CN110299377B - 显示基板及制造方法、显示装置 - Google Patents

显示基板及制造方法、显示装置 Download PDF

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Publication number
CN110299377B
CN110299377B CN201910595839.7A CN201910595839A CN110299377B CN 110299377 B CN110299377 B CN 110299377B CN 201910595839 A CN201910595839 A CN 201910595839A CN 110299377 B CN110299377 B CN 110299377B
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photoresist
substrate
display substrate
driving circuit
circuit layer
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CN110299377A (zh
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麦轩伟
黄华
李树磊
房松
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US16/913,435 priority patent/US20210005632A1/en
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

本发明提供一种显示基板及制造方法、显示装置，属于显示技术领域，其可至少部分解决现有的显示基板在转移微发光二极管之前表面平整度不高的问题。本发明的显示基板包括基底、设置在所述基底上的驱动电路层、设置在所述驱动电路层背向所述基底一侧且与所述驱动电路层内的电极电连接的多个绑定衬垫，所述多个绑定衬垫彼此之间的间隙填充光刻胶，且所述多个绑定衬垫的背向所述基底的表面与所述光刻胶背向所述基底的表面共面。

Description

显示基板及制造方法、显示装置
技术领域
本发明属于显示技术领域，具体涉及一种显示基板、一种显示基板的制造方法、一种显示装置。
背景技术
微发光二极管(Micro LED或Mini LED)可通过转移的工艺从生长基板上转移至制作有驱动电路的显示基板上。通常，一次转移工艺所转移的微发光二极管的数量是非常大的，这对显示基板的上表面的平整度的要求非常高。如何提高转移工艺前显示基板的平整度，称为本领域技术人员亟待解决的技术问题。
发明内容
本发明至少部分解决现有的显示基板在转移工艺之前的平整度不高的问题，提供一种显示基板、一种显示基板的制造方法、一种显示装置。
解决本发明技术问题所采用的技术方案是一种显示基板，包括基底、设置在所述基底上的驱动电路层、设置在所述驱动电路层背向所述基底一侧且与所述驱动电路层内的电极电连接的多个绑定衬垫，所述多个绑定衬垫彼此之间的间隙填充光刻胶，且所述多个绑定衬垫的背向所述基底的表面与所述光刻胶背向所述基底的表面共面。
可选地，所述光刻胶的背向所述基底的表面的高度公差d1在
±1um以内。
可选地，所述驱动电路层的背向所述基底的表面的高度公差为d2，所述光刻胶的厚度D满足：|2.5*d2|≤D≤|4*d2|。
可选地，还包括固定在所述绑定衬垫上的微发光二极管。
解决本发明技术问题所采用的技术方案是一种显示基板的制造方法，包括：在基底上形成驱动电路层，其中暴露至少部分电极；涂布一层光刻胶，并对所述光刻胶进行流平；对所述光刻胶进行曝光和显影，以形成暴露所述电极的过孔；在所述过孔内形成与所述光刻胶共面的绑定衬垫。
可选地，所述对所述光刻胶进行流平包括：对所述光刻胶静置、超声波震荡、加温等任一项处理。
可选地，所述在所述过孔内形成与所述光刻胶共面的绑定衬垫包括：采用电镀工艺在所述过孔内生长所述绑定衬垫，其中，控制电流和/或时间参数以使所述绑定衬垫与所述光刻胶共面。
可选地，所述形成与所述光刻胶共面的绑定衬垫包括：形成填满并超出所述过孔的绑定衬垫；对所述绑定衬垫进行磨平以使所述绑定衬垫与所述光刻胶共面。
可选地，所述在所述过孔内形成与所述光刻胶共面的绑定衬垫之后，还包括：向所述绑定衬垫转移微发光二极管。
解决本发明技术问题所采用的技术方案是一种显示装置，包括根据上述的显示基板。
附图说明
图1为本发明的实施例的一种显示基板的结构示意图；
图2为本发明的实施例的另一种显示基板的结构示意图；
图3为本发明的实施例的一种显示基板的制造方法的流程图；
图4a-图4c为本发明的实施例的显示基板在制造的不同阶段的结构示意图；
其中，附图标记为：10、基底；11、驱动电路层；110、电极；
12、光刻胶；13、绑定衬垫；21、微发光二极管。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1：
参见图1和图2，本实施例提供一种显示基板，包括基底10、设置在基底10上的驱动电路层11、设置在驱动电路层11背向基底10一侧且与驱动电路层11内的电极110电连接的多个绑定衬垫13，多个绑定衬垫13彼此之间的间隙填充光刻胶12，且多个绑定衬垫13的背向基底10的表面与光刻胶12背向基底10的表面共面。
基底10材料例如是玻璃。驱动电路层11中设置有栅线(未示出)、数据线(未示出)等信号线，当然还设置有驱动晶体管(未示出)等，用于向绑定衬垫13提供驱动电压。当然，驱动电路层11的上表面还包括绝缘材料。驱动电路层11内的结构可与现有的液晶显示基板、OLED显示基板中的类似，不做赘述。这里的电极110可以是驱动晶体管的一极，当然也可能是某条信号线中的一段线路兼作为电极110。绑定衬垫13用于将微发光二极管21的阴极或阳极与对应的电极110实现电连接，当然绑定衬垫13还用于固定微发光二极管21。绑定衬垫13的材料例如是Cu、Al、Ag、Au、In等。
由于光刻胶12的平整度可以控制地比驱动电路层11的平整度高，且通过现有的绑定衬垫13的制造工艺能够实现绑定衬垫13与光刻胶12共面，如此，在转移微发光二极管21时，显示基板的上表面的平整度得到了极大的提升，从而提高了微发光二极管21转移的良率。
可选地，光刻胶12的背向基底10的表面的高度公差d1(图中未标示)在±1um以内。当然，光刻胶12的背向基底10的表面越平整越好，上述公差范围对于多数转移设备而言是足够的。
可选地，结合图4b，驱动电路层11的背向基底10的表面的高度公差为d2，光刻胶12的厚度D满足：|2.5*d2|≤D≤|4*d2|。光刻胶12过薄，则对驱动电路层11表面不平整的填平效果不明显。光刻胶12过厚则会增加光刻胶12以及后续绑定衬垫13的材料成本以及增加工艺耗时。上述厚度范围为相对合适的范围。
可选地，如图2所示，还包括固定在绑定衬垫13上的微发光二极管21。具体地，图2示出的是两个横向微发光二极管21。
实施例2：
参见图3，本实施例提供一种显示基板的制造方法，包括以下步骤。该制造方法用以制造实施例1的显示基板，具体细节可相互参照。
步骤S1、在基底10上形成驱动电路层11，其中暴露至少部分电极110。该步骤完成后的产品形态参见图4a。
步骤S2、涂布一层光刻胶12，并对光刻胶12进行流平。
例如采用中文狭缝涂布(Slit Die)、画胶涂布(dispensing)、喷胶涂布(spraying)、旋涂(Spin Coating)、丝网印刷(Screen Printing)等工艺在驱动电路层11上涂布一层光刻胶12。
具体地，可对光刻胶12进行静置、超声波震荡、加温等任一项处理。
步骤S3、对光刻胶12进行曝光和显影，以形成暴露电极110的过孔。该步骤完成后的产品形态参见图4b。
步骤S4、在过孔内形成与光刻胶12共面的绑定衬垫13。当然，需要控制绑定衬垫13的上表面与光刻胶12的上表面尽量平齐。
一种控制绑定衬垫13的上表面与光刻胶12的上表面的实施方式为：采用电镀工艺在过孔内生长绑定衬垫13，其中，控制电流和/或时间参数以使绑定衬垫13与光刻胶12共面。
另一种控制绑定衬垫13的上表面与光刻胶12的上表面的实施方式为：形成填满并超出过孔的绑定衬垫13；对绑定衬垫13进行磨平以使绑定衬垫13与光刻胶12共面。当然，为减少磨平的工作量，优选采用电镀的工艺生长绑定衬垫13。
可选地，在过孔内形成与光刻胶12共面的绑定衬垫13之后，还包括步骤S5、向绑定衬垫13转移微发光二极管21。在将生长基板(未示出)上的微发光二极管21转移至显示基板时，由于此时绑定衬垫13的平整度得到极大提升，转移的良率也会得到提升。
实施例3：
本实施例提供一种显示装置，包括根据上述的显示基板。具体的，该显示装置可为微发光二极管(Micro-LED或者Mini-LED)显示面板、微发光二极管显示模组、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

1.一种显示基板，包括基底、设置在所述基底上的驱动电路层、设置在所述驱动电路层背向所述基底一侧且与所述驱动电路层内的电极电连接的多个绑定衬垫；所述显示基板包括远离基底一侧的第一表面；其特征在于，所述基底是玻璃，所述多个绑定衬垫彼此之间的间隙填充光刻胶，所述光刻胶用于平整所述显示基板的第一表面，且所述多个绑定衬垫的背向所述基底的表面与所述光刻胶背向所述基底的表面共面。
2.根据权利要求1所述的显示基板，其特征在于，所述光刻胶的背向所述基底的表面的高度公差d1在±1um以内。
3.根据权利要求1所述的显示基板，其特征在于，所述驱动电路层的背向所述基底的表面的高度公差为d2，所述光刻胶的厚度D满足：|2.5*d2|≤D≤|4*d2|。
4.根据权利要求1所述的显示基板，其特征在于，还包括固定在所述绑定衬垫上的微发光二极管。
5.一种如权利要求1所述的显示基板的制造方法，其特征在于，包括：
在基底上形成驱动电路层，其中暴露至少部分电极；
涂布一层光刻胶，并对所述光刻胶进行流平；
对所述光刻胶进行曝光和显影，以形成暴露所述电极的过孔；
在所述过孔内形成与所述光刻胶共面的绑定衬垫。
6.根据权利要求5所述的制造方法，其特征在于，所述对所述光刻胶进行流平包括：对所述光刻胶静置、超声波震荡、加温任一项处理。
7.根据权利要求5所述的制造方法，其特征在于，所述在所述过孔内形成与所述光刻胶共面的绑定衬垫包括：采用电镀工艺在所述过孔内生长所述绑定衬垫，其中，控制电流和/或时间参数以使所述绑定衬垫与所述光刻胶共面。
8.根据权利要求5所述的制造方法，其特征在于，所述形成与所述光刻胶共面的绑定衬垫包括：形成填满并超出所述过孔的绑定衬垫；对所述绑定衬垫进行磨平以使所述绑定衬垫与所述光刻胶共面。
9.根据权利要求5所述的制造方法，其特征在于，所述在所述过孔内形成与所述光刻胶共面的绑定衬垫之后，还包括：
向所述绑定衬垫转移微发光二极管。
10.一种显示装置，其特征在于，包括根据权利要求1-4任意一项所述的显示基板。
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