CN110281359A - A kind of ceramics board production technology - Google Patents
A kind of ceramics board production technology Download PDFInfo
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- CN110281359A CN110281359A CN201910697240.4A CN201910697240A CN110281359A CN 110281359 A CN110281359 A CN 110281359A CN 201910697240 A CN201910697240 A CN 201910697240A CN 110281359 A CN110281359 A CN 110281359A
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- storage frame
- scrap
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- ceramic wafer
- filter screen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/003—Apparatus or processes for treating or working the shaped or preshaped articles the shaping of preshaped articles, e.g. by bending
- B28B11/005—Using heat to allow reshaping, e.g. to soften ceramic articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/04—Exhausting or laying dust
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Filtering Materials (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Abstract
The present invention relates to PCB ceramic wafer field, specifically a kind of ceramic board production technology, used ceramic wafer process units includes support frame, sealing structure, storage frame, storage organization, solenoid valve, air inlet pipe and scrap container structure；One end of solenoid valve is fixed on storage frame and is connected with scrap container structure, the other end of solenoid valve is fixed on air inlet pipe, and then the gas on-off of the inside by solenoid valve control scrap container structure, when air inlet pipe is connected with scrap container structure, make the internal negative pressure of scrap container structure, the dust on PCB ceramic wafer and storage organization is set to enter the inside of scrap container structure in turn, when the internal negative pressure of scrap container structure, reduce the contact area of PCB ceramic wafer and storage organization, and then keep the cleaning effect of scrap dust more preferable, filter screen is deformable, and then effectively prevent filter screen from blocking, and then substantially increase the storage quality of scrap.
Description
Technical field
The present invention relates to PCB ceramic wafer field, specifically a kind of ceramic board production technology.
Background technique
Ceramic substrate refers to that copper foil is bonded directly to aluminium oxide (Al2O3) or aluminium nitride (AlN) ceramic substrate at high temperature
Special process plate on surface, made ultra-thin composite substrate have good electrical insulation performance, and high thermal conductivity characteristic, excellent is soft
Soldering property and high adhesive strength, and various figures can be etched as pcb board, there is very big current-carrying capability, therefore,
Ceramic substrate has become the basic material of high-power electric and electronic circuit structure technology and interconnection technique.
However, PCB ceramic wafer is frangible, need to check circuit board after being bonded copper foil on PCB ceramic wafer, checks electricity
The integrality of road plate, and need to clear up the dust on PCB ceramic wafer, when placement detects on the table, due to PCB ceramics
Plate thickness is relatively thin, is not easy to take, and unbalance stress is easily damaged PCB ceramic wafer during detecting PCB ceramic wafer, and uses gas
Pipe clears up the dust on ceramic wafer, assembles scrap and dust indoors, and scrap and dust can be reassembled and be completed in cleaning
On ceramic wafer, and influence the health of producers.
Summary of the invention
For the problems of the prior art, the present invention provides a kind of ceramic board production technologies.
The technical solution adopted by the present invention to solve the technical problems is: a kind of ceramics board production technology, the technique include
Following steps:
S1: pure zirconia aluminium powder, SiO2, MgO, CaO powder are uniformly mixed by stir mixing device, then proceed to be added
Toluene and ethyl cellulose, obtain mixture after mixing evenly；Obtained mixture is ground by grinder, is being mixed
Abrasive lapping takes out mixture to after having viscosity, to obtain the ceramic slurry with viscosity, after grinding stirring, can make
More evenly, the ceramic wafer after preventing production is since each feed distribution unevenly causes ceramic wafer to produce for each raw material mixing in mixture
It is unqualified, while powdered crushing is carried out to each raw material, each raw material mixing uniformity can be improved, to improve ceramic wafer production
Quality；
S2: ceramic green sheet obtained in S1 is sintered by high temperature furnace, and high-temperature temperature setting is 1500 degrees Celsius
To between 1650 degrees Celsius, sintering time is ten minutes, obtains ripe of ceramics, mixture can be made to solidify by high temperature sintering, together
When high temperature sintering after the use intensity of ceramic wafer can be improved, improve ceramic wafer service life；
S3: it ten minutes later by ripe cooling two of ceramics obtained in S2, is passed through in high temperature furnace again, high temperature furnace temperature setting
Between 1300 degrees Celsius to 1400 degrees Celsius, by high temperature furnace to ceramic ripe progress warpage equating, the ceramics after volume is flat are ripe
Piece carries out size separation, by ripe, the standard compliant ceramics of size by carrying out ceramic wafer system in ceramic wafer process units after sorting
Make；It is handled by warpage equating, can get ripe good of ceramics of surface smoothness, facilitate post-processing, while saving at the later period
Reason time and the waste for avoiding raw material also help in addition, being handled by warpage equating so that the size of ripe of ceramics meets
Actual demand.
Wherein, ceramic wafer process units used in S3 include support frame, sealing structure, storage frame, storage organization,
Solenoid valve, air inlet pipe and scrap container structure；The bottom end of the storage frame of rectangular configuration is equipped with support frame as described above, the storage
The inside of frame is equipped with the storage organization for being used to support PCB ceramic wafer, and sliding between the storage organization and the storage frame
Dynamic connection；The inside of the storage frame is equipped with the scrap container structure for storing PCB ceramics plate surface scrap, and described
Storage organization and the scrap container structure contradict；The storage frame is equipped with the inside for clearing up the scrap container structure
Scrap the sealing structure；The bottom end of the storage frame, which is equipped with, to be connected in the solenoid valve of the scrap container structure,
And the solenoid valve is equipped with the air inlet pipe away from one end of the storage frame.
Specifically, the scrap container structure includes Liang Ge diversion chamber, filter screen, stomata, diversion trench and chip-removal hole, it is described
The bottom end of storage frame sets that there are two the diversion chamber for being used for water conservancy diversion, passes through multiple diversion trenches between two diversion chamber
Conducting, the diversion trench are the different semi-cylindrical structure composition of two diameters, and multiple stomatas are through the storage frame
It is connected with the diversion chamber on top, for storing the chip-removal hole of scrap through the storage organization, the receipts
Receiving the inside of frame is equipped with the filter screen for filtering scrap, the angle between the filter screen and the bottom surface of the storage frame
For acute angle, the solenoid valve is connected with a diversion chamber of bottom end.
Specifically, the sealing structure includes handle and cover board, it is sealed for the internal cavities to the storage frame
The cover board be set to the end of the filter screen, the cover board engages with the storage frame, and the handle is fixed on the lid
The side wall of plate.
Specifically, the storage organization includes storage box, rubber bumps, elastic slice, piston, drive rod, reset spring, support
Plate, block and sealing block, at least provided with six reset springs, the reset spring is led with described for the bottom end of the storage frame
Chute corresponds, and the storage frame is fixed in one end of the reset spring, and the other end of the reset spring is fixed on
The piston, the side wall of the piston are equipped with the sealing block of semi-cylindrical structure, the sealing block and the piston in
It is slidably connected between the storage frame, is slidably connected between the sealing block and the diversion trench, the length of the sealing block is small
In the half of the length of the diversion trench, the piston is equipped with the drive rod, the biography away from one end of the reset spring
It is slidably connected between lever and the filter screen, the drive rod is fixed on the storage box, institute away from one end of the piston
It states storage box and is equipped with the support plate for being used to support PCB ceramic wafer, the support plate is equipped with and is used to support PCB ceramic wafer
The rubber bumps, the tops of the rubber bumps is hemispherical dome structure, the side in the section of the bottom end of the rubber bumps
The chip-removal hole for storing scrap, the rubber are equipped with for wavy shaped configuration, between two adjacent rubber bumps
The inside of protrusion is equipped with the block of arcuate structure, and the end of the block is fixed with the elastic slice, the elastic slice with it is described
It is slidably connected between support plate, the bottom end of the elastic slice and the filter screen contradict.
Specifically, the bottom end of the storage frame is equipped with the bottom plate being detachably connected, the reset spring is supported with the bottom plate
Touching.
Beneficial effects of the present invention:
(1) a kind of ceramic board production technology of the present invention, one end of solenoid valve are fixed on storage frame and are received with scrap
Micro-nano structure conducting, the other end of solenoid valve is fixed on air inlet pipe, and then passes through the inside of solenoid valve control scrap container structure
Gas on-off make the internal negative pressure of scrap container structure when air inlet pipe is connected with scrap container structure, and then PCB is made to make pottery
Dust on porcelain plate and storage organization enters the inside of scrap container structure, and then substantially increases the cleaning matter of dust scrap
Amount.
(2) a kind of ceramic board production technology of the present invention when the internal negative pressure of scrap container structure, and then drives and deposits
Storage structure and storage frame sliding, and then so that PCB ceramic wafer is accommodated in the inside of storage frame, while reducing PCB ceramic wafer and depositing
The contact area of storage structure, and then keep the cleaning effect of scrap dust more preferable, storage organization contradicts scrap container structure, and then makes
Filter screen deformation, and then effectively prevent filter screen from blocking, when the air pressure inside of scrap container structure is identical as atmospheric pressure, deposit
Storage structure resets, and then so that PCB ceramic wafer is skidded off storage frame, while keeping the contact area of PCB ceramic wafer and storage organization bigger,
And then the quality of detection PCB ceramic wafer is substantially increased, keep taking for PCB ceramic wafer more convenient.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is process flow chart of the invention；
Fig. 2 is a kind of preferred embodiment overall structure diagram of ceramic wafer process units used herein；
Fig. 3 is the attachment structure schematic diagram of storage frame and storage organization shown in Fig. 2；
Fig. 4 is the portion A shown in Fig. 3 enlarged diagram；
Fig. 5 is the portion B shown in Fig. 3 enlarged diagram.
In figure: 1, support frame, 2, sealing structure, 21, handle, 22, cover board, 3, storage frame, 4, storage organization, 41, storage
Frame, 42, rubber bumps, 43, elastic slice, 44, piston, 45, drive rod, 46, reset spring, 47, support plate, 48, block, 49, close
Envelope block, 5, solenoid valve, 6, air inlet pipe, 7, bottom plate, 8, scrap container structure, 81, diversion chamber, 82, filter screen, 83, stomata, 84,
Diversion trench, 85, chip-removal hole.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As Figure 1-Figure 5, a kind of ceramic board production technology of the present invention, the technique the following steps are included:
S1: pure zirconia aluminium powder, SiO2, MgO, CaO powder are uniformly mixed by stir mixing device, then proceed to be added
Toluene and ethyl cellulose, obtain mixture after mixing evenly；Obtained mixture is ground by grinder, is being mixed
Abrasive lapping takes out mixture to after having viscosity, to obtain the ceramic slurry with viscosity, after grinding stirring, can make
More evenly, the ceramic wafer after preventing production is since each feed distribution unevenly causes ceramic wafer to produce for each raw material mixing in mixture
It is unqualified, while powdered crushing is carried out to each raw material, each raw material mixing uniformity can be improved, to improve ceramic wafer production
Quality；
S2: ceramic green sheet obtained in S1 is sintered by high temperature furnace, and high-temperature temperature setting is 1500 degrees Celsius
To between 1650 degrees Celsius, sintering time is ten minutes, obtains ripe of ceramics, mixture can be made to solidify by high temperature sintering, together
When high temperature sintering after the use intensity of ceramic wafer can be improved, improve ceramic wafer service life；
S3: it ten minutes later by ripe cooling two of ceramics obtained in S2, is passed through in high temperature furnace again, high temperature furnace temperature setting
Between 1300 degrees Celsius to 1400 degrees Celsius, by high temperature furnace to ceramic ripe progress warpage equating, the ceramics after volume is flat are ripe
Piece carries out size separation, by ripe, the standard compliant ceramics of size by carrying out ceramic wafer system in ceramic wafer process units after sorting
Make；It is handled by warpage equating, can get ripe good of ceramics of surface smoothness, facilitate post-processing, while saving at the later period
Reason time and the waste for avoiding raw material also help in addition, being handled by warpage equating so that the size of ripe of ceramics meets
Actual demand.
Wherein, ceramic wafer process units used in S3 includes support frame 1, sealing structure 2, storage frame 3, storage knot
Structure 4, solenoid valve 5, air inlet pipe 6 and scrap container structure 8；The bottom end of the storage frame 3 of rectangular configuration is equipped with support frame as described above
1, the inside of the storage frame 3, which is equipped with, is used to support the storage organization 4 of PCB ceramic wafer, and the storage organization 4 with it is described
It is slidably connected between storage frame 3；The inside of the storage frame 3 is equipped with the scrap for storing PCB ceramics plate surface scrap
Container structure 8, and the storage organization 4 and the scrap container structure 8 contradict；The storage frame 3 is equipped with for clearing up
State the sealing structure 2 of the scrap of the inside of scrap container structure 8；The bottom end of the storage frame 3 is equipped with conducting in described useless
Consider the solenoid valve 5 of container structure 8 to be worth doing, and the solenoid valve 5 is equipped with the air inlet pipe 6 away from one end of the storage frame 3.
Specifically, the scrap container structure 8 includes Liang Ge diversion chamber 81, filter screen 82, stomata 83, diversion trench 84 and row
Consider hole 85 to be worth doing, the bottom end of the storage frame 3 sets that there are two the diversion chamber 81 for being used for water conservancy diversion, leads between two diversion chamber 81
It crosses multiple diversion trenches 84 to be connected, the diversion trench 84 is the different semi-cylindrical structure composition of two diameters, multiple described
One diversion chamber 81 on stomata 83 through the storage frame 3 and top is connected, for storing the chip-removal hole of scrap
85 are equipped with the filter screen 82 for filtering scrap, the mistake through the storage organization 4, the inside of the storage frame 3
Angle between strainer 82 and the bottom surface of the storage frame 3 is acute angle, a diversion chamber 81 of the solenoid valve 5 and bottom end
Conducting；Angle between the filter screen 82 and the bottom surface of the storage frame 3 is acute angle, and then is convenient for scrap toward the mistake
One end of strainer 82 is assembled, and then substantially increases scrap storage efficiency and its quality.
Specifically, the sealing structure 2 include handle 21 and cover board 22, for it is described storage frame 3 internal cavities into
The cover board 22 of row sealing is set to the end of the filter screen 82, and the cover board 22 engages with the storage frame 3, the handle
21 are fixed on the side wall of the cover board 22；When the scrap on the filter screen 82 is excessive, the handle 21 is held, described in extraction
Cover board 22 clears up the scrap on the filter screen 82, and then it is more convenient to clear up the scrap on the filter screen 82.
Specifically, the storage organization 4 includes storage box 41, rubber bumps 42, elastic slice 43, piston 44, drive rod 45, answers
Position spring 46, support plate 47, block 48 and sealing block 49, the bottom end of the storage frame 3 is at least provided with six reset springs
46, the reset spring 46 is corresponded with the diversion trench 84, and the storage frame is fixed in one end of the reset spring 46
3, the other end of the reset spring 46 is fixed on the piston 44, and the side wall of the piston 44 is equipped with semi-cylindrical structure
The sealing block 49, the sealing block 49 and the piston 44 are slidably connected between the storage frame 3, the sealing block 49
It is slidably connected between the diversion trench 84, the length of the sealing block 49 is less than the half of the length of the diversion trench 84, institute
State piston 44 and be equipped with the drive rod 45 away from one end of the reset spring 46, the drive rod 45 and the filter screen 82 it
Between be slidably connected, the drive rod 45 is fixed on the storage box 41 away from one end of the piston 44, on the storage box 41
Equipped with the support plate 47 for being used to support PCB ceramic wafer, the support plate 47 is equipped with and is used to support the described of PCB ceramic wafer
Rubber bumps 42, the top of the rubber bumps 42 are hemispherical dome structure, the side in the section of the bottom end of the rubber bumps 42
The chip-removal hole 85 for storing scrap is equipped with for wavy shaped configuration, between the rubber bumps 42 of adjacent two, it is described
The inside of rubber bumps 42 is equipped with the block 48 of arcuate structure, and the end of the block 48 is fixed with the elastic slice 43, institute
It states and is slidably connected between elastic slice 43 and the support plate 47, the bottom end of the elastic slice 43 and the filter screen 82 contradict；First will
PCB ceramic wafer is placed in the rubber bumps 42, and the rubber bumps 42 are squeezed and deformed under pressure, and then make PCB
Ceramic wafer and the contact area of the rubber bumps 42 become larger, and keep the fixed effect of PCB ceramic wafer more preferable, convenient in the rubber
PCB ceramic wafer is detected in protrusion 42, while the rubber bumps 42 keep PCB ceramic wafer exposed in the storage frame 3
Outside, and then keep taking for relatively thin ceramic wafer more convenient, PCB ceramic wafer unbalance stress when detecting is avoided, PCB is caused
Ceramic wafer damage, while when the solenoid valve 5 does not work, the filter screen 82 deforms, while the filter screen 82 pulls
The elastic slice 43, the elastic slice 43 drive the block 48 to pull the rubber bumps 42, make the top surface of the rubber bumps 42
Deformation, further increases the contact area of the rubber bumps 42 and PCB ceramic wafer, and the bottom end of the rubber bumps 42 is cut
The side in face is wavy shaped configuration, and then resets convenient for the rubber bumps 42, while shakes the filter screen 82, is avoided
Scrap is assembled on the filter screen 82, causes the filter screen 82 to block, the air inlet pipe 6 is connected to vacuum pump, then
It is electrically connected between the power supply line of the solenoid valve 5 and the power supply line of vacuum pump, when vacuum pump is started to work, the solenoid valve
5 connect, and then the air of the bottom end of the piston 44 is made to pass through the solenoid valve 5 and its air inlet pipe 6, in the work of atmospheric pressure
Under, it is slidably connected between the piston 44 and its sealing block 49 and the storage frame 3, the piston 44 drives the biography
It is slidably connected between lever 45 and the storage frame 3, the drive rod 45 drives between the storage box 41 and the storage frame 3
It is slidably connected, and then the PCB ceramic wafer in the rubber bumps 42 is made to be accommodated in the inside for storing frame 3, while the branch
Fagging 47 is squeezed and deformed the elastic slice 43, the elastic slice 43 is made to contradict the block 49 and its institute close to the filter screen 82
Filter screen 82 is stated, the filter screen 82 is made to generate deformation, the block 48 contradicts the rubber bumps 42, makes the rubber bumps
42 top is hemispherical dome structure, and then reduces the contact area of PCB ceramic wafer Yu the rubber bumps 42, and then make dust
Treatment effect is more preferable, until the sealing block 49 and the storage frame 3 contradict, the diversion trench 84 is connected described in two and leads
Flow chamber 81, then the gas of the inside of the storage frame 3 enters the diversion chamber 81 by the stomata 83, and then makes the receipts
It receives the internal negative pressure of frame 3, makes the sealing performance between the cover board 22 and the storage frame 3 more preferable under condition of negative pressure, it is external
Air by the chip-removal hole 85 enter it is described storage frame 3 inside, and then formed air-flow, make air-flow will be on PCB ceramic wafer
Scrap suck it is described storage frame 3 inside, by the filter screen 82 filter, be accommodated in scrap on the filter screen 82.
Specifically, the bottom end of the storage frame 3 is equipped with the bottom plate 7 being detachably connected, the reset spring 46 and the bottom
Plate 7 contradicts；It is more convenient that the setting of the bottom plate 7 dismantles the reset spring 46 and its piston 44.
When in use, PCB ceramic wafer is placed in rubber bumps 42 first, rubber bumps 42 squeeze under pressure
Deformation, and then PCB ceramic wafer and the contact area of rubber bumps 42 is made to become larger, keep the fixed effect of PCB ceramic wafer more preferable, is convenient for
PCB ceramic wafer is detected in rubber bumps 42, while rubber bumps 42 keep PCB ceramic wafer exposed in the outer of storage frame 3
Portion, and then keep taking for relatively thin ceramic wafer more convenient, PCB ceramic wafer unbalance stress when detecting is avoided, PCB is caused to make pottery
Porcelain plate damage, while when solenoid valve 5 does not work, filter screen 82 deforms, while filter screen 82 pulls elastic slice 43, and elastic slice 43 drives
Dynamic block 48 pulls rubber bumps 42, makes the top surface deformation of rubber bumps 42, further to increase rubber bumps 42 and PCB ceramics
The contact area of plate, the side in the section of the bottom end of rubber bumps 42 is wavy shaped configuration, and then rubber bumps 42 is convenient for reset,
It simultaneously shakes filter screen 82, avoids scrap and assemble on filter screen 82, cause filter screen 82 to block, air inlet pipe 6 is connected
To vacuum pump, then it is electrically connected between the power supply line of solenoid valve 5 and the power supply line of vacuum pump, when vacuum pump is started to work,
Solenoid valve 5 is connected, and then the air of the bottom end of piston 44 is made to pass through solenoid valve 5 and its air inlet pipe 6, under atmospheric pressure,
It is slidably connected between piston 44 and its sealing block 49 and storage frame 3, piston 44 drives the company of sliding between drive rod 45 and storage frame 3
It connects, drive rod 45 drives and is slidably connected between storage box 41 and storage frame 3, and then receives the PCB ceramic wafer in rubber bumps 42
It is contained in the inside of storage frame 3, while support plate 47 is squeezed and deformed elastic slice 43 close to filter screen 82, and elastic slice 43 is made to contradict block
49 and its filter screen 82, so that filter screen 82 is generated deformation, block 48 contradicts rubber bumps 42, makes the top of rubber bumps 42 partly
Spherical structure, and then the contact area of PCB ceramic wafer Yu rubber bumps 42 is reduced, and then keep dust treatment effect more preferable, directly
It is contradicted to sealing block 49 and storage frame 3, makes the conducting of diversion trench 84 in Liang Ge diversion chamber 81, then store the gas of the inside of frame 3
Enter diversion chamber 81 through air passing hole 83, and then make the internal negative pressure for storing frame 3, cover board 22 and storage frame 3 are made under condition of negative pressure
Between sealing performance it is more preferable, external air enters the inside of storage frame 3 by chip-removal hole 85, and then forms air-flow, makes gas
The inside of scrap sucking storage frame 3 on PCB ceramic wafer is filtered by filter screen 82, scrap is made to be accommodated in filter screen 82 by stream
On；When the scrap on filter screen 82 is excessive, handle 21 is held, extracts cover board 22, the scrap on filter screen 82 is cleared up, in turn
Clear up the scrap on filter screen 82 more convenient.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the description in above embodiment and specification only illustrates the present invention
Principle, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these variation and
Improvement is both fallen in the scope of protection of present invention.The claimed scope of the invention is by appended claims and its equivalent
Object defines.
Claims (5)
1. it is a kind of ceramics board production technology, it is characterised in that: the technique the following steps are included:
S1: pure zirconia aluminium powder, SiO2, MgO, CaO powder are uniformly mixed by stir mixing device, then proceed to that toluene is added
And ethyl cellulose, mixture is obtained after mixing evenly；Obtained mixture is ground by grinder, is ground in mixture
It is milled to after viscosity, mixture is taken out, to obtain the ceramic slurry with viscosity；
S2: ceramic green sheet obtained in S1 is sintered by high temperature furnace, high-temperature temperature setting be 1500 degrees Celsius extremely
Between 1650 degrees Celsius, sintering time is ten minutes, obtains ripe of ceramics；
S3: it ten minutes later by ripe cooling two of ceramics obtained in S2, is passed through in high temperature furnace again, high temperature furnace temperature setting exists
Ripe of ceramics between 1300 degrees Celsius to 1400 degrees Celsius, by high temperature furnace to ceramic ripe progress warpage equating, after volume is flat
Size separation is carried out, by ripe, the standard compliant ceramics of size by carrying out ceramic wafer system in ceramic wafer process units after sorting
Make；
Wherein, ceramic wafer process units used in S3 includes support frame (1), sealing structure (2), storage frame (3), storage
Structure (4), solenoid valve (5), air inlet pipe (6) and scrap container structure (8)；The bottom end of the storage frame (3) of rectangular configuration is set
Having support frame as described above (1), the inside of storage frame (3) is equipped with the storage organization (4) for being used to support PCB ceramic wafer, and
It is slidably connected between the storage organization (4) and the storage frame (3)；The inside of storage frame (3) is equipped with for storing PCB
The scrap container structure (8) of ceramic plate surface scrap, and the storage organization (4) is supported with the scrap container structure (8)
Touching；Storage frame (3) is equipped with the sealing structure for clearing up the scrap of the inside of the scrap container structure (8)
(2)；The bottom end of storage frame (3), which is equipped with, to be connected in the solenoid valve (5) of the scrap container structure (8), and the electricity
Magnet valve (5) is equipped with the air inlet pipe (6) away from one end of storage frame (3).
2. a kind of ceramic board production technology according to claim 1, it is characterised in that: scrap container structure (8) packet
Kuo Liangge diversion chamber (81), filter screen (82), stomata (83), diversion trench (84) and chip-removal hole (85), the bottom of storage frame (3)
The diversion chamber (81) for being used for water conservancy diversion there are two setting is held, passes through multiple diversion trenches between two diversion chamber (81)
(84) it is connected, the diversion trench (84) is the different semi-cylindrical structure composition of two diameters, and multiple stomatas (83) are run through
A diversion chamber (81) in storage frame (3) and top is connected, and the chip-removal hole (85) for storing scrap passes through
It is through at the storage organization (4), the inside of storage frame (3) is equipped with the filter screen (82) for filtering scrap, described
Angle between filter screen (82) and the bottom surface of storage frame (3) is acute angle, described in one of the solenoid valve (5) and bottom end
Diversion chamber (81) conducting.
3. a kind of ceramic board production technology according to claim 2, it is characterised in that: the sealing structure (2) includes mentioning
Hand (21) and cover board (22), the cover board (22) for being sealed to the internal cavities for storing frame (3) are set to described
The end of filter screen (82), the cover board (22) engage with the storage frame (3), and the handle (21) is fixed on the cover board
(22) side wall.
4. a kind of ceramic board production technology according to claim 2, it is characterised in that: the storage organization (4) includes depositing
Store up frame (41), rubber bumps (42), elastic slice (43), piston (44), drive rod (45), reset spring (46), support plate (47), gear
Block (48) and sealing block (49), the bottom end of storage frame (3) is at least provided with six reset springs (46), the reset bullet
Spring (46) and the diversion trench (84) correspond, and the storage frame (3) is fixed in one end of the reset spring (46), described
The other end of reset spring (46) is fixed on the piston (44), and the side wall of the piston (44) is equipped with semi-cylindrical structure
The sealing block (49), the sealing block (49) and the piston (44) are slidably connected between the storage frame (3), described
It is slidably connected between sealing block (49) and the diversion trench (84), the length of the sealing block (49) is less than the diversion trench (84)
Length half, the piston (44) away from the reset spring (46) one end be equipped with the drive rod (45), the biography
It is slidably connected between lever (45) and the filter screen (82), the drive rod (45) is fixed away from the one end of the piston (44)
In the storage box (41), the storage box (41) is equipped with the support plate (47) for being used to support PCB ceramic wafer, the branch
Fagging (47) is equipped with the rubber bumps (42) for being used to support PCB ceramic wafer, and the top of the rubber bumps (42) is half
Spherical structure, the side in the section of the bottom end of the rubber bumps (42) are wavy shaped configuration, two adjacent rubber convex
The chip-removal hole (85) being equipped between (42) for storing scrap is played, the inside of the rubber bumps (42) is equipped with arcuate structure
The block (48), the end of the block (48) is fixed with the elastic slice (43), the elastic slice (43) and the support plate
(47) it is slidably connected between, the bottom end and the filter screen (82) of the elastic slice (43) contradict.
5. a kind of ceramic board production technology according to claim 4, it is characterised in that: the bottom end of storage frame (3) is set
There is the bottom plate (7) being detachably connected, the reset spring (46) and the bottom plate (7) contradict.
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| CN201910697240.4A CN110281359B (en) | 2019-07-30 | 2019-07-30 | Ceramic plate production process |
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|---|---|---|---|
| CN201910697240.4A CN110281359B (en) | 2019-07-30 | 2019-07-30 | Ceramic plate production process |
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| CN110281359B (en) | 2020-09-08 |
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Effective date of registration: 20200812 Address after: 362500 Dehua science and Technology Park 90, Quanzhou, Fujian Applicant after: FUJIAN DEHUA DAIYUTANG CERAMICS Co.,Ltd. Address before: 230000 Huangshan Road 628, Hefei High-tech Zone, Anhui Province Applicant before: Liu Fating |
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Denomination of invention: A production process of ceramic plate Effective date of registration: 20210629 Granted publication date: 20200908 Pledgee: Industrial Commercial Bank of China Ltd. Dehua branch Pledgor: FUJIAN DEHUA DAIYUTANG CERAMICS Co.,Ltd. Registration number: Y2021990000565 |