CN110281155A - 一种校准工具 - Google Patents
一种校准工具 Download PDFInfo
- Publication number
- CN110281155A CN110281155A CN201910707570.7A CN201910707570A CN110281155A CN 110281155 A CN110281155 A CN 110281155A CN 201910707570 A CN201910707570 A CN 201910707570A CN 110281155 A CN110281155 A CN 110281155A
- Authority
- CN
- China
- Prior art keywords
- disk body
- truing tool
- plane
- tool according
- clamping portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 238000000227 grinding Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 150000004651 carbonic acid esters Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910707570.7A CN110281155B (zh) | 2019-08-01 | 2019-08-01 | 一种校准工具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910707570.7A CN110281155B (zh) | 2019-08-01 | 2019-08-01 | 一种校准工具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110281155A true CN110281155A (zh) | 2019-09-27 |
CN110281155B CN110281155B (zh) | 2022-01-14 |
Family
ID=68024639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910707570.7A Active CN110281155B (zh) | 2019-08-01 | 2019-08-01 | 一种校准工具 |
Country Status (1)
Country | Link |
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CN (1) | CN110281155B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022205496A1 (zh) * | 2021-04-02 | 2022-10-06 | 台湾积体电路制造股份有限公司 | 晶圆清洗设备及定位治具 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6506098B1 (en) * | 2002-05-20 | 2003-01-14 | Taiwan Semiconductor Manufacturing Company | Self-cleaning slurry arm on a CMP tool |
JP2003133269A (ja) * | 2001-10-26 | 2003-05-09 | Applied Materials Inc | 化学機械研磨装置 |
CN101112750A (zh) * | 2006-07-28 | 2008-01-30 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨机台中研磨液及去离子水输送管的配置方法 |
CN101121247A (zh) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | 研磨头的清洗装置 |
CN102335869A (zh) * | 2010-07-21 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置和方法 |
CN202317931U (zh) * | 2011-10-20 | 2012-07-11 | 汪涛 | 一种用于砂带磨削机的角度调整装置 |
CN105562780A (zh) * | 2014-10-16 | 2016-05-11 | 西安志越机电科技有限公司 | 便携式斜孔钻削装置 |
CN105965330A (zh) * | 2016-07-06 | 2016-09-28 | 苏州工业园区代思科电子科技有限公司 | 一种v型划片刀的加工装置 |
CN206066195U (zh) * | 2016-10-17 | 2017-04-05 | 李孔亮 | 一种宝石加工研磨抛光设备 |
-
2019
- 2019-08-01 CN CN201910707570.7A patent/CN110281155B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133269A (ja) * | 2001-10-26 | 2003-05-09 | Applied Materials Inc | 化学機械研磨装置 |
US6506098B1 (en) * | 2002-05-20 | 2003-01-14 | Taiwan Semiconductor Manufacturing Company | Self-cleaning slurry arm on a CMP tool |
CN101112750A (zh) * | 2006-07-28 | 2008-01-30 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨机台中研磨液及去离子水输送管的配置方法 |
CN101121247A (zh) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | 研磨头的清洗装置 |
CN102335869A (zh) * | 2010-07-21 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置和方法 |
CN202317931U (zh) * | 2011-10-20 | 2012-07-11 | 汪涛 | 一种用于砂带磨削机的角度调整装置 |
CN105562780A (zh) * | 2014-10-16 | 2016-05-11 | 西安志越机电科技有限公司 | 便携式斜孔钻削装置 |
CN105965330A (zh) * | 2016-07-06 | 2016-09-28 | 苏州工业园区代思科电子科技有限公司 | 一种v型划片刀的加工装置 |
CN206066195U (zh) * | 2016-10-17 | 2017-04-05 | 李孔亮 | 一种宝石加工研磨抛光设备 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022205496A1 (zh) * | 2021-04-02 | 2022-10-06 | 台湾积体电路制造股份有限公司 | 晶圆清洗设备及定位治具 |
Also Published As
Publication number | Publication date |
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CN110281155B (zh) | 2022-01-14 |
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Date | Code | Title | Description |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211026 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |