CN110323164A - 一种硅片清洗装置及硅片清洗方法 - Google Patents
一种硅片清洗装置及硅片清洗方法 Download PDFInfo
- Publication number
- CN110323164A CN110323164A CN201910604084.2A CN201910604084A CN110323164A CN 110323164 A CN110323164 A CN 110323164A CN 201910604084 A CN201910604084 A CN 201910604084A CN 110323164 A CN110323164 A CN 110323164A
- Authority
- CN
- China
- Prior art keywords
- dipper
- electrode plate
- silicon chip
- silicon wafer
- overflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910604084.2A CN110323164B (zh) | 2019-07-05 | 2019-07-05 | 一种硅片清洗装置及硅片清洗方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910604084.2A CN110323164B (zh) | 2019-07-05 | 2019-07-05 | 一种硅片清洗装置及硅片清洗方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110323164A true CN110323164A (zh) | 2019-10-11 |
CN110323164B CN110323164B (zh) | 2022-03-18 |
Family
ID=68122926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910604084.2A Active CN110323164B (zh) | 2019-07-05 | 2019-07-05 | 一种硅片清洗装置及硅片清洗方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110323164B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112058774A (zh) * | 2020-08-24 | 2020-12-11 | 台州市老林装饰有限公司 | 一种湿法刻蚀清洗机构的溢流槽结构 |
CN112349629A (zh) * | 2020-10-30 | 2021-02-09 | 北京北方华创微电子装备有限公司 | 清洗槽组件和半导体清洗设备 |
CN113426752A (zh) * | 2021-06-28 | 2021-09-24 | 北京七星华创集成电路装备有限公司 | 掩膜板的清洗设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120266913A1 (en) * | 2009-01-08 | 2012-10-25 | Micron Technology, Inc. | Methods Of Removing Particles From Over Semiconductor Substrates |
CN103364478A (zh) * | 2012-03-27 | 2013-10-23 | 大日本网屏制造株式会社 | 基板处理装置 |
CN103681414A (zh) * | 2012-09-20 | 2014-03-26 | 株式会社东芝 | 处理装置、制造处理液体的方法和制造电子器件的方法 |
CN103721968A (zh) * | 2012-10-15 | 2014-04-16 | 江苏天宇光伏科技有限公司 | 一种提高电池转换效率的制绒清洗方法 |
US20180264526A1 (en) * | 2017-03-14 | 2018-09-20 | Lg Electronics Inc. | Device for cleaning surface using electrowetting element and method for controlling the same |
CN109326505A (zh) * | 2018-08-27 | 2019-02-12 | 上海申和热磁电子有限公司 | 一种提高硅片最终清洗金属程度的方法及装置 |
-
2019
- 2019-07-05 CN CN201910604084.2A patent/CN110323164B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120266913A1 (en) * | 2009-01-08 | 2012-10-25 | Micron Technology, Inc. | Methods Of Removing Particles From Over Semiconductor Substrates |
CN103364478A (zh) * | 2012-03-27 | 2013-10-23 | 大日本网屏制造株式会社 | 基板处理装置 |
CN103681414A (zh) * | 2012-09-20 | 2014-03-26 | 株式会社东芝 | 处理装置、制造处理液体的方法和制造电子器件的方法 |
CN103721968A (zh) * | 2012-10-15 | 2014-04-16 | 江苏天宇光伏科技有限公司 | 一种提高电池转换效率的制绒清洗方法 |
US20180264526A1 (en) * | 2017-03-14 | 2018-09-20 | Lg Electronics Inc. | Device for cleaning surface using electrowetting element and method for controlling the same |
CN109326505A (zh) * | 2018-08-27 | 2019-02-12 | 上海申和热磁电子有限公司 | 一种提高硅片最终清洗金属程度的方法及装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112058774A (zh) * | 2020-08-24 | 2020-12-11 | 台州市老林装饰有限公司 | 一种湿法刻蚀清洗机构的溢流槽结构 |
CN112349629A (zh) * | 2020-10-30 | 2021-02-09 | 北京北方华创微电子装备有限公司 | 清洗槽组件和半导体清洗设备 |
CN112349629B (zh) * | 2020-10-30 | 2023-12-22 | 北京北方华创微电子装备有限公司 | 清洗槽组件和半导体清洗设备 |
CN113426752A (zh) * | 2021-06-28 | 2021-09-24 | 北京七星华创集成电路装备有限公司 | 掩膜板的清洗设备 |
Also Published As
Publication number | Publication date |
---|---|
CN110323164B (zh) | 2022-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110323164A (zh) | 一种硅片清洗装置及硅片清洗方法 | |
CN101879520B (zh) | 修复重金属污染土壤的两级泡沫分离设备 | |
CN210805721U (zh) | 一种集清洗及烘干于一体的基片清理设备 | |
CN213942990U (zh) | 污染土壤修复用搅拌装置 | |
TW201725287A (zh) | 半導體裝置之製造裝置及製造方法 | |
US20200368736A1 (en) | System and method for restoring kinetic properties of resin | |
US9308542B2 (en) | Treatment solution supply apparatus, treatment solution supply method, and computer storage medium | |
CN207326708U (zh) | 一种高效率的软抛机 | |
CN206779150U (zh) | 一种可互换电极的电解槽 | |
CN102126772B (zh) | 一种电吸附除盐再生系统及再生方法 | |
CN111112221A (zh) | 一种工件储存运输装置 | |
TW200536643A (en) | Electrolytic processing apparatus | |
JP2001046991A (ja) | ガラス基板の洗浄方法 | |
CN109908641A (zh) | 电解液离线精过滤装置 | |
CN205353500U (zh) | 一种液晶面板清洗装置 | |
CN211700203U (zh) | 一种半导体抛光片清洗设备 | |
CN208964702U (zh) | 一种电镀废水回收利用装置 | |
KR101594703B1 (ko) | 웨이퍼 세정장치 | |
CN210676158U (zh) | 清洗槽及修整器清洗系统 | |
CN210676159U (zh) | 清洗槽及修整器清洗系统 | |
JPH10223590A (ja) | 基板洗浄装置および基板洗浄方法 | |
CN219425200U (zh) | 一种蓝宝石衬底片自动刷洗装置 | |
CN217750931U (zh) | 一种金属加工研磨抛光设备的加工平台 | |
CN212461610U (zh) | 一种钙钛矿太阳能电池生产用硅片表面酸洗装置 | |
CN210711134U (zh) | 一种海绵铁新型材料处理微污染河水的处理系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211014 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |