Background technology
Develop rapidly along with multimedia, many flat-panel screens (Flat Panel Display) technology is developed in succession, and (Liquid Crystal Display LCD), becomes the main flow of following display gradually as LCD.
In the process of making LCD, often use printed circuit board (PCB) (PWB) to assemble, between printed circuit board (PCB) and display panel, utilize integrated circuit (IC) chip (IC) to make bridge joint.Fig. 1 is existing a kind of liquid crystal flat panel display planar structure synoptic diagram.In the S of display panel 100 side adjacency printed circuit board (PCB) 110 is arranged, between the two with several integrated circuit (IC) chip 130 bridge joints.Same, in the G of display panel 100 side adjacency printed circuit board (PCB) 120 is arranged, and use chip 140 bridge joints.Generally speaking, must use ACF film (Anisotropically conductive film) integrated circuit (IC) chip could be fixed on the printed circuit board (PCB).
The ACF film utilizes conducting particles to connect the IC chip and makes it to become conducting with printed circuit board (PCB) electrode between the two, can avoid conducting short circuit between adjacent two electrodes again simultaneously, and only reaches the purpose in vertical conducting.Its principal ingredient comprises resin adhesive agent, conducting particles two large divisions.The resin adhesive agent is mainly fixedly electrode relative position between IC chip and PWB, and provides a compressing strength to keep the contact area between electrode and conducting particles.General resin is divided into thermoplastic resin and thermoset resin two big classes.Aspect conducting particles, the Anisotropically conductive characteristic depends primarily on the pack completeness of conducting particles.Though the conductance of Anisotropically conductive film can improve along with the increase of conducting particles pack completeness, also can promote conducting particles simultaneously and contact with each other the probability that causes short circuit.In addition, conducting particles must have excellent particle size homogeneity and out of roundness, consistent to guarantee electrode with contact area between conducting particles, keep identical conducting resistance, and avoid partial electrode not touch conducting particles simultaneously, the situation that causes opening a way takes place, and common particle size range is between 3~5 μ m.
Generally speaking, the main ACF of employing attaches machine above-mentioned ACF film is attached on the IC piece, described ACF attaching machine consists predominantly of ACF sticking carrying platform, pressure head, vacuum and high-pressure gas circuit etc., wherein the ACF sticking carrying platform uses pressure head the ACF film to be pasted to the pin field of IC piece by porous breathable pottery sorption location IC piece then.
State Intellectual Property Office's application number is 200520037719.9 invention " the COG processing procedure encapsulates thermal head with high technology ceramics ", disclose a kind of COG processing procedure and encapsulated thermal head with high technology ceramics, be to be that main material is made with aluminium nitride or silicon nitride ceramics, have high precision, long serviceable life, lower cost, broad serviceability temperature scope, and do not give birth to static, not residual ACF colloid, can repair.Though said method solves because of the pressure head distortion produces out-of-flatness by the material that changes pressure head and makes the problem that has minute bubbles between ACF film and IC piece pin field, but, do not consider that the out-of-flatness of ACF sticking carrying platform makes ACF film and IC piece pin field produce the situation of minute bubbles.
With reference to Fig. 2, it is the structural representation of existing ACF sticking carrying platform.Existing ACF sticking carrying platform 2 is provided with screw hole l around it, be used for fixing described ACF sticking carrying platform 2.Be provided with sorption unit 3 in ACF sticking carrying platform 2, described sorption unit 3 is used for vacuum is inhaled in sorption unit 3 corresponding to the air hole under the ACF sticking carrying platform 2, and the IC piece that is placed on the sorption unit 3 is fixed on the sorption unit 3.Wherein, the main unit of described ACF sticking carrying platform 2 is main material with the stainless steel, and middle sorption unit 3 is a main material with the porous breathable resin.
When above-mentioned ACF sticking carrying platform comes into operation, exist following defective:
1) owing to the ACF film will be pasted to the pin field of IC piece, cause pressure head pressing repeatedly at same position, for the lower porous breathable resin of hardness, in working temperature is about 100 ℃, long-term under the situation that pressure head is being pressed, when using about 6-8 month, the surface of the sorption unit of porous breathable resin material will be worn and torn, will be out of shape, cause whole microscope carrier surface irregularity, reduced the serviceable life of ACF sticking carrying platform.
2) when the IC piece is put on the sorption unit,, pressing the out-of-flatness meeting that produces to cause when attaching the ACF film, having minute bubbles to produce between the ACF film and IC piece through long-time pressure head because the hardness of microscope carrier is relatively poor.These type of minute bubbles can cause CCD (Charge CoupledDevice, charge-coupled device) to grasp IC piece MARK (sign) and make a mistake when the IC piece is fed into real wiring and uses, and cause this IC piece to be rejected.Though the IC piece of giving up can utilize once more, the ACF film that needs to have attached before just can come into operation with attaching the ACF film again after artificial the removing, has both wasted the cost of ACF film, has wasted human resources again.
3) when the ACF film that manually cleans on the IC piece, some conductive foreign matters can be attached to the pin field of IC piece, cause IC piece, panel to face the pin conducting mutually and be short-circuited, it is bad finally can to cause product to occur, need drop into manpower and equipment reparation again, waste production cost.
Summary of the invention
The object of the present invention is to provide a kind of ACF sticking carrying platform, is the shortcoming of short and waste production cost in permeable resin microscope carrier serviceable life of bringing to solve in the prior art because of microscope carrier.
A kind of ACF sticking carrying platform provided by the invention is used for fixedly IC piece of ACF attaching machine, comprises main unit and porous breathable pottery sorption unit, and described porous breathable pottery sorption unit is arranged on the main unit, is used for fixedly IC piece of sorption.
Especially, the aperture of the used porous breathable pottery in described porous breathable pottery sorption unit is about 20um.The size of described porous breathable pottery sorption unit is fixed, and is identical with an IC block size.
Wherein, have on the described main unit and the corresponding groove in porous breathable pottery sorption unit, described porous breathable pottery sorption unit embeds in the groove of main unit, sticks on the main unit by bonding agent.
Perhaps, have on the described main unit and the corresponding groove in porous breathable pottery sorption unit, porous breathable pottery sorption unit embeds in the groove of main unit, around the groove of main unit, be provided with at least one trip, trip position with respect to main unit on porous breathable pottery sorption unit is provided with the card ear, is fixed on the main unit by buckle-type.
A kind of ACF sticking carrying platform is used for fixedly IC piece of ACF attaching machine, comprises alumina ceramic main body unit and porous breathable pottery sorption unit, and described porous breathable pottery sorption unit is arranged on the alumina ceramic main body unit, wherein,
Porous breathable pottery sorption unit is used for fixing the IC piece;
The alumina ceramic main body unit has and the corresponding groove in porous breathable pottery sorption unit in the centre.
Especially, the size of described porous breathable pottery sorption unit is fixed, and is identical with an IC block size.The aperture of the porous breathable pottery that described porous breathable pottery sorption unit is used is 20um.
Wherein, described porous breathable pottery sorption unit embeds in the groove of alumina ceramic main body unit, sticks on the alumina ceramic main body unit by bonding agent.
Perhaps, described porous breathable pottery sorption unit embeds in the alumina ceramic main body unit groove, around the groove of alumina ceramic main body unit, be provided with at least one trip, trip position with respect to the alumina ceramic main body unit on porous breathable pottery sorption unit is provided with the card ear, is fixed on the main unit by buckle-type.
In addition, screw hole is set, is used for the ACF sticking carrying platform is fixed in ACF attaching machine at the edge of above-mentioned alumina ceramic main body unit.Described screw hole shape can be circle or ellipse.
The present invention adopts the beneficial effect of above-mentioned technology to be:
1) porous breathable of microscope carrier of the present invention pottery sorption unit adopts the porous breathable pottery to have wear-resistant preferably, resistant to elevated temperatures characteristics, the hardness of porous breathable pottery is higher, when the ACF film is pasted to the pin field of IC piece, even pressure head is being pressed repeatedly at same position, in working temperature is about 100 ℃, long-term under the situation that pressure head is being pressed, and does not also have tangible wearing and tearing and surface irregularity, therefore, increase the serviceable life of ACF sticking carrying platform of the present invention.
2) porous breathable of microscope carrier of the present invention pottery sorption unit adopts the porous breathable pottery, the phenomenon that surface irregularity can not occur, therefore, when the IC piece is put in porous breathable pottery sorption part, when attaching the ACF film, not too have minute bubbles between ACF film and the IC piece and produce.CCD (Charge Coupled Device, charge-coupled device) grasps IC piece MARK (sign) than being easier to, the reduction of IC piece rejection rate, and the utilization factor of IC piece also increases.Therefore also need not to attach again the ACF film, both reduced the cost of ACF film, removed the process of artificial removal ACF film again from, effectively utilized human resources.
3) the present invention has removed the process of artificial removal ACF film from, has avoided the IC piece some conductive foreign matters to be attached to the pin field of IC piece when cleaning, causes IC piece, panel to face the problem that conducting is short-circuited between the pin mutually, has improved the quality of product.
Embodiment
Below in conjunction with accompanying drawing, specify the present invention.
Core of the present invention is to adopt the job operation of ground to obtain required shape and size on the porous breathable pottery, combines with the main unit of microscope carrier then to assemble, and must arrive the ACF sticking carrying platform that the specific region has porosity characteristic.
The porous breathable pottery is a kind of solid material that contains pore, in general, pore in the porous breathable ceramic body shared volume fraction between 20% to 95%.According to the type of pore, can be divided into open pore and two kinds in the hole of holding one's breath, the former pore all be connect mutually and link to each other with external environment, the latter is enclosed in the interior isolated pore of ceramic body, they have different purposes respectively in different occasions.
According to the application aims difference, the composition of porous breathable stupalith is also different, specifically comprises aluminium oxide, trichroite, mullite, sepiolite, silit, zirconia, hydroxyapatite or the like.In order to obtain the porous breathable stupalith of definite shape and structure, preparation process has played decisive action.At present, main several porous breathable pottery preparation technologies comprise foam process, extruding-out process and foam impregnation technology, and the porous article that these three kinds of technologies make is called foam porous pottery, honeycomb porous ceramics and screen like and porous ceramic respectively visually.
Thermal conductivity is low, volume density is little, surface area is high because of its unique porous structure has for the porous breathable stupalith, and advantage and distinctive high temperature resistant, the characteristics such as chemical stability good, intensity height of stupalith itself such as surface structure with unique physical and chemical property.
Porous breathable pottery with open pore in the present embodiment is an example, describes the present invention in detail.
With reference to Fig. 3, it is for the result schematic diagram of first kind of ACF sticking carrying platform of the present invention.ACF sticking carrying platform of the present invention comprises main unit 2 and porous breathable pottery sorption unit 4.Described porous breathable pottery sorption unit 4 is arranged on the main unit 2, is used for fixedly IC piece of sorption.
Especially, the aperture of the used porous breathable pottery in porous breathable described in present embodiment pottery sorption unit 4 is about 20um.The applicant's long-term practice finds that the porous breathable pottery in this kind aperture can either guarantee the soundness of this porous breathable pottery under high temperature and big suction, can guarantee that again it has air permeability and good, and the IC piece can be fixed on the ACF sticking carrying platform well.
Porous breathable pottery sorption unit 4 obtains required size and shape by grinding, because the air hole under the ACF sticking carrying platform is under porous breathable pottery sorption unit, the quality of IC piece is also non-homogeneous, therefore, the size of general porous breathable pottery sorption unit 4 is identical with the size and the shape of an IC chip with shape, be about 20 * 30mm, so that the air hole under the porous breathable pottery is when bleeding the suction vacuum, the IC piece can closely be fixed on the porous breathable pottery, situation askew or that can not closely fix can not occur fixing.
Described main unit 2 is an alumina ceramic material, with the method for grinding, opens a groove corresponding with the ceramic sorption of porous breathable unit 4 thereon.Subsequently, by bonding agent such as glue porous breathable pottery sorption unit and main unit are assembled.
Perhaps, after opening a groove corresponding on the main unit 2, around groove, at least one trip 21 is set, for example, a trip can be set respectively on four edges with porous breathable pottery sorption unit 4.Accordingly, trip 21 positions with respect to main unit 2 on porous breathable pottery sorption unit 4 are provided with card ear 41, are fixed on the main unit 2, as shown in Figure 5 by buckle-type.When porous breathable pottery sorption unit 4 embeds main unit 2, the card ear 41 of porous breathable pottery sorption unit 4 inserts the opening of main unit 2 trips 21, this connected mode is not only simple to operation, when changing porous breathable pottery sorption unit, need not glue, and the card ear is vertically to insert trip, since the gravity of porous breathable pottery sorption unit 4 self, difficult drop-off.
Wherein, the thickness of described porous breathable pottery sorption unit is half of main unit thickness, to reach better sealing effectiveness, makes porous breathable pottery sorption unit can better adsorb the IC piece, reaches better fixed effect.
In addition, the fluting place of main unit 2 can be provided with a screen pack, avoids causing equipment failure because of dust sucks air hole.
Wherein, described edge at the ACF sticking carrying platform is provided with several screw holes 1, and screw hole 1 both can be circle and also can be ellipse.Circular screw hole has fixation preferably.The applicant finds that oval-shaped screw hole can attach machine board otherness at different ACF and do fine adjustments, makes the present invention can adapt to each ACF and attaches machine.Therefore, most preferred embodiment of the present invention is to adopt oval-shaped screw hole.
When ACF sticking carrying platform of the present invention puts into operation, at first be fixed in ACF sticking carrying platform of the present invention on the board seat of ACF attaching machine with screw, screw hole is oval, and the ACF sticking carrying platform is finely tuned, and makes air hole on the ACF attaching machine under the ceramic sorption of porous breathable unit.With reference to Fig. 6, IC piece 9 pin field upwards are placed on above the porous breathable pottery sorption unit of ACF sticking carrying platform, open ACF and attach machine, the air hole vacuumizing, IC piece 9 promptly is fixed on the ACF sticking carrying platform.Supplying with roller 12 subsequently rotates, the ACF film is sent to IC piece 9 pin field top, wherein, described ACF film comprises two-layer, top one deck is centrifugal paper 8, following one deck is ACF13, and described centrifugal paper 8 is on two rollers, and the top that the ACF film is sent to IC piece pin field described here is meant the top that the ACF13 of following one deck is sent to IC piece 9 pin field.Subsequently, pressure head 6 presses down, and makes the ACF film be attached at the pin field of IC piece 9 by 100 ℃ high temperature.Then, hemisection cutter 11 cuts off ACF13, and trip roller 7 rotates, and centrifugal paper 8 is removed.
With reference to Fig. 4, it is for the result schematic diagram of second kind of ACF sticking carrying platform of the present invention.ACF sticking carrying platform of the present invention comprises alumina ceramic main body unit 5 and porous breathable pottery sorption unit 4.Described porous breathable pottery sorption unit 4 is arranged on the alumina ceramic main body unit 5, is used for fixedly IC piece of sorption.
Especially, the aperture of the porous breathable pottery that porous breathable described in present embodiment pottery sorption unit 4 is used is 20um, this kind porous breathable pottery can either guarantee the soundness of this porous breathable pottery under high temperature and big suction, can guarantee that again it has air permeability and good, the IC piece can be fixed on the ACF sticking carrying platform well.
Porous breathable pottery sorption unit 4 obtains required size and shape by grinding, because the air hole under the ACF sticking carrying platform is under porous breathable pottery sorption unit, the quality of IC piece is also non-homogeneous, therefore, the size of general porous breathable pottery sorption unit 4 is identical with the size and the shape of an IC chip with shape, be about 20 * 30mm, so that the air hole under the porous breathable pottery is when bleeding the suction vacuum, the IC piece can closely be fixed on the porous breathable pottery, situation askew or that can not closely fix can not occur fixing.
Described alumina ceramic main body unit 2 is an alumina ceramic material.
Aluminium oxide ceramics is divided into two kinds of high-purity type and plain editions at present.High-purity type aluminium oxide ceramics is Al
2O
3Content is at the stupalith more than 99.9%, because its sintering temperature is up to 1650-1990 ℃, transmission peak wavelength is 1~6 μ m, is made generally in melten glass to replace platinum crucible: utilize its light transmission and can alkaline-resisting metal protection as the sodium vapor lamp pipe; In electronics industry, can be used as ic substrate and high-frequency insulation material.Al presses in plain edition aluminium oxide ceramics system
2O
3The content difference is divided into kinds such as 99 porcelain, 95 porcelain, 90 porcelain, 85 porcelain, Al sometimes
2O
3Content also divides common aluminium oxide ceramics series into 80% or 75%.Wherein 99 alumina ceramics materials are used to make high-temperature crucibles, fire-resistant boiler tube and special high-abrasive material, as ceramic bearing, ceramic seal spare and water valve plate etc.; 95 alumina ceramics are mainly as corrosion-resistant, wear parts; Owing to often mix the part talcum, improved electrical property and physical strength in 85 porcelain, can with metal sealings such as molybdenum, niobium, tantalum, have as electrovacuum device device.Its characteristics are:
1) good insulation performance;
2) enough withstand voltage, rupture strength;
3) high wearing quality.
The method of described alumina ceramic main body unit 5 usefulness grindings is opened a groove corresponding with porous breathable pottery sorption unit 4 thereon.Subsequently, by bonding agent such as glue porous breathable pottery sorption unit 4 and alumina ceramic main body unit 5 are assembled.
Perhaps, after opening a groove corresponding on the alumina ceramic main body unit, around groove, at least one trip 21 is set, for example, a trip can be set respectively on four edges with porous breathable pottery sorption unit 4.Accordingly, the trip position with respect to the alumina ceramic main body unit on porous breathable pottery sorption unit 4 is provided with card ear 41, is fixed on the alumina ceramic main body unit 5, as shown in Figure 5 by buckle-type.When porous breathable pottery sorption unit 4 embeds alumina ceramic main body unit 5, the card ear 41 of porous breathable pottery sorption unit 4 inserts the opening of alumina ceramic main body unit 5 trips 21, this connected mode is not only simple to operation, when changing porous breathable pottery sorption unit, need not glue, and the card ear is vertically to insert trip, since the gravity of porous breathable pottery sorption unit 4 self, difficult drop-off.
Wherein, the thickness of described porous breathable pottery sorption unit 4 is half of alumina ceramic main body unit 5 thickness, to reach better sealing effectiveness, makes porous breathable pottery sorption unit can better adsorb the IC piece, reaches better fixed effect.
In addition, the tapping of alumina ceramic main body unit 5 can be provided with a screen pack, avoids causing equipment failure because of dust sucks air hole.
Wherein, at the edge of the alumina ceramic main body unit of described ACF sticking carrying platform several screw holes 1 are set, screw hole 1 both can be circle and also can be ellipse.Circular screw hole has fixation preferably, and oval-shaped screw hole can attach machine board otherness at different ACF and do fine adjustments, makes the present invention can be adapted to each ACF and attaches machine.
When ACF sticking carrying platform of the present invention puts into operation, at first be fixed in ACF sticking carrying platform of the present invention on the board seat of ACF attaching machine with screw, screw hole is oval, and the ACF sticking carrying platform is finely tuned, and makes air hole on the ACF attaching machine under the ceramic sorption of porous breathable unit.With reference to Fig. 6, IC piece 9 pin field upwards are placed on above the porous breathable pottery sorption unit of ACF sticking carrying platform, open ACF and attach machine, the air hole vacuumizing, IC piece 9 promptly is fixed on the ACF sticking carrying platform.Supplying with roller 12 subsequently rotates, the ACF film is sent to IC piece 9 pin field top, wherein, described ACF film comprises two-layer, top one deck is centrifugal paper 8, following one deck is ACF13, and described centrifugal paper 8 is on two rollers, and the top that the ACF film is sent to IC piece pin field described here is meant the top that the ACF13 of following one deck is sent to IC piece 9 pin field.Subsequently, pressure head 6 presses down, and makes the ACF film be attached at the pin field of IC piece 9 by 100 ℃ high temperature.Then, hemisection cutter 11 cuts off ACF13, and trip roller 7 rotates, and centrifugal paper 8 is removed.
ACF sticking carrying platform with the LCM3201WA04 machine is an example below, and the present invention is described.Its ACF sticking carrying platform purity is 95% Al
2O
3Pottery is replaced original stainless steel material, with Al
2O
3Pottery is as the main unit of ACF sticking carrying platform, and middle porous breathable pottery sorption unit uses the porous breathable pottery, six screw holes at main unit edge be shaped as ellipse.Described porous breathable pottery sorption unit and main unit obtain required form and size by grinding.Porous breathable pottery sorption unit embeds in the main unit, and is bonding by glue.The thickness of described ACF sticking carrying platform is 10mm.This microscope carrier has following advantage:
1) ACF pottery microscope carrier of the present invention has advantages of good abrasion, resistant to elevated temperatures characteristics, and the porous breathable ceramic hardness is higher, even pressed repeatedly by pressure head under 100 ℃ of left and right sides temperature, does not also have the phenomenon of tangible wearing and tearing and surface irregularity.Because superpower wearing quality, this microscope carrier serviceable life is than the long service life of existing resin microscope carrier.
2) when the ACF film is pasted on the pin field of IC piece, do not have minute bubbles between ACF and the IC piece, CCD grasps IC piece MARK ratio and is easier to, and the phenomenon that mistake is grabbed MARK or be can not find MARK can not occur, so the quantity that the IC piece is rejected in use also reduces, reduced the cost that material drops into.
Need when 3) the IC piece of Hui Shouing utilizes again to attach again after the ACF film that has attached the removal with the IC piece, the IC number of blocks of recovery reduces, and the use amount of ACF film also reduces thereupon.
4) need artificial cleaning during the ACF film on the IC piece that remove to reclaim, the IC piece of recovery reduces, and has saved human resources to a certain extent.
5) during the ACF film on the IC piece that remove to reclaim, some conductive foreign matters can be attached to the pin field of IC piece, cause IC piece, liquid crystal panel to face mutually that conducting is short-circuited between the pin, use the present invention, the IC piece that reclaims reduces, reduce the possibility that foreign matter is attached to IC piece pin field, improved the quality of product to a certain extent.
More than disclosed only be several specific embodiment of the present invention, but the present invention is not limited thereto, any those skilled in the art can think variation, all should drop in protection scope of the present invention.