CN110289341A - A kind of full-color SMD LED and its installation method increasing binding force with printed wiring board - Google Patents
A kind of full-color SMD LED and its installation method increasing binding force with printed wiring board Download PDFInfo
- Publication number
- CN110289341A CN110289341A CN201910504340.0A CN201910504340A CN110289341A CN 110289341 A CN110289341 A CN 110289341A CN 201910504340 A CN201910504340 A CN 201910504340A CN 110289341 A CN110289341 A CN 110289341A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- pad
- binding force
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009434 installation Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 11
- 238000004020 luminiscence type Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011324 bead Substances 0.000 abstract description 19
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The present invention discloses a kind of full-color SMD LED support for increasing binding force with printed wiring board, including shell, multiple power pins, it is characterized by: the shell is equipped with the pad of installation luminescence chip, the fixation pin of one with printed wiring board welding are respectively extended in the pad both ends.A pin is respectively extended at this programme bracket die bond region pad both ends, increases four plus two or six plus two pins by original four or six pins in mould group, increases the binding force between lamp bead and PCB (printed wiring board).Also, crystal bonding area pad is the main thoroughfare of luminescence chip heat dissipation, after crystal bonding area pad both ends increase the pin externally drawn, will increase the heat exchange outside luminescence chip and lamp bead, improves the rate of heat dissipation of luminescence chip.
Description
Technical field
The present invention relates to LED technology field, especially a kind of full-color SMD LED for increasing binding force with printed wiring board and
Its installation method.
Background technique
SMD LED full-color display part currently on the market is as shown in Figs 1-4, including shell 1, pin configuration are to weld
Line area extends four or six power pins 2, and 3 both ends of pad in 6 place die bond region of luminescence chip are not no pins；
Secondly, the injection molding of 1 bottom of SMD LED full-color display part shell currently on the market 5 is all concave shape inwards into pouring a little.
LED display corresponds to the splicing of difference spacing by single LED lamp bead and forms, the electricity that every LED lamp bead passes through itself
Source pin 2 is fixed with the PCB (printed wiring board) for having printed tin cream and is connected with circuit.
When LED display lease use, display module needs often assembled dismounting, so that the lamp bead of mould group edge surrounding
It is easy to be caused power pins 2 and PCB (printed wiring board) to be removed by the shock of external force in assembly dismounting, the lamp bead at edge goes out
Now dead lamp, rosin joint, fall the problems such as lamp.These problems not only have an impact to display effect, and maintenance capacity is also big.Secondly, display screen lamp
In the small-pitch situation of pearl, display screen power consumption is higher, and many display screens encounter the bad problem that radiates, and lamp body temperature is compared with Gao Qing
Under condition, luminescence chip can make emission wavelength drift about as temperature increases, and be presented as that display color is impure or partial region
Color displacement.
Small-pitch display screen is especially put, since required lamp bead size is smaller, the pin area of corresponding lamp bead
Smaller, it is smaller that this allows for the binding force of lamp bead and tin cream on PCB (printed wiring board) pad.Display screen module is due to needing
Often to dismount assembled and transport, the lamp bead of mould group edge surrounding will receive the collision of external force, and the lamp bead after being collided is held
Easily cause pin and PCB to remove, to rosin joint occur, the failure such as dead lamp, maintenance capacity is larger, to display screen after-sales service cause compared with
Big puzzlement.
Moreover, putting small-pitch display screen, the lamp bead quantity in unit area is more, the DC power of unit area
It increases accordingly.For a LED display chip, the forbidden bandwidth value of light emitting region material directly determines the luminous wavelength of device
Or color.Temperature increases, and the forbidden bandwidth of material will reduce, and causes device emission wavelength elongated.When the temperature increases, RGB
Temperature drift can occur for the dominant wavelength of three kinds of primary colours, and for red, when temperature increases 1 °, dominant wavelength will increase about 0.02-
0.03nm increases 0.03-0.05nm for green and blue, the drift of primary colours dominant wavelength by directly affect LED white balance and
Colour temperature causes the variation of image color.The variation of operating temperature also results in the drift of each primary colours chromaticity coordinates, with chromaticity coordinates
Mobile, the color saturation of each primary colours can also change, and drift about to high saturation direction, the uniformity consistency of color and true
Property be deteriorated.Therefore, the closeer display screen of point spacing typically encounters the bad bring difference screen body region colour purity of screen body heat dissipation
Inconsistent problem.
Summary of the invention
The technical problem to be solved by the present invention is there is rosin joint and the bad problem that radiates in use in full-color SMD LED.
The present invention solve the technical problem the technical solution adopted is that:
A kind of full-color SMD LED support increasing binding force with printed wiring board, including shell, multiple power pins,
Be characterized in that: the shell is equipped with the pad of installation luminescence chip, and one and printed wiring board are respectively extended in the pad both ends
The fixation pin of welding.
Be molded preferably, the shell is equipped with close to the surface of printed wiring board into pouring a little, it is described be molded into pour a little and
The surface plane height of the shell close to printed wiring board is identical.
A kind of installation method for the full-color SMD LED support increasing binding force with printed wiring board, it is characterised in that: first
First, setting welds the fixation solder joint of the fixed pin, welds the power pad of the power pins on a printed-wiring board；Its
It is secondary, pre- point silica gel is carried out with the shell bonding position on a printed-wiring board；Finally, by power pins and printed wiring board
Power pad welding, the fixation solder joint in fixed pin and printed wiring board is welded.
The beneficial effects of the present invention are:
A pin is respectively extended at this programme bracket die bond region pad both ends, by original four or six in mould group
Pin increases four plus two or six plus two pins, increases the binding force between lamp bead and PCB (printed wiring board).
Also, crystal bonding area pad is the main thoroughfare of luminescence chip heat dissipation, after crystal bonding area pad both ends increase the pin externally drawn,
It will increase the heat exchange outside luminescence chip and lamp bead, improve the rate of heat dissipation of luminescence chip.
The bottom of this programme shell be molded it is a little identical as bottom plane height into pouring, therefore in lamp bead bottom into pouring a correspondence
The position PCB can carry out pre- point silica gel.Silica gel can form solidification in Reflow Soldering excessively, on the one hand lamp can be improved in the silica gel after solidification
On the other hand the binding force of pearl and PCB can increase the heat exchange of lamp bead ontology Yu PCB (printed wiring board).
The present invention program can be applied to indoor or complete outdoor high definition, high contrast LED display.Applied to the aobvious of this programme
Display screen mould group edge lamp bead collision resistance is obviously improved, and reduces the probability of edge lamp bead failure.In addition this programme can be with
Color difference caused by improving lamp bead internal illumination chip caused by the intensive display screen poor heat radiation of point spacing since temperature raises is asked
Topic.
Detailed description of the invention
Fig. 1 is background technique scheme main view
Fig. 2 is background technique scheme rearview
Fig. 3 is background technique scheme bottom view
Fig. 4 is background technique scheme right view
Fig. 5 is main view of the embodiment of the present invention
Fig. 6 is rearview of the embodiment of the present invention
Fig. 7 is elevational schematic view of the embodiment of the present invention
Fig. 8 is right side view of the embodiment of the present invention
Fig. 9 is cut-away view of outer cover of the embodiment of the present invention
In figure: 1. shells；2. power pins；3. pad；4. fixed pin；5. being molded into pouring a little；6. luminescence chip.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
A kind of full-color SMD LED support increasing binding force with printed wiring board, including shell 1, multiple power pins 2,
It is characterized by: shell 1 is equipped with the pad 3 of installation luminescence chip, 3 both ends of pad are respectively extended one and are welded with printed wiring board
Fixation pin 4, shell 1 is equipped with close to the surface of printed wiring board to be molded into pouring a little 5, be molded into pour a little 5 and shell 1 close to print
The surface plane height of brush wiring board is identical.
A kind of installation method for the full-color SMD LED support increasing binding force with printed wiring board, steps are as follows: firstly,
The power pad 7 of the fixation solder joint 6 of pin 4, source of welding current pin 2 is welded and fixed in setting on a printed-wiring board；Secondly, printing
Pre- point silica gel is carried out on brush wiring board with 1 bonding position of shell；Finally, by power pins 2, fixed pin 4 and print on bracket
Power pad 7, fixed solder joint 6 on brush wiring board weld.
The present invention can be changed apparent to one skilled in the art for various ways, and such change is not considered as
It departs from the scope of the present invention.All such obviously modify the field technical staff are included within present claims
Within the scope of.
Claims (3)
1. a kind of full-color SMD LED support for increasing binding force with printed wiring board, including shell (1), multiple power pins
(2), it is characterised in that: the shell (1) is equipped with the pad (3) of installation luminescence chip, and pad (3) both ends respectively extend one
A fixation pin (4) with printed wiring board welding.
2. increasing the full-color SMD LED support of binding force with printed wiring board as described in claim 1, it is characterised in that: institute
It states shell (1) and is equipped with close to the surface of printed wiring board and is molded into pouring point (5), it is described to be molded into pouring point (5) and the shell (1)
Surface plane height close to printed wiring board is identical.
3. a kind of installation method for the full-color SMD LED support for increasing binding force with printed wiring board, it is characterised in that: firstly,
The power supply weldering of the fixation solder joint of the fixed pin (4), the welding power pins (2) is welded in setting on a printed-wiring board
Point；Secondly, pre- point silica gel is carried out with the shell (1) bonding position on a printed-wiring board；Finally, by power pins (2) with
Power pad welding in printed wiring board, the fixation solder joint in fixed pin (4) and printed wiring board is welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910504340.0A CN110289341A (en) | 2019-06-12 | 2019-06-12 | A kind of full-color SMD LED and its installation method increasing binding force with printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910504340.0A CN110289341A (en) | 2019-06-12 | 2019-06-12 | A kind of full-color SMD LED and its installation method increasing binding force with printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110289341A true CN110289341A (en) | 2019-09-27 |
Family
ID=68003803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910504340.0A Withdrawn CN110289341A (en) | 2019-06-12 | 2019-06-12 | A kind of full-color SMD LED and its installation method increasing binding force with printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110289341A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046141A (en) * | 2001-07-31 | 2003-02-14 | Nichia Chem Ind Ltd | Light emitting device and method of manufacturing the same |
| JP2004363537A (en) * | 2002-09-05 | 2004-12-24 | Nichia Chem Ind Ltd | Semiconductor equipment, manufacturing method therefor and optical device using the same |
| US20080041625A1 (en) * | 2006-08-16 | 2008-02-21 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| EP2437319A2 (en) * | 2010-09-30 | 2012-04-04 | Odelo GmbH | Method for producing lensed SMD light diodes |
| US20130341656A1 (en) * | 2011-03-02 | 2013-12-26 | Cree, Inc. | Miniature Surface Mount Device |
| CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
| CN209729939U (en) * | 2019-06-12 | 2019-12-03 | 浙江英特来光电科技有限公司 | A kind of full-color SMD LED increasing binding force with printed wiring board |
-
2019
- 2019-06-12 CN CN201910504340.0A patent/CN110289341A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046141A (en) * | 2001-07-31 | 2003-02-14 | Nichia Chem Ind Ltd | Light emitting device and method of manufacturing the same |
| JP2004363537A (en) * | 2002-09-05 | 2004-12-24 | Nichia Chem Ind Ltd | Semiconductor equipment, manufacturing method therefor and optical device using the same |
| US20080041625A1 (en) * | 2006-08-16 | 2008-02-21 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| EP2437319A2 (en) * | 2010-09-30 | 2012-04-04 | Odelo GmbH | Method for producing lensed SMD light diodes |
| US20130341656A1 (en) * | 2011-03-02 | 2013-12-26 | Cree, Inc. | Miniature Surface Mount Device |
| CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
| CN209729939U (en) * | 2019-06-12 | 2019-12-03 | 浙江英特来光电科技有限公司 | A kind of full-color SMD LED increasing binding force with printed wiring board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190927 |