CN201046545Y - 研磨液清洗装置 - Google Patents
研磨液清洗装置 Download PDFInfo
- Publication number
- CN201046545Y CN201046545Y CNU200720069510XU CN200720069510U CN201046545Y CN 201046545 Y CN201046545 Y CN 201046545Y CN U200720069510X U CNU200720069510X U CN U200720069510XU CN 200720069510 U CN200720069510 U CN 200720069510U CN 201046545 Y CN201046545 Y CN 201046545Y
- Authority
- CN
- China
- Prior art keywords
- cleaning device
- lapping liquid
- grinding pad
- grinding
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
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Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200720069510XU CN201046545Y (zh) | 2007-04-24 | 2007-04-24 | 研磨液清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200720069510XU CN201046545Y (zh) | 2007-04-24 | 2007-04-24 | 研磨液清洗装置 |
Publications (1)
Publication Number | Publication Date |
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CN201046545Y true CN201046545Y (zh) | 2008-04-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200720069510XU Expired - Lifetime CN201046545Y (zh) | 2007-04-24 | 2007-04-24 | 研磨液清洗装置 |
Country Status (1)
Country | Link |
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CN (1) | CN201046545Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437014A (zh) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | 湿法刻蚀清洗设备 |
CN103878680A (zh) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | 降低晶圆被刮伤的方法、化学机械研磨机台及清洗器 |
-
2007
- 2007-04-24 CN CNU200720069510XU patent/CN201046545Y/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437014A (zh) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | 湿法刻蚀清洗设备 |
CN103878680A (zh) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | 降低晶圆被刮伤的方法、化学机械研磨机台及清洗器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121116 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121116 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20080416 |