述保护层30可设置呈一整片，无需开窗，可对所述线路主体21形成更有效的防护。
一般地，所述线路主体21还具有向外延伸超出所述保护层30的若干外引脚211，若干所述外引脚211可沿所述基板10的侧边排布。换言之，所述保护层30的设置区域优选为小于所述基板10，其在对所述线路主体21实现遮蔽保护的同时，还不影响该柔性线路板100与外部的电性连接。实际制程中，所述基板10另一侧表面还可设置至少一处对位标记(未图示)，以便于所述通孔11的加工及后续封装。
所述覆晶薄膜封装结构200还包括安装在所述柔性线路板100上的芯片40，此处，同一所述柔性线路板100上可集成安装复数个相同或不同规格的芯片40。所述芯片40具有若干与所述内引脚22相接合的金属凸块41，所述金属凸块41设置在所述芯片40朝向所述基板10的一侧表面，且所述金属凸块41沿垂直于所述基板10的方向延伸并与所述内引脚22相接。优选地，所述金属凸块41沿背离所述芯片40的方向的设置高度相一致，以利于该芯片40的封装加工。
所述金属凸块41可选用金、铜、镍等导电性能良好的金属或合金制得。为实现所述金属凸块41与内引脚22的稳定连接，通常可在所述内引脚的表面设置一焊料层，所述焊料层主要可选用锡或含锡合金。可以想见地，在本发明其它实施方式中，所述焊料层亦可设置在所述金属凸块41背离相应芯片40的末端。当然，此处对所述金属凸块41的制备材料的描述仅为更完整地描述本发明的具体方案，而不应理解为对本发明实施方式的限制。
所述金属凸块41的规格与相应所述内引脚22的宽度需相匹配，以便于两者的连接。所述金属凸块41在与该金属凸块41的延伸方向相垂直的平面上的投影通常设置呈圆形，而随着业界对金属凸块41的电性导通与信息传输性能等方面要求的提高，所述金属凸块41沿垂直其延伸方向的截面亦可设置呈椭圆形或长条形。实际制备过程中，所述芯片40表面通常还对应所述金属凸块41制备有相应的衬底金属层，此处不再赘述。
所述覆晶薄膜封装结构200还包括密封层50，所述密封层50填充在所述金属凸块41与内引脚22的周围，以将所述金属凸块41与内引脚22与外部隔绝。所述密封层50通常采用绝缘性能良好且具有较好的防水、防侵蚀性能的树脂材料，且所述密封层50优选完全填充所述芯片40与基板10之间空隙，以对所述芯片40形成更好的保护与支撑，增强所述覆晶薄膜封装结构200的强度。
相较于现有技术，所述芯片40及内引脚22设置在所述基板10背离线路主体21的另一侧，所述保护层30无需开窗，其能够对所述线路主体21形成更好的防护；
所述金属线路层20的内引脚22设置尺寸能够减小，降低其与外物接触造成电性短路及外观不良的风险；
所述密封层50的尺寸予以大幅度减小，降低材料用量，减小所述基板10的固化区域面积，即有效缩减所述芯片40的实际封装体积，有利于芯片的小型化与集成化的设计封装。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (7)

1.一种柔性线路板，包括基板、形成于所述基板表面的金属线路层，其特征在于：所述金属线路层包括位于所述基板一侧表面的线路主体、位于所述基板另一侧表面且用以连接相应芯片的若干内引脚，所述基板开设有对应于所述内引脚的通孔，所述内引脚贯穿所述通孔以与所述线路主体相连通，且所述通孔与内引脚一一对应；所述柔性线路板还包括设置在所述线路主体背离所述基板一侧的保护层，所述保护层设置呈一整片，且所述保护层的设置区域小于所述基板；所述线路主体具有向外延伸超出所述保护层的若干外引脚，若干所述外引脚沿所述基板的侧边排布。
2.根据权利要求1所述的柔性线路板，其特征在于：所述基板另一侧表面还设有至少一处对位标记。
3.根据权利要求1所述的柔性线路板，其特征在于：所述金属线路层主要由金属铜或铜合金制得。
4.一种覆晶薄膜封装结构，其特征在于：所述覆晶薄膜封装结构包括芯片及如权利要求1-3任一项所述的柔性线路板，所述芯片具有若干与所述内引脚相接合的金属凸块。
5.根据权利要求4所述的覆晶薄膜封装结构，其特征在于：所述金属凸块设置在所述芯片朝向所述基板的一侧表面，且所述金属凸块沿垂直于所述基板的方向延伸并与所述内引脚相接。
6.根据权利要求4所述的覆晶薄膜封装结构，其特征在于：所述金属凸块在与该金属凸块的延伸方向相垂直的平面上的投影呈圆形、椭圆形或长条形。
7.根据权利要求4所述的覆晶薄膜封装结构，其特征在于：所述覆晶薄膜封装结构还包括密封层，所述密封层填充在所述金属凸块与内引脚的周围，以将所述金属凸块与内引脚与外部隔绝。
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