CN110281359B - Ceramic plate production process - Google Patents

Ceramic plate production process Download PDF

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Publication number
CN110281359B
CN110281359B CN201910697240.4A CN201910697240A CN110281359B CN 110281359 B CN110281359 B CN 110281359B CN 201910697240 A CN201910697240 A CN 201910697240A CN 110281359 B CN110281359 B CN 110281359B
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Prior art keywords
frame
ceramic plate
ceramic
storage
filter screen
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CN201910697240.4A
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CN110281359A (en
Inventor
刘法亭
范浩
陈路阳
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FUJIAN DEHUA DAIYUTANG CERAMICS Co.,Ltd.
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Fujian Dehua Daiyutang Ceramics Co ltd
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Publication of CN110281359A publication Critical patent/CN110281359A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/003Apparatus or processes for treating or working the shaped or preshaped articles the shaping of preshaped articles, e.g. by bending
    • B28B11/005Using heat to allow reshaping, e.g. to soften ceramic articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B17/00Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
    • B28B17/04Exhausting or laying dust
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206Magnesium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3208Calcium oxide or oxide-forming salts thereof, e.g. lime
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment

Abstract

The invention relates to the field of PCB ceramic plates, in particular to a ceramic plate production process.A used ceramic plate production device comprises a support frame, a sealing structure, a containing frame, a storage structure, an electromagnetic valve, an air inlet pipe and a waste chip containing structure; the one end of solenoid valve is fixed in and accomodates the frame and accomodate the structure with the sweeps and switch on, the other one end of solenoid valve is fixed in the intake pipe, and then accomodate the gaseous break-make of the inside of structure through solenoid valve control sweeps, when the intake pipe accomodates the structure with the sweeps and switches on, make the sweeps accomodate the inside negative pressure of structure, and then make the inside that the structure was accomodate to the dust on PCB ceramic plate and the storage structure, when the inside negative pressure of structure was accomodate to the sweeps, the area of contact of PCB ceramic plate and storage structure has been reduced, and then the clearance effect that makes the sweeps dust is better, the filter screen flexible, and then the effectual filter screen that prevents blocks up, and then the quality of.

Description

Ceramic plate production process
Technical Field
The invention relates to the field of PCB ceramic plates, in particular to a ceramic plate production process.
Background
The ceramic substrate is a special process plate in which copper foil is directly bonded to the surface of an aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at a high temperature, and the manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed Circuit Board), and has great current carrying capacity, so that the ceramic substrate becomes a basic material for the structure technology and the interconnection technology of high-power electronic circuits.
However, the PCB ceramic plate is fragile, need inspect the circuit board after the copper foil of bonding on the PCB ceramic plate, the integrality of inspection circuit board, and need clear up the dust on the PCB ceramic plate, when placing and detecting on the workstation, because PCB ceramic plate thickness is thinner, be not convenient for take, when detecting PCB ceramic plate in-process atress inequality and damage the PCB ceramic plate easily, and adopt the dust on the trachea clearance ceramic plate, make sweeps and dust gathering indoor, sweeps and dust can gather again on the ceramic plate of clearing up the completion, and influence producers' healthy.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a ceramic plate production process.
The technical scheme adopted by the invention for solving the technical problems is as follows: a ceramic plate production process, the process comprising the steps of:
s1: uniformly mixing pure alumina powder, SiO2, MgO and CaO powder by a stirring and mixing device, then continuously adding toluene and ethyl cellulose, and uniformly stirring to obtain a mixture; grinding the obtained mixture by a grinding machine, taking out the mixture after the mixture is ground to have viscosity, thereby obtaining ceramic slurry with viscosity, mixing all raw materials in the mixture more uniformly after grinding and stirring, preventing unqualified ceramic plate production caused by uneven distribution of all raw materials in the produced ceramic plate, and simultaneously crushing all raw materials in a powdery manner, so that the uniform mixing degree of all raw materials can be improved, and the production quality of the ceramic plate is improved;
s2: sintering the ceramic green sheet obtained in the step S1 through a high-temperature furnace, wherein the temperature of the high-temperature furnace is set to be 1500-1650 ℃, the sintering time is ten minutes, so that a ceramic cooked sheet is obtained, the mixture can be solidified through high-temperature sintering, and meanwhile, the service strength of the ceramic plate can be improved after the ceramic plate is sintered at high temperature, and the service life of the ceramic plate is prolonged;
s3: cooling the ceramic cooked slices obtained in the step S2 for twenty minutes, then introducing the cooled ceramic cooked slices into a high-temperature furnace again, setting the temperature of the high-temperature furnace between 1300 ℃ and 1400 ℃, carrying out warping and flattening on the ceramic cooked slices through the high-temperature furnace, carrying out size sorting on the rolled ceramic cooked slices, and carrying out ceramic plate manufacturing on the ceramic cooked slices with the sizes meeting the standard in a ceramic plate production device after sorting; through the warpage flattening treatment, can obtain the ripe piece of the good pottery of surface smoothness, make things convenient for the post processing, practice thrift the post processing time simultaneously and avoid the waste of raw materials, in addition, through the warpage flattening treatment, still be favorable to making the size of the ripe piece of pottery accord with the demand of reality.
The ceramic plate production device used in the S3 comprises a support frame, a sealing structure, a containing frame, a storage structure, an electromagnetic valve, an air inlet pipe and a waste scrap containing structure; the support frame is arranged at the bottom end of the containing frame with a rectangular structure, the storage structure for supporting the PCB ceramic plate is arranged inside the containing frame, and the storage structure is connected with the containing frame in a sliding mode; the waste chip storage structure for storing waste chips on the surface of the PCB ceramic plate is arranged inside the storage frame, and the storage structure is abutted against the waste chip storage structure; the storage frame is provided with a sealing structure for cleaning scraps in the scrap storage structure; the bottom of accomodating the frame be equipped with switch on in the sweeps accomodates the structure the solenoid valve, just the solenoid valve deviates from the one end of accomodating the frame is equipped with the intake pipe.
Specifically, the sweeps is accomodate the structure and is included two water conservancy diversion rooms, filter screen, gas pocket, guiding gutter and chip removal hole, the bottom of accomodating the frame is equipped with two and is used for the water conservancy diversion room, two switch on through a plurality of between the water conservancy diversion room the guiding gutter, the guiding gutter is the half cylinder structure constitution that two diameters are different, and is a plurality of the gas pocket run through in accomodate one on frame and top the water conservancy diversion room switches on, is used for accomodating the sweeps the chip removal hole run through in the storage structure, the inside of accomodating the frame is equipped with and is used for filtering the sweeps the filter screen, the filter screen with contained angle between the bottom surface of accomodating the frame is the acute angle, solenoid valve and one of bottom the water conservancy diversion room switches on.
Specifically, seal structure includes handle and apron, be used for right the inside cavity of accomodating the frame seals the apron is located the tip of filter screen, the apron with accomodate the frame block, the handle is fixed in the lateral wall of apron.
Specifically, the storage structure comprises a storage frame, a rubber bulge, an elastic sheet, a piston, a transmission rod, a reset spring, a support plate, a stop block and a sealing block, wherein the bottom end of the storage frame is at least provided with six reset springs, the reset springs correspond to the diversion trenches one to one, one ends of the reset springs are fixed on the storage frame, the other ends of the reset springs are fixed on the piston, the side wall of the piston is provided with the sealing blocks of a semi-cylinder structure, the sealing blocks and the piston are both in sliding connection between the storage frame, the sealing blocks and the diversion trenches are in sliding connection, the length of the sealing blocks is smaller than half of that of the diversion trenches, one end of the piston departing from the reset springs is provided with the transmission rod, the transmission rod is in sliding connection with the filter screen, and one end of the transmission rod departing from the piston is fixed on the storage frame, be equipped with on the storage frame and be used for supporting the PCB ceramic plate the backup pad, be equipped with in the backup pad and be used for supporting the PCB ceramic plate rubber arch, the bellied top of rubber is half spherical structure, the side of the cross-section of the bellied bottom of rubber is wave structure, adjacent two be equipped with between the rubber arch and be used for accomodating the sweeps the chip removal hole, the bellied inside of rubber is equipped with the arc structure the dog, the end fixing of dog has the shell fragment, the shell fragment with sliding connection between the backup pad, the bottom of shell fragment with the filter screen is contradicted.
Specifically, the bottom of accomodating the frame is equipped with the bottom plate of dismantling the connection, reset spring with the bottom plate is contradicted.
The invention has the beneficial effects that:
(1) according to the ceramic plate production process, one end of the electromagnetic valve is fixed to the containing frame and is communicated with the waste chip containing structure, the other end of the electromagnetic valve is fixed to the air inlet pipe, so that the on-off of air inside the waste chip containing structure is controlled through the electromagnetic valve, when the air inlet pipe is communicated with the waste chip containing structure, negative pressure inside the waste chip containing structure is achieved, and therefore dust on the PCB ceramic plate and the storage structure enters the waste chip containing structure, and the cleaning quality of dust and waste chips is greatly improved.
(2) According to the ceramic plate production process, when negative pressure is applied to the inside of the waste chip containing structure, the storage structure and the containing frame are driven to slide, so that the PCB ceramic plate is contained in the containing frame, the contact area between the PCB ceramic plate and the storage structure is reduced, the cleaning effect of waste chip dust is better, the storage structure is abutted against the waste chip containing structure, the filter screen is deformed, the filter screen is effectively prevented from being blocked, when the internal air pressure of the waste chip containing structure is equal to the atmospheric pressure, the storage structure is reset, the PCB ceramic plate slides out of the containing frame, the contact area between the PCB ceramic plate and the storage structure is larger, the quality of detecting the PCB ceramic plate is greatly improved, and the PCB ceramic plate can be taken conveniently and quickly.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view showing the overall structure of a preferred embodiment of a ceramic plate production apparatus used in the present invention;
FIG. 3 is a schematic view of a connection structure between the receiving frame and the storage structure shown in FIG. 2;
FIG. 4 is an enlarged view of portion A of FIG. 3;
fig. 5 is an enlarged view of the portion B shown in fig. 3.
In the figure: 1. the support frame, 2, seal structure, 21, handle, 22, apron, 3, accomodate the frame, 4, storage structure, 41, storage frame, 42, rubber bulge, 43, shell fragment, 44, piston, 45, transfer line, 46, reset spring, 47, backup pad, 48, dog, 49, sealed piece, 5, solenoid valve, 6, intake pipe, 7, bottom plate, 8, sweeps accomodate the structure, 81, guiding flow chamber, 82, filter screen, 83, gas pocket, 84, guiding gutter, 85, chip removal hole.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, a ceramic plate production process according to the present invention comprises the steps of:
s1: uniformly mixing pure alumina powder, SiO2, MgO and CaO powder by a stirring and mixing device, then continuously adding toluene and ethyl cellulose, and uniformly stirring to obtain a mixture; grinding the obtained mixture by a grinding machine, taking out the mixture after the mixture is ground to have viscosity, thereby obtaining ceramic slurry with viscosity, mixing all raw materials in the mixture more uniformly after grinding and stirring, preventing unqualified ceramic plate production caused by uneven distribution of all raw materials in the produced ceramic plate, and simultaneously crushing all raw materials in a powdery manner, so that the uniform mixing degree of all raw materials can be improved, and the production quality of the ceramic plate is improved;
s2: sintering the ceramic green sheet obtained in the step S1 through a high-temperature furnace, wherein the temperature of the high-temperature furnace is set to be 1500-1650 ℃, the sintering time is ten minutes, so that a ceramic cooked sheet is obtained, the mixture can be solidified through high-temperature sintering, and meanwhile, the service strength of the ceramic plate can be improved after the ceramic plate is sintered at high temperature, and the service life of the ceramic plate is prolonged;
s3: cooling the ceramic cooked slices obtained in the step S2 for twenty minutes, then introducing the cooled ceramic cooked slices into a high-temperature furnace again, setting the temperature of the high-temperature furnace between 1300 ℃ and 1400 ℃, carrying out warping and flattening on the ceramic cooked slices through the high-temperature furnace, carrying out size sorting on the rolled ceramic cooked slices, and carrying out ceramic plate manufacturing on the ceramic cooked slices with the sizes meeting the standard in a ceramic plate production device after sorting; through the warpage flattening treatment, can obtain the ripe piece of the good pottery of surface smoothness, make things convenient for the post processing, practice thrift the post processing time simultaneously and avoid the waste of raw materials, in addition, through the warpage flattening treatment, still be favorable to making the size of the ripe piece of pottery accord with the demand of reality.
The ceramic plate production device used in the step S3 comprises a support frame 1, a sealing structure 2, a containing frame 3, a storage structure 4, an electromagnetic valve 5, an air inlet pipe 6 and a waste chip containing structure 8; the supporting frame 1 is arranged at the bottom end of the receiving frame 3 with a rectangular structure, the storage structure 4 for supporting the PCB ceramic plate is arranged inside the receiving frame 3, and the storage structure 4 is connected with the receiving frame 3 in a sliding mode; the waste chip accommodating structure 8 for accommodating waste chips on the surface of the PCB ceramic plate is arranged inside the accommodating frame 3, and the storage structure 4 is abutted against the waste chip accommodating structure 8; the sealing structure 2 used for cleaning the scraps in the scrap accommodating structure 8 is arranged on the accommodating frame 3; the bottom of accomodating frame 3 be equipped with switch on in structure 8 is accomodate to the sweeps solenoid valve 5, just solenoid valve 5 deviates from the one end of accomodating frame 3 is equipped with intake pipe 6.
Specifically, the scrap accommodating structure 8 comprises two flow guide chambers 81, a filter screen 82, air holes 83, flow guide grooves 84 and scrap discharge holes 85, the two flow guide chambers 81 for guiding flow are arranged at the bottom end of the accommodating frame 3, the two flow guide chambers 81 are communicated with each other through the flow guide grooves 84, the flow guide grooves 84 are formed by two semi-cylindrical structures with different diameters, the air holes 83 penetrate through the accommodating frame 3 and are communicated with one flow guide chamber 81 at the top end, the scrap discharge holes 85 for accommodating scraps penetrate through the storage structure 4, the filter screen 82 for filtering scraps is arranged in the accommodating frame 3, an included angle between the filter screen 82 and the bottom surface of the accommodating frame 3 is an acute angle, and the electromagnetic valve 5 is communicated with one flow guide chamber 81 at the bottom end; the filter screen 82 with the contained angle of accomodating between the bottom surface of frame 3 is the acute angle, and then is convenient for the sweeps toward the one end gathering of filter screen 82, and then has improved sweeps greatly and has accomodate efficiency and quality.
Specifically, the sealing structure 2 includes a handle 21 and a cover plate 22, the cover plate 22 for sealing the internal cavity of the receiving frame 3 is disposed at an end of the filter screen 82, the cover plate 22 is engaged with the receiving frame 3, and the handle 21 is fixed to a side wall of the cover plate 22; when the sweeps on the filter screen 82 are too much, the handle 21 is held by a hand, the cover plate 22 is pulled out, the sweeps on the filter screen 82 are cleaned, and the sweeps on the filter screen 82 are further cleaned more conveniently and quickly.
Specifically, the storage structure 4 includes a storage frame 41, a rubber protrusion 42, an elastic sheet 43, a piston 44, a transmission rod 45, a return spring 46, a support plate 47, a stopper 48 and a sealing block 49, the bottom end of the storage frame 3 is at least provided with six return springs 46, the return springs 46 correspond to the diversion trenches 84 one to one, one end of each return spring 46 is fixed to the storage frame 3, the other end of each return spring 46 is fixed to the piston 44, the side wall of the piston 44 is provided with the sealing block 49 of a semi-cylindrical structure, the sealing block 49 and the piston 44 are both in sliding connection between the storage frame 3, the sealing block 49 is in sliding connection with the diversion trenches 84, the length of the sealing block 49 is smaller than half of the length of the diversion trenches 84, one end of the piston 44 departing from the return springs 46 is provided with the transmission rod 45, the transmission rod 45 is slidably connected with the filter screen 82, one end of the transmission rod 45, which is far away from the piston 44, is fixed to the storage frame 41, the storage frame 41 is provided with a support plate 47 for supporting a PCB (printed circuit board) ceramic plate, the support plate 47 is provided with the rubber bulge 42 for supporting the PCB ceramic plate, the top end of the rubber bulge 42 is of a hemispherical structure, the side of the cross section of the bottom end of the rubber bulge 42 is of a wavy structure, the chip removal hole 85 for accommodating waste chips is arranged between every two adjacent rubber bulges 42, the stopper 48 of an arc structure is arranged inside the rubber bulge 42, the end part of the stopper 48 is fixed with the elastic sheet 43, the elastic sheet 43 is slidably connected with the support plate 47, and the bottom end of the elastic sheet 43 is abutted against the filter screen 82; firstly, the PCB ceramic plate is placed on the rubber bulge 42, the rubber bulge 42 is extruded and deformed under the action of pressure, so that the contact area between the PCB ceramic plate and the rubber bulge 42 is enlarged, the fixing effect of the PCB ceramic plate is better, the PCB ceramic plate can be conveniently detected on the rubber bulge 42, meanwhile, the rubber bulge 42 exposes the PCB ceramic plate outside the storage frame 3, the taking of the thinner ceramic plate is more convenient, the phenomenon that the PCB ceramic plate is damaged due to uneven stress of the PCB ceramic plate during detection is avoided, meanwhile, when the electromagnetic valve 5 does not work, the filter screen 82 deforms, meanwhile, the filter screen 82 pulls the elastic sheet 43, the elastic sheet 43 drives the stopper 48 to pull the rubber bulge 42, the top surface of the rubber bulge 42 deforms, and the contact area between the rubber bulge 42 and the PCB ceramic plate is further increased, the side of the cross section of the bottom end of the rubber bulge 42 is of a wave-shaped structure, so that the rubber bulge 42 is convenient to reset, the filter screen 82 shakes to prevent scraps from being accumulated on the filter screen 82 to block the filter screen 82, the air inlet pipe 6 is connected to a vacuum pump, then the power line of the electromagnetic valve 5 is electrically connected with the power line of the vacuum pump, when the vacuum pump starts to work, the electromagnetic valve 5 is switched on, so that air at the bottom end of the piston 44 passes through the electromagnetic valve 5 and the air inlet pipe 6, under the action of atmospheric pressure, the piston 44 and the sealing block 49 thereof are in sliding connection with the storage frame 3, the piston 44 drives the transmission rod 45 to be in sliding connection with the storage frame 3, the transmission rod 45 drives the storage frame 41 to be in sliding connection with the storage frame 3, then the PCB ceramic board on the rubber protrusion 42 is received in the receiving frame 3, and the supporting plate 47 is close to the filter screen 82, so that the elastic sheet 43 is extruded and deformed, the elastic sheet 43 abuts against the stopper 49 and the filter screen 82, so that the filter screen 82 is deformed, the stopper 48 abuts against the rubber protrusion 42, so that the top end of the rubber protrusion 42 is of a hemispherical structure, thereby reducing the contact area between the PCB ceramic board and the rubber protrusion 42, further improving the dust treatment effect, until the sealing block 49 abuts against the receiving frame 3, so that the guiding grooves 84 are communicated with the two guiding chambers 81, and then the gas in the receiving frame 3 enters the guiding chambers 81 through the air holes 83, thereby improving the internal negative pressure of the receiving frame 3, and improving the sealing performance between the cover plate 22 and the receiving frame 3 under the negative pressure condition, the outside air enters the inside of the containing frame 3 through the chip removing holes 85 to form an air flow, so that the air flow sucks the waste chips on the PCB ceramic plate into the inside of the containing frame 3, and the waste chips are contained on the filter screen 82 after being filtered by the filter screen 82.
Specifically, a bottom plate 7 detachably connected with the bottom end of the containing frame 3 is arranged, and the return spring 46 abuts against the bottom plate 7; the bottom plate 7 is arranged to facilitate and facilitate the detachment of the return spring 46 and the piston 44.
When in use, firstly, the PCB ceramic plate is placed on the rubber bulge 42, the rubber bulge 42 is extruded and deformed under the action of pressure, further the contact area between the PCB ceramic plate and the rubber bulge 42 is enlarged, the fixing effect of the PCB ceramic plate is better, the PCB ceramic plate is convenient to detect on the rubber bulge 42, meanwhile, the PCB ceramic plate is exposed outside the containing frame 3 by the rubber bulge 42, further the taking of the thinner ceramic plate is more convenient, the damage of the PCB ceramic plate caused by uneven stress of the PCB ceramic plate in the detection process is avoided, meanwhile, when the electromagnetic valve 5 does not work, the filter screen 82 is deformed, the filter screen 82 pulls the elastic sheet 43, the elastic sheet 43 drives the stop dog 48 to pull the rubber bulge 42, the top surface of the rubber bulge 42 is deformed, the contact area between the rubber bulge 42 and the PCB ceramic plate is further increased, and the side edge of the cross section at the bottom end of the rubber bulge 42, thereby facilitating the resetting of the rubber protrusion 42, simultaneously shaking the filter screen 82, avoiding the accumulation of scraps on the filter screen 82 to block the filter screen 82, connecting the air inlet pipe 6 to the vacuum pump, electrically connecting the power line of the electromagnetic valve 5 with the power line of the vacuum pump, when the vacuum pump starts to work, switching on the electromagnetic valve 5, further enabling the air at the bottom end of the piston 44 to pass through the electromagnetic valve 5 and the air inlet pipe 6 thereof, under the action of atmospheric pressure, the piston 44 and the sealing block 49 thereof are in sliding connection with the receiving frame 3, the piston 44 drives the transmission rod 45 to be in sliding connection with the receiving frame 3, the transmission rod 45 drives the storage frame 41 to be in sliding connection with the receiving frame 3, further enabling the PCB ceramic plate on the rubber protrusion 42 to be received inside the receiving frame 3, simultaneously, the support plate 47 is close to the filter screen 82, enabling the elastic sheet 43 to, the filter screen 82 is deformed, the stopper 48 abuts against the rubber protrusion 42, so that the top end of the rubber protrusion 42 is of a hemispherical structure, the contact area between the PCB ceramic board and the rubber protrusion 42 is reduced, and further the dust treatment effect is better, until the sealing block 49 abuts against the storage frame 3, the diversion trench 84 is communicated with the two diversion chambers 81, then the gas inside the storage frame 3 enters the diversion chambers 81 through the air holes 83, so that the internal negative pressure of the storage frame 3 is further realized, the sealing performance between the cover plate 22 and the storage frame 3 is better under the negative pressure condition, the external air enters the storage frame 3 through the chip removal holes 85, and further an air flow is formed, so that the air flow sucks the waste chips on the PCB ceramic board into the storage frame 3, and the waste chips are filtered through the filter screen 82 and stored on the filter screen 82; when the sweeps on the filter screen 82 are too much, the handle 21 is held by hand, the cover plate 22 is pulled out, the sweeps on the filter screen 82 are cleaned, and the sweeps on the filter screen 82 are further cleaned more conveniently and quickly.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the embodiments and descriptions given above are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (5)

1. A ceramic plate production process is characterized in that: the process comprises the following steps:
s1: uniformly mixing pure alumina powder, SiO2, MgO and CaO powder by a stirring and mixing device, then continuously adding toluene and ethyl cellulose, and uniformly stirring to obtain a mixture; grinding the obtained mixture by a grinding machine, and taking out the mixture after the mixture is ground to have viscosity so as to obtain ceramic slurry with viscosity;
s2: sintering the ceramic green sheet obtained in the step S1 in a high-temperature furnace, wherein the temperature of the high-temperature furnace is set to be 1500-1650 ℃, and the sintering time is ten minutes, so as to obtain a ceramic cooked sheet;
s3: cooling the ceramic cooked slices obtained in the step S2 for twenty minutes, then introducing the cooled ceramic cooked slices into a high-temperature furnace again, setting the temperature of the high-temperature furnace between 1300 ℃ and 1400 ℃, carrying out warping and flattening on the ceramic cooked slices through the high-temperature furnace, carrying out size sorting on the rolled ceramic cooked slices, and carrying out ceramic plate manufacturing on the ceramic cooked slices with the sizes meeting the standard in a ceramic plate production device after sorting;
the ceramic plate production device used in the S3 comprises a support frame (1), a sealing structure (2), a containing frame (3), a storage structure (4), an electromagnetic valve (5), an air inlet pipe (6) and a waste chip containing structure (8); the supporting frame (1) is arranged at the bottom end of the containing frame (3) with a rectangular structure, the storage structure (4) used for supporting the PCB ceramic plate is arranged inside the containing frame (3), and the storage structure (4) is connected with the containing frame (3) in a sliding mode; the waste chip storage structure (8) used for storing waste chips on the surface of the PCB ceramic plate is arranged inside the storage frame (3), and the storage structure (4) is abutted against the waste chip storage structure (8); the sealing structure (2) used for cleaning the scraps in the scrap accommodating structure (8) is arranged on the accommodating frame (3); the bottom of the storage frame (3) is provided with an electromagnetic valve (5) which is communicated with the scrap storage structure (8), and one end of the electromagnetic valve (5) departing from the storage frame (3) is provided with the air inlet pipe (6).
2. A ceramic plate production process according to claim 1, characterised in that: the scrap accommodating structure (8) comprises two flow guide chambers (81), a filter screen (82), air holes (83), a flow guide groove (84) and a scrap discharge hole (85), the bottom end of the containing frame (3) is provided with two diversion chambers (81) for diversion, the two diversion chambers (81) are communicated through a plurality of diversion grooves (84), the diversion trench (84) is composed of two semi-cylindrical structures with different diameters, a plurality of air holes (83) penetrate through the containing frame (3) and are communicated with one diversion chamber (81) at the top end, the chip removal hole (85) for receiving chips penetrates through the storage structure (4), the inside of the containing frame (3) is provided with the filter screen (82) for filtering the waste scraps, the included angle between the filter screen (82) and the bottom surface of the containing frame (3) is an acute angle, the electromagnetic valve (5) is communicated with one flow guide chamber (81) at the bottom end.
3. A ceramic plate production process according to claim 2, characterised in that: seal structure (2) are including handle (21) and apron (22), are used for right the inside cavity of accomodating frame (3) is sealed apron (22) are located the tip of filter screen (82), apron (22) with accomodate frame (3) block, handle (21) are fixed in the lateral wall of apron (22).
4. A ceramic plate production process according to claim 2, characterised in that: the storage structure (4) comprises a storage frame (41), rubber bulges (42), elastic sheets (43), pistons (44), transmission rods (45), reset springs (46), a support plate (47), a stop block (48) and sealing blocks (49), wherein the bottom end of the storage frame (3) is at least provided with six reset springs (46), the reset springs (46) are in one-to-one correspondence with the diversion trenches (84), one ends of the reset springs (46) are fixed on the storage frame (3), the other ends of the reset springs (46) are fixed on the pistons (44), the side walls of the pistons (44) are provided with the sealing blocks (49) of a semi-cylinder structure, the sealing blocks (49) and the pistons (44) are in sliding connection between the storage frame (3), and the sealing blocks (49) are in sliding connection with the diversion trenches (84), the length of sealing block (49) is less than half of the length of guiding gutter (84), piston (44) deviates from the one end of reset spring (46) is equipped with transfer line (45), transfer line (45) with sliding connection between filter screen (82), transfer line (45) deviate from the one end of piston (44) is fixed in storage frame (41), be equipped with on storage frame (41) and be used for supporting PCB ceramic plate backup pad (47), be equipped with on backup pad (47) and be used for supporting PCB ceramic plate rubber arch (42), the top of rubber arch (42) is the hemisphere structure, the side of the cross-section of the bottom of rubber arch (42) is the wave structure, two adjacent be equipped with between rubber arch (42) and be used for accomodating the sweeps chip removal hole (85), the inside of rubber arch (42) is equipped with the arc structure dog (48), the end part of the stop block (48) is fixedly provided with the elastic sheet (43), the elastic sheet (43) is in sliding connection with the supporting plate (47), and the bottom end of the elastic sheet (43) is abutted against the filter screen (82).
5. A ceramic plate production process according to claim 4, characterised in that: the bottom of accomodating frame (3) is equipped with bottom plate (7) that can dismantle the connection, reset spring (46) with bottom plate (7) are contradicted.
CN201910697240.4A 2019-07-30 2019-07-30 Ceramic plate production process Active CN110281359B (en)

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RU2138392C1 (en) * 1997-08-15 1999-09-27 Кеворков Виктор Аршакович Department of prestressed ferroconcrete articles
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