CN110293481A - 一种研磨设备和研磨设备的清洁方法 - Google Patents
一种研磨设备和研磨设备的清洁方法 Download PDFInfo
- Publication number
- CN110293481A CN110293481A CN201910560878.3A CN201910560878A CN110293481A CN 110293481 A CN110293481 A CN 110293481A CN 201910560878 A CN201910560878 A CN 201910560878A CN 110293481 A CN110293481 A CN 110293481A
- Authority
- CN
- China
- Prior art keywords
- lapping liquid
- supply pipe
- liquid supply
- fixed disk
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910560878.3A CN110293481B (zh) | 2019-06-26 | 2019-06-26 | 一种研磨设备和研磨设备的清洁方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910560878.3A CN110293481B (zh) | 2019-06-26 | 2019-06-26 | 一种研磨设备和研磨设备的清洁方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110293481A true CN110293481A (zh) | 2019-10-01 |
CN110293481B CN110293481B (zh) | 2021-12-24 |
Family
ID=68028980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910560878.3A Active CN110293481B (zh) | 2019-06-26 | 2019-06-26 | 一种研磨设备和研磨设备的清洁方法 |
Country Status (1)
Country | Link |
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CN (1) | CN110293481B (zh) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101362310A (zh) * | 2007-08-09 | 2009-02-11 | 富士通株式会社 | 抛光装置、基板制造方法及电子装置的制造方法 |
CN201235498Y (zh) * | 2008-07-30 | 2009-05-13 | 常州松晶电子有限公司 | 晶片双面研磨机 |
CN102264508A (zh) * | 2008-12-22 | 2011-11-30 | 彼特沃尔特斯有限公司 | 用于双面磨削加工扁平工件的设备 |
JP2012106319A (ja) * | 2010-11-18 | 2012-06-07 | Asahi Glass Co Ltd | 研磨用液供給装置及び研磨方法及びガラス基板の製造方法及びガラス基板 |
CN102580953A (zh) * | 2009-09-01 | 2012-07-18 | 中芯国际集成电路制造(上海)有限公司 | 清洗研磨液供给系统的方法 |
CN203092352U (zh) * | 2013-02-07 | 2013-07-31 | 中芯国际集成电路制造(北京)有限公司 | 一种带有自动清洗装置的化学机械抛光研磨液供应系统 |
CN105058220A (zh) * | 2015-07-28 | 2015-11-18 | 安徽格楠机械有限公司 | 一种磁悬浮动力双面研磨机及其操作方法 |
CN206140220U (zh) * | 2016-10-30 | 2017-05-03 | 云南蓝晶科技有限公司 | 四驱双面晶片磨光机 |
CN208663469U (zh) * | 2018-07-20 | 2019-03-29 | 德淮半导体有限公司 | 研磨头及化学机械研磨装置 |
CN208913880U (zh) * | 2018-10-19 | 2019-05-31 | 德淮半导体有限公司 | 研磨液过滤系统、研磨液供应系统及化学机械研磨设备 |
-
2019
- 2019-06-26 CN CN201910560878.3A patent/CN110293481B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101362310A (zh) * | 2007-08-09 | 2009-02-11 | 富士通株式会社 | 抛光装置、基板制造方法及电子装置的制造方法 |
CN201235498Y (zh) * | 2008-07-30 | 2009-05-13 | 常州松晶电子有限公司 | 晶片双面研磨机 |
CN102264508A (zh) * | 2008-12-22 | 2011-11-30 | 彼特沃尔特斯有限公司 | 用于双面磨削加工扁平工件的设备 |
CN102580953A (zh) * | 2009-09-01 | 2012-07-18 | 中芯国际集成电路制造(上海)有限公司 | 清洗研磨液供给系统的方法 |
JP2012106319A (ja) * | 2010-11-18 | 2012-06-07 | Asahi Glass Co Ltd | 研磨用液供給装置及び研磨方法及びガラス基板の製造方法及びガラス基板 |
CN203092352U (zh) * | 2013-02-07 | 2013-07-31 | 中芯国际集成电路制造(北京)有限公司 | 一种带有自动清洗装置的化学机械抛光研磨液供应系统 |
CN105058220A (zh) * | 2015-07-28 | 2015-11-18 | 安徽格楠机械有限公司 | 一种磁悬浮动力双面研磨机及其操作方法 |
CN206140220U (zh) * | 2016-10-30 | 2017-05-03 | 云南蓝晶科技有限公司 | 四驱双面晶片磨光机 |
CN208663469U (zh) * | 2018-07-20 | 2019-03-29 | 德淮半导体有限公司 | 研磨头及化学机械研磨装置 |
CN208913880U (zh) * | 2018-10-19 | 2019-05-31 | 德淮半导体有限公司 | 研磨液过滤系统、研磨液供应系统及化学机械研磨设备 |
Also Published As
Publication number | Publication date |
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CN110293481B (zh) | 2021-12-24 |
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Effective date of registration: 20210928 Address after: 710065 1-3-068, No. 1888, Xifeng South Road, high tech Zone, Xi'an City, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20211011 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710065 room 1323, block a, city gate, No. 1, Jinye Road, high tech Zone, Xi'an, Shaanxi Province Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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GR01 | Patent grant | ||
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |